The explanation of best mode of the present invention
In Fig. 1, chemical cleaning method groove or container 11 are equipped with a kind of first selected treatment fluid 13, and this first treatment fluid 13 is prepared under the chosen temperature in bath temperature scope T (bathe temperature)=10~90 ℃, selectively heats with a reservoir heater 15.(the first) treatment fluid 13 can be deionization (DI) water or certain other appropriate solution.First liquid 13 is inertia preferably, and preferably has than higher surface tension.DI water surface tension (under the room temperature) is about 80 dyne/cm, and it can be worked well herein.IPA has lower surface tension 17.6 dyne/cm, and it also can be worked herein well.One or more workpiece 17A, 17B, 17C immersed fully or sink in the liquid 13 a selected time interval, time range is △ t=1-600 second.Alternatively, will not immerse in first treatment fluid by workpiece.First liquid 13 selectively stands the ultrasonic vibration effect, ultrasonic vibration is produced by one or more ultrasonic transducer 19A, 19B, this ultrasonic transducer 19A, 18B are positioned in the outer wall place or inwall place or diapire of groove 11, perhaps are positioned at the inside of first liquid 13 itself.The frequency of ultrasonic vibration is preferably in the scope between 20kHz to 750kHz, but if desired can be higher.Can produce a ultrasonic frequency sequence from the ultrasonic transducer that NeW Ultrasonics has bought, comprising 40,72,104 and 136kHz.Other ultrasonic transducers can produce higher ultrasonic frequency, and some device also can produce the low ultrasonic frequency that reaches 20kHz.
Workpiece 17A, 17B, 17C are upwards pulled out from first treatment fluid 13, and the exposing surface of workpiece is sprayed a slice second treatment fluid (not being clearly shown that) in Fig. 1, so that reach the dry and/or purification of workpiece fast.Second liquid preferably comprises a kind of fluorohydrocarbon (methyl nine fluorine butyl ether or MSX 4518s, for ease of reference, regard them as HFE herein), or a kind of ethylating fluorohydrocarbon (eth-HFE), they can be bought as HFE-7100 or HFE-7200 from 3M Company, or as fluorohydrocarbon or ethylization fluorohydrocarbon and one or both other chemicals such as anti-form-1,2-dichloroethylene, H
2Cl C-CClH
2The mixture of (producing the azeotropic mixture of a kind of HFE) or other halogen-containing alkene is bought.Fluorohydrocarbon has a kind of chemical composition, it or
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12(general molecular formula) or the mixture of these compositions.4 among these are formed respectively shown in Fig. 2 A-2D, and two marks that seemingly provide together near 100% in these 4 compositions.The freezing point of HFE and boiling point are about T=-135 ℃ and T=60 ℃ respectively.HFE has density and surface tension is respectively 1.52gm/cm
3With 13.6 dyne/cm.It is 38 ℃-Yue 80 ℃ that other HFE prescriptions have boiling spread.By contrast, isopropyl alcohol (IPA) and glassware for drinking water have surface tension to be about 17.6 dyne/cm and 80 dyne/cm respectively.Therefore, when workpiece being pulled out from purification tank or spray second kind of liquid, HFE can replace the liquid substance that IPA, water and other surface tension of great majority are suitable for from surface of the work.Second kind of liquid can be used as common liq to be provided, or provides as steam, cigarette, " mist " or other suitable liquid form (collective be called second " liquid) herein, but the common liq form is preferred.
Eth-HFE has a kind of chemical composition, that is or
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12(general molecular formula) or the mixture of these compositions.As if these form wherein 4 compositions respectively shown in Figure 1A-1D, and these 16 compositions wherein first are in the same place with the 6th composition, and the mark near 100% is provided.
The tractive workpiece pass second liquid or the linear speed that workpiece is pulled out from second liquid preferably in the 0.5-10cm/sec scope, but can be slightly soon or slow slightly, and when immersing workpiece, second liquid selectively stands ultrasonic vibration.The molecular weight of HFE and eth-HFE is about 364 and 378 respectively, molecular weight (18 than water, 364/18=20.2>>1 simultaneously) or isopropyl alcohol molecular weight (60) much higher, therefore, when tractive workpiece and is passed second liquid, the higher density of second liquid and than low surface tension make this liquid can: (1) is easy to from any drop with high surfaces tension parameters of surface of the work displacement; The surface of (2) downwards workpiece (part) being exposed moves into the first-the second liquid and mixes below.If the employing ultrasonic vibration, after then workpiece shifted out from second liquid, surface of the work was at the 30sec inner drying; And if without ultrasonic vibration, after then workpiece shifts out from second liquid, long-time slightly as 30-45sec in the surface of the work drying.In this way, by removing the residue of exposing surface, also purified workpiece.
When second liquid remains on (comprising HFE or eth-HFE) following time of temperature of 10 ℃≤T≤80 ℃ scope, concerning the jar with the liquid surface that normally exposes, because volatilization, losing this liquid at the most is several ml/min.Second liquid can be extracted out from container 11, passes filter 21 and returns in its container, so that remove residue and make the recirculation of second liquid, is used for dry and/or purify and use.
Fig. 3 is a flow chart, and it illustrates and is used to implement one of them embodiment of proper operation formality of the present invention.In step 31, in a workpiece (electronic unit) immersed one fully (preferably inertia) first treatment fluid, as deionization (DI) water or IPA, under T=10-90 ℃ of scope chosen temperature, immerse time interval scope (selectively) and be chosen to be △ t=0-600sec.In step 33, to most of or whole immersion time interval wherein, first liquid selectively stands ultrasonic fluctuation under the one or more selected ultrasonic frequency in the 20-750kHz scope.In step 35, after finishing the time interval of immersion, preferably under the linear pulling rate between the 0.5-5cm/min and preferably in toilet or inert environments, workpiece is slowly pulled out from the first treatment fluid purification tank.In step 37, be transported to selected second treatment fluid such as HFE or eth-HFE on the surface that workpiece exposes and dispose.In step 39 (selectively), with selected liquid filtering, or purify in addition and return in this container, or turn back in another container, in another chemical cleaning method groove, re-using.Operating performance shown in Figure 2 will provide the purification of certain workpiece, and after in revealing HFE or eth-HFE, will make workpiece drying (entire method is 1-60sec) within the 1-30sec being no more than usually.If only wish the workpiece drying, then step 33 can be saved.
The conveying of second liquid can be by being sprayed onto second liquid on the exposing surface of workpiece in the step 37, for example, and as delegation or a spraying liquid; Or by a fluid supply this fluid drips is flow on wherein one or more surfaces and to carry out, this fluid supply be positioned at workpiece top, its side or near.
Fig. 4 A-4F illustrates a kind of suitable method, supply to utilize HFE or eth-HFE in electronic unit sheet drying and purification, and it is wherein most of or whole to recycle this liquid.In Fig. 4 A and 4B, utilize one or more workpiece arm 43A and 43B, with one or (preferably) many workpiece 41, pick up as semiconductor chip, printed circuit board (PCB) etc., and these workpiece are positioned in first groove or jars 45, this first groove or jars 45 is at open-top, and in its bottom one scavenge port 47 arranged.Preferably, originally this groove adorns deionization (DI) water 49, and preferably under the temperature of 10-90 ℃ of scope, and workpiece 41 immerses in the DI water fully.Preferably, DI water installs to the top of first groove 45, and overflow a little from this first groove 45, so that remove the accumulation that makes undesired material in the DI water and reduce to minimum by overflowing.Alternatively, workpiece arm 43A and 43B can be with temporarily catching also one or more vacuum cups (preferably) or the disk or the adhesive disc replacement of holding workpiece 41.
In Fig. 4 C, second groove or jar 51 are equipped with second liquid 50 (as HFE or eth-HFE or their azeotropic mixture), this groove or jars 51 preferably remains under the pressure P between the 10-100psi with respect to surrounding environment, and remain under the temperature range of 10-80 ℃ (to eth-HFE) or 10-60 ℃ (to HFE), above-mentioned second groove or jars 51 be positioned at first groove 41 top, side or near.
Second groove 51 is connected on one, two or the polylith thin plate 53, and thin plate 53 wherein has slot or other suitable hole 55 (shown in the side view of Fig. 5).Hole 55 so is orientated, and allows second liquid 50 of pressurization when flowing out from second groove 51 with box lunch, and this second liquid ejects (atomizing or not atomizing) with level of approximation, vertical or oblique mode from these holes.Any object that is positioned at 55 fronts, hole all will be covered from liquid, steam or the mist jet of second liquid 50 or with method for distinguishing.
