CN1299729A - 磨削方法和磨削装置 - Google Patents

磨削方法和磨削装置 Download PDF

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Publication number
CN1299729A
CN1299729A CN 00137374 CN00137374A CN1299729A CN 1299729 A CN1299729 A CN 1299729A CN 00137374 CN00137374 CN 00137374 CN 00137374 A CN00137374 A CN 00137374A CN 1299729 A CN1299729 A CN 1299729A
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CN
China
Prior art keywords
grinding
cutting fluid
emery wheel
nozzle
cup emery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 00137374
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English (en)
Chinese (zh)
Inventor
荒井茂弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Publication of CN1299729A publication Critical patent/CN1299729A/zh
Pending legal-status Critical Current

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CN 00137374 1999-12-06 2000-12-06 磨削方法和磨削装置 Pending CN1299729A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP346284/1999 1999-12-06
JP34628499A JP2001162533A (ja) 1999-12-06 1999-12-06 加工方法および加工装置

Publications (1)

Publication Number Publication Date
CN1299729A true CN1299729A (zh) 2001-06-20

Family

ID=18382362

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 00137374 Pending CN1299729A (zh) 1999-12-06 2000-12-06 磨削方法和磨削装置

Country Status (3)

Country Link
JP (1) JP2001162533A (ja)
CN (1) CN1299729A (ja)
TW (1) TW467791B (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189144B2 (en) 2002-04-03 2007-03-13 Nsk Ltd. Centerless grinding apparatus and centerless grinding method
CN100571983C (zh) * 2006-04-05 2009-12-23 株式会社电装 具有磨屑清除装置的研磨设备以及清除磨屑的方法
CN103025487A (zh) * 2010-07-09 2013-04-03 圣戈班金刚石工具有限责任两合公司 用于冷却润滑剂的喷嘴
CN103415371A (zh) * 2010-12-23 2013-11-27 安立世 抛光和磨削圆柱体的轴向端部上的弯曲表面的方法和设备
CN109202690A (zh) * 2017-07-04 2019-01-15 株式会社迪思科 磨削装置
CN115213814A (zh) * 2022-07-28 2022-10-21 宁波芯丰精密科技有限公司 一种磨削主轴

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110465844B (zh) * 2019-08-30 2021-06-01 广东博智林机器人有限公司 一种打磨机器人及其工作方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189144B2 (en) 2002-04-03 2007-03-13 Nsk Ltd. Centerless grinding apparatus and centerless grinding method
CN100571983C (zh) * 2006-04-05 2009-12-23 株式会社电装 具有磨屑清除装置的研磨设备以及清除磨屑的方法
CN103025487A (zh) * 2010-07-09 2013-04-03 圣戈班金刚石工具有限责任两合公司 用于冷却润滑剂的喷嘴
CN103025487B (zh) * 2010-07-09 2015-04-08 圣戈班金刚石工具有限责任两合公司 用于冷却润滑剂的喷嘴
CN103415371A (zh) * 2010-12-23 2013-11-27 安立世 抛光和磨削圆柱体的轴向端部上的弯曲表面的方法和设备
CN109202690A (zh) * 2017-07-04 2019-01-15 株式会社迪思科 磨削装置
CN115213814A (zh) * 2022-07-28 2022-10-21 宁波芯丰精密科技有限公司 一种磨削主轴
CN115213814B (zh) * 2022-07-28 2024-01-23 宁波芯丰精密科技有限公司 一种磨削主轴

Also Published As

Publication number Publication date
TW467791B (en) 2001-12-11
JP2001162533A (ja) 2001-06-19

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SEIKO INSTR INC.

Free format text: FORMER OWNER: SEIKO SEIKI CO., LTD.

Effective date: 20030307

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20030307

Address after: Chiba, Chiba, Japan

Applicant after: Seiko Instruments Inc.

Address before: Chiba County, Japan

Applicant before: Nippon Seiki Co., Ltd.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication