CN1318210C - Resin composition, molded product thereof and electroconductive sheet - Google Patents

Resin composition, molded product thereof and electroconductive sheet Download PDF

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Publication number
CN1318210C
CN1318210C CNB008149178A CN00814917A CN1318210C CN 1318210 C CN1318210 C CN 1318210C CN B008149178 A CNB008149178 A CN B008149178A CN 00814917 A CN00814917 A CN 00814917A CN 1318210 C CN1318210 C CN 1318210C
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China
Prior art keywords
conducting strip
resin
weight
type resin
substrate layer
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Expired - Lifetime
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CNB008149178A
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Chinese (zh)
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CN1384784A (en
Inventor
小杉和裕
宫川健志
日向野正德
清水美基雄
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D1/00—Books or other bound products
    • B42D1/08—Albums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2313/00—Elements other than metals
    • B32B2313/04—Carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2325/00—Polymers of vinyl-aromatic compounds, e.g. polystyrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2355/00—Specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of index codes B32B2323/00 - B32B2333/00
    • B32B2355/02—ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00—Polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/02—Open containers
    • B32B2439/06—Bags, sacks, sachets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/902—High modulus filament or fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31935—Ester, halide or nitrile of addition polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

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  • Business, Economics & Management (AREA)
  • Engineering & Computer Science (AREA)
  • Educational Administration (AREA)
  • Educational Technology (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Wrappers (AREA)

Abstract

An electroconductive sheet comprising a substrate layer of a thermoplastic resin comprising an acrylonitrile-butadiene-styrene copolymer type resin and/or a polystyrene type resin and having laminated on at least one side of the substrate layer, a surface layer of an electroconductive resin composition comprising a polycarbonate type resin and from 5 to 50 wt % of carbon black.

Description

Resin combination, its formed product and conducting strip
Technical field
The present invention relates to a kind of resin combination, use its formed product and conducting strip.Described conducting strip is used for the packing container of semiconductor such as IC and electronic component, is used in particular for carrier band (carrier-tape).
Background of invention
In order to pack IC, to use electronic component or the electronic component of IC, the dish of injection moulding, dish that vacuum forms, magazine, carrier band (being also referred to as embossing carrier band) etc. have been used.In order to prevent that electronic components such as IC are damaged owing to static, have used the packing container that is dispersed with conductive filler therein.As conductive filler, be extensive use of carbon black, always can obtain stable surface resistivity with this with low cost.
The conducting strip that is made of the thermoplastic resin that wherein is dispersed with carbon black has some shortcomings, for example (1) mechanical strength and processing characteristics reduce, (2) Bao Zhuan electronic component and conducting strip friction can make the conducting strip surface contain the resin wear of carbon black, thus stained electronic component.JP-A-57-205145, JP-A-62-18261 etc. have proposed to overcome the method for problem (1), and JP-A-9-7624, JP-A-9-76425 etc. have proposed to overcome the method for problem (2).Yet electronic component is just becoming and becoming increasingly complex, and is accurate and small, and packing and sealing electronic component carry out now just at faster speed, therefore need a kind of conducting strip that is used for packaging electronic components, it is not easy to cause electronic component stained, and has the mechanical strength of improvement.
The disclosure of the Invention content
The invention provides a kind of conducting strip that is used for packaging electronic components, it has eliminated electronic component basically because the electronic component that itself and conducting strip friction cause is stained, and have enough mechanical strengths, can stand packing or sealing at a high speed, the packing container that also provides a kind of electronic component to use.This conducting strip is used in particular for the carrier band.
The invention provides a kind of conducting strip, it has a substrate layer and is laminated to the substrate layer conductive resin composition top layer on the one side at least, and this conductive resin composition contains a kind of polycarbonate type resin and accounts for the carbon black of polycarbonate type resin 5-50 weight %.Described conducting strip is as the conducting strip of packaging electronic components, and the described packing container that is used for the conducting strip of packaging electronic components as electronic component is particularly as the carrier band.
As the structure of conducting strip, a kind of double-decker of top layer/substrate layer preferably, its mesexine is made of conductive resin composition, places the one side that contacts with electronic component.In addition, the structure on also preferred top layer/substrate layer/top layer.Between top layer and substrate layer, can also be furnished with another layer.
The polycarbonate type resin that is used for conductive resin composition is not particularly limited, available commercially available product.For example, available aromatic polycarbonate resin, aliphatic polycarbonate resin and aromatic-aliphatic Merlon.Also can use bisphenol-A and phosgene polycondensation by routine, or the Merlon of bisphenol-A and carboxylate polycondensation acquisition, it usually is classified as engineering plastics.It mainly is made up of bis-phenol, produces by phosgenation or ester exchange, and the bis-phenol that is used as raw material for example can be: 2, and 2-two-(4-hydroxyphenyl) propane (bisphenol-A), 2,4-two (4-hydroxyphenyl)-methyl-butane or 1,1-two-(4-hydroxyphenyl)-cyclohexane.Also can use same Merlon, react the Copolycarbonate that obtains by carboxyl acid copolymer, or its mixture.
Mix carbon black in the conductive resin composition and can be for example furnace black, channel black or acetylene black, preferred carbon black should have big specific area, thereby in resin, mix on a small quantity and just can obtain high electrical conductivity, for example KETJENBLACK or acetylene black.
The amounts of carbon black of mixing conductive resin composition preferably accounts for the 5-50 weight % of polycarbonate type resin.If be less than 5 weight %, just can not obtain enough surface resistivities, electronic component will take place because the damage that static causes.If surpass 50 weight %, the flowability of conductive resin composition can descend, thereby is difficult to it is laminated on the substrate layer, and the mechanical strength of the conducting strip that will obtain also can descend.
Conducting strip is in the one side of itself and conductive resin composition lamination, surface resistivity preferably 10 2-10 10Ω.If surpass this scope, will be difficult to prevent electronic component because electrostatic interaction damages.
In conductive resin composition, can mix another kind of resinous principle, as acrylonitrile-butadiene-styrene copolymer type resin or polybutylene terephthalate resin, as conditioning agent.
As conditioning agent, be fit to use ethene-glyceryl methacrylate type copolymer and acrylonitrile-styrene type copolymer.To this, conductive resin composition contains a kind of polycarbonate type resin, accounts for the ethene-glyceryl methacrylate type copolymer of the carbon black of polycarbonate type resin 5-50 weight %, maximum 40 weight % and the graft resin of acrylonitrile-styrene type copolymer.Conductive resin composition can singly be used polycarbonate type resin, carbon black and graft resin preparation, or can mainly be made of these, and contains other composition in the object of the invention scope.
The graft resin of ethene-glyceryl methacrylate type copolymer and acrylonitrile-styrene type copolymer is the resin that obtains to ethene-glyceryl methacrylate type copolymer by with acrylonitrile-styrene type copolymer grafted.The acrylonitrile-styrene type copolymer grafted that suitable use will contain 50 weight % acrylonitrile at the most is to containing the resin that obtains on the ethene of the glyceryl methacrylate of 45 weight %-glyceryl methacrylate type copolymer at the most, and it has the commercially available prod.
The graft resin amount of mixing accounts for polycarbonate type resin 40 weight % at the most, preferred 1-40 weight %, more preferably 3-40 weight %.In this content range, mechanical strength, particularly impact strength will be improved, and can stand the high-speed packaging and the sealing of electronic component.If surpass 40 weight %, elastic modelling quantity will descend.
When above-mentioned resin combination is used for conducting strip as conductive resin composition, can be used as individual layer conducting strip or multilayer conductive sheet.It can be itself to be the product use that is shaped.
In conductive resin composition, also can depending on the circumstances or the needs of the situation add additives such as lubricant, plasticizer or processing aid.
Conducting strip is especially suitable for use as the carrier band.For this purposes, the conducting strip that the carrier band that needs reflectivity from the teeth outwards to reduce is used, to prevent inspection machine since conducting strip when image is for example checked IC because the conducting strip surface is reflected makes mistakes.According to the present invention, the conductive resin composition layer should have the surface roughness Ra of 0.6-4.0 micron, thereby can prevent owing to the reflection of conducting strip surface makes mistakes when electronic components such as image inspection IC.If surface roughness Ra is less than 0.6 micron, lustrous surface is just too high, and the result images inspection machine can be owing to the reflection of conducting strip surface makes mistakes when operation.If surface roughness Ra surpasses 4.0 microns, the conducting strip surface can be too coarse, and the outward appearance of layer is bad, is not suitable as the conducting strip of carrier band.At this, surface roughness Ra is the center line surface roughness of measuring according to JIS-B-0651.
As substrate layer, preferably contain acrylonitrile-butadiene-styrene copolymer type resin and/or polystyrene type resin, contain polybutylene terephthalate type resin and polycarbonate type resin, or contain have aromatic ethylene base monomer residue and unsaturation dicarboxylic acids inferior acid amides derive residue inferior amidatioon copolymer.Can in purpose scope of the present invention, in substrate layer, mix another kind of component.
By thermoplastic resin substrate layer (containing acrylonitrile-butadiene-styrene copolymer type resin and/or polystyrene type resin) and be laminated to substrate layer at least the conducting strip that constitutes of the conductive resin composition (contain a kind of polycarbonate type resin and account for the carbon black of polycarbonate type resin 5-50 weight %) on the one side be that conducting strip preferably one of is constructed.
Being used for acrylonitrile-butadiene-styrene copolymer type resin of the present invention is the resin that mainly contains copolymer (mainly by three kinds of compositions: acrylonitrile, butadiene and styrene constitute), available commercially available prod.For example, can use by at least a and be selected from the monomer of aromatic vinyl monomer and vinyl cyanide and the copolymer of diene type diblock rubber or glycerol polymerization, or the blend product of described copolymer.Described diene type rubber is to obtain by the butadiene of polymerization as component, for example polybutadiene, polyisoprene, acrylonitrile-butadiene copolymer and SB.Aromatic ethylene base monomer can be the styrene that replaces of styrene, AMS or alkyl for example.Vinyl cyanide monomer can be the acrylonitrile that replaces of acrylonitrile, methacrylonitrile or halogen for example.The object lesson of the product mix of copolymer and described copolymer comprises acrylonitrile-butadiene-styrene-terpolymer and by polybutadiene and acrylonitrile-styrene dimer being carried out the polymer alloy acquisition.In addition, also comprise the acrylonitrile-styrene dimer that does not contain rubber constituent.
Polystyrene type resin is a kind of by the polymer of polymerization as the styrene acquisition of composition, and its example comprises the polymers for general use that is mainly obtained by polystyrene resin, or impact-resistant polystyrene resin, or its mixture.
Substrate layer at conducting strip is under the situation about preparing with at least a thermoplastic resin that is selected from acrylonitrile-butadiene-styrene copolymer type resin and polystyrene resin, also can mix the polycarbonate type resin that accounts for thermoplastic resin 1-50 weight % amount.By mixing polycarbonate type resin, mechanical strength will further be improved.The amount of polycarbonate type resin is at least 50 weight % preferably, thereby obtain conducting strip cheaply.
Under with PET type resin and the situation of polycarbonate type resin as substrate layer, the ratio of PET type resin is the 35-97 weight % of two kinds of composition total amounts preferably, and the ratio of polycarbonate type resin is 3-65 weight % preferably.At this point, can in not damaging the object of the invention scope, mix another kind of composition.
