CN116583002A - Display module and display device - Google Patents

Display module and display device Download PDF

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Publication number
CN116583002A
CN116583002A CN202310349040.6A CN202310349040A CN116583002A CN 116583002 A CN116583002 A CN 116583002A CN 202310349040 A CN202310349040 A CN 202310349040A CN 116583002 A CN116583002 A CN 116583002A
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CN
China
Prior art keywords
circuit board
bonding
display module
substrate
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310349040.6A
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Chinese (zh)
Inventor
黄赛娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Priority to CN202310349040.6A priority Critical patent/CN116583002A/en
Publication of CN116583002A publication Critical patent/CN116583002A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses a display module and a display device, wherein the display module comprises: a substrate assembly; the first circuit board is arranged on the side edge of the substrate assembly; the second circuit board comprises a body, a first bonding part and a second bonding part, wherein the first bonding part and the second bonding part are arranged on the same surface of the body, and the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged; the first circuit board is bridged between the second circuit board and the substrate assembly through the windowing, so that the second bonding part is connected with the first circuit board. The bonding wire arranged on the same surface can be respectively connected with the substrate assembly and the first circuit board, so that the bonding of the single-layer COF is realized, and the preparation cost is effectively reduced.

Description

Display module and display device
Technical Field
The application relates to the technical field of display equipment, in particular to a display module and a display device.
Background
With the development of display technology, the design requirements of display devices are also increasing. The conventional display module is generally driven by COF (Chip On Film).
In the prior art, in order to save the module cost, a Driver (driving) FPC (Flexible Printed Circuit, flexible printed circuit board) and a TP (Touch Panel) FPC are combined into one FPC, and then the two-in-one FPC formed by the combination is bonded with a double-layer COF layer and a screen module to form a display module. The bonding leads of the double-layer COF are respectively arranged on the two side surfaces of the film body, the bonding lead on one side surface is used for being connected with the screen module, and the bonding lead on the other side surface is used for being connected with the two-in-one FPC.
However, the cost of the double-layer COF used in the above manner is high, which is disadvantageous to reduce the preparation cost; if a single-layer COF is used, the bonding leads are all disposed on the same surface of the COF, so that the COF cannot bond with the two-in-one FPC and the panel module at the same time.
Disclosure of Invention
The application mainly solves the technical problems of providing a display module and a display device, and can solve the problem that a single-layer COF, a two-in-one FPC and a screen module cannot be bonded at the same time in the prior art.
In order to solve the technical problem, a first technical scheme adopted by the application is to provide a display module, which comprises: a substrate assembly; the first circuit board is arranged on the side edge of the substrate assembly; the second circuit board comprises a body, a first bonding part and a second bonding part, wherein the first bonding part and the second bonding part are arranged on the same surface of the body, and the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged; the first circuit board is bridged between the second circuit board and the substrate assembly through the windowing, so that the second bonding part is connected with the first circuit board.
The first circuit board comprises a bendable region, and a first region and a second region which are connected through the bendable region; one end of the first area, which is far away from the bendable area, is provided with a first bonding area, one end of the second area, which is far away from the bendable area, is provided with a second bonding area, and the first bonding area and the second bonding area are respectively arranged on the two side surfaces of the first circuit board; the bendable region penetrates through the open window, the first circuit board is connected with the second bonding part through the first bonding region, and is connected with the substrate component through the second bonding region.
The second circuit board further comprises a first driving chip, and the first driving chip is arranged between the first bonding part and the second bonding part; the first driving chip and the substrate assembly are electrically connected through the first bonding part, and the first driving chip and the first circuit board are electrically connected through the second bonding part.
The window is arranged between the first bonding part and the first driving chip, or between the second bonding part and the first driving chip.
Wherein, the fenestration is arranged at the side of the body.
The substrate assembly comprises a display substrate and a touch substrate arranged on one side surface of the display substrate; a first bonding golden finger is arranged on the surface of one side of the display substrate, which is close to the touch substrate, and a second bonding golden finger is arranged on the surface of one side of the touch substrate, which is far away from the display substrate; the first bonding part is connected with the first bonding golden finger so that the first driving chip drives the display substrate; the second bonding area is connected with the second bonding golden finger so as to drive the touch substrate through a second driving chip arranged on the first circuit board.
