CN1321550C - Flexible wiring plate and producing method thereof - Google Patents
Flexible wiring plate and producing method thereof Download PDFInfo
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- CN1321550C CN1321550C CNB2004100634380A CN200410063438A CN1321550C CN 1321550 C CN1321550 C CN 1321550C CN B2004100634380 A CNB2004100634380 A CN B2004100634380A CN 200410063438 A CN200410063438 A CN 200410063438A CN 1321550 C CN1321550 C CN 1321550C
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Abstract
Provided is a flexible wiring board of high reliability which can cope with narrow pitch, and to provide its manufacturing method. In the flexible wiring board (1), a connection terminal (6) is joined to the terminal connection (3a) of a wiring pattern (3) through anisotropic conductive material (5), and a lifting prevention means 9 for preventing the lifting of the connection terminal (6) is installed. In the flexible wiring board (1), bonding of the lifting prevention means (9) which consists of reinforcement component (8) is performed at the same time as the bonding of the connection terminal (6) to the connection terminal (3a) of the wiring pattern (3).
Description
Technical field
The present invention relates to a kind of flexible wiring board that is suitable for being electrically connected between the electron device part and manufacture method thereof.
Background technology
Up to now, the technology of utilizing flexible wiring board to carry out the electrical connection between electronic equipment part is widely known by the people.Have as the flexible wiring board that uses this technology: have be provided with on the flexible insulating properties substrate institute decide pattern wiring pattern (conductor circuit) and, the flexible wiring board of the input and output usefulness splicing ear that is electrically connected with this wiring pattern, perhaps (for example, with reference to the patent documentations 1) such as flexible wiring boards of the splicing ear of using with the electro part carrying that also is provided for carrying various electronic units such as chip part or electron tube the splicing ear except that input and output.
Figure 18 and Figure 19 represent near the structure of splicing ear of original flexible wiring board, original flexible wiring board 101 has the insulating properties substrate 102 that the flexible thin film constitutes, the flexible thin film is formed by the material that PET (PETG) etc. has insulating properties, on the surface of these insulating properties substrate 102 one sides (front of Figure 18, above Figure 19) go up form by conducting resinls such as printing elargol obtain decide the wiring pattern 103 of pattern.This wiring pattern 103 possesses terminal connecting portion 103a, and this terminal connecting portion 103a is configured in the terminal arrangement zone TPA of insulating properties substrate 102.The terminal arrangement of this insulating properties substrate 102 zone TPA for example is arranged on as the left part shown in the left of Figure 18 of surface one end that forms wiring pattern 103 and Figure 19.
In addition, the terminal connecting portion 103a of wiring pattern 103 along the left end of insulating properties substrate 102 with fixed spacing dispose side by side.That is, terminal connecting portion 103a is by being that a plurality of (being 3) linearity pattern that length direction is parallel to each other forms among Figure 18 with respect to Figure 18 of the left end quadrature of insulating properties substrate 102 and the left and right directions of Figure 19.
In addition, the position except that the TPA of terminal arrangement zone on insulating properties substrate 102 surfaces is by by being used to prevent that the resist 104 that wiring pattern 103 is corroded and the gluey China ink of insulating properties of damage etc. etc. constitutes from being covered.That is, the surface of the terminal connecting portion 103a of wiring pattern 103 is not covered by resist 104, but is exposed on the external.
And on the surface of terminal connecting portion 103a, splicing ear 105 Jie that are made of the metal forming that is used for being electrically connected with corresponding electronic unit are bonded together by conductive adhesive 106 states overlapping and that be electrically connected with maintenance.This splicing ear 105 for example is used as input or lead-out terminal in the occasion that is used for being connected with other electronic unit such as connector, in the occasion of electronic units such as mounting core chip part or electron tube, just when acting on the terminal that is electrically connected with the electrode of the electronic unit of installing.
Therefore, when splicing ear 105 is used as the terminal of the occasion that electronic unit is installed, loading position at the electronic unit of installing is provided with terminal arrangement zone TPA, at the splicing ear 105 of this terminal arrangement zone TPA formation with the electrode shape correspondingly-shaped of corresponding electronic unit.
As what the manufacture method of this flexible wiring board 101 was used be: utilize elargol on insulating properties substrate 102, to print the wiring pattern 103 of pattern that formation is decided, then utilize the gluey ink print of insulating properties to form resist 104, to cover the wiring pattern 103 except that its terminal connecting portion 103a, then, after being printed on conductive adhesive 106 on the terminal connecting portion 103a, the last joint of terminal connecting portion 103a that on the conductive adhesive 106 splicing ear 105 is bonded in wiring pattern 103 by the splicing ear 105 that is made of metal forming is overlapped.
Patent documentation 1: the spy opens flat 10-117057 communique
Yet, in the manufacture method of above-mentioned original flexible wiring board 101, the formation position of the conductive adhesive 106 that forms in printing has deviation to a certain degree inevitably, spacing at wiring pattern 103, specifically in the more roomy occasion of gap ratio of the terminal connecting portion 103a of wiring pattern 103, what can produce the position deviation of conductive adhesive 106, although can not produce excessive bad, but the narrow occasion of spacing at the terminal connecting portion 103a of wiring pattern 103, small position deviation because of conductive adhesive 106, by the conductive adhesive 106 this so-called bridging phenomenon that is short-circuited, there is this problem that causes decrease in yield between adjacent terminal connecting portion 103a.Particularly, along with the requirement of miniaturization in recent years, wiring pattern 103 needs thin spaceization, rate of finished products lowly become distinct issues.
In addition, in recent years, require to improve the reliability of various electronic units, even in original flexible wiring board 101, as one of countermeasure that improves reliability, require to improve splicing ear 105 is connected to joint reliability on the terminal connecting portion 103a of wiring pattern 103.Promptly, flexible wiring board 101 is owing to possess flexible, for example because the external force of the bending of the length direction shown in the left and right directions of Figure 18 and Figure 19 etc. and produce stress at the terminal connecting portion 103a of wiring pattern 103 and the bonding part of splicing ear 105, there is the tendency that is easy to peel off in splicing ear 105, particularly, in the occasion that applies external force repeatedly, there is the more incidental problem of peeling off of splicing ear 105.
To this, seek a kind of thin spaceization, the high flexible wiring board and the manufacture method thereof of joint reliability of wiring pattern and splicing ear simultaneously that can corresponding wiring pattern.
Summary of the invention
The present invention is the scheme that proposes in view of these problems, and its purpose is to provide a kind of thin spaceization, the high flexible wiring board and the manufacture method thereof of joint reliability of wiring pattern and splicing ear simultaneously that can corresponding wiring pattern.
To achieve the above object, flexible wiring board of the present invention, have: possess flexible insulating properties substrate, possess the splicing ear that is formed on the wiring pattern of the terminal connecting portion that the conducting resinl on this insulating properties substrate constitutes, constitutes by the metal forming that is electrically connected with described terminal connecting portion by printing, it is characterized in that: described splicing ear Jie comes overlapping with the terminal connecting portion of described wiring pattern by anisotropic conductive material and is bonded into the state that maintenance is electrically connected, simultaneously, be provided for preventing the mechanism for stripping that prevents that this splicing ear peels off.And, by adopting this structure, because the anisotropic conductive parts only are positioned at wiring pattern and the splicing ear conducting particles to each other that is overlapped on the wiring pattern just can be electrically connected, so, thin spaceization that can corresponding wiring pattern.And, peel off the joint reliability that anti-locking mechanism can easily improve wiring pattern and splicing ear.
In flexible wiring board of the present invention, preferred: described prevent mechanism for stripping be bonded on the strengthening part of another side side of junction of the terminal connecting portion of described at least wiring pattern of described insulating properties substrate and described splicing ear and the insulating properties guard block that engages in the mode of the ora terminalis of the described splicing ear of the junction that covers the terminal connecting portion that is positioned at described wiring pattern and described splicing ear at least, among at least one side.And by adopting this structure, strengthening part can stop the distortion of the junction of the terminal connecting portion of the wiring pattern that brings because of external force and splicing ear.And the insulating properties guard block remains on junction with the terminal connecting portion of wiring pattern with splicing ear.
On the other hand, the manufacture method of flexible wiring board of the present invention, it is characterized in that: the splicing ear pressed and overlapped that metal forming is made of anisotropic conductive material by being situated between is connected on the terminal connecting portion that is formed on the wiring pattern that the conducting resinl on the one side that possesses flexible insulating properties substrate constitutes by printing, and the terminal connecting portion and the described splicing ear of described wiring pattern is bonded into the state that keeps electrical connection, simultaneously, make preformed strengthening part be bonded on the another side side of the junction of the terminal connecting portion of described at least wiring pattern of described insulating properties substrate and described splicing ear.And, by adopting this structure, owing to can carry out splicing ear to the joint of the terminal connecting portion of wiring pattern and strengthening part joint, so can easily enhance productivity with same operation to the insulating properties substrate.
Description of drawings
Fig. 1 is the vertical view of major part of the execution mode of expression flexible wiring board of the present invention.
Fig. 2 is the cutaway view along the 2-2 line of Fig. 1.
Fig. 3 is vertical view execution mode, that the mother metal paper tinsel pasted the major part of the state on female anisotropic conductive film of expression flexible printed board fabrication method of the present invention.
Fig. 4 is the cutaway view along the 4-4 line of Fig. 3.
Fig. 5 is the not vertical view of the major part of the state of part execution mode, that removed the mother metal paper tinsel of expression flexible printed board fabrication method of the present invention.
Fig. 6 is the cutaway view along the 6-6 line of Fig. 5.
Fig. 7 is vertical view execution mode, that weak adhesive sheet pasted the major part of the state on female anisotropic conductive film of expression flexible printed board fabrication method of the present invention.
Fig. 8 is the 8-8 line cutaway view along Fig. 7.
Fig. 9 is the vertical view of mother substrate of the execution mode of flexible printed board fabrication method of the present invention.
Figure 10 is the cutaway view along the 10-10 line of Fig. 9.
Figure 11 is the vertical view of major part of state execution mode, form wiring pattern on mother substrate of flexible printed board fabrication method of the present invention.
Figure 12 is the cutaway view along the 12-12 line of Figure 11.
Figure 13 is the vertical view of major part of state execution mode, that resist is set on mother substrate of flexible printed board fabrication method of the present invention.
Figure 14 is the cutaway view along the 14-14 line of Figure 13.
Figure 15 is key diagram execution mode, that metal forming joined to the operation on the mother substrate of expression flexible printed board fabrication method of the present invention.
Figure 16 is vertical view execution mode, that peeled off the state of weak adhesive sheet of flexible printed board fabrication method of the present invention.
Figure 17 is the cutaway view along the 17-17 line of Figure 14.
Figure 18 is the vertical view of the major part of the original flexible wiring board of expression.
Figure 19 is the amplification view along the 19-19 line of Figure 18.
Among the figure: 1-flexible wiring board, 2-insulating properties substrate, 2M-mother substrate, 3-wiring pattern; 3a-terminal connecting portion, 4-resist, 5A-anisotropic conductive film, the female anisotropic conductive film of 5M-; the 6-splicing ear, 6A-metal forming, 6a-base end part; the 6b-leading section, 6c-ora terminalis, 7-insulating properties guard block; the 7a-insulating tape, 8-reinforcement material, 8A-reinforcing band; 9-prevents mechanism for stripping, TA-terminal arrangement zone, and the BA-substrate forms presumptive area.
Embodiment
Below the present invention will be described for the execution mode shown in reference to the accompanying drawings.
The flexible wiring board of present embodiment is to be that example is represented with the wiring plate that can insert removably in the connector.
Fig. 1 and Fig. 2 represent the major part of the execution mode of flexible wiring board of the present invention, and Fig. 1 is that vertical view, Fig. 2 are the cutaway view of Fig. 1 along the 2-2 line.
As Fig. 1 and shown in Figure 2, the flexible wiring board 1 of present embodiment possesses and has flexible insulating properties substrate 2.On this insulating properties substrate 2, the general use by PET, PI (polyimides) etc. has flexible thin film's substrate that the resin of insulating properties forms.In addition, it is film about 25 μ m that insulating properties substrate 2 forms its thickness for example, gives like this that it is flexible.In addition, also can make the insulating properties substrate have light transmission by making film.
Above shown in the top of Fig. 2 of above-mentioned insulating properties substrate 2, form the wiring pattern (conductor circuit) 3 of deciding pattern to some extent.This wiring pattern 3 forms by conducting resinls such as printing elargol such as silk screen printings.
Above-mentioned wiring pattern 3 possesses terminal connecting portion 3a.This terminal connecting portion 3a for example is located at the left part of the wiring pattern 3 shown in the left of Fig. 1 and Fig. 2, and this terminal connecting portion 3a is configured in the inside of the terminal arrangement zone TA that the left part of the insulating properties substrate 2 shown in the left of Fig. 1 and Fig. 2 is provided with.That is, be taken as terminal arrangement zone TA as the surface of the left part shown in the left of Fig. 1 of an end of insulating properties substrate 2 and Fig. 2, the terminal connecting portion 3a of wiring pattern 3 is configured in the right side in the TA of this terminal arrangement zone.
In addition, the terminal connecting portion 3a of wiring pattern 3 along the left end of insulating properties substrate 2 with fixed spacing dispose side by side.That is, terminal connecting portion 3a by with Fig. 1 of the left end quadrature of insulating properties substrate 2 and the left and right directions of Fig. 2 be that a plurality of (being 3 in the present embodiment) linearity pattern that length direction is parallel to each other forms.
The position except that the TA of above-mentioned terminal arrangement zone on insulating properties substrate 2 surfaces is used to prevent that the resist 4 that the gluey China ink of insulating properties of wiring pattern 3 corrosion and damage etc. etc. is constituted from covering.
TA is provided with anisotropic conductive material 5 in the terminal arrangement zone of above-mentioned insulated substrate 2, to cover the terminal connecting portion 3a of wiring pattern 3.This anisotropic conductive material 5 constitutes by mixed distribution conducting particles in resin.The connection that is formed by this anisotropic conductive material 5 is crimping basically, and conducting particles and resin are born the function that is electrically connected and keeps crimped status respectively.
As this anisotropic conductive material 5 employed resins, can enumerate ray hardening resins such as thermosetting resin, ultraviolet ray etc.In addition, as this anisotropic conductive material 5 employed conducting particless, can list particle that on metallics such as nickel, copper or resin balls, has coated metals such as nickel, gold etc.Can enumerate anisotropic conductive film (Anisotropic Coductive Film), anisotropy conductiving glue etc. as this anisotropic conductive material 5.In the present embodiment, in order to improve productivity, use be the anisotropic conductive film 5A of heating crimp type.
On above-mentioned anisotropic conductive material 5, be provided with decide the splicing ear 6 of pattern.The metal that this splicing ear 6 has conductivity by copper etc. is that the metal forming 6A of material makes, and is positioned at base end part 6a as the distolateral right-hand member side of its length direction one and is situated between overlapping with the terminal connecting portion 3a subtend of corresponding wiring pattern 3 and engage with the state that keeps electrical connection by anisotropic conductive material 5.In addition, leading section 6b Jie who is positioned at as splicing ear 6 another distolateral left end side is engaged with the terminal arrangement zone TA of insulating properties substrate 2 by anisotropic conductive material 5.And the surface of the leading section 6b of splicing ear 6 is electrically connected with the electrode of the not shown connector that goes out.
It is wideer at the width dimensions shown in Fig. 1 above-below direction than leading section 6b at the width dimensions shown in Fig. 1 above-below direction that splicing ear 6 in the present embodiment forms base end part 6a, simultaneously, base end part 6a is also narrower at the width dimensions shown in Fig. 1 above-below direction than the terminal connecting portion 3a of wiring pattern 3 at the width dimensions shown in Fig. 1 above-below direction.In addition, as shown in Figure 1, the terminal connecting portion 3a spacing to each other of the leading section 6b of the splicing ear 6 in present embodiment gap ratio wiring pattern 3 to each other is narrow.Promptly, at least the leading section 6b of splicing ear 6 formation is the linearity pattern that length direction is parallel to each other with respect to Fig. 1 of the left end quadrature of insulated substrate 2 and the left and right directions of Fig. 2, simultaneously, the terminal connecting portion 3a spacing to each other of leading section 6b gap ratio wiring pattern 3 to each other is narrow.
In addition, be disposed at terminal arrangement zone TA wiring pattern 3 terminal connecting portion 3a remove part the base end part 6a overlapping part with splicing ear 6 by covering with the anisotropic conductive material 5 that covers terminal configuring area TA, can prevent to corrode and damage.
The right part of above-mentioned splicing ear 6 is covered by insulating properties guard block 7.The protective material that can enumerate insulating tape that substrate simultaneously has adhesive linkage, constitute by gluey China ink of insulating properties etc. as this insulating properties guard block 7.In the present embodiment; as 7 uses of insulation protection parts are insulating tape 7A; as Fig. 1 and shown in Figure 2, the mode that this insulating properties guard block 7 with the ora terminalis 6c of the splicing ear 6 of the junction that covers the terminal connecting portion 3a be positioned at wiring pattern 3 and splicing ear portion 6 at least, specifically covers as the ora terminalis 6c of the base end part 6a of splicing ear 6 length direction right-hand members engages.In addition, insulating properties guard block 7 also can be configured to: cover the whole of the ora terminalis 6c of splicing ear 6 of the junction comprise the terminal connecting portion 3a that is positioned at wiring pattern 3 and splicing ear portion 6 and side edge.
As shown in Figure 2, strengthening part 8 with below Fig. 2 shown in the terminal arrangement zone TA of above-mentioned insulating properties substrate 2 below engage.As this strengthening part 8, the one side that can be set forth in base material possesses the stiffener of adhesive linkage, reinforcing band or strengthening membrane etc.What use as strengthening part in the present embodiment, is reinforcing band 8.As the base material of this reinforcing band 8A, can list PET, PI, PPS (polyphenylene sulfide) etc.
In addition, as adhesive linkage, although can from the various materials of generally acknowledging, select in the past, but, importantly, the engaging simultaneously of terminal connecting portion 3a of the wiring pattern 3 that the joint of 8 pairs of insulating properties substrates 2 of strengthening part can form by anisotropic conductive material 5 with 6 pairs of splicing ears carried out, thereby can improve productivity.Therefore, as the adhesive linkage of strengthening part 8, preferably can wait the sufficient adhesion strength that obtains insulating properties substrate 2 by the wiring pattern 3 that forms by anisotropic conductive material 5 and used crimp force, heat or the light of joint of splicing ear 6.For example can enumerate pressure sensitive bonding agent, reaction curable bonding agent (photo-hardening bonding agent, anaerobic bonding agents such as thermmohardening type bonding agent, the compound bonding agent that synthesizes by thermosetting and thermoplasticity, ultraviolet ray) etc.
In addition, as long as strengthening part 8 is configured in the another side side of the junction of the terminal connecting portion 3a of wiring pattern at least 3 of insulated substrate 2 and splicing ear 6.
The two is configured for preventing that the splicing ear 6 of present embodiment from peeling off prevents mechanism for stripping 9 to utilize above-mentioned insulating properties guard block 7 and strengthening part 8.
In addition, as preventing mechanism for stripping 9, as long as at least one side who has among insulation protection parts 7 and the strengthening part 8 is just passable.
Here, the manufacture method to the flexible wiring board of present embodiment describes.
Fig. 3～Figure 17 is the figure that the execution mode to the manufacture method of flexible wiring board of the present invention describes, Fig. 3 is the vertical view that expression pastes the mother metal paper tinsel major part of the state on female anisotropic conductive film, Fig. 4 is the cutaway view along the 4-4 line of Fig. 3, Fig. 5 is the not vertical view of the major part of the state of part of the mother metal paper tinsel removed of expression, Fig. 6 is the cutaway view along the 6-6 line of Fig. 5, Fig. 7 is the vertical view that expression pastes weak adhesive sheet the major part of the state on female anisotropic conductive film, Fig. 8 is the cutaway view along the 8-8 line of Fig. 7, Fig. 9 is the vertical view of mother substrate, Figure 10 is the cutaway view along the 10-10 line of Fig. 9, Figure 11 is the vertical view that is illustrated in the major part of the state that forms wiring pattern on the mother substrate, Figure 12 is the cutaway view along the 12-12 line of Figure 11, Figure 13 is the vertical view that is illustrated in the major part of the state that resist is set on the mother substrate, Figure 14 is the cutaway view along the 14-14 line of Figure 13, Figure 15 is the key diagram that expression joins metal forming to the operation on the mother substrate, Figure 16 is a vertical view of having peeled off the state of weak adhesive sheet, and Figure 17 is the cutaway view along the 17-17 line of Figure 14.
In the manufacture method of the flexible wiring board 1 of present embodiment, as Fig. 3 and shown in Figure 4, at first, utilize stacked processing that the mother metal paper tinsel 6M of 1 conductivity such as Copper Foil is sticked on the another side that one side has female anisotropic conductive film 5M of somatotype thin slice (strippable thin slice) 11.What use as female anisotropic conductive film 5M in addition, is the big material of area than terminal arrangement zone TA.
Then, as Fig. 5 and shown in Figure 6, partly remove mother metal paper tinsel 6M by using chemical etch technique, the metal forming 6M that makes institute's determined number forms splicing ear 6 with formalized shape and with the another side that decided pattern remains in female anisotropic conductive film 5M.The splicing ear 6 that constitutes by metal remained paper tinsel 6A in operation thereafter, with the insulating properties substrate 2 that should engage on the allocation position of terminal connecting portion 3a of wiring pattern 3 set accordingly.
Next, as Fig. 7 and shown in Figure 8, utilize heat to roll weak adhesive sheet 12 that processing will the bonding agent of cementability forms a little less than the PET film simultaneously applies, be attached on the another side of female anisotropic conductive film 5M with the form that coats each metal forming 6A.
On the other hand, wiring pattern 3 forms with different therewith operations.Therefore, at first as Fig. 9 and shown in Figure 10, preparation PET etc. has the mother substrate 2M of flexible insulated substrate 2.This mother substrate 2M is for the efficient employed substrate of a plurality of goods of making, and can produce a plurality of in the lump by molded grade.Promptly, as mother substrate 2M, use: cut among a plurality of Fig. 9 that 1 square metre so big area of area that printing machine can print obtains the so big substrate of substrate formation presumptive area BA of insulated substrate 2 of finishing the flexible wiring board 1 of product with the formation shown in the double dot dash line by for example material of PET film.
Then, as Figure 11 and shown in Figure 12,, wiring pattern 3 printings of decided pattern are formed on the substrate formation presumptive area BA of mother substrate 2M with formalized shape by with silk screen print method conducting resinl being printed on the one side of mother substrate 2M and making it dry.At this moment, conducting resinl uses is that silver powder be impregnated in conductive ink in the binder resin.
Then, as Figure 13 and shown in Figure 14, the mode that forms the surface of removing TA position, terminal arrangement zone in the surface that has formed wiring pattern 3 among the presumptive area BA with the substrate that covers mother substrate 2M makes it dry again by the gluey China ink with silk screen print method printing insulating properties, thereby printing forms resist 4.
