CN1306385A - 用于电气/电子设备的单模块系统 - Google Patents
用于电气/电子设备的单模块系统 Download PDFInfo
- Publication number
- CN1306385A CN1306385A CN00132639A CN00132639A CN1306385A CN 1306385 A CN1306385 A CN 1306385A CN 00132639 A CN00132639 A CN 00132639A CN 00132639 A CN00132639 A CN 00132639A CN 1306385 A CN1306385 A CN 1306385A
- Authority
- CN
- China
- Prior art keywords
- pcb
- single module
- pin
- module system
- module section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Central Heating Systems (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
公开了一种用于电气/电子设备的单模块系统。该单模块系统包括:第一模块部分,具有由陶瓷或金属基的材料构成的第一PCB和位于第一PCB上的发热器件;和第二模块部分,具有由环氧树脂或苯酚基的材料构成的第二PCB和位于第二PCB上的非发热器件。
Description
本发明涉及用于电气/电子设备的单模块系统,具体涉及一种将所有器件全模块化的用于电气/电子设备的单模块系统,其可避免电气安装在采用逆变器的电气/电子设备中占据大量空间,从而减小了电气/电子设备的体积。
图1是示意性表示常规电气/电子设备的逆变器的部件布置的方框图。
参见图1,在常规逆变器中,所有电路部件都安装在印刷电路板(PCB)10上。各个电路部件具有双列直插式封装(DIP)的结构。
在这些电路部件中,将诸如桥式二极管(BD)2,开关模式电源(SMPS)5,三端双向可控硅开关元件4,智能电源模块(IPM)6等等的发热器件连接到一个散热片。
构成逆变器的一个重要部分的IPM6是在其中嵌入有以下部件的模块,这些部件包括六个绝缘栅双极晶体管(IGBT),续流二极管(FWD),IGBT驱动电路,和用于保护IGBT防止其过(电)流的IGBT保护电路等等。附图标号7表示用于控制整个逆变器电路的微机。
如上构造的常规逆变器接收AC电源。AC电源流过滤波器1,而后通过BD2和平滑电容器(Cap)3变换为DC电源。通过SMPS5将DC电源调节到诸如5V,15V或其它值的所需电压。三端双向可控硅开关4用于驱动外部负载。
但是,常规逆变器的缺陷在于,由于所有部件都安装在PCB10上,使PCB10的体积增大,由此使得电气/电子设备的体积也增大。
因此,本发明意欲解决现有技术中出现的问题,本发明的一个目的是提供一种用于电气/电子设备的单模块系统,其模块化所有器件以避免电气安装在采用逆变器的电气/电子设备中占据大量空间,从而减小电气/电子设备的体积。
为了实现上述目的,根据本发明的一个方面,提供一种用于电气/电子设备的单模块系统,包括:第一模块部分,其具有由陶瓷或金属基的材料构成的第一PCB和位于该第一PCB上的发热器件;和第二模块部分,其具有由环氧树脂或苯酚基的材料构成的第二PCB和位于该第二PCB上的非发热器件。
根据本发明的另一个方面,第一模块部分和第二模块部分的结构被设计为,第一和第二PCB通过支撑条相互连接并由支撑条支撑。
根据本发明的另一个方面,用于该单模块系统的器件包括裸露型部件。
根据本发明的特征,可以将安装在常规逆变器的PCB上的所有电路部件均模块化,使得发热器件和非发热器件独立地分别位于第一和第二层上。在本发明中,第一层由具有良好传热特性的材料例如陶瓷或金属基的PCB形成,以便利于消散发热器件产生的热,第二层由环氧树脂或苯酚基的PCB构成。为了进一步减小模块的尺寸,发热和非发热器件包括裸露型部件。结果,本发明提供的优点在于,有可能实现采用逆变器的家用电器电路的单个模块化部分。
在结合附图阅读以下详细说明后,本发明的上述目的,和其它特征和优点将变得更加明显,附图中:
图1是示意性表示常规电气/电子设备的逆变器部件布置的方框图;
图2和3是分别表示根据本发明一个实施例的电气/电子设备的单模块系统的电源板和控制板的方框图;
图4是表示根据本发明的电气/电子设备的单模块系统的电源板和控制板的双层布置的剖视图;
图5a到5c是表示根据本发明的电气/电子设备的单模块系统中电源板和控制板之间的多种连接图形的剖视图;
图6a到6c是表示根据本发明的电气/电子设备的单模块系统的外表面上形成的外部连接管脚的多种构型。
下面将参照附图中的例子对本发明的优选实施例进行更详细的说明。在可能的情况下,相同的标号在附图和说明书中表示相同或相似的部分。
参见图2和3,根据本发明一个实施例的电气/电子设备的单模块系统被设计为具有双层结构,从而能够将大量部件模块化。
在根据本发明的单模块系统的双层结构中,发热器件位于第一层,组成与控制有关的部件的非发热器件位于第二层。用于形成第一层的第一PCB111可以使用陶瓷PCB,金属PCB或具有良好传热特性的类似PCB。