In order to solve the above technical problems, a second technical solution adopted by the present application is to provide another display module, including: a substrate assembly; the first circuit board is arranged on the side edge of the substrate assembly; the second circuit board comprises a body, a first bonding part and a second bonding part, wherein the first bonding part and the second bonding part are arranged on the same surface of the body, and the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged; and a switching flexible board is arranged between the second circuit board and the first circuit board, one end of the switching flexible board is connected with the second bonding part, and the other end of the switching flexible board is connected with the first circuit board.
The two ends of the switching flexible board are respectively provided with a first connector and a second connector; the first connector is connected with the first circuit board, and the second connector is connected with the second bonding part; preferably, the first connector comprises a golden finger or a zero insertion force connector, and the second connector is a golden finger.
The two ends of the first circuit board are respectively provided with a first bonding area and a second bonding area, and the first bonding area and the second bonding area are arranged on the same side face of the first circuit board; the first circuit board is connected with a first connector of the transfer flexible board through a first bonding area and connected with the touch substrate through a second bonding area.
In order to solve the above technical problems, a third technical solution adopted by the present application is to provide a display device, where the display device includes the above display module.
The beneficial effects of the application are as follows: compared with the prior art, the display module and the display device provided by the application have the advantages that the windowed is arranged on the body of the second circuit board, and the first circuit board is bridged between the second circuit board and the substrate assembly through the windowed, so that two bonding leads arranged on the same surface of the body can be respectively connected with the substrate assembly and the first circuit board. Or, a switching flexible board is arranged between the second circuit board and the first circuit board, so that the second bonding part of the body and the first circuit board are respectively connected through the switching flexible board. Through changing the shape of the body or adding the switching flexible board, the bonding lead arranged on the same surface of the body can be respectively connected with the substrate assembly and the first circuit board, so that the bonding of the single-layer COF is realized, and the preparation cost is effectively reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the examples will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a first embodiment of a display module according to the present application;
FIG. 2 is a top view of an embodiment of the second circuit board of FIG. 1;
FIG. 3 is a top view of another embodiment of a second circuit board of the present application;
fig. 4 is a schematic structural diagram of a second embodiment of the display module of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
In the prior art, in order to save the module cost, a Driver (driving) FPC (Flexible Printed Circuit, flexible printed circuit board) and a TP (Touch Panel) FPC are combined into one FPC, and then the two-in-one FPC formed by the combination is bonded with a double-layer COF layer and a screen module to form a display module. The bonding leads of the double-layer COF are respectively arranged on the two side surfaces of the body, the bonding lead on one side surface is used for being connected with the screen module, and the bonding lead on the other side surface is used for being connected with the two-in-one FPC. However, the cost of the double-layer COF used in the above manner is high, which is disadvantageous to reduce the preparation cost; if a single-layer COF is used, the bonding leads are all disposed on the same surface of the COF, so that the COF cannot bond with the two-in-one FPC and the panel module at the same time.
Based on the above situation, the application provides a display module and a display device, which can solve the problem that the single-layer COF, the two-in-one FPC and the screen module cannot be bonded at the same time in the prior art.
The first display module provided by the application comprises: a substrate assembly; the first circuit board is arranged on the side edge of the substrate assembly; the second circuit board comprises a body, a first bonding part and a second bonding part, wherein the first bonding part and the second bonding part are arranged on the same surface of the body, and the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged; the first circuit board is bridged between the second circuit board and the substrate assembly through the windowing, so that the second bonding part is connected with the first circuit board.
The second display module provided by the application comprises: a substrate assembly; the first circuit board is arranged on the side edge of the substrate assembly; the second circuit board comprises a body, a first bonding part and a second bonding part, wherein the first bonding part and the second bonding part are arranged on the same surface of the body, and the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged; and a switching flexible board is arranged between the second circuit board and the first circuit board, one end of the switching flexible board is connected with the second bonding part, and the other end of the switching flexible board is connected with the first circuit board.
Through changing the shape of the body or adding the switching flexible board, the bonding lead arranged on the same surface of the body can be respectively connected with the substrate assembly and the first circuit board, so that the bonding of the single-layer COF is realized, and the preparation cost is effectively reduced.
For illustrating the specific structure of the display module of the present application, please refer to fig. 1 and fig. 2, wherein fig. 1 is a schematic structural diagram of a first embodiment of the display module of the present application, and fig. 2 is a top view of an embodiment of the second circuit board of fig. 1.
In this embodiment, the display module 100 includes a substrate assembly 10, a first circuit board 20, and a second circuit board 30. The first circuit board 20 is disposed at a side of the substrate assembly 10. The second circuit board 30 includes a body 33, a first bonding portion 31 and a second bonding portion 32 disposed on the same surface of the body 33, and the first bonding portion 31 is connected to a surface of the substrate assembly 10 on which the first circuit board 20 is disposed. The body 33 is provided with a window 35, and the first circuit board 20 is bridged between the second circuit board 30 and the substrate assembly 10 through the window 35, so that the second bonding portion 32 is connected with the first circuit board 20.
In the present embodiment, the first circuit board 20 is a two-in-one FPC formed by combining a Driver FPC and a TP FPC, and the first circuit board 20 is provided with a second driving chip.
In this embodiment, the first circuit board 20 includes a bendable region 201 and a first region and a second region connected by the bendable region 201. The first bonding region 21 is disposed at one end of the first region away from the bendable region 201, the second bonding region 22 is disposed at one end of the second region away from the bendable region 201, and the first bonding region 21 and the second bonding region 22 are disposed on two side surfaces of the first circuit board 20 respectively.
The bendable region 201 is disposed through the window 35, the first circuit board 20 is connected to the second bonding portion 32 disposed on the second circuit board 30 through the first bonding region 21, and the first circuit board 20 is connected to the substrate assembly 10 through the second bonding region 22.
The first bonding region 21 and the second bonding region 22 are gold fingers. Specifically, the golden finger (connecting finger) is a connecting hardware composed of a plurality of golden yellow conductive contacts, and is named because the surface of the golden finger is gold-plated and the conductive contacts are arranged like a finger.
In some embodiments, the thickness of the copper layer in the bendable region 201 is lower than that in the first region and the second region, so that the bending curve is better.
It will be appreciated that the pliable region 201 need only pass through the fenestration 35 and need not form a right angle.
In the present embodiment, the second circuit board 30 is a single-layer COF, and the body 33 is provided with a copper sheet coated on one side surface of the first bonding portion 31 and the second bonding portion 32, and a conductive trace is formed on the copper sheet. The body 33 is a film body.
The first bonding portion 31 and the second bonding portion 32 are gold fingers.
The second circuit board 30 further includes a first driving chip 34, where the first driving chip 34 is disposed between the first bonding portion 31 and the second bonding portion 32. The first driving chip 34 is electrically connected to the substrate assembly 10 through the first bonding portion 31, and the first driving chip 34 is electrically connected to the first circuit board 20 through the second bonding portion 32.
In the present embodiment, the substrate assembly 10 includes a display substrate 11 and a touch substrate 12 provided on one side surface of the display substrate 11. A first bonding gold finger 110 is disposed on a surface of the display substrate 11, which is close to the touch substrate 12, and a second bonding gold finger 120 is disposed on a surface of the touch substrate 12, which is far from the display substrate 11. The first bonding portion 31 is connected to the first bonding finger 110, so that the first driving chip 34 drives the display substrate 11, and the second bonding region 22 is connected to the second bonding finger 120, so as to drive the touch substrate 12 through the second driving chip disposed on the first circuit board 20.
In some embodiments, the second driving chip may also be disposed on the body 33, which is not limited in the present application.
In the present embodiment, the window 35 is provided between the first bonding portion 31 and the first driving chip 34. In some embodiments, the window 35 may also be disposed between the second bonding portion 32 and the first driving chip 34.
For convenience of description, the location of the window 35 on the body 33 is described in relation to the first bonding portion 31 and the second bonding portion 32 in fig. 2. As can be seen from fig. 2, the first bonding portion 31 and the second bonding portion 32 are disposed on the upper side and the lower side of the body 33, respectively, and the first bonding portion 31 and the second bonding portion 32 are disposed in parallel.
It can be appreciated that the window 35 is disposed between the first bonding portion 31 and the first driving chip 34, or between the second bonding portion 32 and the first driving chip 34, so as to avoid occupying the space on the left and right sides of the body 33, thereby reducing the area of the body 33. Further, under the condition of not affecting the routing, the window 35 can be widened appropriately, so that the bendable region 201 of the first circuit board 20 can be more easily penetrated through the window 35, thereby reducing the splicing difficulty of the whole assembly.
In some embodiments, referring to fig. 3, the window 35 may also be disposed at a side of the body 33, which is not limited in the present application.
It can be understood that when the window 35 is disposed on the side of the body 33, the space on the left and right sides of the body 33 is occupied, resulting in an increase of the area of the body 33, but since the window 35 is not disposed between the first bonding portion 31 or the second bonding portion 32 and the first driving chip 34, the routing between the first bonding portion 31 and the first driving chip 34 or between the second bonding portion 32 and the first driving chip 34 is not affected at all, and the routing difficulty of the second circuit board 30 can be reduced.
In the above embodiments, the window 35 has a rectangular shape.
It will be appreciated that the rectangular shape has a certain width, which enables the bendable region 201 of the first circuit board 20 to more easily penetrate the open window 35, thereby reducing the difficulty of splicing the whole assembly.
In some embodiments, the window 35 may be a slit, so long as the bendable region 201 of the first circuit board 20 can be ensured to penetrate through the window 35, which is not limited in the present application.
It will be appreciated that the smaller width of the slit requires a more precise splicing process to place the bendable region 201 of the first circuit board 20 through the fenestration 35, but allows for a more compact construction of the overall assembly resulting from the splice.
In some embodiments, the window 35 may be circular, triangular, or other shapes, which only needs to ensure that the bendable region 201 of the first circuit board 20 matches the shape of the window 35 and can penetrate the window 35, which is not limited in the present application.
Unlike the prior art, in this embodiment, the window 35 is provided on the body 33, and the softness of the bendable region 201 in the first circuit board 20 is correspondingly adjusted, so that the first circuit board 20 can be bridged between the second circuit board 30 and the substrate assembly 10 through the window 35, and further the first bonding portion 31 and the second bonding portion 32 provided on the same surface of the body 33 are respectively connected with the substrate assembly 10 and the first circuit board 20, thereby realizing single-layer COF bonding. Further, since the present embodiment realizes bonding of the single-layer COF only by changing the morphology of the body 33, it is not necessary to use a double-layer COF, and thus the manufacturing cost is effectively reduced.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a second embodiment of the display module according to the present application.
In this embodiment, the display module 200 includes a substrate assembly 10, a first circuit board 20, and a second circuit board 30. The first circuit board 20 is disposed at a side of the substrate assembly 10. The second circuit board 30 includes a body 33, a first bonding portion 31 and a second bonding portion 32 disposed on the same surface of the body 33, and the first bonding portion 31 is connected to a surface of the substrate assembly 10 on which the first circuit board 20 is disposed. A switching flexible board 40 is disposed between the second circuit board 30 and the first circuit board 20, one end of the switching flexible board 40 is connected with the second bonding portion 32, and the other end is connected with the first circuit board 20.
Only the portions of the present embodiment that differ from the first embodiment will be described below.
In the present embodiment, the first connector 41 and the second connector 42 are respectively provided at both ends of the transfer flexible board 40. Wherein, the first connector 41 is connected with the first circuit board 20, and the second connector 42 is connected with the second bonding portion 32.
In this embodiment, the first bonding region 21 and the second bonding region 22 are respectively disposed at two ends of the first circuit board 20, and the first bonding region 21 and the second bonding region 22 are disposed on the same side of the first circuit board 20.
The first circuit board 20 is connected to the first connector 41 of the adapting flexible board 40 through the first bonding region 21, and is connected to the second bonding gold finger 120 disposed on the touch substrate 12 through the second bonding region 22.
In some embodiments, the first connector 41 comprises a gold finger or zero insertion force connector (ZIF, zero Insertion Force). Among them, the ZIF connector refers to a type of connector, and has no specific size.
In some embodiments, the second connector 42 is a gold finger. In this case, since the body 33 in the COF layer is too soft, the ZIF connector or the remaining connectors are difficult to be crimped, and thus the second connector 42 must be a gold finger.
As can be appreciated, in the present embodiment, by adding the transferring flexible board 40 between the second circuit board 30 and the first circuit board 20, the first connector 41 and the second connector 42 at two ends of the transferring flexible board 40 can be used to connect the first circuit board 20 and the second bonding portion 32 of the body 33 respectively, so as to achieve bonding of a single COF layer.
Correspondingly, the application provides a display device which comprises an equipment body and any one of the display modules.
Compared with the prior art, the bonding wire arranged on the same surface of the body can be respectively connected with the substrate assembly and the first circuit board by changing the shape of the body or adding the switching flexible board, so that the bonding of the single-layer COF is realized, and the preparation cost is effectively reduced.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.

