CN1295782C

CN1295782C - Sintered heat radiator

Info

Publication number: CN1295782C
Application number: CNB011188693A
Authority: CN
Inventors: 蔡柏彬
Original assignee: Amulaire Thermal Tech Inc
Current assignee: Amulaire Thermal Tech Inc
Priority date: 2001-06-26
Filing date: 2001-06-26
Publication date: 2007-01-17
Anticipated expiration: 2021-06-26
Also published as: CN1393930A

Abstract

The present invention relates to a heat radiation fin formed in a sintering mode, which comprises a bottom seat sintered and formed by powder metallurgy, and a heat radiation fin body formed by bending metal sheets, wherein a plurality of grooves are arranged on the bottom seat at intervals; the heat radiation fin body is bent into continuous rectangles, so that a plurality of sheets in a hollow grid plate shape are formed. A groove arranged on the bottom of the heat radiation fin body is matched on the bottom seat; the bottom end of the middle part of the heat radiation fin body is clamped to the grooves of the bottom seat. The heat radiation fin body is clamped by the characteristic that the bottom seat shrinks to reduce the gaps of the grooves when sintered; or the bottom seat and the heat radiation fin body are made of the same metal, and are sintered into a whole. The heat radiation fin has optimal heat conduction efficiency.

Description

Utilize the fin of sintering processing moulding

Technical field

The invention relates to a kind of fin that utilizes the sintering processing moulding, refer to a kind of preferable heat conduction efficiency that obtains especially, can bring into play the fin of big heat-sinking capability.

Background technology

Computer industry develops rapidly in recent years, caloric value as electronic heating components such as microprocessor chips is more and more high, and size is more and more little, for this intensive heat effectively being distributed the environment outside system, operate under permissive temperature to keep assembly, usually be additional on the electronic heating component surface to have the larger area fin, increase heat-sinking capability.

The traditional fin of Fig. 1-Figure 2 shows that, comprise that a base 10a and a heat radiation lamellar body 20a form, base 10a is a plate body made from copper product, heat radiation lamellar body 20a is a thin slice body made from copper product, it is to be bent into continuous rectangle and to form most sheet hollow grating forms, can utilize heat-conducting glue 30a gummed (as Fig. 2) or scolding tin to be fixedly welded on the base 10a heat radiation lamellar body 20a, form a fin, this fin can be installed on the electronic heating component such as microprocessor chip, can be in order to assist the electronic heating component heat radiation.Its major defect is:

Having the interface thermal resistance between the base 10a of traditional fin and the heat radiation lamellar body 20a produces, therefore the heat of electronic heating component generation often can't upwards conduct to heat radiation lamellar body 20a via base 10a smoothly, so heat conduction efficiency is lower, can't bring into play big heat-sinking capability.

At above-mentioned defective, the inventor is that the spy concentrates on studies and cooperates the utilization of scientific principle, proposes a kind of reasonable in designly finally, and effectively improves the technical scheme of the present invention of above-mentioned disappearance.

Summary of the invention

Main purpose of the present invention is to provide a kind of fin that utilizes the sintering processing moulding, its base is engaged between the lamellar body with heat radiation, and be combined as a whole with sintering processing, not having the interface thermal resistance between base and the heat radiation lamellar body produces, the heat that electronic heating component is produced can upwards conduct to the heat radiation lamellar body via base smoothly, have larger area heat radiation lamellar body assistance heat radiation so that utilize, reach preferable heat conduction efficiency, the purpose of the big heat-sinking capability of performance.

The object of the present invention is achieved like this: a kind of fin that utilizes the sintering processing moulding, comprise base and heat radiation lamellar body, and it is characterized in that: this base is to utilize powder metallurgy sintered mode moulding, is interval with most grooves on it; This heat radiation lamellar body is to be bent into continuous rectangle and to form most sheet hollow grating forms, this heat radiation lamellar body is made up of most top, pars intermedia and the bottoms that join continuously, the bottom of this heat radiation lamellar body is provided with a groove, the groove fit of this heat radiation lamellar body is on this base, the pars intermedia bottom of this heat radiation lamellar body is sticked in the groove of base, shrink the lamellar body that to dispel the heat by the base sintering and clamp, heat radiation lamellar body and base are combined as a whole.

This base and heat radiation lamellar body are made with copper or aluminium.The top of this heat radiation lamellar body also is provided with a groove.This base is identical metal with the heat radiation lamellar body, further is sintered to integrative-structure.

Theme advantage of the present invention is not have the interface thermal resistance between base and the heat radiation lamellar body to produce, the heat that electronic heating component is produced can upwards conduct to the heat radiation lamellar body via base smoothly, so that utilize and have larger area heat radiation lamellar body assistance heat radiation, has preferable heat conduction efficiency, the effect of the big heat-sinking capability of performance.

Further specify below in conjunction with preferred embodiment and accompanying drawing.

Description of drawings

Fig. 1 is the solid combination schematic diagram of traditional heat-dissipating sheet.

Fig. 2 is the A portion enlarged diagram of Fig. 1.

Fig. 3 is a perspective exploded view of the present invention.

Fig. 4 is a three-dimensional combination schematic diagram of the present invention.

Fig. 5 is a combination cross-sectional schematic of the present invention.

Fig. 6 is the A-A cross-sectional schematic of Fig. 5.

Fig. 7 is the enlarged diagram of the part of base of the present invention and groove.

Fig. 8 is the schematic diagram of assembling flow path of the present invention.

Fig. 9 is the solid combination schematic diagram of embodiments of the invention 2.

Embodiment

Embodiment 1

Consult Fig. 3-Fig. 8, the present invention provides a kind of fin that utilizes the sintering processing moulding, include a base 10 and one the heat radiation lamellar body 20 form, base 10 wherein is one made with the good material of thermal conductivity such as copper or aluminium, it is to utilize powder metallurgy sintered mode moulding, this base 10 is to be a square plate body, and the shape of this base 10 also can be done different variations according to need certainly, equidistantly is interval with most grooves 11 on this base 10.

Heat radiation lamellar body 20 is one with the made sheet metal of the good material of thermal conductivity such as copper or aluminium, this heat radiation lamellar body 20 is to be bent into continuous rectangle and to form most sheet hollow grating forms, have than large tracts of land, this heat radiation lamellar body 20 is one by most the tops 21 that join continuously, the square body that pars intermedia 22 and bottom 23 are formed, this top 21 and bottom 23 are parallel shape, top 21 and bottom 23 are connected to the relative both sides in top and bottom of pars intermedia 22, the bottom 23 of this heat radiation lamellar body 20 is milled and is provided with a groove 24, setting by this groove 24, can make pars intermedia 22 bottoms of heat radiation lamellar body 20 see through groove 24 and reveal, these pars intermedia 22 bottoms are corresponding with the groove 11 of base 10.

After base 10 and heat radiation lamellar body 20 are formed separately, can give in conjunction with (consulting Fig. 8 simultaneously), be that will the dispel the heat groove 24 of lamellar body 20 is matched with on the base 10, and pars intermedia 22 bottoms that make this heat radiation lamellar body 20 are sticked in the groove 11 of base 10, heat radiation lamellar body 20 and base 10 are fastened togather, then will dispel the heat lamellar body 20 and base 10 carries out the sintering program, shrinkable characteristic when utilizing base 10 sintering, the gap of groove 11 is dwindled and lamellar body 20 clampings of will dispelling the heat, heat radiation lamellar body 20 and base 10 are combined as a whole, if base 10 is identical metal with heat radiation lamellar body 20, then more can further be sintered to one; Form the fin that utilizes the sintering processing moulding of the present invention by above-mentioned composition.

Embodiment 2

Consult Fig. 9, a groove 25 is established at the top 21 of heat radiation lamellar body 20 of the present invention also millable, by the setting of this groove 25, can be convenient to install a radiator fan (figure slightly).

Fin of the present invention can be installed on the electronic heating element such as microprocessor chip, can be in order to assist the electronic heating component heat radiation.Owing to engaged between base 10 and the lamellar body 20 that dispels the heat, shrinkable characteristic when utilizing base 10 sintering, the gap of groove 11 is dwindled and lamellar body 20 clampings of will dispelling the heat, and heat radiation lamellar body 20 and base 10 are combined as a whole, if base 10 is identical metal with heat radiation lamellar body 20, then more can further be sintered to one, not having the interface thermal resistance between base 10 and the heat radiation lamellar body 20 produces, therefore the heat of electronic heating component generation can upwards conduct to heat radiation lamellar body 20 via base 10 smoothly, so that utilize and have the 20 assistance heat radiations of larger area heat radiation lamellar body, so can have preferable heat conduction efficiency, with the big heat-sinking capability of performance.

The present invention also can use aluminium backing and copper radiating rib body, or the base of other different materials and heat radiation lamellar body, the characteristic that the aluminium groove shrinks when utilizing sintering, and the copper radiating rib body is clamped, and both are combined as a whole.This kind structure has only mechanical bond but not sintering, and needs lower than the fusing point of the material of heat radiation lamellar body if the material of base and heat radiation lamellar body when inequality, is used for the fusing point of the material of base.

In sum; the present invention can improve the base of traditional heat-dissipating sheet and the problem that heat radiation has the interface thermal resistance between the lamellar body really; the heat that electronic heating component is produced outwards conducts to the heat radiation lamellar body via base smoothly; heat conduction efficiency is higher; the big heat-sinking capabilities of performance etc. have novelty and creativeness, and the above only is preferred embodiment of the present invention; the equivalence techniques that all utilizations specification of the present invention and graphic content are done changes, and all is contained within protection scope of the present invention.

Claims

1, a kind of fin that utilizes the sintering processing moulding comprises base and heat radiation lamellar body, and it is characterized in that: this base is to utilize powder metallurgy sintered mode moulding, is interval with most grooves on it; This heat radiation lamellar body is to be bent into continuous rectangle and to form most sheet hollow grating forms, this heat radiation lamellar body is made up of most top, pars intermedia and the bottoms that join continuously, the bottom of this heat radiation lamellar body is provided with a groove, the groove fit of this heat radiation lamellar body is on this base, the pars intermedia bottom of this heat radiation lamellar body is sticked in the groove of base, and heat radiation lamellar body and base are one through sinter bonded.

2, the fin that utilizes the sintering processing moulding according to claim 1 is characterized in that: this base and heat radiation lamellar body are made with copper or aluminium.

3, the fin that utilizes the sintering processing moulding according to claim 1, it is characterized in that: the top of this heat radiation lamellar body also is provided with a groove.

4, the fin that utilizes the sintering processing moulding according to claim 1 is characterized in that: this base is identical metal with the heat radiation lamellar body.