CN1306625C - Structure of LED and method for manufacturing same - Google Patents
Structure of LED and method for manufacturing same Download PDFInfo
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- CN1306625C CN1306625C CNB031501079A CN03150107A CN1306625C CN 1306625 C CN1306625 C CN 1306625C CN B031501079 A CNB031501079 A CN B031501079A CN 03150107 A CN03150107 A CN 03150107A CN 1306625 C CN1306625 C CN 1306625C
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- gallium nitride
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Abstract
The present invention provides an LED component and a manufacturing method thereof. A buffer layer is grown on the surface of a substrate firstly, and then an LED structure is grown on the buffer layer, wherein the LED structure comprises a p-type quantum dot crystal stacking layer on a p-type gallium nitride layer. Because the p-type quantum dot crystal stacking layer has roughening scattering effect, the travel route of light beams emitted from a light emitting layer formed from multiple layers of InGaN quantum well structure layer is changed, and the probability of internal full reflection is reduced. Thereby, the publicly known roughening procedure can be simplified effectively, and light emitting efficiency can be promoted.
Description
Technical field
The present invention relates to a kind of light-emitting diode and manufacture method thereof, particularly relate to light emitting diode construction and the manufacture method thereof of a kind of p of comprising type quantum dot epitaxial layer on p type gallium nitride layer.
Background technology
Because light LED material, refraction coefficient is widely different between three-five families (III-V) gallium nitride (GaN) semiconductor refraction coefficients (n=2.3) and air (n=1), make its cirtical angle of total reflection have only 25 degree approximately, the light that causes luminescent layer to produce, major part can only can not escape out at inner full-reflection, in order to change the shortcoming of this interface, in known technology, someone proposes semiconductor surface is carried out alligatoring, light is come out from luminescent layer after through the roughened layer interface.Because of the scattering properties of roughened layer interface changes the travel path of light, even so also there is the probability of total reflection, but the probability that light exhales has increased, this technology is as document (IEEE Transcations on ElectronDevices, 47 (7), 1492,2000) described.The mode of known technology alligatoring mainly is to reach with etching method on surface of heap of stone brilliant, as at United States Patent (USP) the 5th, 040, in No. 044, has disclosed and has utilized chemical etching with alligatoring light-emitting component surface, increases the luminous efficiency effect so as to reaching.Other related datas also have United States Patent (USP) the 5th, 429, and No. 954 and the 5th, 898, No. 192 etc.Yet, only being applied in the red light-emitting diode in the mode of above-mentioned manufacture process processing, this mainly is based on its materials processing characteristic and is easier to.But with respect to gallium nitride series material and inapplicable, this is because gallium nitride series material does not have very strong acid and alkali-resistance characteristic, when Wet-type etching and be not easy control.Though and the employing dry etching can overcome aforesaid Wet-type etching problem, causes the damage of epitaxial layer easily.Especially p type gallium nitride layer (p-GaN) very easily therefore causes resistance to rise, and influences CURRENT DISTRIBUTION, the deterioration luminous efficiency.And the very thin thickness (0.1～0.3 μ m) of the common deposition of p type gallium nitride layer, if directly alligatoring p type gallium nitride layer then may destroy luminescent layer, cause the shortcoming that light-emitting area is reduced.In addition, generally be useful in the transparency electrode on the gallium nitride light-emitting diode,, must keep very thin thickness (10nm) for the good cause of printing opacity.Add man-hour in alligatoring, will be destroyed and cause the discontinuous of transparency electrode, also can cause harmful effect simultaneously, and reduce luminous efficiency CURRENT DISTRIBUTION.Therefore, unless p type gallium nitride layer can deposit enough thick thickness, just might carry out dry etching, but blocked up p type gallium nitride layer can make the electric current dispersion and cause luminous efficiency to reduce, and the scheme of therefore direct alligatoring p type gallium nitride layer seems and is difficult to carry out.
Summary of the invention
In view of the above problems, the present invention proposes to utilize brilliant mode of heap of stone to reach the effect of alligatoring, so as to improving gallium nitride series emitting component, the present invention has disclosed a kind of method of alligatoring gallium nitride layer light-emitting component, compare with known technology, the present invention can obtain the obviously luminous efficiency of lifting.
Main purpose of the present invention is: in the light emitting diode construction of building crystal to grow, growth p type quantum dot epitaxial layer on p type gallium nitride layer surface, utilize the characteristic with alligatoring dispersion effect of the p type quantum dot epitaxial layer of gallium nitride series, can simplify known effectively for to make light emitting diode construction have the coarsening process of good alligatoring dispersion effect.
Another object of the present invention is: by p type quantum dot epitaxial layer, the light that luminescent layer came out that InGaN (InGaN) multiple quantum trap structure layer is formed, because of the alligatoring dispersion effect of p type quantum dot epitaxial layer changes the light course, reduce the probability of inner full-reflection, promote luminous efficiency.
Of the present invention theing contents are as follows:
The 1st content of the present invention is a kind of light emitting diode construction, is provided with substrate, it is characterized in that this structure comprises:
In this on-chip resilient coating, the material of this resilient coating is gallium nitride (GaN) series compound;
In the light emitting diode construction layer of this buffer-layer surface, this light emitting diode construction layer is to constitute in conjunction with n type gallium nitride layer, multiple quantum trap structure layer, p type aluminium gallium nitride alloy layer and p type gallium nitride layer,
Wherein, this n type gallium nitride layer is on this resilient coating, and the material of this n type gallium nitride layer is a gallium nitride series III-V compounds of group,
This multiple quantum trap structure layer is on this n type gallium nitride layer, and the material of this multiple quantum trap structure layer is the InGaN series compound,
This p type aluminium gallium nitride alloy layer is on this multiple quantum trap structure layer, and the material of this p type aluminium gallium nitride alloy layer is a p type aluminium gallium nitride alloy series III-V compounds of group,
This p type gallium nitride layer is on this p type aluminium gallium nitride alloy layer, and the material of this p type gallium nitride layer is a p type gallium nitride series III-V compounds of group;
P type quantum dot epitaxial layer on this p type gallium nitride layer of this light emitting diode construction layer, the material of this p type quantum dot epitaxial layer is an aluminum indium nitride gallium series compound, wherein, this n type gallium nitride layer of this light emitting diode construction layer, this multiple quantum trap structure layer, this p type aluminium gallium nitride alloy layer, this p type gallium nitride layer and this p type quantum dot epitaxial layer, partly all etched operation removes;
On this p type quantum dot epitaxial layer and the p type Ohm contact electrode that is electrically connected, the material of this p type Ohm contact electrode is nickel/metal; And
On this n type gallium nitride layer of this light emitting diode construction layer and the n type Ohm contact electrode that is electrically connected, the material of this n type Ohm contact electrode is titanium/aluminum metal; Can one forward bias be set in this light emitting diode construction whereby.
The 2nd content of the present invention is a kind of manufacturing method for LED, it is characterized in that, comprises following steps:
Substrate is set;
In this substrate surface growth one deck resilient coating;
In this buffer-layer surface growth light emitting diode construction layer, this light emitting diode construction layer is to constitute in conjunction with n type gallium nitride layer, multiple quantum trap structure layer, p type aluminium gallium nitride alloy layer and p type gallium nitride layer;
On this p type gallium nitride layer surface of this light emitting diode construction layer, growth p type quantum dot epitaxial layer, this p type quantum dot epitaxial layer is electrically connected with p type Ohm contact electrode, the material of this p type Ohm contact electrode is nickel/gold (Ni/Au) metal, this n type gallium nitride layer is electrically connected with n type Ohm contact electrode, the material of this n type Ohm contact electrode is titanium/aluminium (Ti/Al) metal, and a positive bias is set whereby.
The 3rd content of the present invention is that in the manufacture method of the 2nd described light-emitting diode, this p type quantum dot epitaxial layer is aluminum indium nitride gallium (Al
xGa
(1-x-y)In
vN) film, 0≤x, y＜1,0≤x+y＜1.
The 4th content of the present invention is that in the manufacture method of the 2nd described light-emitting diode, this substrate is sapphire (Sapphire), carborundum (SiC), silicon (Si), GaAs (GaAs), lithium metaaluminate (LiAlO
2), lithium gallium oxide (LiGaO
2) and aluminium nitride (AlN) substrate one of them.
The 5th content of the present invention is that in the manufacture method of the 2nd described light-emitting diode, the thickness of this p type quantum dot epitaxial layer is greater than 10 dusts ().
The 6th content of the present invention is that in the manufacture method of the 2nd described light-emitting diode, the mean roughness of this p type quantum dot epitaxial layer is greater than 10 dusts ().
Description of drawings
Fig. 1 is a kind of light emitting diode construction schematic diagram according to the embodiment of the invention.
Fig. 2 is a kind of manufacturing method for LED flow chart according to the embodiment of the invention.Among the figure
101 substrates, 102 resilient coatings
103 light emitting diode construction layers, 1030 n type gallium nitride layer
1032 multiple quantum trap structure layers, 1034 p type aluminium gallium nitride alloy layer
1036 p type gallium nitride layers, 107 p type quantum dot epitaxial layers
108 p type Ohm contact electrodes, 109 n type Ohm contact electrodes
201 growth resilient coatings, 203 growth light emitting diode construction layers
205 growth quantum point epitaxial layers 207 form electrode
Embodiment
In order to make objects and advantages of the present invention more obvious, below by describing specific embodiment in detail also in conjunction with the accompanying drawings.
Fig. 1 is a kind of light emitting diode construction schematic diagram according to the embodiment of the invention.Sapphire (sapphire) substrate 101 is placed Organometallic Chemistry gas deposition (MOCVD) system, substrate 101 also can be carborundum (SiC), silicon (Si), GaAs (GaAs), lithium metaaluminate (LiAlO except that being sapphire (Sapphire) material
2), lithium gallium oxide (LiGaO
2) and aluminium nitride (AlN) one of them.
At first in 500～600 ℃, gallium nitride (GaN) resilient coating (buffer layer) 102 that growth one deck 20～50 nanometers (nm) are thick, then in these resilient coating 102 surperficial growth light emitting diode construction layers 103, this light emitting diode construction layer 103 comprises n type gallium nitride layer 1030, multiple quantum trap structure layer 1032, p type aluminium gallium nitride alloy layer 1034 and p type gallium nitride layer 1036, wherein this n type gallium nitride layer 1030 is on this resilient coating 102, and the material of this n type gallium nitride layer 1030 is gallium nitride series III-V compounds of group.
Substrate temperature is risen to 1000～200 ℃, 1～2 micron (μ m) thick n type gallium nitride layer (n-type GaN) 1030 that mixes silicon (Si) impurity of growth one deck, the material of n type gallium nitride layer 1030 is gallium nitride series III-V compounds of group, afterwards test piece is taken out, insert in the Organometallic Chemistry gas deposition (MOCVD), and substrate 101 temperature are risen to 700 ℃～900 ℃, growth InGaN (InGaN) multiple quantum trap structure layer 1032 is as luminescent layer, the p type aluminium gallium nitride alloy layer 1034 of now growth one deck magnesium doping (Mg doped), one deck magnesium doped p of growing up again afterwards type gallium nitride layer 1036, one deck magnesium doped p of growing up again at last type quantum dot epitaxial layer 107, the material of p type quantum dot epitaxial layer 107 is aluminum indium nitride gallium series compounds, mean roughness is one deck aluminum indium nitride gallium (Al greater than 10 dusts ()
xGa
(1-x-y)In
vN) film, 0≤x, y＜1,0≤x+y＜1.So just, light-emitting diode chip has completed.
This wafer of heap of stone is utilized inductively coupled plasma-reactive ion etch (inductively coupled plasma-reactive ion etching of dry etching, ICP-RIE) program, part p type quantum dot epitaxial layer 107, p type gallium nitride layer 1036, p type aluminium gallium nitride alloy layer 1034, InGaN (InGaN) multiple quantum trap structure layer 1032 are removed, and exposed n type gallium nitride layer 1030 surfaces.Again nickel/gold (Ni/Au) metal is made in p type quantum dot epitaxial layer 107 surfaces and electrical connection, as p type Ohm contact electrode 108.And titanium/aluminium (Ti/Al) metal is made in n type gallium nitride layer 103 surfaces and electrical connection, as n type Ohm contact electrode 109.Whereby a forward bias can be set, according to the above-mentioned steps grainiess of the present invention that just completed.
Fig. 2 is a kind of manufacturing method for LED flow chart according to the embodiment of the invention.The resilient coating of at first in step 201, growing up: sapphire (sapphire) substrate 101 is placed Organometallic Chemistry gas deposition (MOCVD) system, in thick gallium nitride (GaN) resilient coating (buffer layer) 102 of 500～600 ℃ of growth one deck 20～50 nanometers (nm).
Then in step 203, growth light emitting diode construction layer 103: substrate 101 temperature are risen to the thick n type gallium nitride layer (n-type GaN) 1030 that mixes silicon (Si) impurity of 1～2 micron of 1000～1200 ℃ of growth one deck (μ m), afterwards test piece is taken out, insert in the Organometallic Chemistry gas deposition (MOCVD), and substrate temperature risen to 700 ℃～900 ℃, growth InGaN (InGaN) multiple quantum trap structure layer 1032 is as luminescent layer, one deck magnesium doped p of then growing up type aluminium gallium nitride alloy layer 1034, one deck magnesium doped p of growing up again afterwards type gallium nitride layer 1036.
At last in step 205, growth one deck magnesium doped p type quantum dot epitaxial layer 107 on p type gallium nitride layer 1036, light-emitting diode chip has so just completed.
In step 207, form electrode 108,109: inductively coupled plasma-reactive ion etch (the inductively coupled plasma-reactive ionetching that this wafer of heap of stone is utilized dry etching, ICP-RIE) program is with part p type quantum dot epitaxial layer 107, p type gallium nitride layer 1036, p type aluminium gallium nitride alloy layer 1034, InGaN (InGaN) multiple quantum trap structure layer 1032 is removed, and expose n type gallium nitride layer 1030 surfaces, again nickel/gold (Ni/Au) metal is made in p type quantum dot epitaxial layer 107 surfaces as p type Ohm contact electrode 108, and titanium/aluminium (Ti/Al) metallic is made in n type gallium nitride layer 1030 surfaces as n type Ohm contact electrode 109, according to the above-mentioned steps grainiess of the present invention that just completed.
Though abovely disclosed the present invention with a preferred embodiment, it is not to be used for limiting the present invention.Any those skilled in the art in not breaking away from spirit of the present invention and scope, should do various changes and improvement, but its various changes of having done still do not break away from the present patent application scope required for protection with improvement.
Claims (6)
1. a light emitting diode construction is provided with substrate, it is characterized in that, this structure comprises:
In this on-chip resilient coating, the material of this resilient coating is gallium nitride (GaN) series compound;
In the light emitting diode construction layer of this buffer-layer surface, this light emitting diode construction layer is to constitute in conjunction with n type gallium nitride layer, multiple quantum trap structure layer, p type aluminium gallium nitride alloy layer and p type gallium nitride layer,
Wherein, this n type gallium nitride layer is on this resilient coating, and the material of this n type gallium nitride layer is a gallium nitride series III-V compounds of group,
This multiple quantum trap structure layer is on this n type gallium nitride layer, and the material of this multiple quantum trap structure layer is the InGaN series compound,
This p type aluminium gallium nitride alloy layer is on this multiple quantum trap structure layer, and the material of this p type aluminium gallium nitride alloy layer is a p type aluminium gallium nitride alloy series III-V compounds of group,
This p type gallium nitride layer is on this p type aluminium gallium nitride alloy layer, and the material of this p type gallium nitride layer is a p type gallium nitride series III-V compounds of group;
P type quantum dot epitaxial layer on this p type gallium nitride layer of this light emitting diode construction layer, the material of this p type quantum dot epitaxial layer is an aluminum indium nitride gallium series compound, wherein, this n type gallium nitride layer of this light emitting diode construction layer, this multiple quantum trap structure layer, this p type aluminium gallium nitride alloy layer, this p type gallium nitride layer and this p type quantum dot epitaxial layer, partly all etched operation removes;
On this p type quantum dot epitaxial layer and the p type Ohm contact electrode that is electrically connected, the material of this p type Ohm contact electrode is nickel/metal; And
On this n type gallium nitride layer of this light emitting diode construction layer and the n type Ohm contact electrode that is electrically connected, the material of this n type Ohm contact electrode is titanium/aluminum metal; Can one forward bias be set in this light emitting diode construction whereby.
2. a manufacturing method for LED is characterized in that, comprises following steps:
Substrate is set;
In this substrate surface growth one deck resilient coating;
In this buffer-layer surface growth light emitting diode construction layer, this light emitting diode construction layer is to constitute in conjunction with n type gallium nitride layer, multiple quantum trap structure layer, p type aluminium gallium nitride alloy layer and p type gallium nitride layer;
On this p type gallium nitride layer surface of this light emitting diode construction layer, growth p type quantum dot epitaxial layer, this p type quantum dot epitaxial layer is electrically connected with p type Ohm contact electrode, the material of this p type Ohm contact electrode is nickel/gold (Ni/Au) metal, this n type gallium nitride layer is electrically connected with n type Ohm contact electrode, the material of this n type Ohm contact electrode is titanium/aluminium (Ti/Al) metal, and a forward bias is set whereby.
3. the manufacture method of light-emitting diode according to claim 2 is characterized in that, this p type quantum dot epitaxial layer is aluminum indium nitride gallium (Al
xGa
(1-x-y)In
vN) film, 0≤x, y＜1,0≤x+y＜1.
4. the manufacture method of light-emitting diode according to claim 2 is characterized in that, this substrate is sapphire (Sapphire), carborundum (SiC), silicon (Si), GaAs (GaAs), lithium metaaluminate (LiAlO
2), lithium gallium oxide (LiGaO
2) and aluminium nitride (AlN) substrate one of them.
5. the manufacture method of light-emitting diode according to claim 2 is characterized in that, the thickness of this p type quantum dot epitaxial layer is greater than 10 dusts ().
6. the manufacture method of light-emitting diode according to claim 2 is characterized in that, the mean roughness of this p type quantum dot epitaxial layer is greater than 10 dusts ().
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|---|---|---|---|
| CNB031501079A CN1306625C (en) | 2003-07-16 | 2003-07-16 | Structure of LED and method for manufacturing same |
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|---|---|---|---|
| CNB031501079A CN1306625C (en) | 2003-07-16 | 2003-07-16 | Structure of LED and method for manufacturing same |
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| CN1571176A CN1571176A (en) | 2005-01-26 |
| CN1306625C true CN1306625C (en) | 2007-03-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996625A (en) * | 2006-01-06 | 2007-07-11 | 大连路明科技集团有限公司 | GaN base optical electronic part and its making method |
| KR20070102114A (en) * | 2006-04-14 | 2007-10-18 | 엘지이노텍 주식회사 | Nitride semiconductor light-emitting device and manufacturing method thereof |
| CN102169929A (en) * | 2011-02-25 | 2011-08-31 | 聚灿光电科技(苏州)有限公司 | Manufacturing method of light-emitting diode (LED) with high light-extraction rate |
| CN102169930B (en) * | 2011-03-07 | 2012-09-19 | 山东大学 | Method for coarsening surface of light-emitting diode (LED) with the aid of metal nanoparticles |
| CN102354699B (en) * | 2011-09-30 | 2016-05-25 | 映瑞光电科技(上海)有限公司 | High pressure nitride LED device and manufacture method thereof |
| CN102723418A (en) * | 2012-01-18 | 2012-10-10 | 许并社 | Conformal coating white light LED chip structure possessing fluorescent characteristic passivation layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041225A2 (en) * | 1999-12-03 | 2001-06-07 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
| TW472400B (en) * | 2000-06-23 | 2002-01-11 | United Epitaxy Co Ltd | Method for roughing semiconductor device surface to increase the external quantum efficiency |
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2003
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001041225A2 (en) * | 1999-12-03 | 2001-06-07 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
| TW472400B (en) * | 2000-06-23 | 2002-01-11 | United Epitaxy Co Ltd | Method for roughing semiconductor device surface to increase the external quantum efficiency |
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Effective date of registration: 20091218 Address after: Taoyuan County of Taiwan Province Co-patentee after: LUMENS Limited by Share Ltd Patentee after: Bright circle Au Optronics Co Address before: Taoyuan County of Taiwan Province Patentee before: Formosa Epitaxy Incorporation |
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