CN1296641A - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- CN1296641A CN1296641A CN00800288A CN00800288A CN1296641A CN 1296641 A CN1296641 A CN 1296641A CN 00800288 A CN00800288 A CN 00800288A CN 00800288 A CN00800288 A CN 00800288A CN 1296641 A CN1296641 A CN 1296641A
- Authority
- CN
- China
- Prior art keywords
- display unit
- film
- pattern
- substrate
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000004332 silver Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000004020 conductor Substances 0.000 abstract description 22
- 239000011888 foil Substances 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 101100400452 Caenorhabditis elegans map-2 gene Proteins 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000006181 electrochemical material Substances 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
A flexible foil having double-sided conductor patterns of a satisfactorily conducting material (gold, silver, nickel) is used in the interconnection of conductor patterns of a display device (LCD, OLED), which enhances the freedom of design.
Description
The present invention relates to display unit, comprise having first substrate that is used for connecting the conductive pattern of pixel in the conductivity mode.Conductive pattern can be understood to mean the pattern of the conductor that just lists and go and wherein introduce the bigger pattern of drive IC.
With such display unit, particularly liquid crystal indicator, be used for measuring equipment very generally, also be used for portable phone.And, obtain more and more widely application based on the el display of (organically) LED.
For ongoing electronic device miniaturization, on the one hand, might on substrate, realize more standard drive electronics, on the other hand, providing the solution that satisfies the needs of consumers, realize that the needs of for example extra function aspects are also increasing simultaneously.So just become to very long at the first on-chip most conductive pattern, because its length makes them have too high resistance.The loss of voltage that causes thus causes the too low driving voltage at pixel area, and this will be with correct adjustment gray scale as cost, or even may cause the pixel that can't encourage.
The objective of the invention is, the display unit of the above type is provided, wherein, in reliable mode the surface of first substrate is provided with and is connected to outside low ohm conductor, and obtain maximum design freedom simultaneously.
, the invention is characterized in that the substrate of at least a portion film has the electrical conductance patterns on the two sides of film for this reason, this pattern by at least one hole on the film with the connection (through-connected) of interpenetrating of conductivity mode.
Preferably this conductive pattern is embodied as metal pattern, every kind of every kind of metal from gold, silver and nickel, selecting of metal.This conductive pattern can be supposed any shape of wanting.Owing to select the metal of low ohm metal as conductive pattern, the length of conductor bar is for not influence or almost not influence of resistance.This means, this conductive pattern can be placed on the display part around, if want, and can any position be used in addition the conductor (for example, joint) that (outside) contact and be connected.
First embodiment according to display unit of the present invention is characterised in that, is connecting the pattern that is connected to the conduction on the film on the zone that connects at the first on-chip conductive pattern.(that is) perforation, near pixel connects, and the resistance of conductive pattern (normally ITO rail bar) influences total resistance hardly by edge along the display part of reality only is provided.
Another embodiment according to display unit of the present invention is characterised in that film is flexible.Direct outside contact can realize by so flexible film, but replacedly, such film can be around the curved edge of substrate, and conductive pattern is connected to the metallized pattern of printed circuit board (PCB) in the mode (for example, passing through anisotropic conductive) of convention.
Another embodiment according to display unit of the present invention is characterised in that, forms interconnection at the pattern of the conduction of film both sides.Cross-coupled use has like this increased the possible number of realizing design circuit on film.
The present invention can be applicable to based on liquid crystal effects or other photoelectric display unit, and wherein photoelectric material is present between two substrates.Such embodiment is characterised in that this display unit comprises second substrate and the photoelectric material between two substrates, and each substrate is equipped with the pattern electrodes of regulation pixel, together with the photoelectric material that inserts.
This display unit also can be based on electroluminescent effect.
To understand these and other aspect of the present invention with reference to the embodiment that describes below.
