CN1316736C - Electronic component mfg. method and device, and driving methof for said making device - Google Patents
Electronic component mfg. method and device, and driving methof for said making device Download PDFInfo
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- CN1316736C CN1316736C CNB2003101143574A CN200310114357A CN1316736C CN 1316736 C CN1316736 C CN 1316736C CN B2003101143574 A CNB2003101143574 A CN B2003101143574A CN 200310114357 A CN200310114357 A CN 200310114357A CN 1316736 C CN1316736 C CN 1316736C
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- warpage
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- 238000000034 method Methods 0.000 title abstract description 38
- 238000004519 manufacturing process Methods 0.000 claims abstract description 37
- 238000009434 installation Methods 0.000 claims description 24
- 239000011347 resin Substances 0.000 abstract description 33
- 229920005989 resin Polymers 0.000 abstract description 33
- 239000013078 crystal Substances 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract 6
- 230000008569 process Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 9
- 239000002912 waste gas Substances 0.000 description 9
- 238000003776 cleavage reaction Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 230000007017 scission Effects 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000008439 repair process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Wire Processing (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Provided is an electronic component manufacturing method, a manufacturing equipment therefor which facilitates maintenance and assures a high accuracy in bending and a driving method for the manufacturing equipment. An electric component manufacturing equipment which bends downward a first lead piece between a mid portion and a front end portion of the lead of the electronic component comprising a resin mold portion incorporating electronic devices and a lead extending from the mold portion, and then bends the first lead piece toward the bottom side of the resin mold portion after the root of the lead is bended, wherein the electric component manufacturing equipment is provided with a bending die D231 and a pair of bending punches D217 mounted outside the bending D231 such that they are horizontally movable. A cam driver 117 is lowered to drive the bending punch D217 in a horizontal direction, then to horizontally push the lead of the crystal vibrator overlaid on the bending punch D231 which then bends the front end of the lead toward the bottom side of the resin mold portion.
Description
Technical field
The present invention relates to comprise that inside is provided with resin molded of electronic unit and from the manufacture method of the electronic unit of this resin molded outstanding lead-in wire, the driving method of its manufacturing installation and this manufacturing installation particularly relates to the warpage of the lead-in wire of electronic unit.
Background technology
Fig. 9 (A) and (B) be the stereogram of crystal resonator and the key diagram of its lead-in wire.This crystal resonator 1 is provided with resin molded 2 of electronic unit etc. by inside, constitutes from this resin molded 2 outstanding lead-in wire 3.In addition, resin molded 2 bottom, be provided with the recess 2a of the front that is used to admit lead-in wire 3, this lead-in wire 3 is according to surrounding resin molded 2 the mode of sidepiece towards the bottom side warpage, and the front of this lead-in wire 3 is accommodated in the recess 2a.The root of the lead-in wire 3 of this moment must be according to the mode of warpage angle [alpha] at 0～10 °, towards inboard warpage.In this manner, comprise that resin molded 2 height with the crystal resonator 1 of lead-in wire 3 reduces, realize that thickness reduces, volume reduces.But because lead-in wire 3 is above-mentioned shape, so drift is descended from the top, promptly the 3 generation resiliences that go between can not obtain such shape with outstanding mode warpage.
Figure 10 is the key diagram that is used for the cam mechanism of the lead-in wire warpage of above-mentioned crystal resonator.This cam mechanism is the mechanism that makes the terminal stage warpage of lead-in wire (the 4th warpage processing of the Fig. 6 that will describe with the back is corresponding), it is by the cam driving medium 11 that is arranged at the nest plate side, rotatably is supported on the template side and the cam lever 12 that is provided with constitutes.If cam driving medium 11 is descended, the front end of cam driving medium 11 and cam lever 12 are chimeric, and cam lever 12 will go between 3 towards inboard warpage towards interior sideway swivel.
The cam mechanism in above-mentioned past has following problem in the occasion of the batch process of carrying out electronic unit.
1. the component shape complexity is difficult to keep in repair.Because cam lever 12 and bar keeper 13 is complex-shaped, particularly cam lever 12 is difficult to form the shape of relative pin-and-hole 14, so most occasion must be carried out trickle adjustment when changing parts.
2. cam lever shaft 15 thin (because of the restriction in the mechanism, it is thinner to have to), intensity a little less than.In addition, because this axle 15 is freely, the rotating range of cam lever 12 is also narrower, keeps constant, so wear away easily.If cam lever shaft 15 wears away, owing to cam lever 12 misplaces, so the warpage generation is bad.
3. cam mechanism (cam lever) is positioned at the counterdie components side, and the waste gas body in resin molded (assembly) enters and causes interference easily, and the precision of warpage is impacted.
Such as, because the waste gas body does not drop to the below, thus do not rotate in the position that stops at the cam lever 12 shown in Figure 10 right side, or the part of " A " in Figure 10 has the occasion of more waste gas body, cam lever 12 does not rotate to the final position, and lead-in wire 3 does not flex into assigned position.So, owing to be sent to next step at this state, thus have parts destruction, or with the problem of mould destruction etc.
Summary of the invention
The present invention proposes in order to address the above problem, the object of the present invention is to provide a kind ofly to keep in repair easily, and the manufacture method of the higher electronic unit of warpage precision, the driving method of its manufacturing installation and this manufacturing installation.
(1) manufacture method of the electronic unit of a kind of form of the present invention relates to and comprises that inside is provided with the resin molded portion of electronic component, and from the manufacture method of the electronic unit of this resin molded outstanding lead-in wire, at least comprise:, form first operation of the 1st joggling part the part 1 warpage in the above-mentioned lead-in wire; Second operation with near the warpage root of above-mentioned lead-in wire; Press down above-mentioned lead-in wire by along continuous straight runs, further make near the 3rd operation of the joggling part warpage of above-mentioned root.In this manner, because in the 3rd operation, along continuous straight runs presses down lead-in wire, so the seldom damage of defectiveness etc. on the face in going between, in addition, the front end of lead-in wire is with the bottom side warpage of higher precision towards electronic unit.
(2) manufacture method of the electronic unit of another kind of form of the present invention is in the form of above-mentioned (1), and above-mentioned the 1st joggling part is formed between the leading section and pars intermedia of above-mentioned lead-in wire.In this manner, during near further making root joggling part warpage, by near will the root of lead-in wire and along continuous straight runs pushing between the 1st joggling part, effect has bigger stress near root, and its warpage processing has degree of precision.
(3) manufacture method of the electronic unit of another form of the present invention is in the form of above-mentioned (1) or (2), and above-mentioned first operation is several times with above-mentioned part 1 warpage.In this manner, each warpage amount seldom makes alleviating of resilience.
(4) manufacture method of the electronic unit of another form of the present invention is a crystal resonator for electronic unit in the form of above-mentioned (1) or (2), thereby can obtain thin crystal resonator.
(5) the present invention also provides a kind of manufacturing installation of electronic unit, be used for to be formed at lead-in wire warpage on the electronic unit by upper die and lower die, it is characterized in that, on patrix, be formed with cam driving medium and warpage drift, on counterdie, be formed with that joggle die, along continuous straight runs corresponding to the warpage drift moves and as the front end warpage that will go between to the cam of the warpage drift of the bottom side of electronic unit and the plane roller that the cam along continuous straight runs is moved by cam driving medium.In this manner, because the damage of the defective on the lead-in wire face etc. seldom, so obtain good goods.In addition, because maintenance capacity is also less, so can carry out high-precision warpage processing.Also have, owing to be not to require the structure of bar axle in the cam lever mode in the past, so there are not the short parts of operating period thresold, the frequency of maintenance is very little, keeps in repair easily.
(6) manufacturing installation of the electronic unit of another kind of form of the present invention is in the form of above-mentioned (5), and cam bears pulling force on the direction away from joggle die, and forms the gap between cam and joggle die.In this manner, because cam is positioned at the position of leaving joggle die all the time, between forms the gap, so be in easily the state with the eliminatings such as waste gas of assembly.
(7) according in of the present invention as (5) or (6) described manufacturing installation form, because above-mentioned cam slides by plane roller along continuous straight runs, so, even adhere under the situation of waste gas, still guarantee sliding at assembly etc.
(8) manufacturing installation of the electronic unit of another kind of form of the present invention is to be used to make comprise that inside is provided with the resin molded portion of electronic component, and from the electronic unit of resin molded outstanding lead-in wire, manufacturing installation comprises the 1st warpage drift and the 1st joggle die at least, the 1st warpage drift is used for the part 1 warpage with lead-in wire, form the 1st joggling part, the 1st joggle die forms corresponding to the 1st warpage drift; The 2nd warpage drift and the 2nd joggle die, the 2nd warpage drift are used near the warpage lead-in wire root, and the 2nd joggle die is provided with corresponding to the 2nd warpage drift; Cam driving medium and the 3rd warpage drift, cam driving medium are used near the further warpage of the joggling part the root, the corresponding cam driving medium of the 3rd warpage drift and form and along continuous straight runs moves.In this manner, because the driving amount of warpage drift depends on the relative position of the horizontal direction of cam driving medium and warpage drift, thus can easily will should the driving amount be limited to certain value, in addition, because resilience is also less, so can carry out high-precision warpage processing.In addition, owing to be not to need the structure of bar axle in the cam lever mode in the past, so there is not the short product of operating period thresold, frequency of maintenance is very little, keeps in repair easily.
(9) manufacturing installation of the electronic unit of another form of the present invention is in the form of above-mentioned (8), also comprise the 4th warpage drift and the 3rd joggle die, the 4th warpage drift is used for the further warpage of above-mentioned the 1st joggling part, and the 3rd joggle die is provided with corresponding to above-mentioned the 4th warpage drift.In this manner, each warpage amount is very little, makes the alleviating of resilience of the lead-in wire that warpage causes.
(10) manufacturing installation of the electronic unit of another kind of form of the present invention is that the leading section of the 1st, the 2nd and the 4th warpage drift is the curved surface shape in the form of above-mentioned (8) or (9).In this manner, the leading section of warpage drift is the curved surface shape, when pressing down, does not have defective on lead-in wire.
(11) manufacturing installation of the electronic unit of another form of the present invention is in the form of above-mentioned (8)～(10), is formed for getting rid of the through hole of waste gas in the lead-in wire etc. around above-mentioned each joggle die.In this manner, by through hole, the waste gas of resin molded and lead-in wire is got rid of.
(12) manufacturing installation of the electronic unit of also a kind of form of the present invention is in the form of above-mentioned (8)～(11), and the above-mentioned the 1st and the 2nd joggle die is that the root of the close above-mentioned lead-in wire of at least a portion forms neighbouringly.Thus, the warpage of lead-in wire keeps stable.
(13) manufacturing installation of the electronic unit of another form of the present invention is in the form of above-mentioned (8)～(12), mode according to the lead-in wire warpage that will form along the long axis direction of above-mentioned electronic unit, form above-mentioned each warpage drift, above-mentioned each joggle die and above-mentioned cam driving medium.Thus, the present invention's electronic unit that can be suitable for going between and form along long axis direction.
(14) manufacturing installation of the electronic unit of another form of the present invention is in the form of above-mentioned (8)～(12), mode according to the lead-in wire warpage that will form along the short-axis direction of above-mentioned electronic unit, form above-mentioned each warpage drift, above-mentioned each joggle die and above-mentioned cam driving medium.Thus, the present invention's electronic unit that can be suitable for going between and form along short-axis direction.
(15) driving method of manufacturing installation of the present invention relates to the driving method of following manufacturing installation, this manufacturing installation manufacturing comprises that inside is provided with the resin molded portion of electronic component, and, drive the 1st warpage drift that is used for the part 1 warpage of above-mentioned lead-in wire from the electronic unit of this resin molded outstanding lead-in wire; Driving is used for the 2nd warpage drift with near the warpage root of above-mentioned lead-in wire; Driving is used near the cam driving medium of the further warpage of the joggling part above-mentioned root and the 3rd warpage drift, and these mat woven of fine bamboo strips 3 warpage drifts form corresponding to above-mentioned cam driving medium, and along continuous straight runs moves.Thus, the damage of the defective on the lead-in wire face etc. seldom obtains good goods.In addition, because maintenance capacity is very little, can carry out high-precision warpage processing.Also have, owing to be not to need the structure of bar axle in the cam lever mode in the past, so there are not the short parts of operating period thresold, the frequency of keeping in repair is very little, keeps in repair easily.
(16) driving method of the manufacturing installation of another form of the present invention is in the form of above-mentioned (15), by driving above-mentioned cam driving medium, drives above-mentioned the 3rd warpage drift.Thus, the damage of the defective on the lead-in wire face etc. seldom, with higher precision with the lead-in wire front end towards the bottom of electronic unit warpage.
Description of drawings
Fig. 1 is the figure of mechanical cam ring driving member of the mould in the presentation graphs 2 and warpage drift periphery concrete structure.
Fig. 2 is equipped with the cutaway view of mould mechanical structure of manufacturing installation of the electronic unit of one embodiment of the present of invention for expression.
The key diagram that Fig. 3 processes for the 1st warpage that adopts warpage drift and joggle die.
The key diagram that Fig. 4 processes for the 2nd warpage that adopts warpage drift and joggle die.
The key diagram that Fig. 5 processes for the 3rd warpage that adopts warpage drift and joggle die.
The key diagram that Fig. 6 processes for the 4th warpage that adopts the warpage drift.
Fig. 7 carries out the action specification figure of each several part that the 4th warpage among Fig. 6 adds the Fig. 1 in man-hour.
Fig. 8 is the stereogram of crystal resonator (its 1).
Fig. 9 is the stereogram of crystal resonator (its 2) and the key diagram of its lead-in wire.
Figure 10 is the key diagram that is used for the cam structure of the lead-in wire warpage of the crystal resonator of Fig. 9.
Embodiment
The 1st embodiment
Fig. 2 is equipped with the cutaway view of mould mechanical structure of manufacturing installation of the electronic unit (crystal resonator) of one embodiment of the present of invention for expression.In this mould machinery, as shown in Figure 2, upper mould fixed plate 101 is installed at the bottom surface side of membrane module 100, in addition, drift fishplate bar 102 is installed at the bottom surface side of upper mould fixed plate 101.The below of this drift fishplate bar 102 is provided with in flexible mode and is supported on stripper plate 103 on the upper die component 100, at the bottom surface side of this stripper plate 103 demoulding piece 104～106 is installed.
On drift fishplate bar 102, resin cleavage drift A110 is installed, resin cleavage drift B111 to the direction in downstream along upstream side from processing, connecting rod cutting punch 112, lead-in wire cutting punch 113, warpage drift A114, warpage drift B115, warpage drift C116, cam driving medium 117 clamps cutting punch 118, and in addition, these parts are along with the decline of upper die component 100, pass the hole that offers in stripper plate 103 and the demoulding piece 104～106, outstanding towards the below.In addition, in upper die component 100, be separately installed with top retainer 120 and feed pin 121 by mistake.
Mode according to relative with upper die component 100 thereunder is provided with down membrane module 200, at its end face counterdie fixed head 201 is installed, and in addition, template 202 is installed thereon.On this template 202, the edge is equipped with resin cleavage mould 210, connecting rod blanking punch 212 from the direction in the upstream side downstream of processing, lead-in wire blanking punch 213, joggle die A214, joggle die B215, joggle die C216 as the warpage drift D217 of cam, and clamps blanking punch 218.In addition, in following membrane module 200, be provided with bottom stop spare 220, in addition, on counterdie fixed head 201 and template 202, the wrong hole 221 that pin 121 inserts that feeds be set when punching press according to the mode relative with top retainer 120.
Fig. 1 is the figure of the peripheral concrete structure of mechanical cam ring driving member 117 of the mould in the presentation graphs 2 and warpage drift D217.This cam driving medium 117 is fixed on the nest plate 102 by retainingf key 122.In addition, be formed with at the leading section of cam driving medium 117 and be used for the rake 117a chimeric with warpage drift D217.This warpage drift D217 according to across 230 and the mode of joggle die D231 be provided with 1 pair.Also have, on warpage drift D217, the chimeric threadably leading section that the bolt 232 that along continuous straight runs connects is arranged has again, is provided with pad 233,234 in the head side of the bolt 232 in template 202 outsides, is provided with spring 235 betwixt.For this reason, warpage drift D217 towards the direction biasing away from joggle die D231, is formed with the gap at ordinary times between warpage drift D217, thus, and easily with the eliminatings such as waste gas body in the resin.Also have, warpage drift D217 is provided with the chimeric rake 217a of rake 117a that is used for the front end of cam driving medium 117, in addition, offers on template 202 and is used to the hole 202a that allows cam driving medium 117 to descend.
In addition, be provided with plane roller 236, thereby but warpage drift D217 along continuous straight runs is successfully mobile in the bottom of warpage drift D217.Also have, on counterdie fixed head 201, offer porosely 240 with the corresponding position of the peripheral part of joggle die D231, on membrane module 200 down, also offer porosely 241 with 240 corresponding positions, hole, this hole 240,241 forms through holes.In addition, in following membrane module 20O, be provided with promote pin 230 towards above the spring 242 of biasing.
The main contents of the action in the mould machinery among Fig. 2 and Fig. 1 are as described below.
If upper die component 100 is realized descending through the guide post (not shown), at first, 106 pushings of demoulding piece are arranged at lead frame and the setting resin molded portion thereon on the template 202.Then, drift fishplate bar 102 descends, and carries out following punching press respectively.
1. by by the punch process of resin cleavage drift A110 and resin cleavage drift B111 and resin cleavage mould 210, do not want part in resin molded on the cutting lead frame.
2. by the punch process by connecting rod cutting punch 112 and connecting rod blanking punch 212, the connecting rod on the cutting lead frame.
3. by the punch process by lead-in wire cutting punch 113 and lead-in wire blanking punch 213, the length cutting is from resin molded outstanding lead-in wire according to the rules.
4. by punch process, lead-in wire is carried out the 1st warpage processing (with reference to Fig. 3) by warpage drift A114 and joggle die A214.
5. by punch process, lead-in wire is carried out the 2nd warpage processing (with reference to Fig. 4) by warpage drift B115 and joggle die B215.
6. by punch process, lead-in wire is carried out the 3rd warpage processing (with reference to Fig. 5) by warpage drift C115 and joggle die C215.
7. by driving warpage drift D217,, lead-in wire is carried out the 4th warpage processing (with reference to Fig. 6) by punch process by warpage drift D217 by cam driving medium 117.
8. by punch process by clamping cutting punch 118 and clamping blanking punch 218, push the end face of resin molded portion with drift 118, lead-in wire is in resin molded incision of warpage state, by being opened in the hole 201a and the hole 200a that is arranged at down in the membrane module 200 in the counterdie fixed head 201, electronic unit is discharged towards the below.
1. above-mentioned～8. punch process carries out simultaneously, but since lead frame according to the punch process degree, send to the order in downstream according to upstream side, so successively the crystal resonator on the lead frame is carried out 1. above-mentioned～8. punch process.In addition, mistake feeds the sendout that pin 121 is used to detect lead frame.The occasion that is fit in the sendout of lead frame, by in lead frame according to the rules the hole offered of spacing arrive 221 places, hole, and in the unaccommodated occasion of the sendout of lead frame, mistake feeds pin 121 and runs into lead frame.By detecting the amount of movement that this mistake feeds pin 121, in such occasion, stop the processing of the following degradation of upper die component 100, punch process is stopped.In addition, with the top retainer 120 of relative mode setting and counterdie retainer 220 restriction upper die components 100, be the slippage of each drift, thus the punch process that is fit to.
The key diagram that Fig. 3 processes for the 1st warpage that adopts warpage drift A114 and joggle die A214.To carry out punch process from resin molded 3 two side-prominent lead-in wires 3 by warpage drift A114 and joggle die A214, with lead-in wire 3 pars intermedia and the lead wire 3a between the leading section towards the below warpage (such as, the warpage angle of lead-in wire is 135 °), carry out the processing of the 1st warpage.
