CN114596778A

CN114596778A - Display device

Info

Publication number: CN114596778A
Application number: CN202210215144.3A
Authority: CN
Inventors: 夏广德; 黄正翰; 梁胜渊
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2021-06-08
Filing date: 2022-03-07
Publication date: 2022-06-07
Anticipated expiration: 2042-03-07
Also published as: CN114596778B

Abstract

A display device comprises a cover plate, a display panel, a first conductive pattern, a second conductive pattern, a flexible circuit board, a first conductive structure and a second conductive structure. The display panel is overlapped on the cover plate and comprises a first substrate. The first conductive pattern and the second conductive pattern are separated from each other and each extend from a first face of the cover plate to a second face of the cover plate opposite to the first face. The second surface of the cover plate faces the first substrate. The flexible circuit board is electrically connected to the plurality of pads of the first substrate. The first conductive pattern and the second conductive pattern are electrically connected to the flexible circuit board.

Description

Display device

Technical Field

The present disclosure relates to display devices, and particularly to a display device having a cover plate with a conductive pattern on a surface thereof.

Background

A wearable device is an electronic product that can be worn by a user, for example, common wearable devices include watches, wristbands, and glasses. Currently, wearable devices often include functions to gather health information, such as detecting sleep conditions, calculating calories expended for exercise, calculating distance walked or run, and the like. In addition, since the heart is an important organ for maintaining the operation of the human body, many people buy wearable devices having functions of detecting the heartbeat, detecting the blood oxygen concentration, and the like, in order to monitor the heart function.

Disclosure of Invention

The present invention provides a display device, which can transmit signals of a first conductive pattern and a second conductive pattern on a cover plate to a flexible printed circuit.

At least one embodiment of the invention provides a display device, which includes a cover plate, a display panel, a first conductive pattern, a second conductive pattern, a flexible circuit board, a first conductive structure and a second conductive structure. The display panel is overlapped on the cover plate and comprises a first substrate. The first conductive pattern and the second conductive pattern are located on the cover plate and separated from each other, wherein the first conductive pattern and the second conductive pattern respectively extend from a first face of the cover plate to a second face of the cover plate opposite to the first face. The second surface of the cover plate faces the first substrate. The flexible circuit board is electrically connected to the plurality of pads of the first substrate. The first conductive structure and the second conductive structure are respectively positioned between the first conductive pattern and the display panel and between the second conductive pattern and the display panel, and the first conductive pattern and the second conductive pattern are electrically connected to the flexible circuit board.

The flexible printed circuit board has the beneficial effects that the signals of the first conductive pattern and the second conductive pattern on the cover plate can be transmitted to the flexible printed circuit board through the arrangement of the first conductive structure and the second conductive structure.

Drawings

Fig. 1A is a schematic top view of a display device according to an embodiment of the invention.

Fig. 1B is a schematic bottom view of a display device according to an embodiment of the invention.

FIG. 2 is a schematic cross-sectional view taken along line a-a' of FIG. 1B.

Fig. 3 is a schematic sectional view of line B-B' of fig. 1B.

Fig. 4A and 4B are partially enlarged schematic views of a display device according to an embodiment of the invention.

Fig. 5A is a schematic top view of a flexible circuit board according to an embodiment of the invention.

Fig. 5B is a schematic bottom view of a flexible circuit board according to an embodiment of the invention.

Fig. 5C is a schematic cross-sectional view of line C-C' of fig. 5A.

Fig. 5D is a schematic cross-sectional view of line D-D' of fig. 5A.

Fig. 6 is a schematic cross-sectional view of a display device according to an embodiment of the invention.

Fig. 7A is a schematic top view of a flexible circuit board according to an embodiment of the invention.

Fig. 7B is a schematic cross-sectional view of line c-c' of fig. 7A.

Fig. 8 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the invention.

Fig. 9 and fig. 10 are partially enlarged schematic views of a display device according to an embodiment of the invention.

The reference numbers are as follows:

1,2 display device

100: cover plate

102 first side

104 second side

110 first conductive pattern

112,122: end

120 second conductive pattern

130 first conductive structure

140 second conductive structure

200,200a display panel

210,210a first substrate

212a,212b,212c bonding pads

220,220a second substrate

300,300a,300b flexible circuit board

310 flexible substrate

312 first side

314 second side

316 conductive via

320 first circuit layer

322,332 contact pad of circuit board

322a,332a first layer

322b,332b a second layer

324,334 routing

330 second circuit layer

340 ink layer

350 first protective layer

360 the second protective layer

370 electronic component

380 connecting terminal

390 buffer structure

392 adhesive layer

394 elevated layer

400 thin film flip chip packaging structure

500 printed circuit board

510 connector

a-a ', b-b', c-c ', d-d' wire

AA display area

BA peripheral area

BD bending zone

BN junction area

CG1 first conductive adhesive

CG2 second conductive adhesive

H, light hole

GP gap

Elastic conductive structure of PC

POL polarizing structure

OCA optical adhesive layer

t1, X1, X2 thickness

Detailed Description

Fig. 1A is a schematic top view of a display device according to an embodiment of the invention. Fig. 1B is a schematic bottom view of a display device according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view taken along line a-a' of FIG. 1B. Fig. 3 is a schematic sectional view of line B-B' of fig. 1B.

Referring to fig. 1A to 3, the display device 1 includes a cover plate 100, a display panel 200, a first conductive pattern 110, a second conductive pattern 120, a flexible circuit board 300, a first conductive structure 130, and a second conductive structure 140. In the present embodiment, the display device 1 further includes a thin film flip chip package structure 400, a printed circuit board 500, and a connector 510.

The cover plate 100 is, for example, glass, quartz, organic polymer, or other applicable material. In the present embodiment, the cover plate 100 includes a first side 102 and a second side 104 opposite to the first side 102. In some embodiments, the first side 102 of the cover plate 100 is an outer surface of the display device 1. For example, the display device 1 is suitable for use as part of a watch, while the first side 102 of the cover plate 100 is the face of the watch. In the embodiment, the first surface 102 of the cover plate 100 is an arc surface, but the invention is not limited thereto. In other embodiments, the first side 102 of the cover plate 100 is planar.

The first conductive pattern 110 and the second conductive pattern 120 are located on the cap plate 100 and separated from each other. In some embodiments, the first conductive pattern 110 and the second conductive pattern 120 are directly formed on the cover plate 100 by physical vapor deposition, chemical vapor deposition, atomic layer deposition, chemical plating, or other suitable methods. In some embodiments, the material of the first conductive pattern 110 and the second conductive pattern 120 includes metal, metal oxide, metal nitride, or other suitable materials. In some embodiments, the thickness t1 of the first conductive pattern 110 and the second conductive pattern 120 is, for example, 200 nm to 600 nm, but the invention is not limited thereto.

In the present embodiment, the first conductive pattern 110 and the second conductive pattern 120 are disposed near an edge of the first surface 102 of the cover plate 100 and extend from the first surface 102 of the cover plate 100 to the second surface 104 of the cover plate 100 opposite to the first surface 102. In some embodiments, the end 112 of the first conductive pattern 110 extending to the second surface 104 is adjacent to the end 122 of the second conductive pattern 120 extending to the second surface 104, so that the position where the first conductive pattern 110 is electrically connected to the display panel 200 is adjacent to the position where the second conductive pattern 120 is electrically connected to the display panel 200, thereby further saving the circuit layout space.

The display panel 200 overlaps the cover plate 100. In the present embodiment, the display panel 200 includes a first substrate 210 and a second substrate 220. The first substrate 210 is located between the cover plate 100 and the second substrate 220. The second side 104 of the cover plate 100 faces the first substrate 210. In some embodiments, the optical adhesive layer OCA and the polarization structure POL are located between the first substrate 210 and the cover plate 100.

In some embodiments, the first substrate 210 is a touch device substrate. For example, the first substrate 210 includes a carrier (glass, quartz, organic polymer or other suitable materials) and pads, signal lines, active devices, passive devices and/or touch electrodes formed on the carrier. For convenience of illustration, fig. 2 and 3 show the

pads

212a and 212b of the first substrate 210, and other components are omitted.