Alternatively, second groove 51 can be positioned at the top of first groove 41, and when workpiece immerses from first liquid bath, second liquid can drip to the exposing surface of workpiece, note simultaneously, be transported to second liquid volume of workpiece exposing surface, before second liquid flows out these surfaces, enough cover these surfaces.
HFE liquid has specific density and is about 1.52 gm/cm
3, it is than specific density (the ≈ 1.0gm/cm of DI water
3) recuperation is many, HFE is a kind of more nonpolar molecule (comparing with the hydrone of height polarity), and surface tension 13.6 dyne/cm of HFE is than surface tension (≈ 80 dyne/cm) much smaller of water.Ethylating HFE has high slightly specific density.Because these difference, so if in Fig. 3 C with HFE or eth-HFE as second liquid 50, the bottom that most of HFE of falling into first liquid 49 or eth-HFE are sunk to first groove 45 (mixing) liquid the most at last.This part HFE that passes through along first liquid bath top workpiece 41 exposing surfaces or the surface that eth-HFE can purify and/or dry workpiece exposes.
In Fig. 4 D and 4E, utilize one or more " propeller " arm 53 now, in first liquid, workpiece 31 is upwards pushed away.When workpiece 41 nearly half is positioned at the top of the first liquid upper surface time, clamp workpiece with workpiece arm 43A and 43B (or vacuum cup or disk or adhesive disc), and, first liquid 49 of workpiece from first groove 45 is slowly upwards drawn with the preferred linear velocity in the 0.5-10cm/sec scope.Along with workpiece 41 moves up, it passes a zone, and workpiece is subjected to from slot 55 second liquid 50 (by injection, drip or other suitable carrying method) conveying effect thereon herein.Since the surface tension of second liquid such as HFE or eth-HFE than first liquid (such as, DI water or IPA) surface tension much smaller, so second liquid will be replaced first liquid on workpiece 41 surfaces.The also very easy volatilization of HFE (or eth-HFE) and similar second liquid, they have lower heat of evaporation (HFE and eth-HFE are about 30 card/grams) and high vapour pressure (about 195mmHg post), any part second liquid of therefore replacing first liquid on the surface of the work will finally volatilize, and the therefore adjacent part of rapid draing workpiece 41 exposing surfaces.In Fig. 4 F, will pull out first liquid of workpiece 41 in first groove 45 fully.
Second liquid (HFE or eth-HFE) that surface evaporation most of or that all do not expose from workpiece 41 will fall into first liquid, and the bottom of first groove that will sink reaches at this place and collects, can utilize the base apertures of first groove to shift out this (mainly being second) liquid herein, be used for the recirculation of second liquid.If the residing surrounding environment of the device shown in Fig. 4 A-4F is for example used dry and cold N
2Or CO keeps dry it and inertia, and then this part second liquid from the surface of the work evaporation can also reclaim, recycles and use.Even environment is not dry and inertia around, using is possible also again.
Fig. 6 illustrates for utilizing second liquid to come the suitable configurations of the device of dry and purification electronic component.Two hollow cylinder 61A and 61B are provided with under the approximately parallel situation of their longitudinal axis.Wherein each all has one or more machine-direction oriented slot 63A and 63B respectively for cylinder 61A and 61B, and wherein well width h is preferably in the 0.02-0.5mm scope.Each cylinder 61A and 61B are connected on the source 65 of the HFE of supercharging or eth-HFE or other suitable second liquid.If this pressure is enough high, then force second liquid to pass slot, and form a thin slice or spray 67, and these spray are a slice or the covering of the fan shape of cylinder, and they and the workpiece between slot 63A and 63B 69 collide and cover this workpiece 69.HFE or eth-HFE or other second suitable liquid, when from slot, penetrating, can moderately heat (such as, be heated to 30-50 ℃ of T ≈), during with the surface collision of convenient second liquid and workpiece 69, second liquid will evaporate quickly, thereby make the workpiece drying.If spray velocity is enough big, then HFE or eth-HFE can also remove undesired residue from that part of exposing surface of workpiece 69, thereby have purified this workpiece 69.Hollow cylinder 61A and 61B preferably utilize a mechanical rotary device 71, with the angular velocity omega in the per second 2 π-100 π radian scope, around their longitudinal axis separately, with equidirectional or rightabout rotation.