In the accompanying drawings:
Fig. 1 is the plan view according to the part of first embodiment of display of the present invention,
Fig. 2 is the cross section of getting along line II-II of Fig. 1,
Fig. 3 illustrates the change example of a part of displayed map 2,
Another of the part of Fig. 4 displayed map 2 becomes example,
Fig. 5 is the plan view according to the part of second embodiment of display of the present invention,
Fig. 6 is the cross section of getting along line VI-VI of Fig. 5, and
Fig. 7 and 8 is the cross sections of getting along line VII-VII and the VIII-VIII of Fig. 5.
These figure do not draw in proportion; Corresponding elements is represented with identical reference number usually.
Fig. 1 is a plane graph, and Fig. 2 is the sectional view of the part of display unit, in this example, liquid crystal indicator comprises liquid crystal junior unit 1, have thread 1 liquid crystal material 2 of distortion, it exists between the substrate 3,4 of two transparent glass or synthetic material, electrode 5,6 is housed on it in the present embodiment.Display unit also comprises the polarizer (not shown), and its polarised direction is mutually perpendicular.Display unit also comprises the oriented layer (not shown), and it arranges the direction of the liquid crystal material on the inwall of substrate in the present embodiment, so that junior unit has 90 degree that reverse.In the present embodiment, liquid crystal material has the photoanisotropy of positivity and the medium anisotropy of positivity.When electrode 5,6 usefulness voltages added energy to molecule, guider was directed to electric field to them.Junior unit 1 is a circumference with the edge 7 of junior unit wall or sealing.
The transparent electrode 5,6 of ITO (tin indium oxide) crosses one another at present embodiment, has stipulated pixel on the intersection area, and electrode must add driving voltage.These voltages can add from the outside by the conduction rail bar of (being printed circuit board (PCB) in this example) on supporting.
In the embodiment in figure 1, electrode 5 adds driving voltage by the drive circuit (IC) 12 that is installed on first substrate 3.Electrode 5 (and the method for passing through the technical convention of LCD, also have electrode 6) be connected by protrusion 13.The conductive pattern 14 ' of other protrusion 13 contacts on film 15.According to the present invention, there is a conductive pattern both sides of (for example, polyalkylene imine) film.In the present embodiment, film is flexible, and has metal pattern in a side, and for example Jin pattern 14 is stipulated the conductor that connects.The pattern 14 ' of the gold on opposite side only comprises contact area in the present embodiment, and it is connected to pattern 14 by connecting connection (or path) in the conductivity mode.If necessary, contact area 14 ' is connected to protrusion 13 by conductor 5 '.Conductor 5 ' is not necessarily made with ITO, but can alternatively make with metal, maybe when use (LT) many-transistor is used for connecting and during without drive IC the form of the pattern of formation polysilicon rail bar.
In the embodiments of figure 3, for be electrically connected (not the having IC 12 now) between conductor 14 ' and the conductor 5, using extra anisotropic conductor 16, is the polyalkylene imine copper film that has the copper rail bar of the conduction of crossing film in the present embodiment.
Fig. 4 shows that becomes an example, and the film 15 (as mentioned above) that wherein has conductor 14 extends to the edge 17 of substrate 3.Fig. 4 shows that clearly the film of describing with reference to Fig. 2 can center on substrate 3 bendings, so that pass through the lip-deep conductor rail bar 19 of anisotropic conductor 18 contact print circuit boards 20.
Fig. 5 and Fig. 6 show that becomes an example, and wherein the film 15 on the substrate 3 has perforate (chain-dotted line 21 expressions are arranged) and is used for display unit 1 (for example, many LED display unit, or as in the present embodiment, LCD display unit) and IC 12. Conductor 5,14,14 ' draws arbitrarily as an example, but is considered to form a functional integral body.See from Fig. 5, the pattern of conductor 14 might be provided on film 15 surfaces, this pattern is contact patterns 14 ' on the zone of path (connect and connect) 16.In this case, on the one hand, might be similar to Fig. 3 and contact conductor rail bar 5.On the other hand, might local interruption conductor rail bar 14 passage region on the side of film 15, and realize providing the connection (Fig. 7,8) of whole connections 16 to the conductor rail bar 14 ' of the opposite side of film 15.In the present embodiment, most of film 15 (particularly at conductive pattern 14, the 14 ' zone that is connected with perforation) is fixed on the substrate by bonding connection.If want, link all outside connections and can realize in a side of substrate, also be possible but connect from different sides.Because conductive pattern 14 is made by low ohm material (gold, silver, nickel), thus very big design freedom is arranged, and do not occur simultaneously because the loss of voltage that long conductor rail bar causes.
Certainly, the present invention is not limited to shown embodiment, but many change examples might be arranged within the scope of the invention.For example, without liquid crystal material, and can use other photoelectric material, such as electrophoresis or electrochemical material.
In a word, (both sides of this film have low ohm, interconnected conductive pattern for LCD, the OLCD) use in, and therefore the very big degree of freedom is provided in display unit to the present invention relates to (flexible) film.
The present invention ascribes each and every kind of novel feature and each and every kind of combination of features to.
Claims (10)
1. display unit, comprise and have first substrate that is used for connecting the conductive pattern of pixel in the conductivity mode, it is characterized in that, the substrate of at least a portion film has the electrical conductance patterns on the two sides of film, and this pattern all connects mutually in the conductivity mode by at least one hole on the film.
2. display unit as claimed in claim 1 is characterized in that the conductive pattern on the film both sides is a metal pattern.
3. display unit as claimed in claim 2 is characterized in that, this metal is to select from gold, silver and nickel one group.
4. display unit as claimed in claim 1 is characterized in that, is connecting the pattern that is connected to the conduction on the film on the zone that connects at the first on-chip conductive pattern.
5. display unit as claimed in claim 4 is characterized in that, a part that has the film that connects fully is fixed on the substrate.
6. display unit as claimed in claim 1 is characterized in that film is flexible.
7. display unit as claimed in claim 4 is characterized in that, the conductive pattern of pattern contact on another supports of at least one conduction.
8. display unit as claimed in claim 1 is characterized in that, forms interconnection at the pattern of the conduction of film both sides.
9. display unit as claimed in claim 1 is characterized in that, display unit comprises second substrate and the photoelectric material between two substrates, and each substrate is equipped with the pattern electrodes of regulation pixel, together with the photoelectric material that inserts.
10. display unit as claimed in claim 1 is characterized in that display unit comprises electroluminescent material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99200671 | 1999-03-08 | ||
| EP99200671.8 | 1999-03-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1296641A true CN1296641A (en) | 2001-05-23 |
| CN1174488C CN1174488C (en) | 2004-11-03 |
Family
ID=8239956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008002886A Expired - Lifetime CN1174488C (en) | 1999-03-08 | 2000-02-14 | Display device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7064751B1 (en) |
| EP (1) | EP1080497A1 (en) |
| JP (1) | JP2002539485A (en) |
| CN (1) | CN1174488C (en) |
| WO (1) | WO2000054333A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10133651B4 (en) * | 2001-07-11 | 2006-02-23 | Siemens Ag | Flexible display unit and method of operation |
| US8510935B2 (en) * | 2007-07-10 | 2013-08-20 | Joseph C Fjelstad | Electronic assemblies without solder and methods for their manufacture |
| US7782191B2 (en) * | 2007-07-25 | 2010-08-24 | Tomas Flores | Portable alarm apparatus for warning persons |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161341A (en) * | 1984-08-31 | 1986-03-29 | Fujitsu Ltd | Gas discharge panel |
| JP2548677Y2 (en) * | 1991-05-10 | 1997-09-24 | シャープ株式会社 | LCD lighting system |
| EP0563959B1 (en) * | 1992-04-02 | 1998-07-29 | Canon Kabushiki Kaisha | Liquid crystal device, display apparatus using same and display method using same |
| JP2727862B2 (en) * | 1992-04-28 | 1998-03-18 | 日本電気株式会社 | Connection tape, film carrier type IC, and connection method |
| US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
| JP2721093B2 (en) * | 1992-07-21 | 1998-03-04 | 三菱電機株式会社 | Semiconductor device |
| DE69328197T2 (en) * | 1992-12-15 | 2000-08-17 | Idemitsu Kosan Co | TRANSPARENT, CONDUCTIVE LAYER, TRANSPARENT, CONDUCTIVE BASE MATERIAL AND CONDUCTIVE MATERIAL |
| US5399902A (en) * | 1993-03-04 | 1995-03-21 | International Business Machines Corporation | Semiconductor chip packaging structure including a ground plane |
| US5436744A (en) * | 1993-09-03 | 1995-07-25 | Motorola Inc. | Flexible liquid crystal display with integrated driver circuit and display electrodes formed on opposite sides of folded substrate |
| DE69428528T2 (en) * | 1994-01-01 | 2002-04-11 | Koninkl Philips Electronics Nv | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR PRODUCING A NUMBER OF LIQUID CRYSTAL DISPLAY DEVICES |
| JP3143565B2 (en) * | 1994-02-28 | 2001-03-07 | キヤノン株式会社 | Flexible printed wiring, connection device thereof, and electric circuit device |
| US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
| TW344043B (en) * | 1994-10-21 | 1998-11-01 | Hitachi Ltd | Liquid crystal display device with reduced frame portion surrounding display area |
| US5834327A (en) * | 1995-03-18 | 1998-11-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing display device |
| DE19626377A1 (en) * | 1996-07-01 | 1998-01-08 | Dunkel Otto Gmbh | Contact device for the electrical connection of a printed circuit board to a liquid crystal display plate |
| US5973761A (en) * | 1997-01-31 | 1999-10-26 | Canon Kabushiki Kaisha | Ferroelectic liquid crystal device having a low-resistivity layer below an alignment control layer |
| US5851709A (en) * | 1997-10-31 | 1998-12-22 | Eastman Kodak Company | Method for selective transfer of a color organic layer |
| JP3380482B2 (en) * | 1997-12-26 | 2003-02-24 | シャープ株式会社 | Liquid crystal display |
| US6236440B1 (en) * | 1998-07-22 | 2001-05-22 | U.S. Philips Corporation | Display device in which one of the two electrodes of a pixel is coated with a dipole material to equalize the electrode work functions |
-
2000
- 2000-02-14 EP EP00909161A patent/EP1080497A1/en not_active Withdrawn
- 2000-02-14 JP JP2000604462A patent/JP2002539485A/en active Pending
- 2000-02-14 WO PCT/EP2000/001176 patent/WO2000054333A1/en not_active Application Discontinuation
- 2000-02-14 CN CNB008002886A patent/CN1174488C/en not_active Expired - Lifetime
- 2000-03-06 US US09/519,551 patent/US7064751B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1174488C (en) | 2004-11-03 |
| WO2000054333A1 (en) | 2000-09-14 |
| JP2002539485A (en) | 2002-11-19 |
| EP1080497A1 (en) | 2001-03-07 |
| US7064751B1 (en) | 2006-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TONGBAO HONG KONG CO., LTD. Free format text: FORMER OWNER: ROYAL PHILIPS ELECTRONICS CO., LTD. Effective date: 20070309 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070309 Address after: Floor two, PHILPS tower, 5 East Science Avenue, Sha Tin, Hongkong Science Park, Hongkong Patentee after: TPO HONG KONG HOLDING Ltd. Address before: Holland Ian Deho Finn Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 2003, 20 / F, phase 3, Chuang Ji City, 370 Kwun Tong Road, Kowloon City, Hong Kong, China Patentee after: Groupon optoelectronics Hong Kong Holdings Ltd. Address before: Two floor, PHILPS building, 5 East Science Avenue, Sha Tin Hongkong Science Park, Hongkong, China Patentee before: Tpo Hong Kong Holding Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191030 Address after: No. 160, science Road, Zhunan base, Xinzhu Science Industrial Park, Zhunan Town, Miaoli County, Taiwan, China Patentee after: INNOLUX DISPLAY CORP. Address before: Room 2003, 20 / F, phase 3, Chuang Ji City, 370 Kwun Tong Road, Kowloon City, Hong Kong, China Patentee before: Groupon optoelectronics Hong Kong Holdings Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20041103 |