CN110197622B - Display device - Google Patents
Display device Download PDFInfo
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- CN110197622B CN110197622B CN201910590798.2A CN201910590798A CN110197622B CN 110197622 B CN110197622 B CN 110197622B CN 201910590798 A CN201910590798 A CN 201910590798A CN 110197622 B CN110197622 B CN 110197622B
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- circuit board
- flexible circuit
- display panel
- bonding layer
- layer
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application provides a display device, which comprises a middle frame and a display module positioned in the middle frame; the display module comprises a bending part and a first bonding layer positioned on the bending part; the bending part is connected with the middle frame through the first bonding layer. This application utilizes and has viscidity glue film to bond display device's flexion and center, has got rid of center and this display module assembly's interval, has further reduced this display device frame non-display area's interval, has realized the design of narrow frame.
Description
Technical Field
The present disclosure relates to display devices, and particularly to a display device.
Background
With the development of display industry technology, users have higher and higher requirements on the design of the display panel, such as the design of a narrow bezel.
The lower frame of the display panel of the existing mobile phone generally adopts cof (chip on fpc) or cop (chip on pi) technology to set the position of the driving chip, so that the lower frame of the display panel has smaller space. The existing display panel is in the matching process of the middle frame, a certain distance exists between the bending part of the display panel and the middle frame, the distance is a non-display area, and the narrow frame design is not met.
Therefore, a display device is needed to solve the above problems.
Disclosure of Invention
The application provides a display device to solve the technical problem that the frame of the existing display device is too large.
In order to solve the above problems, the technical solution provided by the present application is as follows:
the application provides a display device, which comprises a middle frame and a display module positioned in the middle frame;
the display module comprises a bending part and a first bonding layer positioned on the bending part;
wherein the bent portion is connected to the middle frame through the first adhesive layer.
In the display device of the present application, the middle frame includes a first groove, and the bent portion is connected to a boundary of the first groove through the first adhesive layer.
In the display device, the display module comprises a display panel and a first flexible circuit board electrically connected with the display panel, wherein the first flexible circuit board is bent to form a first bending part and is accommodated in the first groove;
the first bonding layer is located on the first bending portion, and the first flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
In the display device, the display module comprises a display panel, a first flexible circuit board electrically connected with the display panel, a touch layer positioned on the display panel, and a second flexible circuit board electrically connected with the touch layer;
the first flexible circuit board is bent to form a first bent part, the second flexible circuit board is bent to form a second bent part, and the first bent part and the second bent part are contained in the first groove;
the first bonding layer is located on the second bending portion, and the second flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
In the display device of this application, the display module assembly still includes to be located first flexion reaches the second tie coat between the second flexion, first flexible circuit board passes through the second tie coat with the second flexible circuit board is connected.
In the display device of the application, the display module comprises a flexible display panel;
one end of the flexible display panel, which is far away from the display area, is bent to form a third bending part and is accommodated in the first groove;
the first bonding layer is located on the third bending portion, and the flexible display panel is connected with the boundary of the first groove through the first bonding layer.
In the display device, the display module comprises a flexible display panel, a touch layer positioned on the flexible display panel, and a second flexible circuit board electrically connected with the touch layer;
the flexible display panel is bent to form a third bent part, the second flexible circuit board is bent to form a second bent part, and the third bent part and the second bent part are contained in the first groove;
the first bonding layer is located on the second bending portion, and the second flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
In the display device of this application, display module assembly still includes to be located the third flexion reaches second tie coat between the second flexion, flexible display panel passes through the second tie coat with the second flexible circuit board is connected.
In the display device of the application, the display module further comprises a cover plate layer;
the cover plate layer is connected with the middle frame through a third bonding layer.
In the display device of the present application,
the first adhesive layer is integrally provided with the third adhesive layer.
Has the advantages that: this application utilizes and has viscidity glue film to bond display device's flexion and center, has got rid of the center with display module assembly's interval has further reduced display device frame non-display area's interval has realized the design of narrow frame.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of the structure of a display device according to the present application;
FIG. 2 is a first block diagram of region A of FIG. 1;
FIG. 3 is a second block diagram of region A of FIG. 1;
FIG. 4 is a third block diagram of region A of FIG. 1;
FIG. 5 is a fourth block diagram of region A of FIG. 1;
FIG. 6 is a fifth block diagram of region A of FIG. 1;
FIG. 7 is a sixth block diagram of region A of FIG. 1;
FIG. 8 is a seventh block diagram of region A of FIG. 1;
fig. 9 is an eighth structural view of the area a in fig. 1.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. Directional phrases used in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., refer only to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting. In the drawings, elements having similar structures are denoted by the same reference numerals.
Referring to fig. 1, fig. 1 is a schematic diagram of a display device 100 according to the present application.
The display device 100 includes a middle frame 200 and a display module 300 located in the middle frame 200.
The display module 300 includes a display panel 10, and a cover plate layer 20 located on the display panel 10.
In this embodiment, the cover plate layer 20 is bonded to the middle frame 200 by a third adhesive layer 43.
The middle frame 200 includes a first groove 201. The display panel 10 is located in the first groove 201, and the cover plate layer 20 is located on the middle frame 200 at the periphery of the first groove 201.
In this embodiment, the cover plate layer 20 is bonded to the middle frame 200 by a third adhesive layer 43.
Referring to fig. 2, fig. 2 is a first structural diagram of a region a in fig. 1.
The display module 300 further includes a bending portion 30 and a first bonding layer 41 on the bending portion 30. Wherein the bent portion 30 is connected to the middle frame 200 by the first adhesive layer 41.
In the present embodiment, the bent portion 30 is connected to the boundary of the first groove 201 by the first adhesive layer 41.
Referring to fig. 2, when the display panel 10 is a rigid panel, the display module 300 includes the display panel 10 and the first flexible circuit board 11 electrically connected to the display panel 10. The first flexible circuit board 11 is bent to form a first bending portion 301, and is received in the first groove 201.
In this embodiment, the first flexible circuit board 11 is used for transmitting corresponding electrical signals of the display device 100.
In this embodiment, the first adhesive layer 41 is located on the first bent portion 301. The first flexible circuit board 11 is connected to the boundary of the first groove 201 through the first adhesive layer 41.
The display module 300 includes a touch layer 50 on the display panel 10.
In this embodiment, the touch layer 50 may be disposed on the same layer as the data/scan signal lines of the display panel 10, where the touch electrode lines connected to the touch electrodes are led from the touch layer 50 to the source/drain layers. Namely, the touch and display functions are simultaneously realized by one chip processor (IC).
The display module 300 further includes an encapsulation layer 60 located between the touch layer 50 and the display panel 10, and an insulating layer 70 located between the touch layer 50 and the cover plate layer 20.
In this embodiment, the touch layer 50 is not limited to be located on the display panel 10, and may be located in the display panel 10 or integrated in the package layer 60.
In this embodiment, the first flexible circuit board 11 is bonded to the middle frame 200 through the first bonding layer 41, so that the distance between the first flexible circuit board 11 and the middle frame 200 is reduced, and the design of a narrow frame is further realized. The first flexible circuit board 11 is bonded to the middle frame 200, so that the shape of the first flexible circuit board 11 is fixed, and the risk of stress concentration caused by bending deformation of the first flexible circuit board 11 in the process of assembling the whole machine or impacting and the like is avoided.
Referring to fig. 3, fig. 3 is a second structural diagram of the area a in fig. 1.
This embodiment is similar to fig. 2, except that:
the display module 300 includes a display panel 10, a first flexible circuit board 11 electrically connected to the display panel 10, a touch layer 50 on the display panel 10, and a second flexible circuit board 51 electrically connected to the touch layer 50.
The first flexible circuit board 11 is bent to form a first bent portion 301, the second flexible circuit board 51 is bent to form a second bent portion 302, and the first bent portion 301 and the second bent portion 302 are received in the first groove 201.
In the present embodiment, the second curved portion 302 has a radius of curvature larger than that of the first curved portion 301.
In this embodiment, the first adhesive layer 41 is located on the second bent portion 302. The second flexible circuit board 51 is connected to the boundary of the first groove 201 through the first adhesive layer 41.
Compared with fig. 2, in the present embodiment, the touch layer 50 is electrically connected to a touch chip (IC) through the second flexible circuit board 51 to receive or transmit a corresponding touch signal. The display panel 10 is electrically connected to the driving chip (IC) through the first flexible circuit board 11 to receive or transmit a corresponding driving signal.
In this embodiment, the second flexible circuit board 51 is disposed on the touch layer 50, and the first adhesive layer 41 is formed on the second flexible circuit board 51 and is accommodated in the first groove 201 after being bent. The second flexible circuit board 51 is bonded to the middle frame 200 through the first bonding layer 41, so that the shape of the second flexible circuit board 51 is fixed, and the risk of stress concentration caused by bending deformation of the second flexible circuit board 51 and friction caused by mutual extrusion of the second flexible circuit board 51 and the first flexible circuit board 11 in the process of assembling or impacting the whole machine is avoided.
Compared with fig. 2, the bezel width of the display device 100 in this embodiment is larger due to the existence of the second flexible circuit board 51. However, the display device 100 of the present embodiment has the advantages of simple structure, low process difficulty, low cost, and the like.
Referring to fig. 4, fig. 4 is a third structural diagram of the area a in fig. 1.
The display module 300 further includes a second adhesive layer 42 located between the first bending portion 301 and the second bending portion 302. The first flexible circuit board 11 is connected to the second flexible circuit board 51 through the second adhesive layer 42.
The present application adds the second adhesive layer 42 to fig. 3. The first flexible circuit board 11 is bonded with the second flexible circuit board 51 through the second bonding layer 42, and the second bonding layer 42 fixes the shape of the first flexible circuit board 11, so that the risk of stress concentration caused by bending deformation of the first flexible circuit board 11 in the whole assembly process or other processes such as impact is avoided.
Referring to fig. 5, fig. 5 is a fourth structural diagram of the area a in fig. 1.
This embodiment is the same as or similar to the embodiment in fig. 2, except that:
the display panel 10 in this embodiment is a flexible display panel 80.
The flexible display panel 80 is bent to form a third bending portion 303 and is received in the first groove 201. Wherein the first adhesive layer 41 is located on the third bent portion 303.
In this embodiment, the flexible display panel 80 is connected to the boundary of the first groove 201 through the first adhesive layer 41.
The display module 300 further includes a touch layer 50 on the flexible display panel 80. The touch layer 50 may lead a touch electrode line connecting each touch electrode from the touch layer 50 to the source/drain layer, and be disposed in the same layer as the data/scan signal line of the flexible display panel 80. Namely, the touch and display functions are simultaneously realized by one chip processor (IC).
In this embodiment, the touch layer 50 is not limited to be located on the flexible display panel 80, and may be located in the flexible display panel 80 or integrated in the packaging layer 60.
In this embodiment, the third bending portion 303 of the flexible display panel 80 is bonded to the middle frame 200 through the first adhesive layer 41, so that the distance between the third bending portion 303 and the middle frame 200 is reduced, and the design of a narrow bezel is further realized. The third bending portion 303 is bonded to the middle frame 200, so that the shape of the third bending portion 303 is fixed, and the risk of stress concentration caused by bending deformation of the flexible display panel 80 in the process of assembling the whole machine or impacting and the like is avoided.
Referring to fig. 6, fig. 6 is a fifth structural diagram of the area a in fig. 1.
This embodiment is the same as or similar to the embodiment in fig. 3, except that:
the display panel 10 in this embodiment is a flexible display panel 80.
The display module 300 includes a flexible display panel 80, a touch layer 50 on the flexible display panel 80, and a second flexible circuit board 51 electrically connected to the touch layer 50.
The flexible display panel 80 is bent to form a third bending portion 303, the second flexible circuit board 51 is bent to form a second bending portion 302, and the third bending portion 303 and the second bending portion 302 are received in the first groove 201.
In this embodiment, the second curved portion 302 has a larger radius of curvature than the third curved portion 303.
In this embodiment, the first adhesive layer 41 is located on the second bent portion 302. The second flexible circuit board 51 is connected to the boundary of the first groove 201 through the first adhesive layer 41.
Compared with fig. 5, in the present embodiment, the touch layer 50 is electrically connected to a touch chip (IC) through the second flexible circuit board 51 to receive or transmit a corresponding touch signal. The flexible display panel 80 is electrically connected to the driving chip (IC) through the first flexible circuit board 11 to receive or transmit a corresponding driving signal.
In this embodiment, the second flexible circuit board 51 is disposed on the touch layer 50, and the first adhesive layer 41 is formed on the second flexible circuit board 51 and is accommodated in the first groove 201 after being bent. The second flexible circuit board 51 is bonded to the middle frame 200 through the first bonding layer 41, so that the shape of the second flexible circuit board 51 is fixed, and the risk of stress concentration caused by bending deformation of the second flexible circuit board 51 and friction caused by mutual extrusion of the second flexible circuit board 51 and the first flexible circuit board 11 in the process of assembling or impacting the whole machine is avoided.
Referring to fig. 7, fig. 7 is a sixth structural diagram of the area a in fig. 1.
This embodiment is the same as or similar to the embodiment in fig. 4, except that:
the display panel 10 in this embodiment is a flexible display panel 80.
The display module 300 further includes a second adhesive layer 42 located between the third bending portion 303 and the second bending portion 302. The flexible display panel 80 is connected to the second flexible circuit board 51 through the third adhesive layer 43.
This embodiment adds the second adhesive layer 42 to that of fig. 6. The flexible display panel 80 is bonded to the second flexible circuit board 51 through the second bonding layer 42, and the second bonding layer 42 fixes the shape of the third bending portion 303 of the flexible display panel 80, so that the risk of stress concentration caused by bending deformation of the flexible display panel 80 during the whole assembly or other processes such as impact is avoided.
Referring to fig. 8, fig. 8 is a seventh structural diagram of the area a in fig. 1.
In this embodiment, a modification is made on the basis of fig. 6, and the first adhesive layer 41 and the third adhesive layer 43 are integrally provided.
Referring to fig. 9, fig. 9 is an eighth structural diagram of the area a in fig. 1.