As polycarbonate type resin, can use the sort of of electroconductive resin component that the top layer uses.This resin of substrate layer can be used for the sort of identical or different of top layer.Preferred PET type resin accounts for the 35-97 weight % of PET type resin and polycarbonate type resin total amount, polycarbonate type resin is 3-65 weight %, more preferably, PET type resin is 51-97 weight %; Polycarbonate type resin is 3-49 weight %.If the mixing ratio of polycarbonate type resin is too low or too high, the folding intensity and the suitability for secondary processing of conducting strip will descend.Being equilibrated in the above-mentioned scope between intensity and the suitability for secondary processing is remarkable.
PET type resin can be mainly be made of ethylene glycol and terephthalic acids or its dimethyl ester.In addition, available have a diethylene glycol, 1 that is used as diol component, 4-tetramethyl glycol, 1, and 4-cyclohexanedimethanol or heptane methylene glycol, or as the isophathalic acid, 1 of dicarboxylic acids composition, the part that 5-naphthalene dicarboxylic acids or hexanedioic acid replace.Consider from formability, preferably a kind of PET type resin, it has 0.1-10 mole %1,4-cyclohexanedimethanol composition is as the diol component of copolymerization, or a kind of PET type resin, it has the sour composition of 1-10 mole % isophathalic acid composition as copolymerization.
The 1-10 mole %1 that more preferably contains diol component and copolymerization, the PET type resin of 4-cyclohexanedimethanol composition, because its crystallization makes slow progress, and impact strength is big.Contain 1 of high molar ratio more if use, the copolymer of 4-cyclohexanedimethanol, its crystallization process is extremely slow, then will cause fusion takes place in pressing steps, drying steps or recycling step and to block, or problem such as the product physical property that is shaped is impaired.
In addition, such PET type resin is to be fit to use, if it is dissolved in 1,1,4, in the time of in the mixed solvent of 4-tetrachloroethanes and phenol (weight ratio 60: 40), inherent viscosity [η] (IV value hereinafter referred to as) is 0.6-1.0dl/g in the time of 30 ℃.If less than 0.6dl/g, the mechanical strength of conducting strip or formed product can be broken with deficiency, if surpass 1.0dl/g, fusion body viscosity can be too high, and extrudability can be too poor, and productive rate will descend.As PET type resin, can use the commercially available prod.
For substrate layer, can use inferior amidated copolymer with aromatic vinyl monomer residue and the inferior amide derivatives residue of unsaturated dicarboxylic.At this point, preferred substrate layers also contains acrylonitrile-butadiene-styrene copolymer type resin except inferior amidatioon copolymer.
Inferior amidatioon copolymer is a kind of copolymer with aromatic vinyl monomer residue and the inferior amide derivatives residue of unsaturated dicarboxylic, also can use the copolymer that also has unsaturated dicarboxylic acid anhydride residue.It can also contain rubber polymer.Each components contents, rubber polymer are 0-40 weight %, and the aromatic vinyl monomer residue is 30-70 weight %, and the inferior amide derivatives residue of unsaturated dicarboxylic is 20-60 weight %, and unsaturated dicarboxylic acid anhydride residue is 0-15 weight %.In addition, but can use and contain 0-40 weight % copolymerizable vinyl groups residue.As inferior amidatioon copolymer, can use the product of sale, as " Malecca " trade name of Denki Kagaku Kogyo K.K. sale.
The acrylonitrile-butadiene-styrene copolymer type resin that is used for this situation is not limited by what, can use the product of sale.Particularly preferably be a kind of acrylonitrile-butadiene-styrene copolymer type resin, it contains the graft copolymer that accounts for 5-93 weight % by the monomer mixture copolymerization acquisition of the rubber polymer of 5-80 weight portion and 20-95 weight portion, this monomer mixture contains the aromatic vinyl monomer of 60-90 weight %, the vinyl cyanide monomer of about 10-40 weight % and about 0-40 weight % can with the vinyl monomer of above-mentioned monomer copolymerization, further preferably a kind of resin combination, it contains the ethylenic copolymer of 0-80 weight %, and this copolymer contains the aromatic vinyl monomer residue of 60-90 weight %, the vinyl cyanide monomer residue of 10-40 weight % and 0-40 weight % can with the vinyl monomer residue of these monomer copolymerizations.
Under the situation of using acrylonitrile-butadiene-styrene copolymer type resin, the consumption of inferior amidatioon copolymer can account for the 5-93 weight % of inferior amidatioon copolymer and acrylonitrile-butadiene-styrene copolymer type resin total amount.If surpass this scope, possible work in-process causes thermal metamorphism, and perhaps the impact strength of Huo Deing is insufficient.
Can mix a small amount of carbon black in the substrate layer of any composition, be prerequisite not damage flowability.Mixed carbon black, mechanical strength can further be improved, and can overcome the too thin problem of thickness when conducting strip forms packing container simultaneously, thereby makes that for example the angle of packing container is transparent.
The amounts of carbon black of mixing substrate layer is not limited by what, as long as it can be dispersed in the substrate resin uniformly.The amounts of carbon black of mixing conductive substrate layer can preferably account for the 0.1-10 weight % of thermoplastic resin in not influencing mobile scope as mentioned above.
In the substrate layer of any composition, can mix another kind of known thermoplastic resin composition (for example polyvinyl resin or acrylic resin), a kind of olefin type resin, as the copolymer of ethene or propylene (as the ethylene-acrylic acid vinylester resin, ethylene-vinyl acetate copolymer resin or ethene-alpha-olefin copolymer resin), or polyester resin (as polyethylene terephthalate resin or polybutylene terephthalate resin) is as conditioning agent.In addition, need as situation, but blast blending, as lubricant, plasticizer or processing aid.In addition, for substrate layer, can be recovered in the conducting strip edge or the underproof coiled material that produce in the conducting strip production with the amount of 5-50 weight %, perhaps the milling product of formed product.
In order to prepare conducting strip of the present invention, at first with the raw material conventional method of part or all conductive resin composition, for example use extruder to knead and granulation, the conductive resin composition and the thermoplastic resin composition one that obtain are reinstated conventional method, use for example extruder expansion, form conductive substrate layer.
For the conductive resin composition of kneading, all raw materials of can once kneading also can be kneaded step by step, for example knead earlier carbon black and half polycarbonate type resin, in the good product of kneading, add surplus material then, and then knead, can also when launching, add remaining material.
Can pass through known method, for example use extruder or calender to prepare conducting strip.As the method for lamination conductive resin composition on substrate layer, the at first available extruder that separates forms sheet or film respectively with these two kinds of materials, for example carries out lamination with lamination methods, dried laminating or extruded layer platen press then.In addition, can on preformed conductive substrate layer, the conductive resin composition lamination be got on by the extrusion coating method.In order to prepare conducting strip with low cost, preferably use for example multi-layer, co-extruded method, use feed sleeve or many menifolds mould once to obtain the conducting strip of lamination.
The method that makes surface roughness Ra reach the 0.6-4.0 micron is not particularly limited, and mixes inorganic filler but can use in resin, as the method for talcum, calcium carbonate, mica or fish glue; Mix natural rubber or elastomeric method; Or with the method for knurling rolls at embossed surface.Have some advantages with knurling rolls in the method for embossed surface, the power performance of conducting strip and manufacturing property are suffered damage, can be widely used in for example vinyl chloride resin, polycarbonate resin, polystyrene resin or PET type resin, they are used as the conducting strip of carrier band now, and, can use conventional those that use as cladding material.
The integral thickness of conducting strip is the 0.1-3.0 millimeter preferably, and the thickness of conductive resin composition layer is the 2-80% of gross thickness.If the conducting strip gross thickness is less than 0.1 millimeter, by the be shaped undercapacity of the packing container that obtains of this conducting strip, if surpass 3.0 microns, pressure forming, manufacturing process such as vacuum forming or hot forming will be difficult for carrying out.In addition, if the thickness of conductive resin composition layer less than 2%, the surface resistivity of packing container can be too high, can not obtain enough antistatic properties, if surpass 80%, its processing characteristics in pressure forming, vacuum forming or hot forming etc. is too poor.
Conducting strip of the present invention is applicable to electronic component such as IC or uses the packaging material of the electronic component of IC, also as dish, vacuum-formed dish, magazine and the carrier band of injection moulding, is specially adapted to the carrier band.
Implement best mode of the present invention
Now, will explain the present invention according to some embodiment in more detail.The invention is not restricted to these specific embodiments yet should understand.
Embodiment 1
As conductive resin composition, by polycarbonate type resin (the Panlight L-1225 that kneads in advance with 50 millimeters exhaust twin (double) screw extruders of φ, Teijin Chemicals Ltd. makes) and account for the KETJENBLACK EC (LION-AKZO manufacturing) of polycarbonate type resin 12 weight %, granulation then obtains the electroconductive resin compound.By the feed sleeve method, with 65 millimeters extruders of φ (L/D=28), 40 millimeters extruders of φ (L/D=26) and wide 500 millimeters T-mould, the electroconductive resin compound layer is pressed in acrylonitrile-butadiene-styrene copolymer type resin (Techno ABS YT-346 as the thermoplastic resin of conducting strip substrate layer, Techno Polymer Co., the Ltd manufacturing) on two face, acquisition contains three layers conducting strip, gross thickness is 300 microns, all has thickness on its two sides and be 30 microns conductive resin composition layer.
Embodiment 2
As conductive resin composition, by polycarbonate type resin (the Panlight L-1225 that kneads in advance with 50 millimeters exhaust twin (double) screw extruders of φ, Teijin Chemicals Ltd. makes) and account for the Denka Black particle (Denki Kagaku Kogyo K.K manufacturing) of polycarbonate type resin 20 weight %, granulation then obtains the electroconductive resin compound.Same procedure with embodiment 1, the electroconductive resin compound layer is pressed in contains acrylonitrile-butadiene-styrene copolymer type resin (Techno ABS YT-346, Techno Polymer Co., Ltd makes) and add 5 weight % polycarbonate type resin (Panlight L-1225 therein, on the two sides of mixture (as the thermoplastic resin of conducting strip substrate layer) Teijin Chemicals Ltd. manufacturing), obtain three layers conducting strip, gross thickness is 200 microns, all has thickness on its two sides and be 20 microns conductive resin composition layer.
Embodiment 3
Same procedure with embodiment 1 obtains the electroconductive resin compound.On two faces of resin as the substrate layer of conducting strip, with 65 millimeters extruders of φ (L/D=28), two 40 millimeters extruders of φ (L/D=26) be used for three types three layers, wide 650 millimeters many menifolds mould, electroconductive resin compound on the lamination, acquisition contains three layers conducting strip, gross thickness is 500 microns, has thickness on the two sides and be 40 microns conductive resin composition layer.This resin as substrate layer contains acrylonitrile-butadiene-styrene copolymer type resin (Ltd makes for Techno ABS YT-346, Techno Polymer Co.) and adds therein the described electroconductive resin compound of 10 weight %.
Embodiment 4
Method with embodiment 3 obtains to contain three layers conducting strip, and different is with the substrate layer resin of polystyrene type resin (ToyoStyrol E640N, Toyo Styrene makes) as conducting strip.
Comparing embodiment 1
Method with embodiment 1 obtains to contain three layers conducting strip; different is with knead in advance polystyrene type resin (the Toyo Styrol E640N of 78 weight % of the exhaust twin (double) screw extruder of 50 millimeters of φ; Toyo Styrene manufacturing), 10 weight %HDPE resin (Hyzex 5000H; Mitsui Chemicals; Inc. make) and 12 weight %KETJENBLACK EC (LION-AKZO manufacturing), granulation obtains the electroconductive resin compound as conductive resin composition then.
Comparing embodiment 2
Method with embodiment 1 obtains to contain three layers conducting strip, different is with the exhaust twin (double) screw extruder of 50 millimeters of φ polystyrene type resin (the Toyo Styrol E640N that kneads in advance, Toyo Styrene manufacturing), 12 weight %KETJENBLACK EC (LION-AKZO manufacturing), granulation then, obtain the electroconductive resin compound as conductive resin composition, with the resin of polystyrene type resin (Toyo Styrol E640N, Toyo Styrene makes) as the substrate layer of conducting strip.
Tested the performance of the conducting strip that as above obtains.Table 1 has shown the result.
Table 1
Surface resistivity (ohm) Tensile properties (flow to/laterally) Carbon comes off
Extension at break (%) Fracture strength (MPa) Yield point strength (Mpa) Stretch modulus
Embodiment 1 10 4 12/11 42/41 48/49 1760/1718 ◎
Embodiment 2 10 4 10/9 45/43 52/50 1852/1769 ◎
Embodiment 3 10 4 12/12 43/43 50/50 1812/1750 ◎
Embodiment 4 10 4 8/9 40/40 46/45 1720/1680 ◎
Comparing embodiment 1 10 4 99/23 32/20 39/38 1469/1453 ○
Comparing embodiment 2 10 4 96/75 25/20 25/23 1666/1539 ×
Embodiment 5
Obtain to contain three layers conducting strip with the same procedure of embodiment 1, different is on the conducting strip one side with surface roughness Ra is that 3.2 microns metal knurling rolls carry out embossing.
Embodiment 6
Obtain to contain three layers conducting strip with the same procedure of embodiment 2, different is on the conducting strip one side with surface roughness Ra is that 0.9 micron metal knurling rolls carry out embossing.
Embodiment 7
Same procedure with embodiment 3 obtains to contain three layers conducting strip, and different is to carry out embossing with the polysiloxanes squeegee that contains sand on the conducting strip one side.
Embodiment 8
Obtain to contain three layers conducting strip with the same procedure of embodiment 4, different is on the conducting strip one side with surface roughness Ra is that 1.9 microns metal knurling rolls carry out embossing.
Comparing embodiment 3
Obtain to contain three layers conducting strip with the same procedure of comparing embodiment 1, different is on the conducting strip two sides is that 0.3 micron metal knurling rolls carry out embossing with surface roughness Ra all, thereby the two sides of conducting strip all has high gloss.
Comparing embodiment 4
Obtain to contain three layers conducting strip with the same procedure of comparing embodiment 2, different is on the conducting strip one side with surface roughness Ra is that 6.7 microns metal knurling rolls carry out embossing.Yet the surface of conducting strip is very irregular, and the non-constant of outward appearance.
Tested the performance of the conducting strip of above preparation.Table 2 has shown the result.
Table 2
Surface resistivity (ohm) Tensile properties (flow to/laterally) Carbon comes off Surface roughness (micron) Surface gloss Image is checked characteristic
Extension at break (%) Intensity during fracture (MPa) Yield point strength (Mpa) Stretch modulus
Embodiment 5 10 4 12/11 42/41 48/49 1760/1718 ◎ 3.76 2 ○
Embodiment 6 10 4 10/9 45/43 52/50 1852/1769 ◎ 0.67 21 ○
Embodiment 7 10 4 12/12 43/43 50/50 1812/1750 ◎ 1.09 17 ○
Embodiment 8 10 4 8/9 40/40 46/45 1720/1680 ◎ 2.11 5 ○
Comparing embodiment 3 10 4 99/23 32/20 39/38 1469/1453 ○ 0.22 65 ×
Comparing embodiment 4 10 4 96/75 25/20 25/23 1666/1539 × 4.55 1 ○
Embodiment 9
With the exhaust twin (double) screw extruder of 50 millimeters of φ polycarbonate type resin (the Panlight L-1225 that kneads in advance, Teijin Chemicals Ltd. makes) and carbon black (the KETJENBLACK EC that accounts for polycarbonate type resin 12 weight %, LION-AKZO makes) and graft resin (the Modiper A-4400 of 5 weight %, NOFCorporation makes, main chain 70 weight %/side chains: 30 weight %), granulation then obtains resin combination.
Launch described resin combination with 65 millimeters extruders of φ (L/D=28) and wide 500 millimeters T-mould, the acquisition gross thickness is 300 microns a conducting strip.
Embodiment 10
With the exhaust twin (double) screw extruder of 50 millimeters of φ polycarbonate type resin (the Panlight L-1225 that kneads in advance, Teijin Chemicals Ltd. makes) and account for polycarbonate type resin 12 weight % carbon black (KETJENBLACK EC, LION-AKZO makes), granulation then obtains resin combination.
Launch described resin combination with 65 millimeters extruders of φ (L/D=28) and wide 500 millimeters T-mould, the acquisition gross thickness is 300 microns a conducting strip.
Embodiment 11
With the same resin combination among the embodiment 9 as the top layer, acrylonitrile-butadiene-styrene copolymer type resin (Techno ABS YT-346, Techno Polymer Co., Ltd makes) as the resin of substrate layer, with 65 millimeters extruders of φ (L/D=28), 40 millimeters extruders of φ (L/D=26) and wide 500 millimeters T-mould, the top layer is deployed on two faces of substrate layer by the feed sleeve method, obtain gross thickness and be 300 microns three layers the conducting strip of containing, the resin combination layer thickness on the two sides is 30 microns.
Embodiment 12
With the exhaust twin (double) screw extruder of 50 millimeters of φ polycarbonate type resin (the Panlight L-1225 that kneads in advance; Teijin Chemicals Ltd. makes) and account for graft resin (the Modiper A-4400 of the acetylene black (DenkiKagaku Kogyo K.K manufacturing) of polycarbonate type resin 20 weight % as carbon black and 10 weight %; NOFCorporation makes), granulation obtains resin combination then.With 65 millimeters extruders of φ (L/D=28), two 40 millimeters extruders of φ (L/D=26) and be used for three types three layers, wide 650 millimeters many menifolds mould, above-mentioned resin combination is laminated on the two sides of mixture, this mixture contains acrylonitrile-butadiene-styrene copolymer type resin (Techno ABS YT-346 as substrate layer, Techno Polymer Co., Ltd makes) and add therein 5 weight % polycarbonate type resin (Panlight L-1225, Teijin Chemicals Ltd. makes), acquisition contains three layers conducting strip, gross thickness is 500 microns, all has thickness and be 40 microns conductive resin composition layer on its two sides.
Tested the performance of above-mentioned conducting strip, table 3 has been listed the result.
Table 3
Surface resistivity (ohm) Tensile properties (flow to/laterally) Dupont impact strength (J) Carbon comes off
Extension at break (%) Intensity during fracture (MPa) Yield point strength (Mpa) Stretch modulus
Embodiment 9 10 4 8/7 52/50 52/50 2035/2087 0.95 ◎
Embodiment 10 10 4 10/12 54/53 59/58 2200/2295 0.75 ◎
Embodiment 11 10 4 11/10 41/39 47/48 1710/1680 0.65 ◎
Embodiment 12 10 4 9/8 44/42 50/48 1780/1730 0.68 ◎
Embodiment 9 and 10 is different, because embodiment 9 has used graft resin, can obviously find out, mixes graft resin and has improved the Dupont impact strength.In addition, from embodiment 11 and 12 obviously as seen, resin combination of the present invention not only can prepare the individual layer conducting strip, can also prepare the multilayer conductive sheet.
Embodiment 13
As substrate layer material, use in table 4 list the polyethylene terephthalate type resin that ratio mixes (PET9921,0.80) and polycarbonate type resin (Panlight L-1250L Eastman makes, the IV value:, TeijinChemicals Ltd. preparation), mix the material of acquisition then.Use contains polycarbonate type resin (the Panlight L-1250L of 100 weight portions, Teijin Chemicals Ltd. preparation) and the carbon black (Denka Black particle, Denki Kagaku Kogyo K.K manufacturing) that is dispersed in 20 weight portions wherein as skin-material.With dry each material of moisture-catcher.Then, simultaneously with 40 millimeters single-screw extrusion machines and the 65 millimeters single-screw extrusion machines material of extruding top layer and substrate layer under 260-300 ℃ extrusion temperature respectively, by being used for the feed sleeve of three layers of two classes (the thickness slit is than=1: 8: 1), with width these three layers of molten resins of T-mould extruded lamination of 650 millimeters, launch with a quench roller again, preparation thickness is 0.30 millimeter three layers the conducting strip of containing, and it has 1: 8: 1 thickness than (top layer: substrate layer: the top layer).
Embodiment 14 and 15 and comparing embodiment 5-7
Same procedure preparation with embodiment 13 contains three layers conducting strip, and different is with the composition of listing in the table 4.
Comparing embodiment 8
The same electroconductive resin that adopts embodiment 13 mesexine to use pushes preparation individual layer conducting strip with 65 millimeters single-screw extrusion machines of φ under 260-300 ℃ extrusion temperature.
Embodiment 16 and 17 and comparing embodiment 9 and 10
Contain three layers conducting strip with the preparation of the same procedure of embodiment 14, the thickness of different is each layer in the sheet is than as shown in table 4.
For the conducting strip that obtains in these embodiment and the comparing embodiment, tested their surface resistivity, tensile properties, carbon obscission, folding intensity and impact strength.In addition, the conducting strip of these embodiment and comparing embodiment is configured as the carrier band with carrier band forming machine, assesses its suitability for secondary processing.Table 5 has shown the result.
Table 4
Embodiment Comparing embodiment
13 14 15 16 17 5 6 7 8 9 10
Substrate layer PC type resin 60 40 20 40 40 0 100 80 40 40
PET type resin 40 60 80 60 60 100 0 20 60 60
The top layer PC type resin 100 100 100 100 100 100 100 100 100 100 100
Top layer/substrate layer/skin depth ratio 1/8/1 1/8/1 1/8/1 1/18/1 1/6/1 1/8/1 1/8/1 1/8/1 3/1/3 1/100/1
Table 5
Embodiment Comparing embodiment
13 14 15 16 17 5 6 7 8 9 10
Surface resistivity Ω 2.4×10 4 3.1×10 4 1.9×10 4 3.2×10 4 2.3×10 4 2.8×10 4 3.1×10 4 4.1×10 4 1.9×10 4 2.3×10 4 5.2×10 4
Tensile properties Fracture stretching % 118 136 195 156 89 301 71 75 13 28 169
Yield point strength MPa 49 47 46 47 47 46 53 51 59 48 47
Breakaway poing intensity MPa 62 55 49 55 55 47 60 56 55 56 54
Stretch modulus MPa 1566 1628 1629 1635 1631 1530 1520 1732 1641 1655 1590
Carbon comes off- ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎
The folding intensity time 251 384 1083 415 350 3020 21 38 15 27 430
Impact strength J 0.7 0.6 0.5 0.7 0.6 1.1 0.5 0.8 0.9 0.8 0.6
Suitability for secondary processing- ○ ○ ○ ○ ○ × △ ○ × △ ○
Embodiment 18
With the exhaust twin (double) screw extruder of 50 millimeters of φ polycarbonate type resin (the Panlight L-1225 that kneads in advance; Teijin Chemicals Ltd. makes) and account for carbon black (the KETJENBLACK EC of polycarbonate type resin 12 weight %; LION-AKZO makes), granulation obtains conductive resin composition then.With the extruder (L/D=26) of 40 millimeters of 65 millimeters extruders of φ (L/D=28), φ and wide 500 millimeters T-mould this conductive resin composition is laminated to inferior amidatioon copolymer (Denka Malecca K-400 as substrate layer by feed sleeve, Denki Kagaku Kogyo K.K. manufacturing) on the two sides, obtain gross thickness and be 300 microns three layers the conducting strip of containing, the thickness of its each face upper surface layer all is 30 microns.
Embodiment 19
With the exhaust twin (double) screw extruder of 50 millimeters of φ polycarbonate type resin (the Panlight L-1225 that kneads in advance; Teijin Chemicals Ltd. makes) and account for carbon black (the DenkaBlack particle of polycarbonate type resin 20 weight %; Denki Kagaku Kogyo K.K makes), granulation obtains conductive resin composition then.With inferior amidatioon copolymer (Denka Malecca K-510, Denki Kagaku Kogyo K.K. makes) as substrate layer, same procedure acquisition gross thickness with embodiment 18 is 200 microns conducting strips that contain three layers, and the thickness of its each face upper surface layer all is 20 microns.
Embodiment 20
Same procedure with embodiment 18 obtains conductive compound.With the extruder (L/D=26) of 40 millimeters of 65 millimeters extruders of φ (L/D=28), two φ be used for wide 650 millimeters many menifolds mould of three layers of three types, this conductive compound is laminated to as containing of substrate layer resin inferior amidatioon copolymer (Denka Malecca K-400, Denki Kagaku Kogyo K.K. makes) and adding wherein on the two sides of the resin of the above-mentioned conductive compound of 10 weight %, obtain gross thickness and be 500 microns three layers the conducting strip of containing, the thickness of each face upper surface layer all is 40 microns.
Embodiment 21
Same procedure with embodiment 18 obtains to contain three layers conducting strip, and different is as substrate layer with inferior amidatioon copolymer (Denka Malecca K-610, Denki Kagaku Kogyo K.K. makes).
Comparing embodiment 11
Same procedure with embodiment 18 obtains to contain three layers conducting strip; different is with the exhaust twin (double) screw extruder of 50 millimeters of φ polystyrene resin (the Toyo Styrol E640N that kneads in advance; Toyo Styrene makes) and account for polyvinyl resin (the Hyzex 5000H of polystyrene resin 10 weight %; Mitsui Chemicals; Inc.) and the carbon black of 12 weight % (KETJENBLACK EC; LION-AKZO makes), granulation obtains the electroconductive resin compound then, as conductive resin composition.With acrylonitrile-butadiene-styrene copolymer type resin (Ltd makes for Techno ABSYT-346, Techno Polymer Co.) as the substrate layer resin.
Comparing embodiment 12
Same procedure with embodiment 18 obtains to contain three layers of conducting strip, different is with the exhaust twin (double) screw extruder of 50 millimeters of φ polystyrene resin (the Toyo Styrol E640N that kneads in advance, Toyo Styrene makes) and account for carbon black (the KETJENBLACK EC of polystyrene resin 12 weight %, LION-AKZO makes), granulation then, obtain the electroconductive resin compound, as conductive resin composition.With polystyrene resin (Toyo Styrol E640N, ToyoStyrene make) as the substrate layer resin.
Zhi Bei above-mentioned conducting strip has carried out following test like this.
Table 6
Surface resistivity (ohm) Tensile properties (flow to/laterally) Carbon comes off
Extension at break (%) Intensity during fracture (MPa) Yield point strength (Mpa) Stretch modulus
Embodiment 18 10 4 28/16 46/43 50/47 1903/1931 ◎
Embodiment 19 10 4 22/14 41/40 43/42 1755/1647 ◎
Embodiment 20 10 4 12/12 49/44 52/50 1951/1980 ◎
Embodiment 21 10 4 17/11 42/38 44/42 1756/1620 ◎
Comparing embodiment 11 10 4 99/52 35/32 43/42 1536/1463 ○
Comparing embodiment 12 10 4 95/89 21/20 20/19 1166/1139 ×
Method of testing is as follows:
Physical property is at 23 ℃, and humidity is measured for 50% time, unless otherwise indicated.For folding intensity and impact strength, test result is that it is more general than formed product according to the standard as conducting strip.
Surface resistivity
With Mitsubishi Petrochemical Co., the Rolestar MCP tester that Ltd makes, distance between the terminals is 10 millimeters, two lines are got equally spaced 10 points on width on two faces, promptly 40 points are measured altogether, and the mean value of taking the logarithm is as surface resistivity.
Tensile properties
According to JIS-K-7127, with Instron type cupping machine, be that 10 mm/min have been carried out extension test at draw speed with No. 4 samples, the mean value of getting flow directional detection and cross measure result is as end product.
The Dupont impact strength
(TOYO SEIKI SEISAKU-SHO LTD), makes bullet fall on the conducting strip, obtains 50% fracture height, from the weight and the described high computational energy value of bullet with the Dupont shock machine.Calculate according to JIS-K-7211.
The charcoal assessment that comes off
The conducting strip of form of film is configured as has 19 millimeters * the carrier band of the pocket of 25 millimeters sizes, be fixed on the shaking table.The IC of QFP14 millimeter * 20 millimeter-64 pins is locked in its pocket part, vibrates 800,000 times, observe then whether deposit is arranged on the IC lead portion with 480 reciprocal speed of stroke per second of 30 millimeters of horizontal directions.Evaluation criteria is ◎: do not observe deposit substantially, zero: observe some deposits, *: observe many deposits.
Surface roughness
With TOKYO SEIMITSU CO., the Surfcom 120A that Ltd makes measures the center line surface roughness according to JIS-B-0651.
Surface gloss
5 some Horiba on two faces, the glossiness detector IG-301 that Ltd makes measures the glossiness of conducting strip, obtains the mean value on each face, gets minimum as glossiness.
Image is checked characteristic test
Use the conducting strip of form of film to be configured as the carrier band, wherein have size and be 19 millimeters * 25 millimeters pocket.The IC of QFP14 millimeter * 20 millimeter-64 pins is contained in the pocket part, uses the CCD camera of 360,000 pixels to determine whether to exist bag virtual image of bottom then.Evaluation criteria is *: the virtual image is clearly arranged, △: unsharp virtual image and zero are arranged: the no virtual image.
Folding intensity
According to JIS-P-8116, flow to sampling at conducting strip, test with 500 gram loads and the reciprocal 175 times folding rate of per minute.
Suitability for secondary processing
With carrier band forming machine (EDG manufacturing) conducting strip is made wide 24 millimeters carrier band, be used for assessing its processing characteristics.Evaluation criteria is zero: good, △: weaker and *: poor.
Industrial applicability
According to the present invention, provide and basically to have eliminated because the electronic component that conducting strip and electronic component friction cause is stained, had sufficient mechanical strength, can stand the high-speed packaging of electronic component and installation, the conducting strip that is used for packing electronics brother part, and the packing container used of electronic component.

Claims (21)

1. conducting strip, it is characterized in that, this conducting strip comprises the substrate layer of one deck thermoplastic resin, described thermoplastic resin is to contain acrylonitrile-butadiene-styrene copolymer type resin and/or polystyrene type resin, and being laminated to the described substrate layer top layer of conductive resin composition on the one side at least, described conductive resin composition contains polycarbonate type resin and based on the carbon black of described polycarbonate type resin 5-50 weight %.
2. conducting strip as claimed in claim 1 is characterized in that, substrate layer also contains the polycarbonate type resin that accounts for thermoplastic resin 1-50 weight %.
3. conducting strip as claimed in claim 1 is characterized in that described conductive resin composition also contains acrylonitrile-butadiene-styrene copolymer type resin or polybutylene terephthalate resin.
4. conducting strip, it is characterized in that, this conducting strip comprises substrate layer, and be pressed with the top layer of conductive resin composition in the one side upper strata at least at substrate layer, described conductive resin composition contains polycarbonate type resin, accounts for the carbon black of polycarbonate type resin 5-50 weight % and the graft resin of the ethene of 40 weight %-glyceryl methacrylate type copolymer and acrylonitrile-styrene type copolymer at the most.
5. conducting strip as claimed in claim 4 is characterized in that described substrate layer contains acrylonitrile-butadiene-styrene copolymer type resin and/or polystyrene type resin.
6. conducting strip, it is characterized in that, this conducting strip comprises substrate layer, described substrate layer contains PET type resin and polycarbonate type resin, these two kinds of component ratios are: in the total amount of two kinds of compositions, PET type resin is 35-97 weight %, polycarbonate type resin is 3-65 weight %, at least has the top layer of conductive resin composition on the one side at substrate layer, described conductive resin composition contains the carbon black of polycarbonate type resin and 5-50 weight %, and the thickness of its mesexine is the 2-80% of gross thickness.
7. conducting strip, it is characterized in that, this conducting strip comprises substrate layer, described substrate layer contains the inferior amidatioon copolymer with aromatic vinyl monomer residue and the inferior amide derivatives residue of unsaturated dicarboxylic, and being laminated to the substrate layer conductive resin composition top layer on the one side at least, described conductive resin composition contains polycarbonate type resin and accounts for the carbon black of polycarbonate type resin 5-50 weight %.
8. conducting strip as claimed in claim 7 is characterized in that, described inferior amidatioon copolymer also contains rubber polymer and unsaturated dicarboxylic acid anhydride residue.
9. conducting strip, it is characterized in that, this conducting strip comprises a substrate layer, described substrate layer contains inferior amidatioon copolymer, described copolymer contains the rubber polymer of 0-40 weight %, 30-70 weight % aromatic vinyl monomer residue, inferior amide derivatives residue of 20-60 weight % unsaturated dicarboxylic and 0-15 weight % unsaturated dicarboxylic acid anhydride residue, and being laminated to the described substrate layer conductive resin composition top layer on the one side at least, described resin combination contains polycarbonate type resin and accounts for the carbon black of polycarbonate type resin 5-50 weight %.
10. conducting strip as claimed in claim 9 is characterized in that, described inferior amidatioon copolymer also contains more than 0 weight %, but and is no more than the ethene residue of the copolymerization of 40 weight %.
11., it is characterized in that described substrate layer also contains acrylonitrile-butadiene-styrene copolymer type resin as each described conducting strip of claim 7-10.
12. conducting strip as claimed in claim 11 is characterized in that, the amount of described inferior amidatioon copolymer is the 5-93 weight % that accounts for inferior amidatioon copolymer and acrylonitrile-butadiene-styrene copolymer type resin total amount.
13., it is characterized in that substrate layer contains the carbon black that accounts for resin total amount 0.1-10 weight % as each described conducting strip of claim 1-12.
14., it is characterized in that described top layer has the surface roughness of 0.6-4.0 micron as each described conducting strip of claim 1-13.
15., it is characterized in that this conducting strip is made by co-extrusion pressure as each described conducting strip of claim 1-14.
16. resin combination, it is characterized in that, said composition contains polycarbonate type resin, accounts for the carbon black of polycarbonate type resin 5-50 weight % and the graft resin of the ethene of 40 weight %-glyceryl methacrylate type copolymer and acrylonitrile-styrene type copolymer at the most.
17. formed product made from the described resin combination of claim 16.
18. conducting strip made from the described resin combination of claim 16.
19. a conducting strip that is used for packaging electronic components is characterized in that, this conducting strip is made with claim 1-15 and 18 each described conducting strips.
20. a packing container that is used for electronic component is characterized in that, this container is to prepare with the described conducting strip that is used for packaging electronic components of claim 19.
21. carrier band that the conducting strip of using with the described packaging electronic components of claim 20 is made.
CNB008149178A 1999-10-27 2000-10-26 Resin composition, molded product thereof and electroconductive sheet Expired - Lifetime CN1318210C (en)

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