In some embodiments, the second substrate 220 is an active device substrate. For example, the second substrate 220 includes a carrier (glass, quartz, organic polymer, or opaque/reflective material (e.g., conductive material, metal, wafer, ceramic or other suitable material) and pads, signal lines, active devices, passive devices and/or light emitting devices formed thereon. For convenience of description, specific components of the second substrate 220 are omitted in fig. 2 and 3, and the second substrate 220 may be a micro light emitting diode substrate, an organic light emitting diode substrate, or a pixel array substrate suitable for a liquid crystal display panel. In some embodiments, the second substrate 220 is electrically connected to the thin film flip chip package structure 400. The thin film flip chip package structure 400 includes, for example, a driver chip or other components.

The first substrate 210 overlaps the second substrate 220 and is fixed together by an optical glue, sealant or other suitable material, which is omitted from fig. 2 and 3.

The first conductive structure 130 is located between the first conductive pattern 110 and the display panel 200, and the second conductive structure 140 is located between the second conductive pattern 120 and the display panel 200. In the embodiment, the first conductive structure 130 is electrically connected to the first conductive pattern 110 and the pad 212a of the first substrate 210, and the second conductive structure 140 is electrically connected to the second conductive pattern 120 and the pad 212b of the first substrate 210. The first conductive pattern 110 is electrically connected to the flexible circuit board 300 through the first conductive structure 130 and the pad 212a, and the second conductive pattern 120 is electrically connected to the flexible circuit board 300 through the second conductive structure 140 and the pad 212 b.

In the embodiment, the first conductive structure 130 and the second conductive structure 140 each include a first conductive paste CG1, a second conductive paste CG2, and an elastic conductive structure PC located between the first conductive paste CG1 and the second conductive paste CG 2. In this embodiment, the first conductive structure 130 and the second conductive structure 140 may be conductive in three directions of the x-axis, the y-axis, and the z-axis, or may be conductive only in the z-axis direction. In other words, the first conductive structure 130 and the second conductive structure 140 may be a common conductive material or an anisotropic conductive material. In some embodiments, the resilient conductive structure PC is a compressible material, such as a conductive foam. The thickness of the elastic conductive structure PC is larger than the thickness of the first conductive paste CG1 and the thickness of the second conductive paste CG 2.

Fig. 4A and 4B are partially enlarged schematic views of a display device according to an embodiment of the invention, wherein fig. 4A and 4B show top views of electrical connections between the flexible circuit board 300 and the display panel 200 of the display device 1 of fig. 1A and 1B, and portions of the cover plate 100, the first conductive structures 110, and the second conductive structures 120 on the first surface 102 of the cover plate 100 are omitted.

Referring to fig. 4A and 4B, in the present embodiment, the display panel 200 includes a display area AA and a peripheral area BA located at the periphery of the display area AA. In the peripheral area BA, the first substrate 210 has a plurality of

pads

212a,212b,212 c. In some embodiments, the pad 212c is located between the pad 212a and the pad 212 b.

The flexible circuit board 300 is electrically connected to the

pads

212a,212b,212c of the first substrate 210. For example, the flexible circuit board 300 is bonded to the

pads

212a,212b,212c by solder, conductive paste or other methods. The material of the

pads

212a,212b,212c may include metal, metal oxide, metal nitride, or other suitable materials.

The

pads

212a and 212b extend from the bottom of the flexible circuit board 300 to a direction away from the flexible circuit board 300. In the present embodiment, the

pads

212a and 212b extend from the bottom of the flexible circuit board 300 toward different directions. For example, the pad 212a extends toward the left, and the pad 212b extends toward the right. The first conductive structure 130 is disposed on the pad 212a and electrically connects the pad 212a to one end 112 of the first conductive pattern 110. The second conductive structure 140 is disposed on the pad 212b and electrically connects the pad 212b to one end 122 of the second conductive pattern 120. The pad 212c is adapted to be electrically connected to the signal line SL in the first substrate 210. It should be noted that fig. 4A and 4B omit the portion of the signal lines SL extending into the display area AA, and the layout of the signal lines SL may be adjusted according to actual requirements. For example, in some embodiments, the first substrate 210 is a touch device substrate, the pad 212c is adapted to transmit a touch signal on the touch device substrate, and the signal line SL extends into the display area AA and serves as a touch signal line, but the invention is not limited thereto. In other embodiments, the first substrate 210 is an active device substrate, the pad 212c is adapted to transmit signals of a light emitting diode or a pixel array, and the signal line SL extends into the display area AA and serves as a scan line or a data line.

Based on the above, in the present embodiment, the signals (e.g., Electrocardiogram (ECG) signals) received by the first conductive patterns 110 and the second conductive patterns 120 are transmitted to the flexible circuit board 300. In addition, in some embodiments, the first conductive pattern 110 and the second conductive pattern 120 do not contact a conductive frame, such as a case of a watch, thereby preventing signals of the first conductive pattern 110 and the second conductive pattern 120 from being grounded via the frame. In some embodiments, the display device 1 is a frameless product, i.e., no other frame is used to cover the first conductive patterns 110 and the second conductive patterns 120.

Referring to fig. 1B, fig. 4A and fig. 4B, in the present embodiment, the flexible circuit board 300 is bent from a side of the first substrate 210 facing the cover 100 to a side of the first substrate 210 opposite to the cover 100, and is electrically connected to the printed circuit board 500 through the connector 510. In other embodiments, the flexible circuit board 300 is disposed on a side of the first substrate 210 opposite to the cover plate 100, and is electrically connected to the

pads

212a,212b, and 212c through the conductive holes penetrating through the first substrate 210.

In the present embodiment, the printed circuit board 500 may be bent to the back surface of the cover plate 100, for example. For example, when the display device 1 is combined with a watch strap and/or other watch components, the printed circuit board 500 may be bent to prevent the printed circuit board 500 from being exposed on the front surface of the watch.

Fig. 5A is a schematic top view of a flexible circuit board according to an embodiment of the invention. Fig. 5B is a schematic bottom view of a flexible circuit board according to an embodiment of the invention. Fig. 5C is a schematic cross-sectional view of line C-C' of fig. 5A. Fig. 5D is a schematic cross-sectional view of line D-D' of fig. 5A. It should be noted that the embodiment of fig. 5A to 5D follows the element numbers and part of the contents of the embodiment of fig. 1A to 4B, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.

Referring to fig. 5A to 5D, the flexible circuit board 300 includes a flexible substrate 310, a first circuit layer 320, a second circuit layer 330, an ink layer 340, a first passivation layer 350, a second passivation layer 360, and a plurality of electronic elements 370. The flexible substrate 310 is, for example, but not limited to, Polyamide (PA), Polyimide (PI), polymethyl methacrylate (PMMA), Polyethylene naphthalate (PEN), Polyethylene terephthalate (PET), Fiberglass Reinforced Plastics (FRP), Polyetheretherketone (PEEK), epoxy resin, or other suitable materials or a combination of at least two of the foregoing materials.

The first circuit layer 320 is disposed on the first surface 312 of the flexible substrate 310. The first circuit layer 320 includes circuit board pads 322 and traces 324. In the embodiment, the circuit board pad 322 includes a double-layer structure, for example, a first layer 322a and a second layer 322 b. The first layer 322a and the trace 324 comprise, for example, copper or other conductive material. The second layer 322b includes, for example, gold, nickel, or other materials or combinations thereof. The ink layer 340 and the first protection layer 350 are disposed on the first circuit layer 320. In the present embodiment, the flexible substrate 310 has a bending region BD corresponding to a side surface of the display panel 200 (see fig. 2 and 3), and the ink layer 340 is disposed in the bending region BD.

In the present embodiment, the

pads

212a,212b,212c (see fig. 2 and 3) of the display panel 200 (see fig. 2 and 3) are located on the first surface 312 of the flexible substrate 310 and electrically connected to the circuit board pads 322 of the first circuit layer 320. The circuit pad 322 and the

pads

212a,212b,212c of the flexible circuit board 300 are located at the bonding area BN of the first surface 312 of the flexible substrate 310. The circuit board pads 322 of the flexible circuit board 300 are bonded to the

pads

212a,212b,212c of the display panel 200 by anisotropic conductive adhesive or other conductive structures.

The second circuit layer 330 is disposed on the second surface 314 of the flexible substrate 310 opposite to the first surface 312. The second circuit layer 330 includes traces 334. The second protective layer 360 is located on the second circuit layer 330. In the embodiment, the first circuit layer at least partially overlaps the bending region BD, and the second circuit layer 330 does not overlap the bending region BD of the flexible substrate 310, so that the bending region BD of the flexible substrate 310 can be bent easily.