Claims (10)

1. A display module, comprising:
a substrate assembly;
the first circuit board is arranged on the side edge of the substrate assembly;
the second circuit board comprises a body, and a first bonding part and a second bonding part which are arranged on the same surface of the body, wherein the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged;
the body is provided with a window, and the first circuit board is bridged between the second circuit board and the substrate assembly through the window, so that the second bonding part is connected with the first circuit board.
2. The display module assembly of claim 1, wherein the display module assembly comprises,
the first circuit board comprises a bendable region, and a first region and a second region which are connected through the bendable region; a first bonding region is arranged at one end, far away from the bendable region, of the first region, a second bonding region is arranged at one end, far away from the bendable region, of the second region, and the first bonding region and the second bonding region are respectively arranged on the two side surfaces of the first circuit board;
the first circuit board is connected with the second bonding part through the first bonding area and is connected with the substrate component through the second bonding area.
3. The display module assembly of claim 2, wherein the display module assembly comprises,
the second circuit board further comprises a first driving chip, and the first driving chip is arranged between the first bonding part and the second bonding part;
the first driving chip and the substrate assembly are electrically connected through the first bonding part, and the first driving chip and the first circuit board are electrically connected through the second bonding part.
4. The display module assembly of claim 3, wherein the display module assembly,
the window is arranged between the first bonding part and the first driving chip, or between the second bonding part and the first driving chip.
5. The display module assembly of claim 3, wherein the display module assembly,
the window is arranged on the side edge of the body.
6. The display module assembly of claim 3, wherein the display module assembly,
the substrate assembly comprises a display substrate and a touch substrate arranged on one side surface of the display substrate; a first bonding golden finger is arranged on the surface of one side, close to the touch substrate, of the display substrate, and a second bonding golden finger is arranged on the surface of one side, far away from the display substrate, of the touch substrate;
the first bonding part is connected with the first bonding golden finger so that the first driving chip drives the display substrate; the second bonding region is connected with the second bonding golden finger so as to drive the touch substrate through a second driving chip arranged on the first circuit board.
7. A display module, comprising:
a substrate assembly;
the first circuit board is arranged on the side edge of the substrate assembly;
the second circuit board comprises a body, and a first bonding part and a second bonding part which are arranged on the same surface of the body, wherein the first bonding part is connected with the surface of one side of the substrate assembly, on which the first circuit board is arranged;
and a switching flexible board is arranged between the second circuit board and the first circuit board, one end of the switching flexible board is connected with the second bonding part, and the other end of the switching flexible board is connected with the first circuit board.
8. The display module assembly of claim 7, wherein the display module assembly,
a first connector and a second connector are respectively arranged at two ends of the switching flexible board; the first connector is connected with the first circuit board, and the second connector is connected with the second bonding part;
preferably, the first connector includes a golden finger or a zero insertion force connector, and the second connector is the golden finger.
9. The display module assembly of claim 8, wherein the display module assembly comprises,
a first bonding region and a second bonding region are respectively arranged at two ends of the first circuit board, and the first bonding region and the second bonding region are arranged on the same side face of the first circuit board;
the first circuit board is connected with the first connector of the transfer flexible board through the first bonding area and connected with the touch substrate through the second bonding area.
10. A display device comprising a display module according to any one of claims 1-6 or claims 7-9.
CN202310349040.6A 2023-04-03 2023-04-03 Display module and display device Pending CN116583002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310349040.6A CN116583002A (en) 2023-04-03 2023-04-03 Display module and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310349040.6A CN116583002A (en) 2023-04-03 2023-04-03 Display module and display device

Publications (1)

Publication Number Publication Date
CN116583002A true CN116583002A (en) 2023-08-11

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