CN1310735C - 导体接合方法及应用其中的锡金焊料结构 - Google Patents
导体接合方法及应用其中的锡金焊料结构 Download PDFInfo
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- CN1310735C CN1310735C CNB200410087941XA CN200410087941A CN1310735C CN 1310735 C CN1310735 C CN 1310735C CN B200410087941X A CNB200410087941X A CN B200410087941XA CN 200410087941 A CN200410087941 A CN 200410087941A CN 1310735 C CN1310735 C CN 1310735C
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004020 conductor Substances 0.000 title claims abstract description 20
- 238000005304 joining Methods 0.000 title claims description 19
- 239000010931 gold Substances 0.000 title abstract description 22
- 229910052737 gold Inorganic materials 0.000 title abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 57
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 34
- 229910000765 intermetallic Inorganic materials 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 13
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- 239000000203 mixture Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006023 eutectic alloy Substances 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
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Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410087941XA CN1310735C (zh) | 2004-10-27 | 2004-10-27 | 导体接合方法及应用其中的锡金焊料结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200410087941XA CN1310735C (zh) | 2004-10-27 | 2004-10-27 | 导体接合方法及应用其中的锡金焊料结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1600495A CN1600495A (zh) | 2005-03-30 |
CN1310735C true CN1310735C (zh) | 2007-04-18 |
Family
ID=34667135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB200410087941XA Expired - Fee Related CN1310735C (zh) | 2004-10-27 | 2004-10-27 | 导体接合方法及应用其中的锡金焊料结构 |
Country Status (1)
Country | Link |
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CN (1) | CN1310735C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102267022A (zh) * | 2011-07-27 | 2011-12-07 | 重庆群崴电子材料有限公司 | 一种光电封装用无铅锡金合金焊料及其制作方法 |
JP6033316B2 (ja) | 2012-09-12 | 2016-11-30 | 株式会社Kelk | レーザダイオード用ペルチェモジュール |
US20160308100A1 (en) * | 2015-04-17 | 2016-10-20 | Chipmos Technologies Inc | Semiconductor package and method of manufacturing thereof |
CN105880859A (zh) * | 2016-04-19 | 2016-08-24 | 北京工业大学 | 一种可调AuSn合金组分的热沉 |
CN111318801B (zh) * | 2020-03-09 | 2021-07-20 | 中南大学 | 一种基于高熵合金扩散焊接的金属间化合物及其制备方法 |
CN111769190B (zh) * | 2020-05-21 | 2022-01-14 | 华灿光电(浙江)有限公司 | 倒装发光二极管芯片及其制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0929484A (ja) * | 1995-07-21 | 1997-02-04 | Tokin Corp | 半田材料及びそれを用いた光電子部品 |
JP2000288770A (ja) * | 1999-03-31 | 2000-10-17 | Kyocera Corp | AuSn多層ハンダ |
JP2001237279A (ja) * | 2000-02-23 | 2001-08-31 | Hitachi Ltd | 半導体装置及びそれを用いた電子装置 |
US6390355B1 (en) * | 1999-09-03 | 2002-05-21 | Motorola, Inc. | Method for forming a metallic contact on an electronic printed circuit board and a product therefrom |
JP2004186566A (ja) * | 2002-12-05 | 2004-07-02 | Tanaka Kikinzoku Kogyo Kk | 熱電変換モジュールの組立方法 |
-
2004
- 2004-10-27 CN CNB200410087941XA patent/CN1310735C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0929484A (ja) * | 1995-07-21 | 1997-02-04 | Tokin Corp | 半田材料及びそれを用いた光電子部品 |
JP2000288770A (ja) * | 1999-03-31 | 2000-10-17 | Kyocera Corp | AuSn多層ハンダ |
US6390355B1 (en) * | 1999-09-03 | 2002-05-21 | Motorola, Inc. | Method for forming a metallic contact on an electronic printed circuit board and a product therefrom |
JP2001237279A (ja) * | 2000-02-23 | 2001-08-31 | Hitachi Ltd | 半導体装置及びそれを用いた電子装置 |
JP2004186566A (ja) * | 2002-12-05 | 2004-07-02 | Tanaka Kikinzoku Kogyo Kk | 熱電変換モジュールの組立方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1600495A (zh) | 2005-03-30 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YANG DAIQIANG Free format text: FORMER OWNER: XINLEI MICRO MFG. CO., LTD. Effective date: 20060113 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20060113 Address after: Taipei County of Taiwan Applicant after: Yang Daiqiang Address before: Hsinchu, Taiwan Province Applicant before: NeoStones MicroFabrication Corp. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Owner name: TAYLOR ENGINEERING CO., LTD. Free format text: FORMER OWNER: YANG DAIQIANG Effective date: 20080725 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20080725 Address after: Virgin Islands (British) Patentee after: Taylor engineering Co.,Ltd. Address before: Taipei County of Taiwan Patentee before: Yang Daiqiang |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070418 Termination date: 20161027 |
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CF01 | Termination of patent right due to non-payment of annual fee |