The electronic element 370 is located on the second surface 314 of the flexible substrate 310. For example, the electronic element 370 is disposed on the second passivation layer 360 and electrically connected to the second circuit layer 330. In some embodiments, electronic component 370 comprises a light sensing element, chip, resistor, capacitor, diode, or other suitable component. In some embodiments, the flexible circuit board 300 has a light hole H, and the light hole H is suitable for allowing light to pass through the flexible substrate 310, so that the light-sensing elements in the electronic element 370 can receive the light.

In some embodiments, the flexible circuit board 300 further includes a connection terminal 380, and the connection terminal 380 is, for example, a gold finger. In some embodiments, the connection terminals 380 are disposed on the first surface 312 and/or the second surface 314 of the flexible substrate 310. The connection terminal 380 is adapted to be inserted into the connector 510 (see fig. 1A and 1B). In some embodiments, the signal received by the first conductive pattern 110 may be electrically connected to the printed circuit board 500 through the first conductive structure 130, the pad 212a of the display panel 200, the first circuit layer 320, the optional second circuit layer 330, the connection terminal 380, and the connector 510 (see fig. 1A and 1B). The signal received by the second conductive pattern 120 (see fig. 1A and 1B) can be electrically connected to the printed circuit board 500 (see fig. 1A and 1B) through the second conductive structure 140, the pad 212B of the display panel 200, the first circuit layer 320, the optional second circuit layer 330, the connection terminal 380, and the connector 510.

Fig. 6 is a schematic cross-sectional view of a display device according to an embodiment of the invention. Fig. 7A is a schematic top view of a flexible circuit board according to an embodiment of the invention. Fig. 7B is a schematic cross-sectional view of line c-c' of fig. 7A. For example, fig. 7A and 7B are schematic diagrams of the flexible circuit board 300a of fig. 6. For convenience of illustration, fig. 6 omits specific components of the flexible circuit board 300a, and fig. 7B shows the positions of the first conductive structures 130 and the second conductive structures 140 in dashed frames.

It should be noted that the embodiment of fig. 6 follows the element numbers and partial contents of the embodiment of fig. 1A to 4B, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.

Referring to fig. 6, fig. 7A and fig. 7B, in the present embodiment, the first conductive structure 130 and the second conductive structure 140 are respectively located between the flexible substrate 300a and the cover plate 100.

In this embodiment, the second circuit layer 330 further includes a circuit board pad 332 located in the bonding area BN of the second surface 314. In the embodiment, the circuit board pad 332 includes a double-layer structure, for example, a first layer 332a and a second layer 332 b. The first layer 332a comprises, for example, copper or other conductive material. The second layer 332b comprises, for example, gold, nickel, or other materials or combinations thereof.

In the embodiment, the first conductive structures 130 and the second conductive structures 140 are located on the second surface 314 of the flexible substrate 310, and the pads (e.g., the pad 212c, as shown in fig. 4A and 4B) of the display panel 200 are located on the first surface 312 of the flexible substrate 310. The two circuit board pads 332 are electrically connected to the first conductive structure 130 and the second conductive structure 140, respectively. In the present embodiment, the first conductive structures 130 and the second conductive structures 140 are bonded to the corresponding circuit pads 332, and then electrically connected to the traces 324 of the first circuit layer 320 through the conductive holes 316 of the flexible substrate 310. The circuit board pads 322 of the first circuit layer 320 are electrically connected to the pads (e.g., the pads 212c, as shown in fig. 4A and 4B) of the display panel 200.

In some embodiments, a portion of the trace 324 of the first circuit layer 320 also includes a double-layer structure similar to the circuit board pad 322, but the invention is not limited thereto.

In some embodiments, the signal received by the first conductive pattern 110 may be electrically connected to the printed circuit board 500 through the first conductive structure 130, the second circuit layer 330, the first circuit layer 320, the connection terminal 380 and the connector 510 (see fig. 1A and 1B). The signal received by the second conductive pattern 120 (see fig. 1A and 1B) can be electrically connected to the printed circuit board 500 (see fig. 1A and 1B) through the second conductive structure 140, the second circuit layer 330, the first circuit layer 320, the connection terminal 380, and the connector 510. In the present embodiment, signals received by the first conductive patterns 110 and the second conductive patterns 120 (please refer to fig. 1A and fig. 1B) are not transmitted through the pads of the display panel 200, so that the pads of the display panel are prevented from being damaged due to electrostatic discharge.

In the present embodiment, the flexible circuit board 300a further includes a buffer structure 390. The buffer structure 390 is disposed on the second surface 314 of the flexible substrate 310, and the buffer structure 390 is disposed between the circuit board pads 332. The buffer structure 390 is, for example, a single-layer or multi-layer structure. For example, in the present embodiment, the buffer structure 390 includes an adhesive layer 392 and a boosting layer 394 disposed on the adhesive layer 392. The enhancement layer 394 includes an insulating material, such as, but not limited to, Polyamide (PA), Polyimide (PI), polymethyl methacrylate (PMMA), Polyethylene naphthalate (PEN), Polyethylene terephthalate (PET), Fiberglass Reinforced Plastics (FRP), Polyetheretherketone (PEEK), epoxy, or other suitable materials or combinations of at least two of the foregoing.

In some embodiments, the thickness X1 of the buffer structure 390 is greater than or equal to the thickness X2 of the circuit board pad 332. The buffer structure 390 helps to reduce the influence of the offset between the circuit pad 332 and the flexible substrate 310 on the manufacturing yield of the first conductive structure 130 and the second conductive structure 140. In some embodiments, a portion of the first conductive structure 130 and a portion of the second conductive structure 140 are formed on the buffer structure 390.

Fig. 8 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the invention. For convenience of illustration, fig. 8 shows the positions of the first conductive structure 130 and the second conductive structure 140 in a dotted frame.

It should be noted that the embodiment of fig. 8 follows the element numbers and part of the contents of the embodiments of fig. 6 to 7B, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, which are not repeated herein.

Referring to fig. 8, in the present embodiment, the buffer structure 390 of the flexible circuit board 300b is laterally separated from the circuit pad 332. By providing the gap GP between the circuit board pad 332 and the buffer structure 390, the buffer structure 380 can be prevented from covering the circuit board pad 332 due to process errors, and the process yield of the first conductive structure 130 and the second conductive structure 140 bonded to the circuit board pad 332 is improved.

Fig. 9 and fig. 10 are partially enlarged schematic views of a display device according to an embodiment of the invention. It should be noted that the embodiment of fig. 9 and 10 uses the element numbers and partial contents of the embodiment of fig. 1 to 4B, wherein the same or similar elements are denoted by the same or similar reference numbers, and the description of the same technical contents is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, which are not repeated herein.

Referring to fig. 9 and 10, in the present embodiment, the display device 2 includes a cover plate 100, a display panel 200a, a first conductive pattern 110, a second conductive pattern 120, a flexible circuit board 300, a first conductive structure 130, and a second conductive structure 140.

The display panel 200a overlaps the cover plate 100 and includes a first substrate 210a and a second substrate 220 a. The second substrate 220a is located between the cover plate 100 and the first substrate 210 a.

In some embodiments, the first substrate 210a is an active device substrate. For example, the first substrate 210a includes a carrier (glass, quartz, organic polymer, or opaque/reflective material (e.g., conductive material, metal, wafer, ceramic or other suitable material) and pads, signal lines, active devices, passive devices and/or light emitting devices formed thereon. For convenience of description, specific components in the first substrate 210a are omitted in fig. 9 and 10, and the first substrate 210a may be a micro light emitting diode substrate, an organic light emitting diode substrate, or a pixel array substrate suitable for a liquid crystal display panel. In some embodiments, some of the pads (not shown in fig. 9 and 10) of the first substrate 210a are electrically connected to the light emitting device or the pixel array, and are bonded to the flexible circuit board 300 or the thin film flip chip package (not shown in fig. 9 and 10).

In some embodiments, the second substrate 220a is a touch device substrate. For example, the second substrate 220a includes a carrier (glass, quartz, organic polymer or other suitable materials), and pads, signal lines, active devices, passive devices and/or touch electrodes formed on the carrier. For convenience of explanation, fig. 9 and 10 omit specific members in the second substrate 220 a.

The first substrate 210a overlaps the second substrate 220a and is fixed together by an optical glue, a sealant or other suitable materials, which are omitted from fig. 9 and 10.

The first conductive pattern 110 and the second conductive pattern 120 are located on the cover plate 100 and separated from each other, wherein the first conductive pattern 110 and the second conductive pattern 120 each extend from the first side 102 of the cover plate 100 to the second side 104 of the cover plate opposite to the first side 102. The second side 104 of the cover plate 100 faces the first substrate 210 a. The flexible circuit board 300 is electrically connected to the

pads

212a and 212b of the first substrate 210 a. The first conductive structure 130 is located between the first conductive pattern 110 and the display panel 210a, the second conductive structure 140 is located between the second conductive pattern 120 and the display panel 210a, and the first conductive pattern 110 and the second conductive pattern 120 are electrically connected to the flexible circuit board 300.

In summary, the first conductive structure and the second conductive structure are disposed in the invention, so that the signals of the first conductive pattern and the second conductive pattern on the cover plate can be transmitted to the flexible printed circuit board.

Claims

1. A display device, comprising:

a cover plate;

a display panel overlapped with the cover plate and including a first substrate;

a first conductive pattern and a second conductive pattern on the cover plate and separated from each other, wherein the first conductive pattern and the second conductive pattern each extend from a first side of the cover plate to a second side of the cover plate opposite to the first side, wherein the second side of the cover plate faces the first substrate;

a flexible circuit board electrically connected to the pads of the first substrate; and

the first conductive structure and the second conductive structure are respectively positioned between the first conductive pattern and the display panel and between the second conductive pattern and the display panel, and the first conductive pattern and the second conductive pattern are electrically connected to the flexible circuit board.

2. The display device of claim 1, wherein the display panel further comprises:

and a second substrate, wherein the first substrate is located between the cover plate and the second substrate, the second substrate is an active element substrate, and the first substrate is a touch device substrate.

3. The display device of claim 1, wherein the display panel further comprises:

and a second substrate, wherein the second substrate is located between the cover plate and the first substrate, the first substrate is an active element substrate, and the second substrate is a touch device substrate.

4. The display device according to claim 1, wherein the flexible circuit board comprises:

a flexible substrate;

the first circuit layer and the second circuit layer are respectively positioned on a first surface and a second surface of the flexible substrate, wherein the first conductive structure and the second conductive structure are positioned on the second surface of the flexible substrate, and the connecting pads are positioned on the first surface of the flexible substrate.

5. The display device according to claim 4, wherein the flexible printed circuit further comprises:

and the buffer structure is positioned on the second surface of the flexible substrate, wherein the second circuit layer comprises a plurality of circuit board connecting pads, the circuit board connecting pads are respectively and electrically connected to the first conductive structure and the second conductive structure, and the buffer structure is positioned between the circuit board connecting pads.

6. The display device of claim 5, wherein the buffer structure has a thickness greater than or equal to a thickness of the plurality of circuit board pads.

7. The display device of claim 5, wherein the buffer structure is laterally separated from the plurality of circuit board pads.

8. The display device according to claim 1, wherein the flexible circuit board comprises:

a flexible substrate having a bonding region and a bending region;

the first circuit layer and the second circuit layer are respectively positioned on a first surface and a second surface of the flexible substrate, the first circuit layer is at least partially overlapped with the bending area, the second circuit layer is not overlapped with the bending area of the flexible substrate, and the connecting pads are positioned in the joint area of the first surface of the flexible substrate.

9. The display device as claimed in claim 8, wherein the second circuit layer comprises a plurality of circuit board pads located at the bonding region, wherein the plurality of circuit board pads are electrically connected to the first conductive structure and the second conductive structure respectively, and the plurality of circuit board pads are electrically connected to the first circuit layer through a plurality of conductive holes penetrating through the flexible substrate.

10. The display device according to claim 1, wherein the first conductive structure and the second conductive structure each comprise a first conductive paste, a second conductive paste, and an elastic conductive structure between the first conductive paste and the second conductive paste.

11. The display device of claim 1, further comprising:

an optical adhesive layer and a polarizing structure located between the first substrate and the cover plate.