CN215341119U - Ultrasonic fingerprint identification device - Google Patents
Ultrasonic fingerprint identification device Download PDFInfo
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- CN215341119U CN215341119U CN202121636500.6U CN202121636500U CN215341119U CN 215341119 U CN215341119 U CN 215341119U CN 202121636500 U CN202121636500 U CN 202121636500U CN 215341119 U CN215341119 U CN 215341119U
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Abstract
The utility model relates to an ultrasonic fingerprint identification device, which comprises a main body and a conductive adhesive layer. The main body comprises a substrate, an electrode layer and a conductive adhesive layer. The electrode layer is located on one side of the substrate and comprises a first convex part, a second convex part and the conductive adhesive layer, wherein the conductive adhesive layer is respectively attached to the first convex part and the second convex part. One end of the chip on film comprises a first attaching portion and a second attaching portion, and the first attaching portion and the second attaching portion are respectively attached to the conductive adhesive layer. In the above, the first protrusion and the second protrusion are respectively adjacent to two ends of the same side of the electrode layer, and when the flip chip film is bonded to the electrode layer by the conductive adhesive layer, the first protrusion and the second protrusion are bonded at the same time. Therefore, the problem of stress concentration of the bonding area is relieved, and the influence on the whole warping degree is reduced.
Description
Technical Field
The utility model relates to an ultrasonic fingerprint identification device, in particular to a Chip On Film (COF) packaging structure design for improving the warping degree to the extent that an entire module is attached to an organic light emitting diode module on the premise of not influencing the ultrasonic function.
Background
In recent years, with the progress of electronic technology, electronic components have been developed to be functional, large-capacity, light, thin, and small. However, while this trend is being developed, the packaging technology is becoming more important. The mounting technology is a technology for mounting an IC, an LSI, a transistor, a resistor, a capacitor chip, or the like on a printed circuit board and a bonding technology for connecting two components or two electrodes.
Conventional wire bonding techniques are not applicable, and currently, the main techniques are Chip On Glass (COG) bonding technique, Chip On Film (COF) bonding technique, and the like. Besides the driving IC, the FPC of COF bonding technology can also be bonded with other parts such as resistors, capacitors, etc. according to the required voltage boosting or other circuits. The product can be light, thin, short and small, but because the parts and the driving IC are distributed on the same flexible printed circuit board (namely integrally formed), the space occupied by related circuits of the designed IC can be further reduced.
In recent times, ultrasonic fingerprint identification technology has developed rapidly due to its characteristics of faster identification and safer use. However, by combining the above technical application, the fingerprint module is mainly attached to the lower surface of the organic light emitting diode module, and the degree of attachment and the matching of the sensor of the organic light emitting diode module is affected by the warping degree difference of the fingerprint module.
However, package warpage becomes a big problem due to further ultra-thinning of the packaging technology. Various materials are used in packages, such as chips, substrates, plastic encapsulations, etc., which have different Coefficients of Thermal Expansion (CTE). When the entire package is subjected to temperature changes, such as from high temperatures during the packaging process to room temperature, the expansion and contraction are not uniform due to the different coefficients of thermal expansion of the various materials, resulting in warpage of the package. When the package becomes thinner, the rigidity is significantly reduced and the package is more easily deformed, so that the warpage is significantly increased.
For this problem, although there are other solutions, for example, a groove is dug downwards at the position where the fingerprint recognition module is placed on the screen, so as to control the thickness of the glass panel and ensure the recognition rate and accuracy of fingerprint recognition, the actual user experience effect is not satisfactory.
In view of the above, the present invention is conceived based on the defects and inconvenience caused by the incomplete design, and the present invention is developed and designed through active research and improvement.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned problems, an object of the present invention is to provide an ultrasonic fingerprint recognition device, which improves the warpage of the whole module and the degree of warpage to attach the whole module to the oled module by using a new structure design through a Chip On Film (COF) technology.
In addition, another object of the present invention is to provide an ultrasonic fingerprint recognition device, which optimizes the warping degree of the module without affecting the ultrasonic function.
The utility model relates to an ultrasonic fingerprint identification device, which comprises a main body and a chip on film.
The main body comprises a substrate, an electrode layer and a conductive adhesive layer. The electrode layer is located on one side of the substrate and includes a first protrusion and a second protrusion. The conductive adhesive layer is respectively attached to the first convex part and the second convex part.
One end of the chip on film comprises a first attaching portion and a second attaching portion, and the first attaching portion and the second attaching portion are respectively attached to the conductive adhesive layer.
Wherein the first protrusion and the second protrusion are respectively adjacent to two ends of the same side of the electrode layer; when the chip on film is bonded to the electrode layer by the conductive adhesive layer, the first protrusion and the second protrusion are bonded at the same time.
Furthermore, the main body further comprises a piezoelectric film layer, the piezoelectric film layer is positioned between the substrate and the electrode layer, the electrode layer is attached to the piezoelectric film layer, and when the electrode layer is connected with the chip on film, the voltage of the first convex part or the second convex part can be selectively conducted.
Furthermore, the chip on film further comprises a third bonding portion located between the first bonding portion and the second bonding portion, and when the chip on film is bonded to the electrode layer by the conductive adhesive layer, the bonding operation is performed on the third bonding portion, and then the bonding operation is performed on the first convex portion and the second convex portion.
In addition, in one embodiment, the first protrusion and the second protrusion are symmetrical to each other with the center line of the electrode layer as a symmetry axis.
Furthermore, the ultrasonic fingerprint identification device further comprises a supporting colloid, and the supporting colloid is positioned at the joint of the flip chip film and the conductive adhesive layer.
Furthermore, the other end of the flip chip film is connected to a flexible printed circuit board.
Furthermore, a plurality of bare chips are connected to one side of the flexible printed circuit board.
In addition, in one embodiment, the body is an IC package, a fingerprint sensor, or a component of a medical device.
Further, the IC package is a driver IC package for a flat panel display or a head driver IC package for an ink jet printer.
Drawings
FIG. 1 is a perspective view of an ultrasonic fingerprint identification device according to the present invention.
FIG. 2 is a perspective exploded view of the ultrasonic fingerprint identification device of the present invention.
FIG. 3 is a perspective view of another preferred embodiment of the ultrasonic fingerprint identification device of the present invention
FIG. 4 is a schematic perspective exploded view of an ultrasonic fingerprint identification device according to another preferred embodiment of the present invention
Fig. 5 is a graph of warpage analysis data of a conventional Chip On Film (COF) package structure.
Fig. 6 is a graph of warp analysis data of the ultrasonic fingerprint identification device of the present invention.
Reference numerals
1. 1': ultrasonic fingerprint identification device
2: main body
21: substrate
22: electrode layer
221: first convex part
222: second convex part
23: conductive adhesive layer
24: piezoelectric thin film layer
3: chip on film
31: first bonding part
32: second bonding part
33: the third fitting part
4: flexible printed circuit board
5: bare chip
6: supporting colloid
L: center line
7: polymer layer
8: epoxy base layer
Detailed Description
To achieve the above objects and advantages, the technical means and structure adopted by the present invention are described in detail with reference to the following drawings for fully understanding the preferred embodiments of the present invention, but it should be noted that the contents do not limit the present invention.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.
In the description of the present invention, it is to be understood that the terms "inside", "outside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or assembly referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Fig. 1 and fig. 2 are a perspective view of the ultrasonic fingerprint recognition device of the present invention and a perspective exploded view of the ultrasonic fingerprint recognition device of the present invention. The utility model relates to an ultrasonic fingerprint identification device 1, comprising: a main body 2 and a flip chip film 3.
The main body 2 includes: a substrate 21, an electrode layer 22 and a conductive adhesive layer 23. The electrode layer 22 is located on one side of the substrate 21, and the electrode layer 22 includes a first protrusion 221 and a second protrusion 222. The conductive adhesive layer 23 is respectively attached to the first protrusion 221 and the second protrusion 222.
In the preferred embodiment, the main body 2 is a driver IC package of a flat panel display, or a printhead driver IC package of an inkjet printer, a fingerprint sensor, or a component of a medical device.
One end of the flip chip film 3 includes a first bonding portion 31 and a second bonding portion 32, the first bonding portion 31 and the second bonding portion 32 are respectively bonded on the conductive adhesive layer 23, the other end of the flip chip film 3 is connected to a flexible printed circuit board 4, and a side of the flexible printed circuit board 4 is connected to a plurality of bare chips 5.
Wherein the first protrusion 221 and the second protrusion 222 are respectively adjacent to two ends of the same side of the electrode layer 22; when the flip-chip film 3 is bonded to the electrode layer 22 through the conductive adhesive layer 23, the bonding operation is performed on the first protrusion 221 and the second protrusion 222 at the same time.
In the present embodiment, it is preferable that the first protrusion 221 and the second protrusion 222 are symmetrical to each other with a center line L of the electrode layer 22 as a symmetry axis, so as to relieve stress concentration and prevent component/part from static load fracture.
Fig. 3 and 4 are a perspective view of an ultrasonic fingerprint identification device according to another preferred embodiment of the present invention and an exploded perspective view of an ultrasonic fingerprint identification device according to another preferred embodiment of the present invention. In another preferred embodiment, the main body 2 further comprises a piezoelectric film layer 24, the piezoelectric film layer 24 is located between the substrate 21 and the electrode layer 22, the electrode layer 22 is attached to the piezoelectric film layer 24, and when the electrode layer 22 is bonded to the flip-chip film 3, the voltage of the first protrusion 221 or the second protrusion 222 can be selectively conducted.
That is, for example, the first protrusion 221 is used to conduct an electrode, and the second protrusion 222 is designed to match with a symmetrical flip-chip thin film structure, so that the second protrusion 222 does not need to conduct an electrode, and only needs to be increased by the design of the screen.
Or, for example, the second protrusion 222 is used to conduct an electrode, and the first protrusion 221 is designed to match with a symmetrical flip-chip thin film structure design, so that the first protrusion 221 does not need to conduct an electrode, and only needs to be increased by the design of the screen.
In addition, it should be noted that a polymer layer 7 is disposed between the substrate 21 and the piezoelectric thin film layer 24, and the electrode layer 22 is disposed with an epoxy base layer 8 on a side opposite to the piezoelectric thin film layer 24. In this embodiment, the main body 2 preferably includes the substrate 21, the polymer layer 7, the piezoelectric film layer 24, the electrode layer 22 and the epoxy base layer 8 in sequence. The substrate 21 is a TFT electrode, the polymer layer 7 is used to enhance adhesion between the piezoelectric material and the TFT electrode, the electrode layer 22 is a silver (Ag) layer, and the epoxy base layer 8 is a silver (Ag) protective layer.
In another preferred embodiment, the flip-chip film 3 further includes a third bonding portion 33, the third bonding portion 33 is located between the first bonding portion 31 and the second bonding portion 32, when the flip-chip film 3 is bonded to the electrode layer 22 by the conductive adhesive layer 23, the bonding operation is performed on the third bonding portion 32, and then the bonding operation is performed on the first protrusion 221 and the second protrusion 222.
In addition, the ultrasonic fingerprint identification device 1 further comprises a supporting colloid 6, and the supporting colloid 6 is located at the joint of the flip chip 3 and the conductive adhesive layer 23, so that the supporting force to the flip chip 3 can be increased, and the stress concentration can be relieved.
In addition, it should be noted that, after the bonding process, the values of the related properties of the ultrasonic fingerprint identification device 1 of the present invention are not different from the values of the conventional structure design except the warpage, such as the overall thickness and the size after packaging.
Fig. 5 and fig. 6 show a graph of warpage analysis data of a conventional Chip On Film (COF) package structure and a graph of warpage analysis data of the ultrasonic fingerprint identification device of the present invention. As can be seen from a comparison of fig. 5 and fig. 6, the design of the present invention has less effect on the warpage degradation after bonding, which is better than the conventional structure by about 150 micrometers (um).
It should be noted that, in the conventional structure, the connection is performed only at one corner, and the other side is in a free state, and the warpage is poor because of the stress existing during the connection. The ultrasonic fingerprint identification device is jointed twice, the middle position of the electrode layer is jointed for the first time, and the two side positions of the electrode layer are jointed for the second time, so that the problem of stress concentration can be relieved, and the whole warping degree of the module is optimized.
In summary, the ultrasonic fingerprint identification device of the present invention has the following advantages:
when the flip chip film is jointed to the electrode layer through the conductive adhesive layer, the flip chip film is jointed twice, the middle position of the flip chip film is jointed for the first time, and the positions of the two sides of the flip chip film are jointed for the second time, so that the problem of stress concentration can be relieved, and the influence on the whole warping degree is reduced by relieving the problem of stress concentration of a joint area.
Through the above detailed description, it is fully evident that the objects and functions of the present invention are advanced by practice, and have industrial applicability, and fully meet the requirements of new patent applications. While the utility model has been described with reference to a preferred embodiment, it is to be understood that the utility model is not limited to the disclosed embodiment, but is intended to cover various modifications, equivalents and alternatives falling within the spirit and scope of the utility model as defined by the appended claims.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or two or more units may be integrated into one unit. The integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
While the foregoing is directed to alternative embodiments of the present invention, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the utility model, and it is intended that such changes and modifications be considered as within the scope of the utility model.
Claims (10)
1. An ultrasonic fingerprint identification device, comprising:
a body, the body comprising:
a substrate;
the electrode layer is positioned on one side surface of the substrate and comprises a first convex part and a second convex part; and
the conductive adhesive layer is respectively attached to the first convex part and the second convex part; and
one end of the chip on film comprises a first attaching part and a second attaching part, and the first attaching part and the second attaching part are respectively attached to the conductive adhesive layer;
wherein the first convex part and the second convex part are respectively adjacent to two ends of the same side of the electrode layer; when the chip on film is bonded to the electrode layer by the conductive adhesive layer, the first convex portion and the second convex portion are bonded.
2. The ultrasonic fingerprint identification device according to claim 1, wherein the main body further comprises a piezoelectric film layer disposed between the substrate and the electrode layer, the electrode layer is attached to the piezoelectric film layer, and when the electrode layer is bonded to the flip-chip film, the voltage of the first protrusion or the second protrusion can be selectively conducted.
3. The ultrasonic fingerprint identification device according to claim 1, wherein the chip on film further comprises a third bonding portion, the third bonding portion is located between the first bonding portion and the second bonding portion, and when the chip on film is bonded to the electrode layer by the conductive adhesive layer, the bonding operation is performed on the third bonding portion first, and then the bonding operation is performed on the first protrusion and the second protrusion simultaneously.
4. The ultrasonic fingerprint recognition device according to claim 1, wherein the first and second protrusions are symmetrical to each other about a center line of the electrode layer as a symmetry axis.
5. The ultrasonic fingerprint identification device according to claim 1, further comprising a supporting adhesive, wherein the supporting adhesive is located at a joint of the chip on film and the conductive adhesive layer.
6. The ultrasonic fingerprint device according to claim 1, wherein the other end of the flip-chip film is connected to a flexible printed circuit board.
7. The ultrasonic fingerprint device according to claim 6, wherein a plurality of bare chips are connected to a side of said flexible printed circuit board.
8. The ultrasonic fingerprint identification device of claim 1, wherein the body is an IC package, a fingerprint recognizer or a medical equipment component.
9. The ultrasonic fingerprint device according to claim 8, wherein the IC package is a driver IC package of a flat panel display or a head driver IC package of an inkjet printer.
10. The ultrasonic fingerprint identification device according to claim 2, wherein a polymer layer is disposed between the substrate and the piezoelectric thin film layer, and an epoxy base layer is disposed on a surface of the electrode layer opposite to the piezoelectric thin film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121636500.6U CN215341119U (en) | 2021-07-19 | 2021-07-19 | Ultrasonic fingerprint identification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121636500.6U CN215341119U (en) | 2021-07-19 | 2021-07-19 | Ultrasonic fingerprint identification device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215341119U true CN215341119U (en) | 2021-12-28 |
Family
ID=79568208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121636500.6U Active CN215341119U (en) | 2021-07-19 | 2021-07-19 | Ultrasonic fingerprint identification device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215341119U (en) |
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2021
- 2021-07-19 CN CN202121636500.6U patent/CN215341119U/en active Active
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