CN1225788C - Heating electronic component radiator bound by binding column - Google Patents
Heating electronic component radiator bound by binding column Download PDFInfo
- Publication number
- CN1225788C CN1225788C CN 99125168 CN99125168A CN1225788C CN 1225788 C CN1225788 C CN 1225788C CN 99125168 CN99125168 CN 99125168 CN 99125168 A CN99125168 A CN 99125168A CN 1225788 C CN1225788 C CN 1225788C
- Authority
- CN
- China
- Prior art keywords
- column
- pedestal
- substrate
- circuit board
- location hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The present invention relates to a heat radiator of a heating electronic element, and provides a heat radiator with simple structure, convenient manufacture and good heat radiating effect, wherein the heat radiator is formed by combining combination columns. The heat radiator comprises a base and a base plate provided with a fan wheel. A plurality of heat radiating columns are upwards and convexly arranged on the base. The combination columns are downwards and convexly arranged on the upper bottom surface of the base plate. The terminals of the combination columns form buckle bodies provided with axial and elastic cutting grooves. The bottom surface of the base is attached to a heating electronic element on a circuit board. The combination columns of the base plates and the buckle bodies at the terminals of the combination columns are combined with positioning holes of the circuit board, and are buckled and positioned on the bottom side of the circuit board.
Description
Technical field
The invention belongs to the electronic component accessory, particularly a kind of heating electronic component radiator with the column combination.
Background technology
The radiator system of the heat-generating electronic elements of commonly using is by fin, fan, outstanding firmware and fastener.Outstanding firmware is located between fin and the fan, so that fan is fixed on the fin, and makes and keeps the gap between the two, and fastener then screws togather fin and is fastened on the central processing unit, so that radiator is in conjunction with being fixed on the central processing unit.The radiator of this structure, constitutional detail is many, make trouble.
Summary of the invention
The heating electronic component radiator that the purpose of this invention is to provide a kind of simple in structure, easily manufactured, good heat dissipation effect with the column combination.
The present invention includes pedestal and substrate.Pedestal system is made by heat-conducting, is convexly equipped with plural thermal column on it up; Substrate is provided with impeller, its bottom surface be convexly equipped with down with circuit board on the corresponding column of location hole, the column terminal forms the button of tool axial elasticity grooving, and outside column, be arranged with flexible member, the two ends difference contact of flexible member is on pedestal and substrate, substrate is produced the elastic acting force away from pedestal; Heat-generating electronic elements amplexiforms on base bottom surface and the circuit board, combines and snaps into position circuit board bottom side on the button of column and terminal thereof and the positioning holes on circuit board on the substrate.
Wherein:
The heat radiation band of column is located at the pedestal periphery on the pedestal, forms the spatial accommodation of impeller on the ccontaining substrate between thermal column.
Pedestal be provided with circuit board on the location hole corresponding positioning hole; Column combines with location hole on pedestal and the circuit board on the substrate, and the button snaps into position of its terminal is in the circuit board bottom side.
The area of substrate is corresponding with the area of pedestal; The thermal column on pedestal two symmetrical limits forms lower height, and the thermal column on two symmetrical limits forms high height in addition; Substrate is held on the top substrate of lower height thermal column and shelves, and its biside plate leans the location by the high height thermal column.
Substrate area is greater than the pedestal area; Substrate is held on pedestal thermal column top, and column directly combines with location hole on the circuit board on it.
Substrate area is greater than the pedestal area; Pedestal is convexly equipped with otic placode outwardly, in otic placode be provided with circuit board on column corresponding positioning hole on location hole and the substrate; Substrate is held on pedestal thermal column top, on it on column and the pedestal otic placode on location hole and the circuit board location hole combine.