Then, as shown in figure 15, to peel off somatotype thin slice 11 and keep the weak adhesive sheet 12 of metal forming 6A, the mode that forms the surface of presumptive area BA towards the substrate of insulating properties mother substrate 2M with the one side of female anisotropic conductive film 5M is carried out overlapping, the base end part 6a that makes metal forming 6A relative with the terminal connecting portion 3a of wiring pattern 3 to.In addition, making the adhesive linkage of preformed reinforcing band 8A is that the inside is relative with the another side that substrate forms the terminal arrangement zone TA of presumptive area BA.In addition, in the occasion of not using strengthening part 8, omitted the adhesive linkage that makes preformed reinforcing band 8A as strengthening part 8 relative with the TA the inside, terminal arrangement zone of insulating properties substrate 2 to operation.
In this state, the thermo-compressed drift 13 that will be heated to institute's fixed temperature (for example 80 ℃) abuts on the face of opposition side of metal forming 6A of weak adhesive sheet 12, carry out heating and pressurizing by being situated between by 12 couples of anisotropic conductive film 5M of weak adhesive sheet, and metal forming 6A is engaged with the terminal connecting portion 3a of each wiring pattern 3 respectively, simultaneously, reinforcing band 8A is engaged with the inside of terminal arrangement zone TA.At this moment, anisotropic conductive film 5M is engaged with than on the big scope of the substrate formation presumptive area BA of mother substrate 3M.
In addition, joint, anisotropic conductive film 5M with respect to the terminal connecting portion 3a of wiring pattern 3 that metal forming 6A is situated between by female anisotropic conductive film 5M form the joint of presumptive area BA, strengthening part 8A forms the inside of presumptive area BA with respect to the substrate of mother substrate 3M joint with respect to substrate, both can form presumptive area BA and carry out, also can form presumptive area BA at all substrates of mother substrate 3M and carry out simultaneously at each substrate.
Then, as Figure 16 and shown in Figure 17, peel off weak adhesive sheet 12 and substrate is formed presumptive area BA and carry out punch process.This punch process can be according to needs such as productivity or design concepts and was selected the recognized techniques from cut-out processing of the pressure processing of having used punch die, laser etc. etc. in the past.Carry out punch process by this substrate is formed presumptive area BA, remove the redundance that substrate forms presumptive area BA that exceeds of female anisotropy mother substrate 5M.
At last, paste the insulating tape 7A of joint by mode, and finish Fig. 1 and flexible wiring board 1 shown in Figure 2 as insulating properties guard block 7 with the ora terminalis 6c of the splicing ear 6 that covers the junction that is positioned at wiring pattern 3 and splicing ear 6 at least.In addition, also can before implementing punch process, engage insulating tape 7A.
Utilize above manufacturing process, constitute the flexible wiring board 1 of present embodiment.
Next the effect to the present embodiment that is made of said structure describes.
Adopt the flexible wiring board 1 of present embodiment, the terminal connecting portion 3a of the splicing ear 6 corresponding wiring patterns 3 that utilize anisotropic conductive material 5 to make to be made of metal forming 6A engages, and the state that obtains utilizing the conducting particles of anisotropic conductive material 5 that the terminal connecting portion 3a of wiring pattern 3 only is electrically connected with overlapping metal forming 6A thereon.Therefore, even the spacing of the terminal connecting portion 3a of adjacent wiring pattern 3 narrows down, can short circuit between the terminal connecting portion 3a of adjacent wiring pattern 3 yet, thus the thin spaceization that the spacing correspondence of wiring pattern 3 is narrowed down.
In addition, adopt the flexible wiring board 1 of present embodiment, because the base end part 6a of splicing ear 6 is narrower than the terminal connecting portion 3a of wiring pattern 3, institute is so that weak adhesive sheet 12 when overlapping on the insulating properties substrate 2, even produce small position deviation, owing to can make the base end part 6a of splicing ear 6 relative with the terminal connecting portion 3a of wiring pattern 3, also can make splicing ear 6 all the time with the corresponding joint of terminal connecting portion 3a of wiring pattern 3.
And, adopt the flexible wiring board 1 of present embodiment, as Fig. 1 and shown in Figure 2, owing to make the spacing of the leading section 6b of splicing ear 6 narrower than the spacing of wiring pattern 3, so, insert flexible wiring board 1 in the connector of the not shown electronic equipment that goes out along Fig. 1 and arrow A direction shown in Figure 2, make a plurality of metal terminal thin slices that wherein exist contact to be electrically connected with the leading section 6b of splicing ear 6 respectively and fetch use, in this case, connector can use the miniature connector of the spacing of a plurality of sheet metals less than the spacing of wiring pattern 3, only just has the advantage that can make electronic equipment realize the miniaturization densification from this point.