The key diagram that Fig. 4 processes for the 2nd warpage that adopts warpage drift B115 and joggle die B215.The lead-in wire 3 of the 1st warpage processing of having carried out Fig. 3 is carried out the 2nd warpage processing by warpage drift B115 and joggle die B215, further, carry out the processing of the 2nd warpage lead wire 3a warpage (the warpage angle of lead-in wire such as be 87 °).In addition, in processing of the 1st warpage and the processing of the 2nd warpage, same position (between the leading section and centre of lead-in wire) is carried out warpage processing.By in the manner described above, carry out warpage processing several times, reduce each warpage amount, can not produce resilience.
The key diagram that Fig. 5 processes for the 3rd warpage that adopts warpage drift C116 and joggle die C216.The lead-in wire 3 of the 2nd warpage processing of having carried out Fig. 4 is carried out punch process by warpage drift C116 and joggle die C216,, carry out the processing of the 3rd warpage the root warpage of lead-in wire 3 (the warpage angle of the root of lead-in wire such as be 110 °).
In addition, any one leading section among above-mentioned warpage drift A114～C116 is the curved surface shape, thereby when carrying out punch process, does not have defective on lead-in wire 3.In addition, joggle die A214, B215 according to lead-in wire 3 root near contacted mode constitute, can be stably 3 carry out warpage processing to going between.
The key diagram that Fig. 6 processes for the 4th warpage that adopts warpage drift D217.Lead wire 3b between root and the pars intermedia in the lead-in wire 3 of the 3rd warpage processing of having carried out Fig. 5 is carried out punch process by warpage drift D217, with lead-in wire 3 the further warpage of root (the warpage angle of the root of lead-in wire such as be 87 °), carry out the processing of the 4th warpage.In addition, the inwall side of the leading section of warpage drift D217 is provided with rake 217b, so that lead wire 3b is flexed into angle less than 90 °.
Fig. 7 carries out the action specification figure of each several part that the 4th warpage among Fig. 6 adds the Fig. 1 in man-hour.
Warpage drift D217 setovers to the direction away from joggle die D231 under the effect of spring 235 all the time, if but cam driving medium 117 descends, rake 217a among the rake 117a of its front end and the warpage drift D217 is chimeric, insert simultaneously among the hole 202a in the template 202, if promptly 1. and 2. cam driving medium 117 is positioned at 3. position in figure, then warpage drift D217 also moves towards joggle die D231,1. and 2. in figure, arrive 3. position, by the rake 217b among the warpage drift D217, along continuous straight runs carries out punching press to lead wire 3a, and 3 root warpage further will go between.
In the 4th warpage, owing to obtain above-mentioned action, so have following advantage.
1. because warpage drift D217 along continuous straight runs (just horizontal) carries out punching press to lead wire 3b,, obtain good goods so the infringement of the defective on the face of lead-in wire 3 etc. seldom.
2. in addition, the position that the engagement of the rake 117a of the driving amount of warpage drift D217 in cam driving medium 117 finishes, depend on the relative position of the horizontal direction of cam driving medium 117 and warpage drift D217, owing to stipulate this relative position easily accurately, also make this driving amount keep certain easily, can carry out higher warpage processing.
3. in addition, owing to be not to require the structure of bar axle in the cam lever mode in the past, so there are not the short parts of operating period thresold, the frequency of maintenance seldom.
4. also have, warpage drift D217 is arranged on the template 202, and as the exhaust countermeasure of resin mold (assembly), at first, by the bottom at warpage drift D217 plane roller 236 is set, and guarantees the sliding of warpage drift D217.In addition, form through hole, scavenge, thereby in mould, do not accumulate waste gas by being opened in down the hole 240,241 in membrane module 200 and the counterdie fixed head 201.Also have, though not shown, at resin cleavage mould 210, connecting rod blanking punch 212, lead-in wire blanking punch 213, joggle die A214, joggle die B215, joggle die C216, and also be respectively equipped with through hole in the clamping blanking punch 218.
5. have again,,,, form the warpage that is fit to so root is applied bigger stress with the further warpage of root of lead-in wire 3 because the lead wire 3b between root and the pars intermedia is pressed down.
In addition, in the above-described embodiments, for as shown in Figure 9, the lead-in wire warpage that will form along the short-axis direction of electronic unit, the example that forms each joggle die and cam driving medium is described.But as shown in Figure 8, the present invention also can be suitable for lead-in wire 3 warpages that form along the long axis direction of electronic unit 1.In addition, in this occasion, according to this lead-in wire corresponding mode of warpage of 3, form each warpage drift, each joggle die and cam driving medium.
Claims (2)
1. the manufacturing installation of electronic unit is used for will being formed at lead-in wire warpage on the electronic unit by upper die and lower die, it is characterized in that,
On described patrix, be formed with cam driving medium and warpage drift,
On described counterdie, be formed with that joggle die, along continuous straight runs corresponding to described warpage drift moves and as with the front end warpage of described lead-in wire to the cam of the warpage drift of the bottom side of electronic unit and the plane roller that described cam along continuous straight runs is moved by described cam driving medium.
2. the manufacturing installation of electronic unit according to claim 1 is characterized in that, described cam bears pulling force on the direction away from described joggle die, and forms the gap between described cam and described joggle die.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34313199A JP2001150030A (en) | 1999-12-02 | 1999-12-02 | Electronic component manufacturing method, manufacturing equipment therefor and driving method for the manufacturing equipment |
| JP343131/99 | 1999-12-02 | ||
| JP343131/1999 | 1999-12-02 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001344447A Division CN1158699C (en) | 1999-12-02 | 2000-12-01 | Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1495996A CN1495996A (en) | 2004-05-12 |
| CN1316736C true CN1316736C (en) | 2007-05-16 |
Family
ID=18359163
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001344447A Expired - Fee Related CN1158699C (en) | 1999-12-02 | 2000-12-01 | Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
| CNB2003101143574A Expired - Fee Related CN1316736C (en) | 1999-12-02 | 2000-12-01 | Electronic component mfg. method and device, and driving methof for said making device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001344447A Expired - Fee Related CN1158699C (en) | 1999-12-02 | 2000-12-01 | Method and apparatus for manufacture of electronic components, and method for driving the apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20010011472A1 (en) |
| JP (1) | JP2001150030A (en) |
| CN (2) | CN1158699C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105251834A (en) * | 2015-10-29 | 2016-01-20 | 苏州凡特斯测控科技有限公司 | Up-and-down linking bending mechanism for electron components |
| CN105945175B (en) * | 2016-05-13 | 2018-04-20 | 珠海市赛科自动化有限公司 | A kind of capacitance clubfoot forming machine |
| CN107952829A (en) * | 2017-11-15 | 2018-04-24 | 中国航发沈阳黎明航空发动机有限责任公司 | It is a kind of to be used for the frock with the shaping of plate nut class bracket bent |
| CN108421935B (en) * | 2018-05-16 | 2023-07-18 | 深圳市华龙精密模具有限公司 | Automatic punching forming die for semiconductor products and processing method thereof |
| JP2020136324A (en) | 2019-02-13 | 2020-08-31 | セイコーエプソン株式会社 | Method for manufacturing electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5078186A (en) * | 1989-09-28 | 1992-01-07 | Kabushiki Kaisha Toshiba | Lead forming for electronic parts having gull wing type outer leads |
| JPH09321204A (en) * | 1996-05-31 | 1997-12-12 | Nec Kansai Ltd | Lead forming apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4829669A (en) * | 1988-04-28 | 1989-05-16 | Nec Corporation | Method of manufacturing a chip carrier |
-
1999
- 1999-12-02 JP JP34313199A patent/JP2001150030A/en active Pending
-
2000
- 2000-12-01 CN CNB001344447A patent/CN1158699C/en not_active Expired - Fee Related
- 2000-12-01 CN CNB2003101143574A patent/CN1316736C/en not_active Expired - Fee Related
- 2000-12-01 US US09/728,680 patent/US20010011472A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5078186A (en) * | 1989-09-28 | 1992-01-07 | Kabushiki Kaisha Toshiba | Lead forming for electronic parts having gull wing type outer leads |
| JPH09321204A (en) * | 1996-05-31 | 1997-12-12 | Nec Kansai Ltd | Lead forming apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1495996A (en) | 2004-05-12 |
| US20010011472A1 (en) | 2001-08-09 |
| CN1301083A (en) | 2001-06-27 |
| CN1158699C (en) | 2004-07-21 |
| JP2001150030A (en) | 2001-06-05 |
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