Owing to the present invention includes pedestal and be provided with the substrate of impeller, be convexly equipped with plural thermal column on the pedestal up; The substrate upper bottom surface is convexly equipped with column down, and the column terminal forms the button of tool axial elasticity grooving, and is arranged with flexible member outside column, and the two ends difference contact of flexible member is on pedestal and substrate, substrate is produced the elastic acting force away from pedestal; Heat-generating electronic elements amplexiforms on base bottom surface and the circuit board, combines and snaps into position circuit board bottom side on the button of column and terminal thereof and the positioning holes on circuit board on the substrate.During assembling, base bottom surface is amplexiformed the circuit board heat-generating electronic elements, substrate places the pedestal top, and combines with the circuit board buckle by the column on the substrate, and is not only simple in structure, easily manufactured, and radiating effect, thereby reaches purpose of the present invention.
Description of drawings
Fig. 1, for decomposition texture schematic isometric of the present invention.
Fig. 2, for structural representation vertical view of the present invention.
Fig. 3, be A-A cutaway view among Fig. 2.
Fig. 4, be A-A cutaway view among Fig. 2 (column directly combines with circuit board on the substrate).
Fig. 5, for decomposition texture schematic isometric of the present invention (column combines with otic placode and circuit board on the substrate).
Fig. 6, for structural representation cutaway view of the present invention (column combines with otic placode and circuit board on the substrate).
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, the present invention includes pedestal 1 and substrate 2.
Pedestal 1 is the plate body of being made by the good metal material of heat conduction, which is provided with circuit board 3 on location hole 31 corresponding positioning hole 11; Its end face extends plural thermal column 12 up, and 12 of adjacent thermal columns are provided with the passage 13 that air can be circulated, and thermal column 12 can encircle and be located at pedestal 1 periphery, so that central part forms spatial accommodation 14.Wherein the thermal column 12 on two symmetrical limits forms lower height, and the thermal column 12 ' on two symmetrical limits forms high height in addition.
The area of substrate 2 is corresponding with the area of pedestal 1, which is provided with the impeller 21 that can be driven in rotation.This impeller 21 can sink and be located at substrate 2 bottom sides.Substrate 2 bottom surfaces be convexly equipped with down with circuit board 3 and pedestal 1 on location hole 31,11 corresponding columns 22, form the button 23 of tool axial elasticity grooving 25 in 22 end of column terminal.Outside column 22, be arranged with flexible member 24.
Also can be as shown in Figure 4, the area of substrate 2 is greater than the area of pedestal 1, and the column 22 that its bottom surface is convexly equipped with down is corresponding with location hole 31 on the circuit board 3.
Also can be as Fig. 5, shown in Figure 6, the area of substrate 2 is greater than the area of pedestal 1, pedestal 1 is convexly equipped with otic placode 15 outwardly, in otic placode 15 be provided with circuit board 3 on column 22 corresponding positioning hole 11 on location hole 31 and the substrate 2.
As Fig. 2, shown in Figure 3, substrate 2 is mounted on the pedestal 1, impeller 21 heavy being located in the spatial accommodation 14 of pedestal 1 end face central part on it, so that substrate 2 with less height and preferred positioning are arranged after pedestal 1 combines, substrate is held on the top than low heat emission post 12, and the dual-side that the highly higher thermal column 12 ' on two symmetrical limits in addition can lean substrate 2 becomes the location.Pedestal 1 is close on the heat-generating electronic elements 32 that is assembled on the circuit board 3 with its bottom surface; Column 22 combines with location hole 11,31 on pedestal 1 and the circuit board 3 on the substrate 2.Also can be as shown in Figure 4, substrate 2 is held on pedestal 1 thermal column 12 tops, and column 22 directly combines with location hole 31 on the circuit board 3 on it.Also can be as Fig. 5, shown in Figure 6, substrate 2 is held on pedestal 1 thermal column 12 tops, on it on column 22 and pedestal 1 otic placode 15 on location hole 11 and the circuit board 3 location hole 31 combine.Button 23 has by elasticity grooving 25 to open and closes elasticity on substrate 2 columns 22.When button 23 closures, can pass through by the location hole on pedestal 1 and the circuit board 3 11,31; When button 23 opens, can be buckled in circuit board 3 bottom sides, the present invention firmly is fastened on the circuit board 3 by the column 22 of substrate 2, and is close on the heat-generating electronic elements 32.Flexible member 24 is sheathed on the column 22.As shown in Figure 3, its two ends difference contact is on pedestal 1 and substrate 2, with the elastic acting force that substrate 2 is produced away from pedestal 1.Also can be as shown in Figure 4, flexible member 24 two ends difference contact is on substrate 2 and circuit board 3.Also can be as shown in Figure 6, flexible member 24 two ends difference contact is on pedestal 1 otic placode 15 and substrate 2.
