CN1133899C - LCD device - Google Patents
LCD device Download PDFInfo
- Publication number
- CN1133899C CN1133899C CNB011005777A CN01100577A CN1133899C CN 1133899 C CN1133899 C CN 1133899C CN B011005777 A CNB011005777 A CN B011005777A CN 01100577 A CN01100577 A CN 01100577A CN 1133899 C CN1133899 C CN 1133899C
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- Prior art keywords
- substrate
- banded
- link
- splicing ear
- ear portion
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- Expired - Fee Related
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- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The liquid crystal display device is produced by disposing two substrates each having a display part 13 having a plurality of transparent electrodes on its inner face and having a connection terminal 14 on one end of the inner face, with the display part 13 facing each other and with the connection terminal 14 protruding from the other substrate, and by sealing a liquid crystal between the two substrates 11, 12. The connection terminals 14 of the substrates 11, 12 are connected to a printed circuit board 15 disposed on the outer face of one substrate 11 through tape-type connecting members 11, 16. The tape-type connecting member 16 connected to the connection terminal 14 of one substrate 11 is folded to show an almost U-shape cross section, while the tape-type member 1 connected to the connection terminal 14 of the other substrate 12 is not folded.
Description
Technical field
The present invention relates to liquid crystal indicator, particularly can make the input terminal that is separately positioned on two substrate places, the liquid crystal indicator that is connected with the tellite that is configured in a lateral surface place on the substrate by banded link.
Background technology
Fig. 4 represents is an example of the liquid crystal indicator in the technology formerly.The device that uses in this example is simple matrix type display panels, so at two substrates that are being oppositely arranged, be that 12 of upside substrate 11 and downside substrates are also enclosed the liquid crystal (not shown) is arranged.Be provided with several transparency electrode (not shown)s parallel to each other respectively at the medial surface place of two substrates 11,12.Place, end on these two substrates 11,12 is provided with splicing ear portion 14, and also is provided with the input terminal that several are connected with transparency electrode on the same substrate respectively here.In these two substrates 11,12, and the relative configuration orthogonal with the transparency electrode on the downside substrate 12 of the transparency electrode on the upside substrate 11 is so the zone that transparency electrode coincides on two substrates 11,12 can constitute display part 13.On the other hand, the splicing ear portion 14 that is positioned on the upside substrate 11 is not positioned opposite to each other with the splicing ear portion 14 that is positioned on the downside substrate 12 on substrate adjacent one another are, but on the display part 13 two different directions the direction place is outstanding toward the outer side respectively.
And, also dispose flexible printed circuit substrate 15 (below abbreviate tellite (FPC) as) at the lateral surface place of upside substrate 11, be positioned at the input terminal at splicing ear portion 14 places on the upside substrate 11, by having the banded link 16 of flexibility, be connected with the loop that constitutes by tellite (FPC) 15.Be positioned at the input terminal at splicing ear portion 14 places on the downside substrate 12, also be connected with the loop that constitutes by tellite (FPC) 15 by banded link 17.
Use has the identical structure form of the composition at the banded link 16 at upside substrate 11 places with using the banded link 17 at downside substrate 12 places, and also being provided with integrated circuit (IC) chip 23 at place, side as Fig. 5, banded resin material body 21 shown in Figure 6, that have flexibility, the place is provided with the circuit connection 22 that is made of conductive film in the another side.Upside substrate 11 can be as shown in Figure 5, make and be positioned at the side 16a place, that be formed with circuit connection 22, an end on the banded link 16, be connected with the splicing ear portion 14 at medial surface place on being positioned at upside substrate 11, and banded link 16 is bent to its section be the U font substantially, be positioned at side 16b place, the other end, that be formed with circuit connection 22 thereby make, can be connected with the end of the tellite (FPC) 15 at lateral surface place on being positioned at upside substrate 11.Implementing to turn back the position of sigmoid, also on banded resin material body 21, be formed with the opening 21a that is shape of slit, so that its bending operation is implemented easily to banded link 16.
On the other hand, downside substrate 12 can be as shown in Figure 6, make the side 17a place, that be formed with circuit connection 22, an end that is positioned on the banded link 17, with be positioned at downside substrate 12 on the splicing ear portion 14 at medial surface place be connected, and banded link 17 is bent to its section be the U font substantially, be positioned at side 17b place, the other end, that be provided with integrated circuit (IC) chip 23 thereby make, can be connected with the end on the tellite that is positioned at upside substrate 11 superolateral surface places (FPC) 15.Here, can utilize the other end 17b on this band shape link 17, form the opening 21b that is window shape at banded resin material body 21 places, and separate circuit connection 22 at the place, inside of this opening 21b.Therefore, can be by the mode of implementing at the inner place of this opening 21b to be welded to connect, tellite (FPC) 15 is implemented to be connected with banded link 17, and then can implement to be connected with the loop that constitutes by tellite (FPC) 15 circuit connection 22 on the banded link 17.
Yet in this structure constituted, the coupling part that has 15 of the banded link 17 that is positioned at downside substrate 12 places and tellites (FPC) is easy to generate peeled off, and circuit connection 22 is easy to generate problems such as broken string.In other words be exactly, have flexibility though be positioned at the banded link 17 at downside substrate 12 places, yet because it is provided with circuit connection 22 and integrated circuit (IC) chip 23, so also will have certain rigid.And, as shown in Figure 6, along with the side that is formed with circuit connection 22 as the direction of lateral surface, promptly when the direction that circuit connection 22 is produced extend is implemented to turn back sigmoid, with as shown in Figure 5, compare in the situation of the sigmoid of implementing along the direction that circuit connection 22 is produced shrink to turn back, the tendency that banded link 17 is born restore to the stress of original shape will be bigger.And, between circuit connection 22 that is positioned at banded link 17 places on the downside substrate 12 and tellite (FPC) 15, be by banded resin material body 21, under 15 states that do not connect airtight mutually of circuit connection 22 and tellite (FPC), implement to connect.Therefore in the connecting portion office of 15 of this banded link 17 and tellites (FPC), have along under the stress of direction of delaminate, be easy to generate between the two and peel off and problem such as broken string.On the other hand; if adopt as shown in Figure 6; make banded link 17 be the structure form of the composition of the sigmoid that turns back; even be formed on the end at splicing ear portion 14 places on the downside substrate 12; to compare the area that further projects to the lateral direction place smaller with upside substrate 11; yet 17 of splicing ear portion 14 and banded links are being implemented when bonding; also can be outstanding many of the sigmoid part of turning back on the banded link 17 by the end edge of downside substrate 12; thereby may make to install is difficult to carry out; and owing to also need this sigmoid that turns back that is projecting form is partly implemented protection, so also have the problem that can make device bigger.
Summary of the invention
The present invention is exactly in order to address the above problem, its objective is provides a kind of coupling assembling that uses between splicing ear portion and tellite (FPC) etc. on the substrate that is configured in, and make this coupling assembling can prevent to produce to peel off and break, improve trustworthiness, and can improve installability and can make equipment miniaturization.
In order to address the above problem, the invention provides a kind of liquid crystal indicator, it can have two substrates that place, end display part, on this medial surface that side within it is provided with several transparency electrodes is provided with the splicing ear portion of the input terminal that is connected with described transparency electrode respectively, these two substrates are oppositely arranged with respect to described display part, and an end that is arranged on described splicing ear portion place is in the relative configuration with it in position that is positioned at the adjacent substrate outside, and inclosure has liquid crystal between these two substrates; It is characterized in that can also be by disposing the circuit connection that is made of conductive film and the banded link of integrated circuit (IC) chip respectively having on the strip-shaped parts of flexibility, make on described two substrates splicing ear portion be configured in described two substrates in the tellite at lateral surface place on substrate be connected; And the described banded link that is connected with splicing ear portion on the described substrate, be folded back and bend to section and be the U font, the described banded link that is connected with splicing ear portion on another substrate does not form the sigmoid that turns back, and is configured in step-like of being made of a substrate and another substrate and locates.
If adopt this form of the composition of the present invention, just can make banded link produce the sigmoid that turns back by the substrate that utilization is configured in the tellite side, and utilize another substrate to make banded link not form the mode of the sigmoid that turns back, make provided, be configured in the coupling assembling that uses between splicing ear portion and tellite (FPC) on the substrate, can prevent and peel off and the phenomenon that breaks, thereby can improve its trustworthiness.And, formerly the sigmoid portion of turning back on the banded link in the technology can be by outstanding bigger position, substrate place, and the present invention can not make banded link generation outstanding, so the present invention can also improve installability, and can make equipment miniaturization.
Here, the banded link among the present invention is when sigmoid is turned back in formation, and two ends on the circuit connection direction of banded link upper edge are under the same directional state.And described two ends that do not form on the banded link of the sigmoid that turns back are in rightabout toward each other state, so banded link when needed, also can not be flat condition.
And, in a kind of liquid crystal indicator provided by the present invention, can also make banded link be provided with integrated circuit (IC) chip by the place, a side at banded resin material body, the parts that are provided with the circuit connection that is made of conductive film at another place, side constitute.
And, in a kind of liquid crystal indicator provided by the present invention, being connected between banded link and tellite, preferably under face that is formed with conductive film on the banded link and the contacted state of tellite, be welded to connect implementing between banded link and tellite.
And; in a kind of liquid crystal indicator provided by the present invention; the end that can also make the described banded link that is connected with splicing ear portion on another substrate, does not promptly form on the banded link of the sigmoid that turns back is connected with splicing ear portion on the substrate, and preferably is coated with the moisture protection agent between the end edge at the place, an end that is positioned at this band shape link and substrate.Adopt this form of the composition, can also prevent that moisture content is by end edge on the banded link and the gap location between substrate, and by the immersion of the binding site place between the circuit connection on input terminal in the splicing ear portion and the banded link, thereby can further improve its quality and trustworthiness.
And; in a kind of liquid crystal indicator provided by the present invention; can also make the banded link that is connected with splicing ear portion on another substrate, promptly not form the banded link of the sigmoid that turns back; locate for step-like that is configured between a substrate and another substrate, and the gap location between this step-like and banded link also preferably is coated with the moisture protection agent.Adopt this form of the composition, gap location between can also prevent that moisture content from being made of two substrates step-like and banded link, and by the immersion of the binding site place between the circuit connection on input terminal in the splicing ear portion and the banded link, thereby can further improve its quality and trustworthiness.
Description of drawings
The schematic appearance figure that Fig. 1 uses for a kind of form of implementation of expression liquid crystal indicator constructed according to the invention.
Fig. 2 (a) schematically illustrates figure for what a form of implementation of expression banded link used in the present invention was used.
Fig. 2 (b) is line B-B in Fig. 2 (a) schematic cross sectional view when cutting open for expression.
Schematic cross sectional view when Fig. 3 cuts open for the line III-III of expression in Fig. 1.
Fig. 4 is a schematic appearance figure that example is used who represents the liquid crystal indicator in the technology formerly.
Schematic cross sectional view when Fig. 5 cuts open for the line V-V of expression in Fig. 4.
Schematic cross sectional view when Fig. 6 cuts open for the line VI-VI of expression in Fig. 4.
Embodiment
Fig. 1～Fig. 3 represents is a kind of form of implementation of liquid crystal indicator constructed according to the invention.In Fig. 1～Fig. 3, represent by identical reference number with structure inscape identical among Fig. 4～Fig. 6, and omitted detailed description them.
Liquid crystal indicator in this form of implementation and main difference part as shown in Figure 4, that belong between the liquid crystal indicator in the technology formerly are, make be connected with tellite (FPC) the 15 banded link 1 of usefulness of the splicing ear portion 14 that is positioned at downside substrate 12 places, can not form the sigmoid form of turning back.
Employed banded link 1 is shown in Fig. 2 (a) and Fig. 2 (b) in this form of implementation, can be on by a side such as banded resin material bodies 21 that constitute, that have flexibility such as polyimide resins, be provided with integrated circuit (IC) chip 23, and on the another side, be formed with the circuit connection 22 that constitutes by conductive film.Direction (circuit connection bearing of trend) along circuit connection 22, integrated circuit (IC) chip 23 is arranged on than the more close tellite of central portion (FPC) end side side, coupled, banded resin material body 21 is provided with the position of integrated circuit (IC) chip 23, also is formed with the opening 21c that is window shape.Circuit connection 22 is in the position than integrated circuit (IC) chip 23 more close substrate-side, be formed with and relative several substrate-side circuit connections 22a of several input terminals in the splicing ear portion 14, and in position than integrated circuit (IC) chip 23 more close tellite (FPC) sides, also be formed with tellite (FPC) on corresponding several tellites of terminal (FPC) lateral circuit line 22b.Substrate-side circuit connection 22a can be by the inside of opening 21c, with be positioned at the substrate-side electrode 23a that integrated circuit (IC) chip 23 locates below and be connected, and tellite (FPC) lateral circuit line 22b also can be by opening 21c inside, and be positioned at tellite (FPC) the lateral electrode 23b that integrated circuit (IC) chip 23 locates below and be connected.
At place, end than integrated circuit (IC) chip 23 more close tellite (FPC) sides, can also be formed with the opening 21b that is window shape on the banded resin material body 21, and at the place, inside of this opening 21b, tellite (FPC) the lateral circuit line 22b that can also exhume out and be the curtain shape.At the position than integrated circuit (IC) chip 23 more close substrate-side, banded resin material body 21 can also be formed with two opening 21a that are shape of slit, so banded link 1 forms the sigmoid that turns back easily in the position of this opening 21a.And, except along the part place two ends on the circuit connection direction, be positioned at by also being formed with coverlay 24 on the circuit connection 22 of opening 21a to integrated circuit (IC) chip 23.Adopt this form of the composition, can prevent that just circuit connection 22 from locating to produce broken string such as the inside of the opening 21a that is shape of slit etc.
If one in upside substrate 11 and the downside substrate 12 is rectangle, display part 13 also can be rectangle.If the long limit on the downside substrate 12 is longer than the long limit of upside substrate 11, then at the end place of display part 13 along long side direction, the splicing ear portion 14 on the downside substrate 12 can be further more outstanding toward the outer side than upside substrate 11.On the other hand, if the minor face on the upside substrate 11 is longer than the minor face on the downside substrate 12, then at the end place of display part 13 along short side direction, the splicing ear portion 14 on the upside substrate 11 can be further more outstanding toward the outer side than downside substrate 12.
As shown in Figure 3, splicing ear portion 14 places on downside substrate 12, be formed with the side of circuit connection 22 on the banded link 1, can be at the end edge place of downside substrate 12 or the position at more close inboard place, overlap each other with the end edge of banded link 1.And, can be by adhesive bond assembly such as formations such as anisotropic conducting films, splicing ear portion 14 and banded link 1 are implemented adhesive bond, thereby can in this way the circuit connection 22 on input terminal in the splicing ear portion 14 and the banded link 1 be coupled together.Banded link 1 can form curve transition in the position that is shape of slit opening 21a, thereby be connected with the tellite that is configured in upside substrate 11 places (FPC) 15 along step-like 30 that is made of downside substrate 12 and upside substrate 11.And; be positioned at the gap of 1 of step-like 30 of constituting and banded link by downside substrate 12 and upside substrate 11; and be positioned at gap between the end edge of downside substrate 12 and banded link 1, can implement sealing by the mode of utilizing moisture protection agent 31,32 to implement to apply respectively.If for instance, this moisture protection agent can be silicone resin, uv-hardening resin etc.Distance A by between the end edge of the end edge on the banded link 1 to the downside substrate 12 preferably is set in the scope of about 0.3～0.7 millimeter (mm), and that get in this form of implementation is 0.5 millimeter (mm).When less than this distance A, be difficult to the moisture protection agent is implemented to apply, and when greater than this distance A, downside substrate 12 will have above the length that needs, thereby can make device be difficult to miniaturization.And the circuit connection 22 on the banded link 1 is connected with 15 of tellites (FPC), and preferably employing exposes in opening 21b inside circuit connection 22 to the open air both are implemented ways of connecting.
The splicing ear portion 14 that is arranged on the upside substrate 11 can constitute similar with a kind of structure as shown in Figure 5, that belong to technology formerly, promptly can turn back sigmoid and make section be the U font, and then be connected with tellite (FPC) 15 by this banded link 16 to banded link 16 enforcements.The banded link 16 that is positioned at upside substrate 11 places can have the similar substantially structure form of the composition with banded link 1 as shown in Figure 3, and in this form of implementation, the quantity of all right foundation such as input terminal etc., change is implemented in quantity and configuration to circuit connection 22, such as can also adopt two input terminals etc.
Be positioned at the bound fraction of 16 of splicing ear portion 14 on the upside substrate 11 and banded links; can be as shown in Figure 5; can be so that be formed with the side of circuit connection on medial surface on the upside substrate 11 and the banded link 16 and connect airtight each other; thereby can utilize general curved to be the banded link 16 of U font; the gap of 16 of the end edge on the upside substrate 11 and banded links is implemented to surround, even and then can form the structure form of the composition that the moisture protection agent also can make moisture content be difficult to immerse is not set.
If adopt this form of implementation, just can adopt banded link 1,16 with same structure form of the composition, and can make its generation sigmoid that turns back by utilizing upside substrate 11, utilize downside substrate 12 to make its mode that does not produce the sigmoid that turns back, two splicing ear portions 14 on the substrate are connected with a tellite (FPC) 15 that is configured in upside substrate 11 lateral surface places.Because 15 banded links 1 of implementing to be connected of splicing ear portion 14 on the downside substrate 12 and tellite (FPC) are not needed to form the sigmoid that turns back, so being welded to connect part and can not being subjected to stress along direction of delaminate of 15 of banded link 1 and tellites (FPC), thereby can prevent to produce peels off and breaks.And, banded link 1 on the downside substrate, be to implement to be welded to connect making under the side that is formed with circuit connection 22 and tellite (FPC) the 15 contacted states, so circuit connection 22 and good by the sealing between the loop of tellite (FPC) 15 formations, and strength of joint is quite high.Therefore, with as shown in Figure 6, banded link 17 is compared along the technology formerly that inappropriate direction produces the sigmoid that turns back, can improve the trustworthiness of connection.And, the banded link 17,16 that this banded link 1,16 can also intact employing formerly uses in the technology.
And compare with technology formerly, the splicing ear portion 14 that is positioned on the downside substrate 12 can be necessary minimum area with combining of 1 of banded link, so formerly technology is compared and can further be realized miniaturization, if adopt this form of implementation, can also not make banded link 1 outstanding fully, thereby can shorten device along the yardstick on display part 13 long side directions towards the lateral direction of downside substrate 12.And display part 13 can not make banded link 1 outstanding towards the lateral direction of downside substrate 12 fully, thereby makes installability good along two ends of long side direction.And; be positioned at the gap between the end edge of downside substrate 12 and banded link 1; and the gap that is positioned at 1 of step-like 30 of constituting and banded link by upside substrate 11 and downside substrate 12; can be coated with moisture protection agent 32,31 respectively; so can prevent because moisture content immerses the problem appearance of input terminal and the bad connection between the substrate-side circuit connection 22a on the banded link 1 in the splicing ear portion 14 that is produced from these gap locations, thereby can improve the trustworthiness of demonstration.
And, be to be that example describes in this form of implementation with the device that is adopting simple matrix type display panels, yet the present invention is not limited to this, the present invention is applicable to that also the medial surface place such as two substrates 11,12 of liquid crystal in clamping is provided with splicing ear portion 14 respectively, and makes the liquid crystal indicator of liquid crystal indicator that the splicing ear portion 14 on two substrates 11,12 is connected with the tellite that is configured in a lateral surface place on the substrate etc.
And, be to be that example describes in this form of implementation, yet the present invention is not limited to this with the situation that is adopting flexible printed circuit substrate (FPC) 15, the present invention can also adopt other various forms tellite.The material of banded link 1, shape etc. also are not limited in these concrete forms of the composition as shown in the figure, can also implement suitably change in institute of the present invention applicable scope.
And, the banded link 16 that is formed on upside substrate 11 places also might not need to adopt the identical structure form of the composition with the banded link 1 that is formed on downside substrate 12 places, but be to make both have the identical structure form of the composition in this form of implementation, because can make the parts universalization like this, thereby has the advantage that can reduce part count.
And in this form of implementation, splicing ear portion 14 on the downside substrate 12 is outstanding along the place, an end on the long side direction by display part 13, and make this band shape link 1 not produce the sigmoid that turns back, yet also can implement change to the size of substrate, thereby make the splicing ear portion 14 that is positioned on the downside substrate 12 outstanding, so also can not make banded link 1 produce the sigmoid that turns back by the place, an end on the short side direction that is positioned on the display part 13.For this situation, can also further shorten the length of device, and can have good installability along the short side direction of display part 13.And the shape of substrate and display part is not limited in rectangle, also can implement suitable change.
If adopt aforesaid the present invention, just can make the splicing ear portion at medial surface end place that two substrates of liquid crystal in clamping that is separately positioned on, when being connected with the tellite that is configured in a lateral surface place on the substrate, a substrate that is configured in the tellite side by utilization makes banded link produce the sigmoid that turns back, and utilize another substrate to make banded link not produce the mode of the sigmoid that turns back, provided and make, be configured in the coupling assembling of splicing ear portion and 15 uses of tellite (FPC) on the substrate, can prevent and peel off and the phenomenon that breaks, thereby can improve trustworthiness.And, do not produce the mode of the sigmoid that turns back by making banded link, can also not form the outshot of the sigmoid portion of turning back, thereby can also further improve installability, and make equipment miniaturization.
Claims (5)
1. liquid crystal indicator, have place, end display part, on this medial surface that side within it is provided with several transparency electrodes and be provided with two substrates of the splicing ear portion of the input terminal that is connected with described transparency electrode respectively, these two substrates are oppositely arranged with respect to described display part, and an end that is arranged on described splicing ear portion place is in the relative configuration with it in position that is positioned at the adjacent substrate outside, and inclosure has liquid crystal between these two substrates
It is characterized in that by disposing the circuit connection that constitutes by conductive film and the banded link of integrated circuit (IC) chip on the strip-shaped parts of flexibility respectively having, make on described two substrates splicing ear portion be configured in described two substrates in the tellite at lateral surface place on substrate be connected
And the described banded link that is connected with splicing ear portion on the described substrate, be folded back and bend to section and be the U font, the described banded link that is connected with splicing ear portion on another substrate does not form the sigmoid that turns back, and is configured in step-like of being made of a substrate and another substrate and locates.
2. a liquid crystal indicator as claimed in claim 1 is characterized in that described banded link is provided with integrated circuit (IC) chip at the place, a side of banded resin material body, is provided with the circuit connection that is made of conductive film at another place, side.
3. liquid crystal indicator as claimed in claim 1, it is characterized in that under side that is formed with described conductive film on the described banded link and the contacted state of described tellite, described banded link and described tellite are implemented to be welded to connect.
4. liquid crystal indicator as claimed in claim 1; it is characterized in that the described banded link that is connected with splicing ear portion on described another substrate; the end edge of an end on the described banded link is connected with splicing ear portion on the described substrate, and coating moisture protection agent between the end edge at the place, an end that is positioned at this band shape link and described substrate.
5. liquid crystal indicator as claimed in claim 1 is characterized in that the gap location between this step-like and banded link is coated with the moisture protection agent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000015055A JP3748752B2 (en) | 2000-01-24 | 2000-01-24 | Liquid crystal display |
| JP015055/2000 | 2000-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1319780A CN1319780A (en) | 2001-10-31 |
| CN1133899C true CN1133899C (en) | 2004-01-07 |
Family
ID=18542411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011005777A Expired - Fee Related CN1133899C (en) | 2000-01-24 | 2001-01-16 | LCD device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3748752B2 (en) |
| CN (1) | CN1133899C (en) |
| TW (1) | TWI262345B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100690002B1 (en) * | 2000-06-12 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | Electroluminence Display |
| JP4257180B2 (en) * | 2003-09-30 | 2009-04-22 | Ｎｅｃ液晶テクノロジー株式会社 | Double-sided liquid crystal display device |
| WO2009130742A1 (en) * | 2008-04-25 | 2009-10-29 | 株式会社日立製作所 | Plasma display apparatus |
| WO2009153828A1 (en) * | 2008-06-16 | 2009-12-23 | 株式会社日立製作所 | Plasma display device and manufacturing method therefor |
| KR101149433B1 (en) * | 2009-08-28 | 2012-05-22 | 삼성모바일디스플레이주식회사 | Flexible display and method for manufacturing the same |
| CN104582263A (en) * | 2015-01-23 | 2015-04-29 | 京东方科技集团股份有限公司 | Flexible printed circuit board, assembling method thereof and display device |
| TW201632039A (en) * | 2015-02-24 | 2016-09-01 | 友達光電股份有限公司 | Flexible printed circuit board and flexible display device comprising the same |
| WO2018010059A1 (en) * | 2016-07-11 | 2018-01-18 | Boe Technology Group Co., Ltd. | Chip on film, flexible display apparatus having the same, and fabricating method thereof |
| CN107357068A (en) * | 2017-07-21 | 2017-11-17 | 武汉华星光电技术有限公司 | A kind of narrow frame display panel and manufacture method |
-
2000
- 2000-01-24 JP JP2000015055A patent/JP3748752B2/en not_active Expired - Fee Related
- 2000-12-30 TW TW89128402A patent/TWI262345B/en not_active IP Right Cessation
-
2001
- 2001-01-16 CN CNB011005777A patent/CN1133899C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3748752B2 (en) | 2006-02-22 |
| JP2001209066A (en) | 2001-08-03 |
| CN1319780A (en) | 2001-10-31 |
| TWI262345B (en) | 2006-09-21 |
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