换句话说,如图2所示,用于限定第一层的第一模块部分110包括:构成逆变器电路部分的IGBT/FWD112;IGBT栅驱动113;IGBT保护电路114,具有用于保护易受图形布线影响的IGBT的过电流(OC)部分和超温度(OT)部分;SMPS开关晶体管115;以及桥式二极管116,用作整流器。如上所述,IGBT/FWD112,IGBT栅驱动113,IGBT保护电路114,SMPS开关晶体管115和桥式二极管116是发热器件,位于第一PCB111上。
此外,如图3所示,用于限定第二层的第二模块部分120包括:微机122;负载驱动部分123;以及自举电路124,用于向位于第二PCB121上的逆变器电路提供器件驱动电源。此处,由于第二层除了第一层以外不包括任何发热器件,形成第二层的第二PCB由环氧树脂或苯酚基的材料构成,而不是由用于形成第一层的陶瓷或金属基的材料构成。
在用于第一层和第二层的各种器件中,诸如电阻器和电容器的无源器件由表面安装器件型部件构成。而且,IGBT,二极管,晶体管,微机等等由裸露型部件构成,并通过丝焊连接到它们各自的PCB。
图4是表示根据本发明的电气/电子设备的单模块系统的电源板和控制板的双层布置的剖视图。
参见图4,由裸露型部件构成的各个发热器件位于由陶瓷或金属基的材料构成的第一PCB111上,并通过丝焊连接到一图形。此时,通过使用铝(Al)的丝焊将通过大电流的IGBT/FWD112,桥式二极管116和SMPS开关晶体管115连接到该图形,并通过使用金(Au)的丝焊将用于驱动IGBT的HVIC113连接到该图形。
而且,微机122位于由环氧树脂或苯酚基的材料构成的第二PCB121上,并通过使用铝(Al)的丝焊连接到一图形。此时,由于第一和第二层上存在裸露型部件,要使用硅胶密封这些裸露型部件,从而防止这些裸露型部件在空气中氧化。附图标号117表示用于促进热量排放的热扩散器。
另一方面,图5a到5c是表示根据本发明的电气/电子设备的单模块系统中电源板和控制板之间的各种连接图形的剖视图。
图5a表示第一和第二层通过支撑条130相互连接的结构。借助于该结构,有可能同时完成第一和第二层之间的连接以及第二层的支撑,而无需使用单独构件来支撑第二层。
图5b表示第一和第二层通过插座140相互连接的另一种结构。
图5c表示第一和第二层通过插座140和跨接线150相互连接的另一种结构,其使得图5b中的连接操作以更容易的方式实现。
考虑到外部电动机,用户和电气/电子设备之间的接口等等,使用图5a到5c中显示的第一和第二层之间连接结构的单模块系统100必须具有用于将逆变器连接到外部电路或外部负载的管脚。
图6a到6c是表示在根据本发明的电气/电子设备的单模块系统的外部表面上形成的外部连接管脚的各种构形的透视图。
图6a表示的结构中,在单模块系统100的外部表面设有连接到第一层的引线管脚161和连接到第二层的IC插座型连接管脚162。引线管脚161和IC插座型管脚162与外部电路或外部负载相连接。
图6b表示的另一种结构中,单模块系统100的外部表面设有连接到第一层的第一管脚170和连接到第二层的第二管脚170。第一和第二管脚170分别成直线相互对准,以便与外部电路或外部负载连接。
图6c表示的另一种结构中,单模块系统100的外部表面设有连接到第一模块部分110的第一管脚182和连接到第二模块部分120的第二管脚181。由于第一管脚182与电源有关,因此第一管脚182位于第二管脚181的内侧。第一管脚182和第二管脚181与外部电路或外部负载相连接。
如上所述,利用该电气/电子设备的单模块系统,安装在常规逆变器的PCB上的所有电路部件都可被模块化,使得发热器件和非发热器件独立地分别位于第一和第二层上。在本发明中,第一层由具有良好传热特性的材料例如陶瓷或金属基的PCB形成,以便利于消散发热器件产生的热。第二层由环氧树脂或苯酚基的PCB构成。为了进一步减小模块的尺寸,发热器件和非发热器件包括裸露型部件。结果,本发明的优点在于,有可能实现采用逆变器的家用电器电路的单个模块化部分。此外,有可能开发出在电路尺寸,操作可靠性和制造成本方面有优势的设备。
以上已经在附图和说明书中说明了本发明的优选实施例,虽然采用了特定的术语,但它们是以通用的和说明性概念给出的,并不用于限制所附权利要求中提出的本发明的保护范围。
Claims (8)
1.一种用于电气/电子设备的单模块系统,包括:
第一模块部分,具有由陶瓷或金属基的材料构成的第一PCB和位于第一PCB上的发热器件;和
第二模块部分,具有由环氧树脂或苯酚基的材料构成的第二PCB和位于第二PCB上的非发热器件。
2.根据权利要求1的单模块系统,其中第一模块部分和第二模块部分的结构被设计为,第一和第二PCB通过支撑条相互连接并由支撑条支撑。
3.根据权利要求1的单模块系统,其中第一模块部分和第二模块部分的结构被设计为,第一和第二PCB通过插座相互连接。
4.根据权利要求3的单模块系统,其中第一模块部分和第二模块部分的结构被设计为,它们通过多个跨接线相互连接,每个跨接线将第一模块部分的插座和第二模块部分的插座相互连接。
5.根据权利要求1到4中任何一项的单模块系统,其中单模块系统的外部表面设有用于第一模块部分的引线管脚和用于第二模块部分的IC插座型连接管脚,以便与外部电路或外部负载相连接。
6.根据权利要求1到4中任何一项的单模块系统,其中单模块系统的外部表面设有连接到第一模块部分的多个第一管脚和连接到第二模块部分的多个第二管脚,第一管脚和第二管脚以直线相互对准,以便与外部电路或外部负载连接。
7.根据权利要求1到4中任何一项的单模块系统,其中单模块系统的外部表面设有连接到第一模块部分的多个第一管脚和连接到第二模块部分的第二管脚,第一管脚位于第二管脚的内侧,第一管脚和第二管脚与外部电路或外部负载连接。
8.根据权利要求1的单模块系统,其中发热器件和非发热器件包括裸露型部件。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000002445A KR100355828B1 (ko) | 2000-01-19 | 2000-01-19 | 전기/전자 제품용 단일 모듈 시스템 |
KR2445/2000 | 2000-01-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1306385A true CN1306385A (zh) | 2001-08-01 |
CN1178561C CN1178561C (zh) | 2004-12-01 |
Family
ID=19639704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001326392A Expired - Fee Related CN1178561C (zh) | 2000-01-19 | 2000-11-16 | 用于电气/电子设备的单模块系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20010008483A1 (zh) |
JP (1) | JP2001230512A (zh) |
KR (1) | KR100355828B1 (zh) |
CN (1) | CN1178561C (zh) |
DE (1) | DE10101777A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101867311A (zh) * | 2009-04-17 | 2010-10-20 | 凹凸电子(武汉)有限公司 | 电源系统 |
US8456101B2 (en) | 2009-04-17 | 2013-06-04 | O2Micro, Inc. | Power systems with platform-based controllers |
CN106611758A (zh) * | 2015-10-23 | 2017-05-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039118A (ja) * | 2003-07-17 | 2005-02-10 | Mitsubishi Electric Corp | 半導体装置 |
JP4513560B2 (ja) * | 2004-12-28 | 2010-07-28 | ダイキン工業株式会社 | パワーモジュールおよび空気調和機 |
TWI342457B (en) * | 2006-05-05 | 2011-05-21 | Chimei Innolux Corp | Printed circuit board module used in liquid crystal display device |
KR101207934B1 (ko) * | 2010-02-10 | 2012-12-04 | 주식회사 케이엠더블유 | 방열판 구조 |
DE102013226513A1 (de) * | 2013-12-18 | 2015-06-18 | Zf Friedrichshafen Ag | Leiterplatte, Verfahren zum Herstellen derselben und Leiterplattenvorrichtung |
CN103747662A (zh) * | 2014-01-22 | 2014-04-23 | 苏州工业园区驿力机车科技有限公司 | 风机控制器 |
US9722510B2 (en) | 2014-06-03 | 2017-08-01 | Cummins Power Generation Ip, Inc. | Modular inverter platform providing physical and electrical configurability and scalability |
CN109462938B (zh) * | 2018-11-19 | 2024-09-24 | 珠海格力电器股份有限公司 | 电路板组件、光伏逆变器及空调系统 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990075852A (ko) * | 1998-03-25 | 1999-10-15 | 이형도 | 파워모듈용 기판 |
-
2000
- 2000-01-19 KR KR1020000002445A patent/KR100355828B1/ko not_active IP Right Cessation
- 2000-11-16 CN CNB001326392A patent/CN1178561C/zh not_active Expired - Fee Related
- 2000-11-29 US US09/725,105 patent/US20010008483A1/en not_active Abandoned
- 2000-12-15 JP JP2000381402A patent/JP2001230512A/ja active Pending
