KR101144531B1 - Touch input device - Google Patents

Abstract

A touch input device is disclosed. The touch input device includes a first substrate; A second substrate spaced apart from the first substrate and disposed below the first substrate; A connection substrate interposed between the first substrate and the second substrate and electrically connected to the first substrate and the second substrate; And a support substrate disposed below the second substrate and supporting the second substrate.

Touch, panel, FPCB, ACF, ACA

Description

Touch input device {TOUCH INPUT DEVICE}

An embodiment relates to a touch input device.

As information processing technology develops, devices capable of inputting signals by external touch or the like are widely used.

In particular, a touch screen device in which a touched position is input to a screen on which an image is displayed is widely used.

Embodiments provide a touch input device in which short circuit is reduced and preventing contamination of foreign matters and the like.

In one embodiment, a touch input device includes a first substrate; A second substrate spaced apart from the first substrate and disposed under the first substrate; A connection substrate interposed between the first substrate and the second substrate and electrically connected to the first substrate and the second substrate; And a support substrate disposed under the second substrate and supporting the second substrate.

In the touch input device according to the embodiment, since the connection substrate is interposed between the first substrate and the second substrate and connected to the first substrate and the second substrate, the connection between the substrates can be strengthened.

In particular, the connecting substrate may be connected to the first substrate and the second substrate by an anisotropic conductive adhesive such as an anisotropic conductive film (ACF) or an anisotropic conductive adhesive (ACA), and accordingly, the touch input device according to the embodiment Short circuit between them can be prevented.

In addition, open regions may be formed in the support substrate and the second substrate, and the connection substrate may be bent or curved to pass through the open regions and extend downward. That is, the touch input device according to the embodiment does not form a step on the side by the connecting substrate.

Therefore, when the touch input device according to the embodiment is accommodated in a case or the like, the distance between the side of the touch input device and the inner surface of the case can be reduced as much as possible. Accordingly, the touch input device according to the embodiment can prevent foreign matter from penetrating into the display set such as a mobile phone including the same.

In the description of the embodiments, each panel, member, layer, pad or substrate or the like is described as being formed "on" or "under" of each panel, member, layer, pad or substrate or the like. In the case, “on” and “under” include both being formed “directly” or “indirectly” through other components. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a touch panel according to an embodiment. 2 is a plan view illustrating a rear surface of an upper substrate. 3 is a plan view illustrating an upper surface of a lower substrate. 4 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 1.

1 to 4, the touch panel includes an upper substrate 100, a lower substrate 200, a spacer 300, an adhesive member 400, a support substrate 500, and a connection substrate 600.

2 and 4, the upper substrate 100 includes a first film substrate 110, a first electrode 120, a second electrode 130, an upper resistance layer 140, and upper wirings 151. , 152, a first connection terminal 160, and a second connection terminal 170.

The first film substrate 110 faces the lower substrate 200 and has a plate shape. The first film substrate 110 is transparent, and examples of the material used as the first film substrate 110 include polyethylene terephthalate (PET) resin.

The first film substrate 110 is flexible. Therefore, the first film substrate 110 can be easily deformed by touch.

The first electrode 120 and the second electrode 130 are spaced apart from each other on the rear surface of the first film substrate 110 and disposed in parallel to each other. The first electrode 120 and the second electrode 130 extend in the X-axis direction.

The resistances of the first electrode 120 and the second electrode 130 are much lower than the resistance of the upper resistance layer 140.

The upper resistance layer 140 is disposed on the rear surface of the first film substrate 110 and covers most of the rear surface of the first film substrate 110.

The upper resistance layer 140 is transparent and is a conductor. Examples of the material used as the upper resistance layer 140 may include indium tin oxide (ITO) or indium zinc oxide (IZO).

The upper resistance layer 140 is disposed between the first electrode 120 and the second electrode 130 and is in contact with the first electrode 120 and the second electrode 130.

The upper resistance layer 140 has a higher resistance than the first electrode 120 and the second electrode 130.

The upper interconnections 151 and 152 connect the first electrode 120 and the second electrode 130 to the first connection terminal 160 and the second connection terminal 170, respectively.

The first connection terminal 160 is electrically connected to the first electrode 120 and is formed on the rear surface of the first film substrate 110.

The second connection terminal 170 is connected to the second electrode 130 and is formed on the rear surface of the first film substrate 110.

The first electrode 120, the second electrode 130, the upper interconnections 151 and 152, the first connection terminal 160 and the second connection terminal 170 are integrally formed. In addition, the first electrode 120, the second electrode 130, the upper wirings 151 and 152, the first connection terminal 160, and the second connection terminal 170 may be formed of a material. As an example, silver, aluminum, copper, these alloys, etc. are mentioned.

3 and 4, the lower substrate 200 is rigid. The lower substrate 200 has a plate shape. The lower substrate 200 may include a second film substrate 210, a third electrode 220, a fourth electrode 230, a lower resistance layer 240, lower interconnections 251 and 252, and a third connection terminal ( 260 and a fourth connection terminal 270.

The second film substrate 210 is transparent and flexible. The second film substrate 210 is opposite to the first film substrate 110.

The third electrode 220 and the fourth electrode 230 are spaced apart from each other, and are arranged side by side on the second film substrate 210. The third electrode 220 and the fourth electrode 230 face each other and are parallel to each other. In addition, the third electrode 220 and the fourth electrode 230 extend in the Y-axis direction.

The third electrode 220 and the fourth electrode 230 have a low resistance. That is, the third electrode 220 and the fourth electrode 230 have a very low resistance compared to the lower resistance film 240. Examples of the material used for the third electrode 220 and the fourth electrode 230 include silver, aluminum, copper, alloys thereof, and the like.

The lower resistance layer 240 is formed between the third electrode 220 and the fourth electrode 230. The lower resistance layer 240 is formed on the second film substrate 210 and covers most of the second film substrate 210.

In addition, the lower resistance layer 240 is in contact with the third electrode 220 and the fourth electrode 230. The lower resistance layer 240 is a conductive layer and is transparent. Examples of the material used as the lower resistance layer 240 may include indium tin oxide (ITO) or indium zinc oxide (IZO).

The lower resistance layer 240 has a higher resistance than the third electrode 220 and the fourth electrode 230. The lower resistance layer 240 is electrically connected to the third electrode 220 and the fourth electrode 230.

The lower interconnections 251 and 252 are connected to the third electrode 220 and the fourth electrode 230, respectively. The lower interconnections 251 and 252 are connected to the third connection terminal 260 and the fourth connection terminal 270. That is, the lower interconnections 251 and 252 connect the third connection terminal 260 and the third electrode 220, respectively, and the fourth connection terminal 270 and the fourth electrode 230. Connect

A portion of the lower substrate 200 is cut to form a first open area 201. The first open area 201 exposes a portion of the lower surface of the upper substrate 100. The first open area 201 may be a through hole penetrating the lower substrate 200.

In addition, by the first open area 201, the upper substrate 100 and the lower substrate 200 form a step with each other.

The spacer 300 is interposed between the upper substrate 100 and the lower substrate 200. The spacer 300 maintains a cell gap between the upper substrate 100 and the lower substrate 200.

The adhesive member 400 is interposed between the upper substrate 100 and the lower substrate 200. The adhesive member 400 is adhered to the upper substrate 100 and the lower substrate 200. The adhesive member 400 is disposed at outer portions of the upper substrate 100 and the lower substrate 200.

1 and 4, the support substrate 500 is disposed below the lower substrate 200. The support substrate 500 is rigid and supports the lower substrate 200. The support substrate 500 may be a glass substrate or a metal substrate. The support substrate 500 may be attached to the lower substrate 200.

A second open area 501 corresponding to the first open area 201 is formed in the support substrate 500. The second open area 501 has a larger planar area than the first open area 201. The second open area 501 exposes a portion of the bottom surface of the lower substrate 200. That is, the second open area 501 includes an exposed area ER corresponding to the lower surface of the exposed lower substrate 200.

By the second open area 501, the support substrate 500 and the lower substrate 200 form a step with each other.

The connection substrate 600 is interposed between the upper substrate 100 and the lower substrate 200. The connection substrate 600 is electrically connected to the upper substrate 100 and the lower substrate 200. In more detail, the connection substrate 600 is connected to the first to fourth connection terminals 160, 170, 260, and 270.

In addition, a first anisotropic conductive adhesive layer 710 is interposed between the connecting substrate 600 and the upper substrate 100 to electrically connect the connecting substrate 600 and the upper substrate 100.

A second anisotropic conductive adhesive layer 720 is interposed between the connecting substrate 600 and the lower substrate 200 to electrically connect the connecting substrate 600 and the lower substrate 200.

The first and second anisotropic conductive adhesive layers 710 and 720 may be, for example, ACF or ACA.

The connection substrate 600 is a flexible printed circuit board (FPCB) and is flexible. In addition, the connection substrate 600 is bent or curved to extend downward. In addition, the connection substrate 600 is disposed in the first open area 201 and the second open area 501. That is, the connection substrate 600 extends downward through the first open area 201 and the second open area 501.

The connection substrate 600 is electrically connected to a driving chip for processing a signal such as a touch input from the outside.

The connection substrate 600 includes a support layer 610, a first wiring layer 620, a second wiring layer 630, a first connection pad 640, a second connection pad 650, and a passivation layer 660. .

The support layer 610 supports the first wiring layer 620, the second wiring layer 630, and the passivation layer 660. The support layer 610 is an insulator, and examples of the material used as the support layer 610 include polyimide.

The first wiring layer 620 and the second wiring layer 630 face each other with the support layer 610 therebetween. The first wiring layer 620 and the second wiring layer 630 are electrically connected to the first connection pad 640 and the second connection pad 650, respectively.

The first connection pad 640 is integrally formed with the first wiring layer 620, and electrically connected to the first connection terminal or the second connection terminal 170 through the first anisotropic conductive adhesive layer 710. Is connected.

The second connection pad 650 is formed integrally with the second wiring layer 630, and the third connection terminal 260 or the fourth connection terminal 270 through the second anisotropic conductive adhesive layer 720. Is electrically connected).

Copper, aluminum, etc. are mentioned as an example of the material used for the said 1st wiring layer 620, the said 2nd wiring layer 630, the said 1st connection terminal 160, and the said 2nd connection terminal 170. FIG.

The connecting substrate 600 is interposed between the upper substrate 100 and the lower substrate 200, and is formed by the first anisotropic conductive adhesive layer 710 and the second anisotropic conductive adhesive layer 720. 100 is electrically connected to the lower substrate 200.

Accordingly, the touch panel according to the embodiment may prevent a short circuit between the connecting substrate 600 and the upper substrate 100 or between the connecting substrate 600 and the lower substrate 200. Thus, the touch panel according to the embodiment has improved reliability.

In addition, the connection substrate 600 is disposed in the first open area 201 and the second open area 501. Therefore, the touch panel according to the embodiment does not form a step on the side surface by the connection substrate 600.

Therefore, when the touch panel is inserted into a case or the like, the gap between the side surface of the touch panel and the inner surface of the case can be minimized and the intrusion of foreign matter can be reduced.

5 is a cross-sectional view illustrating a process of manufacturing a touch panel according to an embodiment.

Referring to FIG. 5, an ACF, a connecting substrate 600, and an ACF are sequentially stacked between the upper substrate 100 and the lower substrate 200.

Thereafter, a first pressing member 801 is disposed in the exposed area ER, and a second pressing member 802 is disposed on the upper substrate 100 in correspondence with the first pressing member 801. .

Thereafter, pressure is applied to the ACFs through the upper substrate 100 and the lower substrate 200 by the first pressing member 801 and the second pressing member 802.

In this case, the ACFs have conductivity in the vertical direction, and the upper substrate 100 and the connection substrate 600 are electrically connected, and the lower substrate 200 and the connection substrate 600 are also electrically connected.

By the first pressing member 801 passing through the second open region 501 of the support substrate 500, pressure may be easily applied to the ACFs, and the first anisotropic conductive adhesive layer 710 and the The conductivity of the second anisotropic conductive adhesive layer 720 is improved.

Therefore, the touch panel according to the embodiment prevents a short circuit and has improved reliability.

6 is an exploded perspective view showing a mobile phone set according to an embodiment.

Referring to FIG. 6, the cellular phone set includes a touch panel 10, a display module 20, and a case 30. The mobile phone set further includes a main board for driving the touch panel and the display module.

The touch panel 10 receives a signal such as an external touch and provides it to the main board. The touch panel 10 covers the display module 20 and is disposed inside the case 30.

The display module 20 displays an image by driving the main substrate. The display module 20 may include an LCD panel or an OLED panel.

The case 30 accommodates the touch panel 10 and the display module 20. In addition, the case 30 accommodates the main substrate.

Since the connection substrate 600 extends downward through the first open area and the second open area, a step is not formed on the side surface of the touch panel 10.

Accordingly, when the touch panel 10 is inserted into the case 30, the gap between the inner surface of the case 30 and the side surface of the touch panel 10 is minimized.

The mobile phone set according to the embodiment may prevent foreign matter from penetrating through the gap between the inner surface of the case 30 and the side surface of the touch panel 10.

Although the present embodiment has been described with respect to a mobile phone set including a touch panel, the present invention is not limited thereto and may be applied to various display sets such as PMP, DMB, and navigation including a touch panel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1 is an exploded perspective view illustrating a touch panel according to an embodiment.

2 is a plan view illustrating a rear surface of an upper substrate.

3 is a plan view illustrating an upper surface of a lower substrate.

4 is a cross-sectional view illustrating a cross section taken along line AA ′ in FIG. 1.

5 is a cross-sectional view illustrating a process of manufacturing a touch panel according to an embodiment.

6 is an exploded perspective view showing a mobile phone set according to an embodiment.

Claims (7)

A first substrate; A second substrate spaced apart from the first substrate and disposed under the first substrate; A connection substrate interposed between the first substrate and the second substrate and electrically connected to the first substrate and the second substrate; And A support substrate disposed below the second substrate and supporting the second substrate; A first open region is formed in the second substrate to expose a portion of the lower surface of the first substrate, And a second open area corresponding to the first open area and wider than the first open area. The touch input device of claim 1, wherein the first substrate and the second substrate are flexible, and the support substrate is rigid. The semiconductor device of claim 1, further comprising: a first conductive adhesive layer interposed between the first substrate and the connection substrate; And And a second conductive adhesive layer interposed between the second substrate and the connecting substrate. delete The method of claim 1, wherein the second open area exposes a portion of the lower surface of the second substrate, The touch substrate is disposed in the first open area and the second open area. A first substrate; A second substrate spaced apart from the first substrate and disposed under the first substrate; A connection substrate interposed between the first substrate and the second substrate and electrically connected to the first substrate and the second substrate; A support substrate disposed under the second substrate and supporting the second substrate; A first conductive adhesive layer interposed between the first substrate and the connecting substrate; And A second conductive adhesive layer interposed between the second substrate and the connecting substrate, The support substrate is formed with an open area exposing the lower surface of the second substrate, And the first conductive adhesive layer and the second conductive adhesive layer are disposed corresponding to the open area. The touch input device of claim 1, wherein the second substrate and the support substrate form a step with each other.

Images