In addition, adopt the flexible wiring board 1 of present embodiment, by silk screen printing silver powder be impregnated in the conducting resinl that constitutes in the binder resin and form wiring pattern 3, but because wiring pattern 3 is being covered by anisotropic conductive material 5 with the overlapping part of splicing ear 6, so, can utilize anisotropic conductive material to prevent to separate out short circuit between the wiring pattern 3 that causes of transport phenomena of silver because of wiring pattern 3.
Have again, adopt the flexible wiring board 1 of present embodiment, because the inside joint at the terminal arrangement zone of insulating properties substrate 2 TA has as preventing that the strengthening part 8 of one of mechanism for stripping 9 from being reinforcing band 8a, so can stop the junction distortion that makes wiring pattern 3 and splicing ear 6 because of the external force along the crooked flexible wiring board 1 of the length direction shown in the left and right directions of Fig. 1 and Fig. 2 by the effect of reinforcing band 8.Its result, owing to can obviously be reduced in the stress that the bonding part of the 3a of splicing ear portion of wiring pattern 3 and splicing ear 6 produces, so can prevent peeling off of splicing ear 6.
Have again; adopt the flexible wiring board 1 of present embodiment; to be positioned at the insulation protection parts 7 as preventing one of mechanism for stripping 9 that the mode of ora terminalis 6c of splicing ear 6 of the junction of wiring pattern 3 and splicing ear 6 engages with covering be insulating tape 7A owing to have; so the effect by insulating tape 7A makes splicing ear 6 remain on junction with wiring pattern 3.Its result can prevent the situation that along the external force of the length direction bending shown in the left and right directions of Fig. 1 and Fig. 2 the ora terminalis 6c of splicing ear 6 is peeled off from the junction owing to flexible wiring board 1.
Thereby, adopting the flexible wiring board 1 of present embodiment, narrow-pitchization that can corresponding wiring pattern 3 simultaneously, can improve the reliability of the joint of wiring pattern 3 and splicing ear 6 at an easy rate.
On the other hand, adopt the manufacture method of the flexible wiring board 1 of present embodiment, since the splicing ear 6 that makes institute decide pattern can not cause by anisotropic conductive material 5 decide to engage with the terminal connecting portion 3a of wiring pattern 3 in the lump to short circuit between the wiring pattern 3 of pattern, so, can engage splicing ear 6 very effectively, can reduce engaging man-hour, thereby can reduce cost significantly.
In addition, adopt the manufacture method of the flexible wiring board 1 of present embodiment, since make decide pattern splicing ear 6 corresponding wiring patterns 3 be configured in bonding again joint on the anisotropic conductive material 5, so can not can forget stickup, high accuracy and easily paste on the terminal connecting portion 3a of wiring pattern 3 and engage.
In addition, adopt the manufacture method of the flexible wiring board 1 of present embodiment, because can in same operation, carry out the engaging of splicing ear 3 and wiring pattern 3 simultaneously, strengthening part 8 engages with insulating properties substrate 2, so, can improve the production efficiency that is provided with the flexible wiring board that prevents mechanism for stripping 91 that constitutes by strengthening part 8 at an easy rate.
Thereby, adopt the manufacture method of the flexible wiring board 1 of present embodiment, in the time of narrow-pitchization that can corresponding wiring pattern 3, can obtain the high flexible wiring board 1 of reliability of the joint of wiring pattern 3 and splicing ear 6 effectively.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various changes as required.
Adopt the flexible wiring board of the present invention of above explanation, in the time of narrow-pitchization that can corresponding wiring pattern 3, have the extremely good effects such as reliability that engage that can improve wiring pattern and splicing ear at an easy rate.
In addition, adopt the manufacture method of flexible wiring board of the present invention, have and to improve production efficiency of being provided with the flexible wiring board that prevents mechanism for stripping that constitutes by strengthening part etc. at an easy rate and play extremely good effect.
Claims (2)
1. flexible wiring board, have: possess flexible insulating properties substrate, possess by printing be formed on the wiring pattern of the terminal connecting portion that the conducting resinl on this insulating properties substrate constitutes, by the splicing ear that the metal forming that is electrically connected with described terminal connecting portion constitutes, it is characterized in that:
Described splicing ear is situated between and is come overlapping with the terminal connecting portion of described wiring pattern and be bonded into the state that maintenance is electrically connected by anisotropic conductive material, simultaneously, also is provided for preventing the mechanism for stripping that prevents that this splicing ear peels off,
The described mechanism for stripping that prevents is to be bonded on the strengthening part of another side side of junction of the terminal connecting portion of described at least wiring pattern of described insulating properties substrate and described splicing ear and at least one side among the insulating properties guard block that engages in the mode of the ora terminalis of the described splicing ear of the junction that covers the terminal connecting portion that is positioned at described wiring pattern and described splicing ear at least.
2. the manufacture method of a flexible wiring board, it is characterized in that: will be connected on the terminal connecting portion that is formed on the wiring pattern that the conducting resinl on the one side that possesses flexible insulating properties substrate constitutes by printing by the splicing ear pressed and overlapped that metal forming constitutes by anisotropic conductive material by being situated between, and the terminal connecting portion and the described splicing ear of described wiring pattern is bonded into the state that keeps electrical connection, simultaneously, make preformed strengthening part be bonded on the another side side of the junction of the terminal connecting portion of described at least wiring pattern of described insulating properties substrate and described splicing ear.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003193603 | 2003-07-08 | ||
| JP2003193603A JP2005032815A (en) | 2003-07-08 | 2003-07-08 | Flexible wiring board and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1578588A CN1578588A (en) | 2005-02-09 |
| CN1321550C true CN1321550C (en) | 2007-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100634380A Expired - Fee Related CN1321550C (en) | 2003-07-08 | 2004-07-06 | Flexible wiring plate and producing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005032815A (en) |
| CN (1) | CN1321550C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960091A (en) * | 2015-03-09 | 2016-09-21 | 阿尔卑斯电气株式会社 | Wiring substrate, connection structure of wiring substrate, and connection method of wiring substrate |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269949A (en) * | 2005-03-25 | 2006-10-05 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing flexible circuit board with insulating plate |
| JP4912917B2 (en) * | 2007-02-22 | 2012-04-11 | 京セラ株式会社 | Circuit board, portable electronic device, and circuit board manufacturing method |
| JP5361817B2 (en) | 2010-07-08 | 2013-12-04 | 三菱電機株式会社 | Optical module |
| KR102204529B1 (en) * | 2019-04-05 | 2021-01-20 | 유한회사 대구특수금속 | Method for mafacturing in mold electronics molding mounted connector terminals |
| JP7325299B2 (en) * | 2019-10-30 | 2023-08-14 | 三菱電機株式会社 | Printed wiring board junction structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152076B2 (en) * | 1979-02-23 | 1986-11-11 | Matsushita Electric Ind Co Ltd | |
| JPH10117057A (en) * | 1996-10-09 | 1998-05-06 | Fujikura Ltd | Mounting method for printed board and printed board |
| JPH11330154A (en) * | 1998-03-09 | 1999-11-30 | Toshiba Corp | Flexible substrate, tape-carrier package using this and mounting method thereof |
| CN1300051A (en) * | 1999-11-17 | 2001-06-20 | Tdk株式会社 | Magnetic head assembly and mfg. method and lead-connection method for said magnetic head assembly |
| JP2003124583A (en) * | 2001-10-15 | 2003-04-25 | Alps Electric Co Ltd | Flexible circuit board |
| US20030094305A1 (en) * | 2001-10-29 | 2003-05-22 | Advanced Display Inc. | Pressure-welded structure of flexible circuit boards |
-
2003
- 2003-07-08 JP JP2003193603A patent/JP2005032815A/en not_active Withdrawn
-
2004
- 2004-07-06 CN CNB2004100634380A patent/CN1321550C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152076B2 (en) * | 1979-02-23 | 1986-11-11 | Matsushita Electric Ind Co Ltd | |
| JPH10117057A (en) * | 1996-10-09 | 1998-05-06 | Fujikura Ltd | Mounting method for printed board and printed board |
| JPH11330154A (en) * | 1998-03-09 | 1999-11-30 | Toshiba Corp | Flexible substrate, tape-carrier package using this and mounting method thereof |
| CN1300051A (en) * | 1999-11-17 | 2001-06-20 | Tdk株式会社 | Magnetic head assembly and mfg. method and lead-connection method for said magnetic head assembly |
| JP2003124583A (en) * | 2001-10-15 | 2003-04-25 | Alps Electric Co Ltd | Flexible circuit board |
| US20030094305A1 (en) * | 2001-10-29 | 2003-05-22 | Advanced Display Inc. | Pressure-welded structure of flexible circuit boards |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105960091A (en) * | 2015-03-09 | 2016-09-21 | 阿尔卑斯电气株式会社 | Wiring substrate, connection structure of wiring substrate, and connection method of wiring substrate |
| CN105960091B (en) * | 2015-03-09 | 2018-09-14 | 阿尔卑斯电气株式会社 | The connection method of circuit board, the connecting structure of circuit board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1578588A (en) | 2005-02-09 |
| JP2005032815A (en) | 2005-02-03 |
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