-
2001
- 2001-01-17 DE DE2001101777 patent/DE10101777A1/de not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101867311A (zh) * | 2009-04-17 | 2010-10-20 | 凹凸电子(武汉)有限公司 | 电源系统 |
CN101867311B (zh) * | 2009-04-17 | 2012-03-07 | 凹凸电子(武汉)有限公司 | 电源系统 |
US8456101B2 (en) | 2009-04-17 | 2013-06-04 | O2Micro, Inc. | Power systems with platform-based controllers |
TWI404319B (zh) * | 2009-04-17 | 2013-08-01 | O2Micro Int Ltd | 具有以平台為基礎之控制器之電源系統以及以平台為基礎之製程方法 |
CN106611758A (zh) * | 2015-10-23 | 2017-05-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
CN106611758B (zh) * | 2015-10-23 | 2020-01-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
Also Published As
Publication number | Publication date |
---|---|
JP2001230512A (ja) | 2001-08-24 |
KR20010073669A (ko) | 2001-08-01 |
US20010008483A1 (en) | 2001-07-19 |
DE10101777A1 (de) | 2001-08-02 |
CN1178561C (zh) | 2004-12-01 |
KR100355828B1 (ko) | 2002-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1178561C (zh) | 用于电气/电子设备的单模块系统 | |
US8288658B2 (en) | Multilayer circuit board and motor drive circuit board | |
US8304889B2 (en) | Power semiconductor module and fabrication method thereof | |
CN100367645C (zh) | 开关电源装置 | |
JP2020519024A (ja) | Dc端子の同軸配列を有するハーフブリッジモジュール | |
US6703699B2 (en) | Semiconductor device | |
EP0697732B1 (en) | Driving circuit module | |
US11107756B2 (en) | Semiconductor device and method for manufacturing the same, and power conversion device | |
US8054641B2 (en) | Electronic unit | |
CN108370220A (zh) | 高压功率模块 | |
US9271398B2 (en) | Power supply module | |
US20160366780A1 (en) | Power modules and pin thereof | |
WO2018211751A1 (ja) | 半導体モジュールおよび電力変換装置 | |
US7902464B2 (en) | Heat sink arrangement for electrical apparatus | |
EP3896732B1 (en) | Packaged stackable electronic power device for surface mounting and circuit arrangement | |
CN1173609C (zh) | 用于电气/电子设备的单系统模块 | |
JP2015053410A (ja) | 半導体モジュール | |
WO2018180580A1 (ja) | 半導体装置および電力変換装置 | |
CN115084113A (zh) | 一种双层结构的半导体电路及电控板 | |
JP4580270B2 (ja) | パワーモジュール | |
WO2013105456A1 (ja) | 回路基板および電子デバイス | |
JP4246040B2 (ja) | 半導体装置の実装体 | |
CN114142742A (zh) | 电力转换装置 | |
US6211564B1 (en) | Integrated circuit package having stepped terminals | |
WO2024013857A1 (ja) | 半導体装置および電力変換装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |