TWI823446B - Electronic device and method of manufacturing the same - Google Patents

Abstract

An electronic device includes a cover plate assembly, a frameless display panel assembly, and an adhesive layer. The cover plate assembly has a first major surface. A peripheral region of the first major surface has a first area. The frameless display panel assembly is disposed below the cover plate assembly and has a second major surface. A peripheral region of the second major surface has a second area smaller than the first area. The adhesive layer is disposed between the peripheral region of the first major surface and the peripheral region of the second major surface. The adhesive layer is a frame-shaped and elastic colloid. The adhesive layer, the cover plate assembly, and the frameless display panel assembly together form a closed space after being pressed together, and the closed space has a pitch of less than 200 microns.

Description

Electronic device and manufacturing method thereof

The present disclosure relates to an electronic device and a manufacturing method thereof.

Currently, a touch display device's touch module and display module are bonded together using full bonding technology. Its disadvantages are excessive thickness, excessive weight, higher cost, and greater manpower and material resources required for disassembly. In order to solve the aforementioned problems, a frame pasting technology has been developed, such as Taiwan Patent No. I616690. However, when moving towards large-size lamination, the above-mentioned lamination technologies are prone to cause deformation problems of the touch display device (that is, the gap between the touch module and the display module cannot be controlled) and Mura problems derived from deformation. .

Therefore, how to propose an electronic device that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide an electronic device that can solve the above problems.

In order to achieve the above object, according to an embodiment of the present disclosure, an electronic device includes a cover assembly, a frameless display panel assembly and an adhesive layer. The cover assembly has a first main surface. The peripheral area of the first main surface has a first area. The frameless display panel assembly is disposed below the cover assembly and has a second main surface. The peripheral area of the second main surface has a second area smaller than the first area. The adhesive layer is disposed between the peripheral area of the first main surface and the peripheral area of the second main surface. The adhesive layer is a frame-shaped and elastic colloid. The adhesive layer, the cover plate assembly and the frameless display panel assembly jointly form a closed space after being pressed together, and the closed space has a spacing of less than 200 microns.

In one or more embodiments of the present disclosure, the enclosed space is evacuated.

In one or more embodiments of the present disclosure, the air pressure value in the closed space is between 0.0003MPa and 0.001MPa.

In one or more embodiments of the present disclosure, the cover assembly includes a cover body and a touch panel. The touch panel is stacked under the cover body and is located between the cover body and the frameless display panel assembly.

In one or more embodiments of the present disclosure, the touch panel includes a silver nanowire electrode layer. The touch panel composed of the nano silver wire electrode layer forms at least a part of the first main surface.

In one or more embodiments of the present disclosure, the cover assembly further includes an anti-glare layer. The anti-glare layer is disposed on a side of the touch panel away from the cover body and constitutes at least a part of the first main surface.

In one or more embodiments of the present disclosure, the haze of the anti-glare layer is at least greater than 15%.

In one or more embodiments of the present disclosure, the electronic device further includes an optical film layer. The optical film layer is disposed on the second main surface.

In one or more embodiments of the present disclosure, the haze of the optical film layer is at least greater than 15%.

In order to achieve the above object, according to an embodiment of the present disclosure, a manufacturing method of an electronic device includes: coating an adhesive material on the peripheral area of the first main surface of the cover assembly, wherein the peripheral area of the first main surface has a third An area; press the frameless display panel assembly and the cover assembly so that the peripheral area of the second main surface of the frameless display panel assembly contacts the adhesive material, wherein the peripheral area of the second main surface has a smaller area than the first a second area of one area; and solidify the adhesive material into an adhesive layer, wherein the adhesive layer is a frame-shaped and elastic colloid, and the adhesive layer, cover assembly and frameless display panel assembly together form a closed space, and the closed space is The spaces have a pitch of less than 200 microns.

In one or more embodiments of the present disclosure, laminating the frameless display panel assembly and the cover assembly and curing the adhesive material into an adhesive layer are performed in a vacuum environment.

In one or more embodiments of the present disclosure, the air pressure value in the closed space is between 0.0003MPa and 0.001MPa.

In one or more embodiments of the present disclosure, the cover assembly includes a stacked cover body and a touch panel. The touch panel contains a nanosilver wire electrode layer. The touch panel composed of the nano silver wire electrode layer forms at least a part of the first main surface.

In summary, in the electronic device of the present disclosure, the cover assembly and the frameless display panel assembly are bonded together by using an elastic frame-shaped adhesive layer, and the adhesive layer, the cover assembly and the frameless display panel assembly are bonded together. The distance between the display panel assemblies that together form a closed space is limited to less than 200 microns, which can effectively control the distance, thereby effectively suppressing deformation problems in large-size applications and Mura problems derived from deformation.

The above is only used to describe the problems to be solved by the present disclosure, the technical means to solve the problems, the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation modes and related drawings.

A plurality of implementation manners of the present disclosure will be disclosed below with drawings. For clarity of explanation, many practical details will be explained together in the following description. However, it should be understood that these practical details should not be used to limit the disclosure. That is to say, in some implementations of the present disclosure, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components will be illustrated in a simple schematic manner in the drawings.

Please refer to FIG. 1 , which is a schematic cross-sectional view of an electronic device 100 according to an embodiment of the present disclosure. As shown in FIG. 1 , in this embodiment, the electronic device 100 includes a cover assembly 110 , a frameless display panel assembly 120 and an adhesive layer 130 a . The cover assembly 110 has a first main surface 110a. The peripheral area of the first main surface 110a has a first area. The frameless display panel assembly 120 is disposed below the cover assembly 110 and has a second main surface 120a. The adhesive layer 130a is disposed between the peripheral area of the first main surface 110a and the peripheral area of the second main surface 120a. The adhesive layer 130a is a frame-shaped and elastic colloid. The adhesive layer 130a, the cover assembly 110 and the frameless display panel assembly 120 are pressed together to form a closed space S, and the closed space S has a distance G of less than 200 microns.

Through the aforementioned structural configuration, the size of the gap G of the closed space S formed by the adhesive layer 130a, the cover assembly 110 and the frameless display panel assembly 120 can be effectively controlled, thereby effectively suppressing deformation problems in large-size applications. And the Mura problem derived from deformation.

In some embodiments, as shown in Figure 1, the first main surface 110a of the cover assembly 110 is its bottom surface, and the peripheral area of the first main surface 110a can be defined as the area where the adhesive layer 130a contacts the first main surface 110a. area, but this disclosure is not limited to this area.

In some embodiments, as shown in FIG. 1 , the second main surface 120a of the frameless display panel assembly 120 is its top surface, and the peripheral area of the second main surface 120a can be defined as the adhesive layer 130a contacting the second main surface 120a. The area of the main surface 120a, but the present disclosure is not limited to this.

In some embodiments, the peripheral area of the second main surface 120a has a second area smaller than the first area. Thereby, more area can be added for the adhesive layer 130a to adhere, thereby providing better adhesive strength.

In some embodiments, the enclosed space S is evacuated. In this way, after the adhesive layer 130a, the cover assembly 110 and the frameless display panel assembly 120 are pressed together, since the gap is less than one atmosphere, the inside of the gap will continue to be pressed by the external environment, thus maintaining continuous non-deformation. sex and air tightness.

In some embodiments, the air pressure value in the closed space S is less than 0.001MPa. Under this condition, the ability of the electronic device 100 to prevent moisture and dust from entering the enclosed space S can be significantly improved.

In some embodiments, the air pressure value in the closed space S is greater than 0.0003MPa. Under this condition, the problem of deformation of the electronic device 100 caused by excessive pressure difference between the inside and outside of the closed space S can be effectively prevented.

As shown in FIG. 1 , in this embodiment, the cover assembly 110 includes a cover body 111 and a touch panel 112 . The touch panel 112 is stacked under the cover body 111 and is located between the cover body 111 and the frameless display panel assembly 120 . In addition, the electronic device 100 further includes an optical film layer 140 . The optical film layer 140 is disposed on the second main surface 120a of the frameless display panel assembly 120. The adhesive layer 130a surrounds the edge of the optical film layer 140. In other words, the optical film layer 140 is located in the closed space S.

In some embodiments, the optical film layer 140 is a polarizer, but the disclosure is not limited thereto.

In some embodiments, the haze of the optical film layer 140 is at least greater than 15% to effectively avoid the problem of uneven brightness caused by the Mura phenomenon (if any) of the frameless display panel assembly 120 .

In some embodiments, the touch panel 112 includes a Silver Nano-Wire (SNW) electrode layer. The touch panel 112 composed of silver nanowire electrode layers forms at least a part of the first main surface 110a. Thereby, the evacuated closed space S can effectively avoid the deterioration of the silver nanowire electrode layer.

Please refer to Figure 2A, Figure 2B and Figure 3. FIG. 2A is a schematic cross-sectional view illustrating an intermediate stage of manufacturing the electronic device 100 according to an embodiment of the present disclosure. FIG. 2B is a schematic cross-sectional view illustrating an intermediate stage of manufacturing the electronic device 100 according to an embodiment of the present disclosure. FIG. 3 is a flow chart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure. As shown in FIG. 3 , with reference to FIG. 1 , FIG. 2A and FIG. 2B , in this embodiment, the manufacturing method of the electronic device mainly includes steps S101 to step S103 .

Step S101: Coat the adhesive material 130b on the peripheral area of the first main surface 110a of the cover assembly 110, where the peripheral area of the first main surface 110a has a first area (as shown in Figure 2A).

Step S102: Press the frameless display panel assembly 120 and the cover assembly 110 in a vacuum environment, so that the peripheral area of the second main surface 120a of the frameless display panel assembly 120 contacts the adhesive material 130b, wherein the The peripheral area of the two main surfaces 120a has a second area smaller than the first area (as shown in Figure 2B).

Step S103: The adhesive material 130b is solidified into an adhesive layer 130a in a vacuum environment. The adhesive layer 130a is a frame-shaped and elastic colloid. The adhesive layer 130a, the cover assembly 110 and the frameless display panel assembly 120 are composed together. The enclosed space S has a spacing G of less than 200 microns (as shown in Figure 1).

In some embodiments, the adhesive material 130b includes RTV (Room Temperature Vulcanization Compound) silicone, which is a room temperature hardening type, the main component is silicon, the average temperature resistance is between -50°C and 200°C, and has good weather resistance. Good insulation, not easy to age, and waterproof.

Please refer to FIG. 4 , which is a schematic cross-sectional view of an electronic device 200 according to another embodiment of the present disclosure. As shown in FIG. 4 , in this embodiment, the electronic device 200 includes a cover assembly 210 , a frameless display panel assembly 120 and an adhesive layer 130 a . The frameless display panel assembly 120 and the adhesive layer 130a are the same as the embodiment shown in FIG. 1, so the relevant descriptions of these components can be referred to the above and will not be described again here. It should be noted that, compared with the embodiment shown in FIG. 1 , the cover assembly 210 of this embodiment further includes an anti-glare layer 213 . The anti-glare layer 213 is disposed on the side of the touch panel 112 away from the cover body 111 and constitutes at least a part of the first main surface 210a. The adhesive layer 130a is disposed between the peripheral area of the first main surface 210a and the peripheral area of the second main surface 120a. The adhesive layer 130a, the cover assembly 210 and the frameless display panel assembly 120 are pressed together to form a closed space S, and the closed space S has a distance G of less than 200 microns.

Through the aforementioned structural configuration, the size of the gap G of the closed space S formed by the adhesive layer 130a, the cover assembly 210 and the frameless display panel assembly 120 can also be effectively controlled, thereby effectively suppressing deformation problems in large-size applications. And the Mura problem derived from deformation.

In some embodiments, the haze of the anti-glare layer 213 is at least greater than 15% to effectively avoid the problem of uneven brightness caused by the Mura phenomenon (if any) of the frameless display panel assembly 120 .

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the electronic device of the present disclosure, the cover assembly and the frameless display panel assembly are bonded together by using an elastic frame-type adhesive layer. By limiting the distance between the adhesive layer, the cover plate assembly and the frameless display panel assembly to form a closed space to less than 200 microns, the distance can be effectively controlled, thereby effectively suppressing deformation and deformation problems in large-size applications. Mura problem caused by deformation.

Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the disclosure. Therefore, the protection of the disclosure is The scope shall be determined by the appended patent application scope.

100,200: Electronic devices 110,210: Cover assembly 110a, 210a: first main surface 111:Cover body 112:Touch panel 120: Frameless display panel assembly 120a: Second main side 130a: Adhesion layer 130b: Adhesive materials 140: Optical coating 213:Anti-glare layer G: spacing S: closed space S101, S102, S103: steps

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure. FIG. 2A is a schematic cross-sectional view illustrating an intermediate stage of manufacturing an electronic device according to an embodiment of the present disclosure. FIG. 2B is a schematic cross-sectional view illustrating an intermediate stage of manufacturing an electronic device according to an embodiment of the present disclosure. FIG. 3 is a flow chart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure. FIG. 4 is a schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100: Electronic devices

110:Cover assembly

110a: First main surface

111:Cover body

112:Touch panel

120: Frameless display panel assembly

120a: Second main side

130a: Adhesion layer

140: Optical coating

G: spacing

S: closed space

Claims (12)

An electronic device, including: a cover assembly having a first main surface, a peripheral area of the first main surface having a first area; a frameless display panel assembly disposed on the cover assembly below, and has a second main surface, a peripheral area of the second main surface has a second area smaller than the first area; and an adhesive layer is provided between the peripheral area of the first main surface and the third Between the peripheral areas of the two main surfaces, the adhesive layer is a frame-shaped and elastic colloid. The adhesive layer, the cover assembly and the frameless display panel assembly jointly form a closed space after being pressed together. , and the closed space has a spacing of less than 200 microns, wherein the closed space is evacuated. The electronic device as claimed in claim 1, wherein an air pressure value in the enclosed space is between 0.0003MPa and 0.001MPa. The electronic device as claimed in claim 1, wherein the cover assembly includes: a cover body; and a touch panel, overlapped under the cover body and located between the cover body and the frameless display between panel assemblies. The electronic device according to claim 3, wherein the touch panel includes a silver nanowire electrode layer, and the touch panel composed of the silver nanowire electrode layer forms at least a part of the first main surface. The electronic device according to claim 1, wherein the cover assembly further includes an anti-glare layer, the anti-glare layer is disposed on a side of the touch panel away from the cover body and constitutes the first main surface. At least part of it. The electronic device as claimed in claim 5, wherein the haze of the anti-glare layer is at least greater than 15%. The electronic device according to claim 1, further comprising an optical film layer disposed on the second main surface. The electronic device according to claim 7, wherein the haze of the optical film layer is at least greater than 15%. A method of manufacturing an electronic device, including: coating an adhesive material on a peripheral area of a first main surface of a cover assembly, wherein the peripheral area of the first main surface has a first area; The frameless display panel assembly is pressed together with the cover assembly, so that a peripheral area of a second main surface of the frameless display panel assembly is in contact with each other. Contact the adhesive material, wherein the peripheral area of the second main surface has a second area smaller than the first area; and solidify the adhesive material into an adhesive layer, wherein the adhesive layer is a frame-shaped and elastic colloid, The adhesive layer, the cover assembly and the frameless display panel assembly together form a closed space, and the closed space has a spacing of less than 200 microns, and the closed space is evacuated. The manufacturing method of an electronic device as claimed in claim 9, wherein pressing the frameless display panel assembly and the cover assembly and curing the adhesive material into the adhesive layer are performed in a vacuum environment . The manufacturing method of an electronic device as claimed in claim 10, wherein an air pressure value in the closed space is between 0.0003MPa and 0.001MPa. The manufacturing method of an electronic device according to claim 9, wherein the cover assembly includes a stacked cover body and a touch panel, the touch panel includes a nanosilver wire electrode layer, and the nanosilver wire electrode layer The touch panel composed of a silver wire electrode layer forms at least a part of the first main surface.

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