In this embodiment, in order to improve on fig. 6, the first adhesive layer 41 may completely fill the space between the second flexible circuit board 51 and the middle frame 200, so as to further fix the shape of the first flexible circuit board 11.
In the embodiments of fig. 2 to 9, the first adhesive layer 41, the second adhesive layer 42, and the third adhesive layer 43 may be adhesive layers having adhesiveness, such as double-sided adhesive tapes.
In the above-described embodiment of fig. 2 to 9, in order to fit the first bent portion 301, the second bent portion 302, or the third bent portion 303, the boundary of the first groove 201 is disposed in parallel with the corresponding bent portion 30.
The application provides a display device, which comprises a display module, a display module and a control module, wherein a middle frame is positioned in the middle frame; the display module comprises a bending part and a first bonding layer positioned on the bending part; the bent portion is connected to the middle frame through the first adhesive layer. This application utilizes and has viscidity glue film to bond display device's flexion and center, has got rid of the center with display module assembly's interval has further reduced display device frame non-display area's interval has realized the design of narrow frame.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (9)
1. A display device is characterized by comprising a middle frame and a display module positioned in the middle frame;
the display module comprises a bending part and a first bonding layer positioned on the bending part, the bending part is connected with the middle frame through the first bonding layer,
wherein the middle frame comprises a first groove, and the bent part is connected with the boundary of the first groove through the first bonding layer.
2. The display device according to claim 1,
the display module comprises a display panel and a first flexible circuit board electrically connected with the display panel, and the first flexible circuit board is bent to form a first bending part and is accommodated in the first groove;
the first bonding layer is located on the first bending portion, and the first flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
3. The display device according to claim 1,
the display module comprises a display panel, a first flexible circuit board electrically connected with the display panel, a touch layer positioned on the display panel and a second flexible circuit board electrically connected with the touch layer;
the first flexible circuit board is bent to form a first bent part, the second flexible circuit board is bent to form a second bent part, and the first bent part and the second bent part are contained in the first groove;
the first bonding layer is located on the second bending portion, and the second flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
4. The display device according to claim 3,
the display module assembly further comprises a second bonding layer located between the first bending portion and the second bending portion, and the first flexible circuit board is connected with the second flexible circuit board through the second bonding layer.
5. The display device according to claim 1,
the display module comprises a flexible display panel;
one end of the flexible display panel, which is far away from the display area, is bent to form a third bending part and is accommodated in the first groove;
the first bonding layer is located on the third bending portion, and the flexible display panel is connected with the boundary of the first groove through the first bonding layer.
6. The display device according to claim 1,
the display module comprises a flexible display panel, a touch layer positioned on the flexible display panel and a second flexible circuit board electrically connected with the touch layer;
the flexible display panel is bent to form a third bent part, the second flexible circuit board is bent to form a second bent part, and the third bent part and the second bent part are contained in the first groove;
the first bonding layer is located on the second bending portion, and the second flexible circuit board is connected with the boundary of the first groove through the first bonding layer.
7. The display device according to claim 6,
the display module assembly further comprises a second bonding layer located between the third bending portion and the second bending portion, and the flexible display panel is connected with the second flexible circuit board through the second bonding layer.
8. The display device according to claim 1,
the display module further comprises a cover plate layer;
the cover plate layer is connected with the middle frame through a third bonding layer.
9. The display device according to claim 8,
the first adhesive layer is integrally provided with the third adhesive layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910590798.2A CN110197622B (en) | 2019-07-02 | 2019-07-02 | Display device |
| PCT/CN2019/110751 WO2021000445A1 (en) | 2019-07-02 | 2019-10-12 | Display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910590798.2A CN110197622B (en) | 2019-07-02 | 2019-07-02 | Display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110197622A CN110197622A (en) | 2019-09-03 |
| CN110197622B true CN110197622B (en) | 2020-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910590798.2A Active CN110197622B (en) | 2019-07-02 | 2019-07-02 | Display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110197622B (en) |
| WO (1) | WO2021000445A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197622B (en) * | 2019-07-02 | 2020-07-10 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN111429804B (en) | 2020-04-02 | 2021-04-27 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN112468621B (en) * | 2020-11-26 | 2023-01-31 | Oppo广东移动通信有限公司 | Electronic device |
| CN114578906A (en) * | 2022-03-16 | 2022-06-03 | 上海天马微电子有限公司 | Display device |
| CN114882796B (en) * | 2022-05-30 | 2023-08-01 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| CN116030714B (en) * | 2022-08-04 | 2023-11-14 | 荣耀终端有限公司 | Electronic equipment and method for filling adhesive material |
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Also Published As
| Publication number | Publication date |
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| CN110197622A (en) | 2019-09-03 |
| WO2021000445A1 (en) | 2021-01-07 |
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