WO2009153828A1

WO2009153828A1 - Plasma display device and manufacturing method therefor

Info

Publication number: WO2009153828A1
Application number: PCT/JP2008/001546
Authority: WO
Inventors: 金江達利; 佐々木孝
Original assignee: 株式会社日立製作所
Priority date: 2008-06-16
Filing date: 2008-06-16
Publication date: 2009-12-23

Abstract

A plasma display device has a plasma display panel (PDP), a first drive circuit, and a first flexible cable. The PDP has a first substrate with a plurality of first electrodes which is extended in a first direction and a second substrate facing the first substrate through a discharge space. The second substrate has a first chamfered portion at one of marginal portions along a second direction intersecting the first direction. For example, one end of the first flexible cable is connected to the first electrodes on the periphery of the side on which the first chamfered portion is provided out of the periphery of the PDP. Further, the other end of the first flexible cable is connected to the first drive circuit on the inside of the periphery of the PDP without requiring the first flexible cable to be folded back and without requiring the first flexible cable to be in contact with the second substrate. This makes it possible to provide a flat PDP device.

Description

Plasma display device and method of manufacturing plasma display device

The present invention relates to a plasma display device and a method for manufacturing the plasma display device.

The plasma display device (PDP device) has a plasma display panel (PDP) and a drive unit for driving the PDP. A PDP is composed of two glass substrates (a front glass substrate and a back glass substrate) bonded together, and displays an image by generating a discharge in a space (discharge space) formed between the glass substrates. To do. The cells corresponding to the pixels in the image are self-luminous, and are coated with phosphors that generate red, green, and blue visible light in response to ultraviolet rays generated by discharge.

For example, a three-electrode PDP displays an image by generating a sustain discharge between the X electrode and the Y electrode. A cell that generates a sustain discharge (a cell to be lit) is selected by, for example, selectively generating an address discharge between the Y electrode and the address electrode.

The drive unit has a drive circuit that applies voltages to the X electrode, the Y electrode, and the address electrode. In this type of PDP device, the drive circuit is connected to each electrode by a flexible substrate (flexible cable) (see, for example, Patent Document 1). Generally, the drive circuit is disposed on the back side of the PDP. For this reason, the flexible cable extending outward from the outer peripheral portion of the PDP is folded back in a U shape and connected to the drive circuit.
JP 2006-301317 A

In the configuration where the flexible cable is folded, it is necessary to secure a space for gently bending the flexible cable in order to prevent the flexible cable itself from being disconnected. For this reason, the size (thickness, width, etc.) of the PDP device with respect to the PDP increases, and the manufacturing cost increases.

An object of the present invention is to provide a thin PDP device. Another object of the present invention is to prevent disconnection between the PDP and the drive circuit and improve the reliability of the PDP device.

The plasma display device has a plasma display panel (PDP), a first drive circuit, and a first flexible cable. The PDP has a first substrate provided with a plurality of first electrodes extending in a first direction, and a second substrate facing the first substrate through a discharge space. The second substrate has a first chamfered portion at one of the edge portions along the second direction intersecting the first direction among the edge portions of the surface opposite to the surface facing the first substrate. Yes. And the 1st drive circuit which applies a voltage to the 1st electrode is electrically connected to the 1st electrode by the 1st flexible cable. For example, one end of the first flexible cable is connected to the first electrode at the outer peripheral portion on the side where the first chamfered portion is provided in the outer peripheral portion of the PDP. Further, the other end of the first flexible cable is connected to the first drive circuit inside the outer periphery of the PDP without folding the first flexible cable and without bringing the first flexible cable into contact with the second substrate. .

In the present invention, a thin PDP device can be provided. In the present invention, disconnection between the PDP and the drive circuit can be prevented, and the reliability of the PDP device can be improved.

It is a figure which shows the PDP apparatus in one Embodiment. It is a figure which shows the principal part of PDP shown in FIG. It is a figure which shows the outline | summary of the circuit part shown in FIG. It is a figure which shows an example of the state of the flexible cable seen from the image display surface and the other side. FIG. 5 is a diagram showing an outline of a side surface of a PDP device along a first direction viewed from a direction opposite to a side on which the address driver shown in FIG. It is a figure which shows the outline | summary of the side surface of the PDP apparatus in alignment with the 2nd direction seen from the side by which the Y driver shown in FIG. 4 is arrange | positioned. It is a figure which shows an example of the cross section along the 1st direction around the connection part of the flexible cable for Y electrodes shown in FIG. 5, and a Y electrode. It is a figure which shows an example of the manufacturing method of a 1st chamfer part. It is a figure which shows the outline | summary of the side surface of the PDP apparatus in the 1st direction in another embodiment. It is a figure which shows the outline | summary of the side surface of the PDP apparatus in the 2nd direction in embodiment shown in FIG. It is a figure which shows an example of the modification of the 1st chamfering part shown in FIG. It is a figure which shows another modification of the 1st chamfering part shown in FIG. It is a figure which shows another modification of the 1st chamfering part shown in FIG. It is a figure which shows an example of the modification of PDP shown in FIG. It is a figure which shows the outline | summary of the side surface in a 2nd direction in the PDP apparatus using PDP shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. A plasma display device (hereinafter also referred to as a PDP device) includes a plasma display panel 10 having a square plate shape (hereinafter also referred to as a PDP), an optical filter 20 provided on the image display surface 16 side (light output side) of the PDP 10, A front housing 30 disposed on the image display surface 16 side of the PDP 10, a rear housing 40 and a base chassis 50 disposed on the back surface 18 side of the PDP 10, and attached to the rear housing 40 side of the base chassis 50 to drive the PDP 10. A double-sided adhesive sheet 70 for attaching the PDP 10 to the base chassis 50. Since the circuit unit 60 includes a plurality of components, the circuit unit 60 is indicated by a dashed box in the figure. The circuit unit 60 is electrically connected to the PDP 10 by a flexible cable (not shown) (for example, flexible cables XFC, YFC, AFC shown in FIG. 4 described later).

The PDP 10 includes a front substrate portion 12 (first substrate) that forms the image display surface 16 and a rear substrate portion 14 (second substrate) that faces the front substrate portion 12. A discharge space (cell) (not shown) is formed between the front substrate portion 12 and the rear substrate portion 14. The front substrate unit 12 and the back substrate unit 14 are formed of, for example, a glass substrate. The optical filter 20 is affixed to a protective glass (not shown) attached to the opening 32 of the front housing 30. The optical filter 20 may have a function of shielding electromagnetic waves. The optical filter 20 may be directly attached to the image display surface 16 side of the PDP 10 instead of the protective glass.

FIG. 2 shows details of the main part of the PDP 10 shown in FIG. An arrow D1 in the drawing indicates the first direction D1, and an arrow D2 indicates the second direction D2 orthogonal to the first direction D1 in a plane parallel to the image display surface. As described above, the discharge space DS is formed between the front substrate portion 12 and the rear substrate portion 14 (more specifically, the concave portion of the rear substrate portion 14).

The front substrate portion 12 is provided extending in the first direction D1 on the surface of the glass substrate FS that faces the glass substrate RS (the lower side in the figure), and a plurality of Xs arranged at intervals from each other. A bus electrode Xb and a Y bus electrode Yb are provided. The X bus electrode Xb is connected with an X transparent electrode Xt extending in the second direction D2 from the X bus electrode Xb to the Y bus electrode Yb. A Y transparent electrode Yt extending in the second direction D2 from the Y bus electrode Yb to the X bus electrode Xb is connected to the Y bus electrode Yb. In the illustrated example, the X transparent electrode Xt and the Y transparent electrode Yt face each other along the second direction D2.

For example, the X bus electrode Xb and the Y bus electrode Yb are opaque electrodes formed of a metal material or the like, and the X transparent electrode Xt and the Y transparent electrode Yt are transparent that transmit visible light formed of an ITO film or the like. Electrode. The X electrode XE (second electrode, sustain electrode) is configured by the X bus electrode Xb and the X transparent electrode Xt, and the Y electrode YE (first electrode, scan electrode) is configured by the Y bus electrode Yb and the Y transparent electrode Yt. And is paired with the X electrode XE. Then, a discharge (sustain discharge) is repeatedly generated between the X electrode XE and the Y electrode YE paired with each other (more specifically, between the X transparent electrode Xt and the Y transparent electrode Yt).

The transparent electrodes Xt and Yt may be disposed on the entire surface between the bus electrodes Xb and Yb to which the transparent electrodes Xt and Yt are connected and the glass substrate FS. Further, an electrode integral with the bus electrodes Xb and Yb may be formed in place of the transparent electrodes Xt and Yt by the same material (metal material or the like) as the bus electrodes Xb and Yb.

The electrodes Xb, Xt, Yb, Yt are covered with the dielectric layer DL. For example, the dielectric layer DL is an insulating film such as a silicon dioxide film formed by a CVD method. A plurality of address electrodes AE (third electrodes) extending in the orthogonal direction (second direction D2) of the bus electrodes Xb and Yb are provided on the dielectric layer DL (lower side in the drawing). Thus, in the PDP of this embodiment, the electrodes XE and YE extending in the first direction D1 and the address electrode AE extending in the second direction D2 are provided on the front substrate portion 12.

The address electrode AE and the dielectric layer DL are covered with a protective layer PL. For example, the protective layer PL is formed of an MgO film having high secondary electron emission characteristics due to cation collision in order to easily generate discharge.

The back substrate portion 14 facing the front substrate portion 12 through the discharge space DS is formed in parallel with each other on the glass base RS and extends in a direction (second direction D2) orthogonal to the bus electrodes Xb and Yb. It has a partition wall (barrier rib) BR. That is, the barrier ribs BR are provided on the surface of the glass substrate RS that faces the glass substrate FS, extend in the second direction D2 that intersects the first direction D1, and are arranged at intervals. A partition wall BR constitutes a side wall of the cell. Further, visible light of red (R), green (G), and blue (B) is generated on the side surface of the partition wall BR and the glass substrate RS between the adjacent partition walls BR by being excited by ultraviolet rays. Phosphors PHr, PHg, and PHb are respectively applied.

One pixel of the PDP 10 is composed of three cells that generate red, green, and blue light. Here, one cell (one color pixel) is formed in a region surrounded by the bus electrodes Xb and Yb and the partition wall BR. As described above, the PDP 10 is configured by arranging cells in a matrix to display an image and alternately arranging a plurality of types of cells that generate light of different colors. Although not particularly illustrated, a display line is constituted by cells formed along the bus electrodes Xb and Yb.

The PDP 10 is configured by bonding the front substrate portion 12 and the rear substrate portion 14 so that the protective layer PL and the partition wall BR are in contact with each other, and enclosing a discharge gas such as Ne or Xe in the discharge space DS.

FIG. 3 shows an outline of the circuit unit 60 shown in FIG. The circuit unit 60 includes a control unit CNT, an X driver XDRV (second drive circuit), a Y driver YDRV (first drive circuit), an address driver ADRV (third drive circuit), and a power supply unit PWR. The power supply unit PWR generates power supply voltages −Vsc, Vs / 2, −Vs / 2, Vsa and the like to be supplied to the drivers YDRV, XDRV, and ADRV.

The control unit CNT controls the operation of the drivers XDRV, YDRV, and ADRV. For example, the control unit CNT selects a subfield to be used based on the image data R0-R7, G0-G7, B0-B7, and outputs control signals YCNT, XCNT, and ACNT to the drivers YDRV, XDRV, and ADRV. Here, the subfield is a field obtained by dividing one field for displaying one screen of the PDP 10, and the number of sustain discharges is set for each subfield. Then, by selecting a subfield to be used for each cell constituting the pixel, a multi-gradation image is displayed. For example, the subfield includes an address period for selecting a cell to be lit (a cell for generating a sustain discharge), a sustain period for generating a sustain discharge in the cell selected in the address period, and the like.

In this embodiment, the drivers XDRV, YDRV, and ADRV are electrically connected to the electrodes XE, YE, and AE, respectively, by flexible cables XFC, YFC, and AFC shown in FIG. The drivers XDRV, YDRV, and ADRV operate as a drive unit that drives the PDP 10.

For example, the X driver XDRV alternately applies voltages −Vs / 2 and Vs / 2 (negative and positive sustain pulses) to the X electrode XE during the sustain period. The Y driver YDRV alternately applies voltages Vs / 2 and −Vs / 2 (positive and negative sustain pulses) having different polarities from the voltage applied to the X electrode XE to the Y electrode YE during the sustain period, In the address period, the voltage −Vsc (scan pulse) is selectively applied to the Y electrode YE. The address driver ADRV selectively applies a voltage Vsa (address pulse) to the address electrode AE during the address period.

In the cell selected by the scan pulse and the address pulse, a discharge (address discharge) is temporarily generated between the Y electrode YE and the address electrode AE. Thereby, in the address period, a cell to be lit in the sustain period is selected. In the sustain period, the sustain pulses having different polarities are repeatedly applied to the X electrode XE and the Y electrode YE, so that the discharge of the cells lit in the sustain period (sustain discharge) is repeatedly performed.

FIG. 4 shows an example of the state of the flexible cables XFC, YFC, and AFC viewed from the side opposite to the image display surface (the lower side in FIG. 1). The meanings of the arrows D1 and D2 in the figure are the same as those in FIG. In FIG. 4, the description of the optical filter 20, the front casing 30, the rear casing 40, and the like shown in FIG. 1 is omitted. Here, for example, the Y electrode flexible cable YFC (first flexible cable), the X electrode flexible cable XFC (second flexible cable)) and the address electrode flexible cable AFC (third flexible cable) are formed on the base film. It is a deformable wiring in which a wiring made of a metal material is formed, and a protective film is covered on a wiring portion other than a connection portion connected to another component or the like.

The circuit unit 60 is attached to the back side of the base chassis 50 (on the rear housing 40 side shown in FIG. 1 described above) inside the edge of the back substrate part 14, and the edge of the back substrate part 14 is the front surface. It is located inside the edge of the substrate part 12. For example, the Y electrode YE is pulled out to the vicinity of the edge along the second direction D2 of the front substrate portion 12 (the outer peripheral portion OT on the left side in FIG. 4), and the X electrode XE is the Y electrode of the front substrate portion 12. YE is pulled out to the vicinity of the edge opposite to the edge from which the YE was pulled out (in FIG. 4, the right outer peripheral portion OT). Further, the address electrode AE is drawn out to the vicinity of the edge portion along the first direction D1 of the front substrate portion 12 (in FIG. 4, the lower outer peripheral portion OT). In addition, chamfered portions CF10, CF20, and CF30 shown in FIG. 5 described later are provided on the edge portion of the back substrate portion 14 on the side where the electrodes YE, XE, and AE are drawn.

Y electrode flexible cable YFC electrically connects driver YDRV and electrode YE, X electrode flexible cable XFC electrically connects driver XDRV and electrode XE, and address electrode flexible cable AFC The driver ADRV and the electrode AE are electrically connected. For example, one end of the flexible cables XFC, YFC, and AFC is connected to the electrodes XE, YE, and AE at the outer peripheral portion OT of the PDP 10, and the other ends of the flexible cables XFC, YFC, and AFC are inside the outer periphery of the PDP 10, The drivers are connected to XDRV, YDRV, and ADRV, respectively. That is, as described in FIG. 1 described above, the Y electrode flexible cable YFC, the X electrode flexible cable XFC, and the address electrode flexible cable AFC electrically connect the circuit unit 60 and the PDP 10.

FIG. 5 shows an outline of the side surface of the PDP device along the first direction D1 as viewed from the direction opposite to the side where the address driver ADRV shown in FIG. 4 is arranged. The meaning of the arrow D1 in the figure is the same as in FIG. In FIG. 4, the description of the optical filter 20, the front casing 30, the rear casing 40, and the like shown in FIG. 1 is omitted.

The back substrate portion 14 is one of the edges along the second direction D2 (the left side in FIG. 5) among the edges of the surface opposite to the surface facing the front substrate portion 12 (the lower side in FIG. 5). ) Has a first chamfered portion CF10. Further, the rear substrate portion 14 is an edge portion on the side opposite to the side on which the first chamfered portion CF10 is provided (on the right side in FIG. 5) of the edge portion on the opposite side of the surface facing the front substrate portion 12. Has a second chamfered portion CF20.

For example, the first chamfered portion CF10 is on the side where the Y electrode YE is drawn out of the edge of the surface on the base chassis 50 side of the back substrate portion 14 (the surface opposite to the surface facing the front substrate portion 12). Chamfered at the corners of the edge. Further, for example, in the second chamfered portion CF20, the X electrode XE is drawn out from the edge of the surface on the base chassis 50 side of the back substrate portion 14 (the surface opposite to the surface facing the front substrate portion 12). The corners of the side edges are chamfered.

The connecting portion YCT2 provided at one end of the Y electrode flexible cable YFC is connected to the Y electrode YE at the outer peripheral portion OT on the side where the first chamfered portion CF10 is provided. In other words, the connection portion YCT1 that is the end portion of the Y electrode YE drawn to the vicinity of the edge of the front substrate portion 12 is connected to the connection portion YCT2 of the Y electrode flexible cable YFC.

Further, the connecting portion YCT3 provided at the other end of the Y electrode flexible cable YFC does not fold back the Y electrode flexible cable YFC, and without bringing the Y electrode flexible cable YFC into contact with the rear substrate portion 14, It is connected to the Y driver YDRV inside the outer periphery of the PDP 10. That is, the Y electrode flexible cable YFC is arranged with the end portion where the connecting portion YCT2 is provided facing outward, and from the connecting portion YCT2 to the Y driver YDRV provided inside the PDP 10, the outer side (connecting portion) It extends without being folded back into a U-shape at the outer side of the connecting portion between YCT1 and connecting portion YCT2.

Thus, in this embodiment, disconnection of the Y electrode flexible cable YFC caused by folding the Y electrode flexible cable YFC into a U shape can be prevented. Further, in this embodiment, since the Y electrode flexible cable YFC is not folded back in a U shape, the force acting in the direction in which the connecting portion YCT1 and the connecting portion YCT2 are separated from each other can be reduced, and the connecting portion YCT1 and the connecting portion YCT2 Can be prevented from becoming unstable (disconnected state).

Here, a configuration in which the Y electrode flexible cable YFC and the Y driver YDRV are connected without providing the first chamfered portion CF10 on the back substrate portion 14 was considered in the process of the present invention. However, in this configuration, when the connecting portion YCT3 of the Y electrode flexible cable YFC is connected to the Y driver YDRV without turning back the Y electrode flexible cable YFC, the Y electrode flexible cable YFC is connected to the corner of the rear substrate portion 14. There is a risk of hitting. For example, when the corner of the back substrate portion 14 and the Y electrode flexible cable YFC are in contact with each other for a long time, the Y electrode flexible cable YFC may be cut by the corner of the back substrate portion 14.

On the other hand, in this embodiment, the back substrate portion 14 has a first chamfered portion CF10 provided by chamfering the corner of the edge adjacent to the Y electrode flexible cable YFC. Thereby, in this embodiment, it can prevent that the Y electrode flexible cable YFC hits the corner | angular of the back substrate part 14, and can prevent the disconnection of the Y electrode flexible cable YFC. That is, in this embodiment, disconnection between the connection part YCT1 of the Y electrode YE and the Y driver YDRV can be prevented, and the reliability of the PDP device can be improved.

The connection part XCT1 which is the end part of the X electrode XE drawn to the vicinity of the edge part of the front substrate part 12 is connected to the connection part XCT2 provided at one end of the flexible cable XFC for X electrode. That is, the connection part XCT2 of the X electrode flexible cable XFC is connected to the X electrode XE at the outer peripheral part OT on the side where the second chamfered part CF20 is provided. Further, the connection part XCT3 provided at the other end of the X electrode flexible cable XFC does not fold back the X electrode flexible cable XFC, and without bringing the X electrode flexible cable XFC into contact with the rear substrate part 14, It is connected to the X driver XDRV inside the outer periphery of the PDP 10.

Thus, in this embodiment, disconnection of the X electrode flexible cable XFC caused by folding the X electrode flexible cable XFC into a U shape can be prevented. Further, in this embodiment, since the X electrode flexible cable XFC is not folded back in a U shape, it is possible to prevent the connection between the connection portion XCT1 and the connection portion XCT2 from becoming unstable (non-connected state). Furthermore, in this embodiment, the second chamfered portion CF20 can prevent the X electrode flexible cable XFC from hitting the corners of the back substrate portion 14, and thus the disconnection of the X electrode flexible cable XFC can be prevented. That is, in this embodiment, disconnection between the connection part XCT1 of the X electrode XE and the X driver XDRV can be prevented, and the reliability of the PDP device can be improved.

Further, when paying attention to the size of the PDP device, in this embodiment, it is not necessary to secure a thickness for folding the flexible cables XFC and YFC into a U-shape, so the edge along the second direction D2 of the PDP device. The thickness around the part can be reduced. Furthermore, in this embodiment, since it is not necessary to secure a space for folding the flexible cables XFC, YFC into a U shape outside the PDP 10, the size of the PDP device (for example, the size of the PDP device in the first direction D1) Can be reduced. That is, in this embodiment, since the size of the PDP device can be reduced, the manufacturing cost of the

casings

30 and 40 shown in FIG. 1 described above can be reduced.

The drivers XDRV and YDRV are attached to the back side (the lower side in FIG. 5) of the base chassis 50 by attachment members FT (for example, screws) inside the edge of the back substrate portion 14. Further, the connection parts XTC3 and YCT3 are connected to the drivers XDRV and YDRV by a connector or the like (not shown).

FIG. 6 shows an outline of the side surface of the PDP device along the second direction D2 as viewed from the side where the Y driver YDRV shown in FIG. 4 is arranged. The meaning of the arrow D2 in the figure is the same as in FIG. In FIG. 6, the description of the optical filter 20, the front housing 30, the rear housing 40, the Y electrode flexible cable YFC shown in FIG. 4 and the like shown in FIG. 1 is omitted.

The back substrate portion 14 is one of the edge portions along the first direction D1 (on the left side in FIG. 6) among the edge portions of the surface opposite to the surface facing the front substrate portion 12 (lower side in FIG. 6). ) Has a third chamfered portion CF30. For example, the third chamfered portion CF30 is on the side where the address electrode AE is drawn out of the edge portion of the surface on the base chassis 50 side of the back substrate portion 14 (the surface opposite to the surface facing the front substrate portion 12). Chamfered at the corners of the edge. The connection portion ACT2 provided at one end of the address electrode flexible cable AFC is connected to the address electrode AE at the outer peripheral portion OT on the side where the third chamfered portion CF30 is provided.

That is, the connection portion ACT1 which is the end portion of the address electrode AE drawn to the vicinity of the edge portion of the front substrate portion 12 is connected to the connection portion ACT2 of the address electrode flexible cable AFC. The connection portion ACT3 provided at the other end of the address electrode flexible cable AFC does not fold back the address electrode flexible cable AFC and does not contact the address electrode flexible cable AFC with the rear substrate portion 14. It is connected to the address driver ADRV inside the outer periphery of the PDP 10.

Thereby, in this embodiment, disconnection of the address electrode flexible cable AFC caused by folding the address electrode flexible cable AFC into a U shape can be prevented. In this embodiment, since the address electrode flexible cable AFC is not folded back in a U-shape, it is possible to prevent the connection between the connection part ACT1 and the connection part ACT2 from becoming unstable (non-connected state). Furthermore, in this embodiment, the third chamfered portion CF30 can prevent the address electrode flexible cable AFC from hitting the corners of the back substrate portion 14, and thus the disconnection of the address electrode flexible cable AFC can be prevented. That is, in this embodiment, disconnection between the connection part ACT1 of the address electrode AE and the address driver ADRV can be prevented, and the reliability of the PDP device can be improved.

Further, when paying attention to the size of the PDP device, in this embodiment, it is not necessary to secure a thickness for folding the address electrode flexible cable AFC into a U-shape, and therefore, it is along the first direction D1 of the PDP device. The thickness around the edge can be reduced. Further, in this embodiment, since it is not necessary to secure a space for folding the address electrode flexible cable AFC in a U shape outside the PDP 10, the size of the PDP device (for example, the size in the second direction D2 of the PDP device). ) Can be reduced. That is, in this embodiment, since the size of the PDP device can be reduced, the manufacturing cost of the

casings

30 and 40 shown in FIG. 1 described above can be reduced.

The address driver ADRV is attached to the back side (the lower side in FIG. 6) of the base chassis 50 with an attachment member FT (for example, a screw) inside the edge of the back substrate portion 14. The connection unit ACT3 is connected to the address driver ADRV by a connector or the like (not shown).

FIG. 7 shows an example of a cross section along the first direction D1 around the connecting portion between the Y electrode flexible cable YFC and the Y electrode YE shown in FIG. FIG. 7 shows a cross section of the position where the bus electrode Yb shown in FIG. 2 is arranged. The meaning of the arrow D1 in the figure is the same as in FIG.

As described with reference to FIG. 4, the Y electrode flexible cable YFC includes the base film FL1, the wiring ML formed on the base film FL1, the connection portion YCT2 (and the connection portion YCT3 shown in FIG. 5 described above). The protective film FL2 that covers the wiring ML other than the above is provided. The end of the Y electrode flexible cable YFC on the side of the connecting portion YCT2 in the protective film FL2 is located inside the connecting portion YCT2 in order to expose the connecting portion YCT2 to the outside of the Y electrode flexible cable YFC. Further, as described in FIG. 5 described above, the Y electrode flexible cable YFC is arranged with the end portion where the connection portion YCT2 is provided facing outward.

Further, the edge on the connection portion YCT1 side in the dielectric layer DL, the protective layer PL, and the glass substrate RS is located inside the connection portion YCT1 in order to expose the connection portion YCT1 to the outside of the PDP 10. The connection portion YCT1 is connected to the connection portion YCT2 by an anisotropic conductive film ACF or the like.

As described above with reference to FIG. 5, the first chamfered portion CF10 is adjacent to the Y electrode flexible cable YFC in the edge portion of the surface opposite to the surface facing the front substrate portion 12 in the rear substrate portion 14. Chamfered at the corners of the edge. For example, the width W10 (width W10 along the first direction D1) and the depth DP10 of the first chamfered portion CF10 are formed to be larger than half the thickness T10 (thickness T12) of the glass base RS.

Here, for example, when the width W10 and the depth DP10 of the first chamfered portion CF10 are small, the Y electrode flexible cable YFC may hit the end portion (first chamfered portion CF10) of the back substrate portion 14. In this case, as described above, the Y electrode flexible cable YFC may be disconnected at a portion in contact with the end portion of the back substrate portion 14. For example, when the end portion of the back substrate portion 14 and the Y electrode flexible cable YFC are in contact with each other for a long time, the end portion of the back substrate portion 14 damages the base film FL1 and the wiring ML sequentially, and the Y electrode flexible cable Cable YFC is disconnected.

On the other hand, in this embodiment, since the width W10 and the depth DP10 of the first chamfered portion CF10 are large, it is possible to reliably prevent the Y electrode flexible cable YFC from hitting the end (corner) of the back substrate portion 14. Thereby, in this embodiment, disconnection of the flexible cable YFC for Y electrodes can be reliably prevented. If the Y electrode flexible cable YFC is not in contact with the back substrate part 14, the width W10 and the depth DP10 of the first chamfered part CF10 may be half or less (thickness T12) of the thickness T10 of the glass base RS. Good.

The cross section along the first direction D1 around the connection portion between the X electrode flexible cable XFC and the X electrode XE is the cross section along the first direction D1 around the connection portion between the Y electrode flexible cable YFC and the Y electrode YE. Is almost the same. The cross section along the second direction D2 around the connection portion between the address electrode flexible cable AFC and the address electrode AE is the cross section along the first direction D1 around the connection portion between the Y electrode flexible cable YFC and the Y electrode YE. Is almost the same. In addition, since the connection part ACT1 of the address electrode AE is formed on the dielectric layer DL, the edge of the protective layer PL and the glass base RS on the connection part ACT1 side is located inside the connection part ACT1.

FIG. 8 shows an example of a manufacturing method of the first chamfered portion CF10. In addition, FIG. 8 has shown the cross section along the 1st direction D1 of the back substrate part 14 (glass base material RS) until 1st chamfering part CF10 is formed. The meaning of the arrow D1 in the figure is the same as in FIG.

First, a glass substrate RS is prepared (FIG. 8 (a)). Then, the first sandblast is performed (FIG. 8B). In the first sandblast (FIG. 8B), first, a photoresist R10 is formed on the glass substrate RS in a portion excluding a region where the first sandblast is performed (FIG. 8B1). For example, the width W20 along the first direction of the region where the first sandblasting is performed is a quarter of the width W10 of the first chamfered portion CF10. The width W20 may not be a quarter of the width W10 as long as it is smaller than the width W10. Then, the abrasive G10 is sprayed from the nozzle gun N10 of the sandblasting device toward the glass substrate RS. (FIG. 8 (b2)). By the sand blasting, the glass substrate RS in a portion (for example, a portion not covered with the photoresist R10) where the abrasive G10 is sprayed is removed (FIG. 8 (b3)). Then, the photoresist R10 is removed, and the first sandblast is completed (FIG. 8 (b4)).

Next, the second sandblasting is performed (FIG. 8C). Each step of the second sandblast is the same as the first sandblast except for the region where the photoresist R10 is formed. Hereinafter, detailed description of each step of sandblasting is omitted. For example, the width W22 along the first direction of the region where the second sandblasting is performed (for example, the portion not covered with the photoresist R10) is two-fourths of the width W10. Note that the width W22 may be less than two-fourths of the width W10 as long as it is smaller than the width W10 and larger than the width W20. That is, the second sandblast is performed including the portion where the first sandblast is performed.

Furthermore, a third sandblast is performed (FIG. 8 (d)). For example, the width W24 along the first direction of the region where the third sandblasting is performed (for example, the portion not covered with the photoresist R10) is three-fourths of the width W10. Note that the width W24 may not be three-fourths of the width W10 as long as it is smaller than the width W10 and larger than the width W22. That is, the third sandblast is performed including the portion where the first and second sandblasts are performed.

Then, the fourth sandblast is performed (FIG. 8 (e)). For example, the width W26 along the first direction of the region where the fourth sandblasting is performed (for example, the portion not covered with the photoresist R10) is the width W10. That is, the fourth sandblast is performed on the entire region where the first chamfered portion CF10 is formed.

As described above, the stepped chamfered portion CF11 having the large width W10 and the depth DP10 is formed on the glass substrate RS by sandblasting a plurality of times (in the example of the figure, four times). In addition, the frequency | count of sandblast may be more than 4 times, and may be less. In addition, the conditions for each time of sandblasting (such as the injection time of the abrasive G10) may be the same or different from each other.

Finally, the stepped chamfered portion CF11 is polished to form the first chamfered portion CF10 (FIG. 8 (f)). For example, the first chamfered portion CF10 is formed by smoothing the surface of the chamfered portion CF11 by chemical mechanical polishing. For example, chemical mechanical polishing is performed by supplying slurry to the surface of the chamfered portion CF11, bringing the surface plate into contact with the surface of the chamfered portion CF11, and rotating the surface plate. For example, the slurry contains cerium oxide abrasive grains having an average particle diameter of about 1 μm, and a foamed polyurethane polishing pad is attached to the surface plate.

In addition, the manufacturing method of 2nd chamfering part CF20 shown in FIG. 5 mentioned above and 3rd chamfering part CF30 shown in FIG. 6 mentioned above is the same as the manufacturing method of 1st chamfering part CF10.

As described above, in this embodiment, the connection portions XCT3, YCT3, and ACT3 of the flexible cables XFC, YFC, and AFC are not folded back and are not brought into contact with the back substrate portion 14, respectively. It is connected to drivers XDRV, YDRV, and ADRV. Therefore, in this embodiment, since it is not necessary to secure the thickness and space for folding the flexible cables XFC, YFC, and AFC, the thickness of the PDP device can be reduced, and the size of the PDP device can be reduced. That is, in this embodiment, a thin PDP device can be provided. Furthermore, in this embodiment, since the size of the PDP device with respect to the PDP 10 can be reduced, the manufacturing cost can be reduced. Further, in this embodiment, since the flexible cables XFC, YFC, AFC can be prevented from hitting the end of the back substrate portion 14, disconnection between each electrode XE, YE, AE and each driver XDRV, YDRV, ADRV is prevented. Can be prevented. Therefore, the reliability of the PDP device can be improved.

9 and 10 show an outline of a PDP device in another embodiment. 9 corresponds to the side surface of the PDP device shown in FIG. 5 described above, and FIG. 10 corresponds to the side surface of the PDP device shown in FIG. 6 described above. In this embodiment, the disconnection preventing material DCP is added to the configuration shown in FIGS. 5 and 6 described above. Other configurations are the same as those of the embodiment described with reference to FIGS. For example, the manufacturing method of the first chamfered portion CF10, the second chamfered portion CF20, and the third chamfered portion CF30 is the same as that in FIG. 8 described above. The same elements as those described in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 9, a disconnection preventing material DCP is provided between the back substrate portion 14 and the Y electrode flexible cable YFC. The intermediate portion of the Y electrode flexible cable YFC may or may not be fixed to the back substrate portion 14 by the disconnection preventing material DCP. For example, the disconnection preventing material DCP is provided on the back substrate portion 14 and is disposed adjacent to the first chamfered portion CF10. The disconnection preventing material DCP may be provided on the entire surface of the first chamfered portion CF10. Here, for example, the disconnection preventing material DCP is formed of an elastic material (silicon resin, epoxy resin, polyimide resin, urethane resin, or the like).

In this embodiment, it is possible to reliably prevent the Y electrode flexible cable YFC from hitting the end (corner) of the back substrate portion 14 by the elastic disconnection preventing material DCP. Even if the Y electrode flexible cable YFC contacts the disconnection preventing material DCP, the disconnection preventing material DCP has elasticity, so that the disconnection of the Y electrode flexible cable YFC is prevented. Therefore, in this embodiment, disconnection of the Y electrode flexible cable YFC can be reliably prevented.

A disconnection preventing material DCP is provided between the back substrate portion 14 and the X electrode flexible cable XFC. The structure around the disconnection prevention material DCP provided between the back substrate portion 14 and the X electrode flexible cable XFC is the periphery of the disconnection prevention material DCP provided between the back substrate portion 14 and the Y electrode flexible cable YFC. The configuration is the same. Therefore, in this embodiment, the elastic breakage prevention material DCP can reliably prevent the X electrode flexible cable XFC from hitting the end portion of the back substrate portion 14 and reliably break the X electrode flexible cable XFC. Can be prevented.

As shown in FIG. 10, a disconnection preventing material DCP is provided between the back substrate portion 14 and the address electrode flexible cable AFC. The configuration around the disconnection preventing material DCP provided between the back substrate portion 14 and the address electrode flexible cable AFC is the periphery of the disconnection preventing material DCP provided between the back substrate portion 14 and the Y electrode flexible cable YFC. The configuration is the same. Therefore, in this embodiment, the elastic disconnection-preventing material DCP can reliably prevent the address electrode flexible cable AFC from hitting the end of the back substrate portion 14 and reliably disconnect the address electrode flexible cable AFC. Can be prevented.

As described above, also in this embodiment, the same effects as those of the embodiment described with reference to FIGS. 1 to 8 can be obtained.

In the above-described embodiment, an example in which one pixel includes three cells (red (R), green (G), and blue (B)) has been described. The present invention is not limited to such an embodiment. For example, one pixel may be composed of four or more cells. Alternatively, one pixel may be composed of cells that generate colors other than red (R), green (G), and blue (B), and one pixel may be red (R), green (G), A cell that generates a color other than blue (B) may be included.

In the above-described embodiment, the example in which the second direction D2 is orthogonal to the first direction D1 has been described. The present invention is not limited to such an embodiment. For example, the second direction D2 may intersect the first direction D1 in a substantially perpendicular direction (for example, 90 ° ± 5 °). Also in this case, the same effect as the above-described embodiment can be obtained.

In the embodiment described above, an example in which the Y driver YDRV is connected to the Y electrode flexible cable YFC by a connector or the like has been described. The present invention is not limited to such an embodiment. For example, the Y driver YDRV may be provided integrally with the Y electrode flexible cable YFC on the base film FL1 of the Y electrode flexible cable YFC. Alternatively, a part of the Y driver YDRV (such as an output circuit) may be provided integrally with the Y electrode flexible cable YFC on the base film FL1 of the Y electrode flexible cable YFC. Similarly, at least a part of the drivers XDRV and ADRV may be provided integrally with the flexible cables XFC and AFC on the base film FL1 of the flexible cables XFC and AFC, respectively.

In this case, the PDP apparatus includes a flexible printed board in which, for example, a Y driver YDRV and a Y electrode flexible cable YFC are integrally provided. Note that the end of the flexible printed circuit board where the Y driver YDRV is not provided is the end (one end of the flexible cable) where the connecting portion YCT2 of the Y electrode flexible cable YFC shown in FIG. 5 described above is provided. . The connection portion between the Y driver YDRV of the flexible printed circuit board and the wiring ML of the Y electrode flexible cable YFC corresponds to the connection portion YCT3 of the Y electrode flexible cable YFC shown in FIG. Also in this case, the same effect as the above-described embodiment can be obtained.

In the above-described embodiment, the connection portion ACT1 of the address electrode AE is near one of the two edges along the first direction D1 of the front substrate portion 12 (the left outer peripheral portion OT in FIG. 6 described above). The example provided in is described. The present invention is not limited to such an embodiment. For example, the connection part ACT1 of the address electrode AE may be provided in the vicinity of both edges (the left and right outer peripheral parts OT in FIG. 6) along the first direction D1 of the front substrate part 12. Alternatively, the address electrode AE in which the connection part ACT1 is provided near one edge part and the address electrode AE in which the connection part ACT1 is provided in the vicinity of the other edge part may be mixed. For example, the third chamfered portion CF30 is provided by chamfering the corner of the edge portion on the side where the connection portion ACT1 is provided, of the edge portion of the surface of the back substrate portion 14 on the base chassis 50 side. Also in this case, the same effect as the above-described embodiment can be obtained.

In the above-described embodiment, the example in which the voltages −Vs / 2 and Vs / 2 are alternately applied to the X electrode XE by the X driver XDRV has been described. The present invention is not limited to such an embodiment. For example, the X electrode XE may be maintained at the ground voltage GND. In this case, for example, the voltages Vs and −Vs are alternately applied to the Y electrode YE by the Y driver YDRV during the sustain period. In the PDP device in which the X electrode XE is maintained at the ground voltage GND, the X driver XDRV and the X electrode flexible cable XFC can be omitted from the configuration shown in FIG. 4 described above. In this case, the ground voltage GND is supplied from the ground line of the PDP 10 to the X electrode XE. Also in this case, the same effect as the above-described embodiment can be obtained.

In the above-described embodiment, the example in which the plasma display device is configured by a PDP having a three-electrode (electrode XE, YE, AE) structure has been described. The present invention is not limited to such an embodiment. For example, the plasma display device may be configured by a PDP having a two-electrode structure. For example, a PDP having a two-electrode structure is configured by omitting the X electrode XE, the X driver XDRV, and the X electrode flexible cable XFC from the configuration shown in FIGS. In the two-electrode PDP, a sustain discharge is generated between the electrodes YE and AE. That is, the electrode AE functions as the address electrode AE described with reference to FIG. 3 in the address period, and functions as the X electrode XE (sustain electrode) in the sustain period. Therefore, the drive circuit (for example, driver ADRV) that drives the electrode AE of the two-electrode structure PDP has the functions of the address driver ADRV and the X driver XDRV described with reference to FIG. Also in this case, the same effect as the above-described embodiment can be obtained.

In the above-described embodiment, the example in which the depth DP10 of the first chamfered portion CF10 is different from the thickness T10 of the back substrate portion 14 has been described. The present invention is not limited to such an embodiment. For example, as shown in FIG. 11, the depth DP10 of the first chamfered portion CF12 may be the same as the thickness T10 of the back substrate portion 14. Similarly, the depths of the chamfered portions CF20 and CF30 shown in FIGS. 5 and 6 described above may be the same as the thickness T10 of the back substrate portion 14. Also in this case, the same effect as the above-described embodiment can be obtained.

In the above-described embodiment, the example in which the first chamfered portion CF10 is formed linearly has been described. The present invention is not limited to such an embodiment. For example, as shown in FIG. 12, the first chamfered portion CF14 may be formed in an arc shape, and as shown in FIG. 13, the first chamfered portion CF16 may be formed in a step shape. Similarly, the chamfered portions CF20 and CF30 shown in FIGS. 5 and 6 described above may be formed in an arc shape or a step shape. Also in this case, the same effect as the above-described embodiment can be obtained.

12 and 13 correspond to a cross section along the first direction D1 around the connection portion between the Y electrode flexible cable YFC and the Y electrode YE shown in FIG. 7 described above. The configuration of FIGS. 12 and 13 is the same as that of the embodiment described in FIGS. 1 to 7 except for the shape of the chamfered portion (for example, the chamfered portion CF14 in FIG. 12 and the chamfered portion CF16 in FIG. 13). Moreover, the manufacturing method of 1st chamfering part CF14 and CF16 is the same as FIG. 8 mentioned above. The same elements as those described in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof will be omitted.

For example, the first chamfered portion CF14 formed in an arc shape shown in FIG. 12 has the sand blasting conditions (abrasion time of the abrasive G10, widths W20, W22, W24, W26, etc.) shown in FIG. It is formed by adjusting the number of times of performing. Further, the first chamfered portion CF16 formed in a stepped shape shown in FIG. 13 is substantially the same as the stepped chamfered portion CF11 shown in FIG. That is, in the PDP 10 having the first chamfered portion CF16, it is not necessary to polish the stepped chamfered portion CF11 shown in FIG. 8 until the shape of the chamfered portion becomes linear, and the manufacturing cost can be reduced.

In the above-described embodiment, the example in which the address electrode AE is provided on the front substrate portion 12 has been described. The present invention is not limited to such an embodiment. For example, as shown in FIG. 14, the address electrode AE may be provided on the back substrate portion 14. FIG. 14 shows an example of a modified example of the PDP 10 shown in FIG. The meanings of the arrows D1 and D2 in the figure are the same as those in FIG. In the configuration of FIG. 14, the plurality of address electrodes AE extending in the second direction D2 are provided on the surface of the glass substrate RS that faces the glass substrate FS, and are covered with the dielectric layer DL2. A partition wall BR is formed on the dielectric layer DL2. In this case, for example, as shown in FIG. 15, the address electrode flexible cable AFC2 is folded in a U shape outside the outer periphery of the PDP 10 and connected to the address driver ADRV.

FIG. 15 shows an outline of a side surface along the second direction D2 in the PDP device using the PDP 10 shown in FIG. The meanings of the arrows D1 and D2 in the figure are the same as those in FIG. In FIG. 15, the description of the optical filter 20, the front casing 30, the rear casing 40, the Y electrode flexible cable YFC shown in FIG. The configuration of FIG. 15 is the same as that of FIG. 6 described above except for the configuration around the end of the address electrode AE. That is, the configuration of the periphery of the flexible cables XFC, YFC is the same as that in the above-described embodiment (FIGS. 4, 5, 7, etc.).

A connection portion ACT4 that is an end portion of the address electrode AE drawn to the vicinity of the edge portion (outer peripheral portion OT) of the rear substrate portion 14 is connected to a connection portion ACT5 provided at one end of the address electrode flexible cable AFC2. . For example, in the address electrode flexible cable AFC2, since the address electrode AE is provided on the back substrate 14 (more specifically, on the glass base RS), the end connected to the address electrode AE is provided. Is arranged toward the inner peripheral side of the PDP 10. Therefore, the connection portion ACT3 provided at the other end of the address electrode flexible cable AFC2 is connected to the address driver ADRV by folding the address electrode flexible cable AFC2 into a U shape outside the outer periphery of the PDP 10.

Further, between the address electrode flexible cable AFC2 and the side surface of the rear substrate portion 14, a silicon resin SR or the like is provided to prevent the address electrode flexible cable AFC2 from being disconnected at the corner of the rear substrate portion 14. It has been. Further, on the rear substrate portion 14, for example, a silicon resin SR that covers the connection portion ACT4 is provided to prevent the connection portion between the connection portion ACT4 and the address electrode flexible cable AFC2 from absorbing moisture. . In addition, the edge part by the side of the connection part ACT4 in the front substrate part 12 is located inside the connection part ACT4 in order to expose the connection part ACT4 to the exterior of PDP10. In other words, the edge part on the connection part ACT4 side in the back substrate part 14 is located outside the edge part of the front substrate part 12. Note that the edge of the rear substrate portion 14 where the connection portion ACT4 is not provided may be at the same position as the edge of the front substrate portion 12.

In the configuration of FIG. 15 (FIG. 14), for example, the connection portions XCT3 and YCT3 of the flexible cables XFC and YFC do not fold back the flexible cables XFC and YFC and do not contact the back substrate portion 14, respectively. It is connected to XDRV and YDRV. Thereby, disconnection between the connection parts XCT1 and YCT1 of the electrodes XE and YE and the drivers XDRV and YDRV is prevented, and the reliability of the PDP device is improved. Also in this case, the thickness around the edge along the second direction D2 of the PDP device can be reduced, and the size of the PDP device (for example, the size of the PDP device in the first direction D1) can be reduced. That is, also in this case, the same effect as that of the above-described embodiment can be obtained except for the effect of the address electrode flexible cable AFC of the above-described embodiment.

In the above-described embodiment, the example in which the chamfered portions CF10, CF20, and CF30 are formed by sandblasting has been described. The present invention is not limited to such an embodiment. For example, the chamfered portions CF10, CF20, and CF30 may be formed by laser ablation. Alternatively, the chamfered portions CF10, CF20, and CF30 may be formed using a glass beveling technique. Also in this case, the same effect as the above-described embodiment can be obtained.

As described above, the present invention has been described in detail. However, the above-described embodiment and its modification are merely examples of the present invention, and the present invention is not limited thereto. Obviously, modifications can be made without departing from the scope of the present invention.

The present invention can be applied to a plasma display device and a method for manufacturing a plasma display device.

Claims

A plasma display panel having a first substrate provided with a plurality of first electrodes extending in a first direction, and a second substrate facing the first substrate through a discharge space;
A first drive circuit for applying a voltage to the first electrode;
A first flexible cable for electrically connecting the first electrode and the first drive circuit;
The second substrate includes a first chamfered portion at one of the edges along the second direction intersecting the first direction among the edges of the surface opposite to the surface facing the first substrate,
One end of the first flexible cable is connected to the first electrode at the outer peripheral portion of the plasma display panel on the side where the first chamfered portion is provided,
The other end of the first flexible cable does not fold back the first flexible cable, and does not bring the first flexible cable into contact with the second substrate. A plasma display device connected to a circuit.
The plasma display device according to claim 1, wherein
The plasma display apparatus according to claim 1, wherein a width and a depth of the first chamfered portion are larger than half of a thickness of the second substrate.
The plasma display device according to claim 1, wherein
The plasma display apparatus according to claim 1, wherein the first chamfered portion is formed in an arc shape.
The plasma display device according to claim 1, wherein
The plasma display apparatus, wherein the first chamfered portion is formed in a step shape.
The plasma display device according to claim 1, wherein
A plasma display device, comprising: a disconnection prevention material provided between the second substrate and the first flexible cable and disposed adjacent to the first chamfered portion.
The plasma display device according to claim 1, wherein
A plasma display device comprising a flexible printed circuit board in which at least a part of the first drive circuit and the first flexible cable are integrally provided.
The plasma display device according to claim 1, wherein
A plurality of second electrodes extending in the first direction and provided on the first substrate and spaced from the first electrodes;
A second drive circuit for applying a voltage to the second electrode;
A second flexible cable for electrically connecting the second electrode and the second drive circuit;
The second substrate includes a second chamfered portion on an edge portion on the opposite side to the side on which the first chamfered portion is provided, of the edge portion of the surface opposite to the surface facing the first substrate.
One end of the second flexible cable is connected to the second electrode at the outer peripheral portion of the plasma display panel on the side where the second chamfered portion is provided,
The other end of the second flexible cable does not fold back the second flexible cable, and does not contact the second flexible cable with the second substrate. A plasma display device connected to a circuit.
The plasma display device according to claim 1, wherein
A plurality of third electrodes extending in the second direction and provided on the first substrate;
A third drive circuit for applying a voltage to the third electrode;
A third flexible cable for electrically connecting the third electrode and the third drive circuit;
The second substrate includes a third chamfered portion at one of the edges along the first direction among the edges of the surface opposite to the surface facing the first substrate,
One end of the third flexible cable is connected to the third electrode at the outer peripheral portion of the plasma display panel on the side where the third chamfered portion is provided,
The other end of the third flexible cable does not fold the third flexible cable, and does not bring the third flexible cable into contact with the second substrate. A plasma display device connected to a circuit.
A plasma display panel having a first substrate provided with a plurality of first electrodes extending in a first direction and a second substrate facing the first substrate through a discharge space; and applying a voltage to the first electrode. A method for manufacturing a plasma display device, comprising: a first drive circuit to be applied; and a first flexible cable for electrically connecting the first electrode and the first drive circuit,
One end of the first flexible cable is connected to the first electrode at an outer peripheral portion of the outer peripheral portion of the plasma display panel where the first chamfered portion is provided, and the first chamfered portion is connected to the first chamfered portion. Among the edges of the surface of the two substrates opposite to the surface facing the first substrate, provided on one of the edges along the second direction intersecting the first direction,
The other end of the first flexible cable is connected to the first drive inside the outer periphery of the plasma display without folding the first flexible cable and without bringing the first flexible cable into contact with the second substrate. A method of manufacturing a plasma display device, comprising connecting to a circuit.
In the manufacturing method of the plasma display device according to claim 9,
A method of manufacturing a plasma display device, wherein the width and depth of the first chamfered portion are larger than half of the thickness of the second substrate.
In the manufacturing method of the plasma display device according to claim 9,
The method for manufacturing a plasma display device, wherein the first chamfered portion is formed in an arc shape.
In the manufacturing method of the plasma display device according to claim 9,
The method of manufacturing a plasma display device, wherein the first chamfered portion is formed in a step shape.
In the manufacturing method of the plasma display device according to claim 9,
A method for manufacturing a plasma display device, wherein a disconnection preventing material is disposed between the second substrate and the first flexible cable at a position adjacent to the first chamfered portion.
In the manufacturing method of the plasma display device according to claim 9,
The plasma display device includes:
A plurality of second electrodes extending in the first direction and provided on the first substrate and spaced from the first electrodes;
A second drive circuit for applying a voltage to the second electrode;
A second flexible cable for electrically connecting the second electrode and the second drive circuit;
One end of the second flexible cable is connected to the second electrode at the outer peripheral portion of the outer peripheral portion of the plasma display panel where the second chamfered portion is provided, and the second chamfered portion is connected to the second chamfered portion. Among the edges of the surface opposite to the surface facing the first substrate in the two substrates, provided on the edge opposite to the side where the first chamfered portion is provided,
The second drive of the second flexible cable inside the outer periphery of the plasma display without folding the second flexible cable and without bringing the second flexible cable into contact with the second substrate. A method of manufacturing a plasma display device, comprising connecting to a circuit.
In the manufacturing method of the plasma display device according to claim 9,
The plasma display device includes:
A plurality of third electrodes extending in the second direction and provided on the first substrate;
A third drive circuit for applying a voltage to the third electrode;
A third flexible cable for electrically connecting the third electrode and the third drive circuit;
One end of the third flexible cable is connected to the third electrode at the outer peripheral portion of the outer peripheral portion of the plasma display panel where the third chamfered portion is provided, and the third chamfered portion is connected to the third chamfered portion. Among the edges of the surface on the opposite side of the surface facing the first substrate in the two substrates, provided on one of the edges along the first direction,
The third drive of the third flexible cable is carried out inside the outer periphery of the plasma display without folding the third flexible cable and without bringing the third flexible cable into contact with the second substrate. A method of manufacturing a plasma display device, comprising connecting to a circuit.