The present invention can make things convenient for circuit board and combines, and makes the pedestal of radiator fix and fit tightly on heat-generating electronic elements, so that heat-generating electronic elements obtains best radiating effect.
Claims (6)
1, a kind of heating electronic component radiator with the column combination, it comprises the substrate (2) that is provided with impeller (21); It is characterized in that it also comprises pedestal (1); Pedestal system is made by heat-conducting, is convexly equipped with plural thermal column on it up; Heavy substrate (2) bottom side that is located at of impeller (21), substrate (2) bottom surface is convexly equipped with down with circuit board (3) and goes up the corresponding column of location hole (22), column (22) terminal forms the button (23) of elasticity grooving, and outside column, be arranged with flexible member (24), the two ends difference contact of flexible member (24) is on pedestal and substrate, substrate is produced the elastic acting force away from pedestal; Pedestal (1) bottom surface and circuit board (3) are gone up heat-generating electronic elements (32) and are amplexiformed, and combine also snaps into position circuit board (3) bottom side on the button of column and terminal thereof and the positioning holes on circuit board on the substrate.
2, the heating electronic component radiator with the column combination according to claim 1 is characterized in that the heat radiation band of column is located at the pedestal periphery on the described pedestal, forms the spatial accommodation of impeller on the ccontaining substrate between thermal column.
3, the heating electronic component radiator with the column combination according to claim 1 and 2, it is characterized in that described pedestal be provided with circuit board on the location hole corresponding positioning hole; Column combines with location hole on pedestal and the circuit board on the substrate, and the button snaps into position of its terminal is in the circuit board bottom side.
4, the heating electronic component radiator with the column combination according to claim 3 is characterized in that the area of described substrate is corresponding with the area of pedestal; The thermal column on pedestal two symmetrical limits forms lower height, and the thermal column on two symmetrical limits forms high height in addition; Substrate is held on the top of lower height thermal column, and the biside plate of described substrate leans the location by the high height thermal column.
5, the heating electronic component radiator with the column combination according to claim 1 and 2 is characterized in that described substrate area is greater than the pedestal area; Substrate is held on pedestal thermal column top, and column directly combines with location hole on the circuit board on it.
6, the heating electronic component radiator with the column combination according to claim 1 and 2 is characterized in that described substrate area is greater than the pedestal area; Pedestal is convexly equipped with otic placode outwardly, in otic placode be provided with circuit board on column corresponding positioning hole on location hole and the substrate; Substrate is held on pedestal thermal column top, on it on column and the pedestal otic placode on location hole and the circuit board location hole combine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99125168 CN1225788C (en) | 1999-11-26 | 1999-11-26 | Heating electronic component radiator bound by binding column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99125168 CN1225788C (en) | 1999-11-26 | 1999-11-26 | Heating electronic component radiator bound by binding column |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1298277A CN1298277A (en) | 2001-06-06 |
| CN1225788C true CN1225788C (en) | 2005-11-02 |
Family
ID=5283769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99125168 Expired - Fee Related CN1225788C (en) | 1999-11-26 | 1999-11-26 | Heating electronic component radiator bound by binding column |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1225788C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307716C (en) * | 2002-12-06 | 2007-03-28 | 诺亚公司 | Multidirectional liquid storage slot heat conducting apparatus and method |
| CN1329179C (en) * | 2004-07-12 | 2007-08-01 | 英华达股份有限公司 | Hot pressing method for binding post |
-
1999
- 1999-11-26 CN CN 99125168 patent/CN1225788C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1298277A (en) | 2001-06-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051102 Termination date: 20131126 |