Azeotropic mixture liquid with HFE or eth-HFE or HFE, purify the surface of workpiece according to the aforementioned operation formality, as if removed the contaminant particle of most of or whole particle diameters, as at present desired to the method for decontaminating surfaces that is used for semiconductor, optics and electronic equipment surface greater than about 0.1 μ m.In test according to the aforementioned operation formality, to observe after from first liquid, taking out workpiece, surface of the work becomes dry at once, so the drying of surface of the work is almost carried out simultaneously with purifying.
According to the product specification that development person provided of the HFE of 3M company, HFE and eth-HFE wherein every kind all be scheduled to as used chlorofluorocarbon class (CFCs) and the non toxic alternative of similar chemicals in the various application over nearly 30 years.HFE surpasses 100 at acute deadly inhaled concentration, under the 000ppm situation, is nontoxic basically.HFE does not incorporate noxious material one class now into.Yet the mixture of HFE and other chemicals may be more active.For example, the HFE azeotropic mixture is volatile, and the HFE azeotropic mixture is discharged into and may requires to abide by the hazardous waste regulation in the water source.Eth-HFE is not also issued respective digital.
DI water and HFE or eth-HFE the two one of be easy to form the liquid/liquid binary system that contains spiece and (for example, contain 20ppm HFE in the DI water; Contain 90ppm DI water among the HFE), this part is high polarity and HFE or the lower polarity of eth-HFE owing to water, reaches the difference of molecular weight between them.Therefore, HFE or eth-HFE are easy to divide with the liquid of DI water or any other inertia, light, high polarity such as IPA and open, be used for filtering and again with or be used to handle HFE or eth-HFE.
Method of the present invention has 3 or 4 arid regions, goes out illustrated in go up on workpiece 81 surfaces as shown in Figure 7.Along with workpiece is pulled out from first liquid, bottom section 81A still is immersed in first liquid.Second area 81 adjacent bottom zone 81A, it has risen to the top of first liquid, but the particulate of air and/or treat liquid is arranged from the teeth outwards.The 3rd regional 81C adjacent second zone territory 81B; it has second liquid that is transported to this zone by spraying or drip; and second liquid forms the fluid sheet (gas particles of liquid and/or atomizing) of one second liquid; it mixes with the air and/or the treat liquid particulate that stay on the surface of exposing, and replaces them.In the 4th regional 81D of contiguous the 3rd regional 81C, the thin fluid sheet of second liquid volatilizees in 30 sec or shorter time usually, stays dry surface of the work simultaneously in this zone.If desired, the surface that can expose by treatment fluid in jar forms the second liquid fluid sheet above slightly, eliminates second area 81B.
Be used to implement another kind of operating performance of the present invention shown in Fig. 8 A-8C.In Fig. 8 A, will be just from first treatment fluid (such as, DI water or IPA, do not show) the middle workpiece 91 that takes out, second treatment fluid 95 is equipped with in immersion, in the jar 93 as the azeotropic mixture of HFE or eth-HFE or HFE, this second treatment fluid 95 is heated to the temperature (general) that is lower than its boiling point to 60-80 ℃ of HFE T ≈.Workpiece 91 is immersed the time interval that second liquid 95 1 is selected, preferably in the 5-120sec scope, perhaps immerse the longer time if desired.To MIN a part of Immersion time (such as, bottom line 5-10sec) at interval, make workpiece 91 stand the ultrasonic vibration effect, this ultrasonic vibration is produced by the supersonic generator 97 that is arranged on jar 93 inside or outside and contiguous jar 93.Lip-deep material residue, air and first liquid that ultrasonic vibration helps second liquid, the 95 displacement workpiece 91 of low surface tension to expose.Immersing after the time interval finishes, shown in Fig. 8 B, be the linear pulling rate of 0.5-10cm/sec with the preferable range, workpiece 91 is drawn in an in check environment from second liquid 95, as vacuum, clean room or mainly contain N
2Or in the environment of CO.Pull out (Fig. 8 C) fully afterwards at workpiece, stay any second liquid on workpiece 91 exposing surfaces, all after pulling out workpiece, volatilize in the 1-30sec usually from second liquid 95.
As shown in Figure 9, can be between two supercharging device 103A and 103B vertically (on the vector V direction) workpiece 101 is pulled out, supercharging device 103A, 103B have machine-direction oriented hole 104A1,104A2,104B1 and 104B2, they are with respect to surface of the work, incidence angle φ with selected is ejected into HFE or eth-HFE liquid on one side or opposed both sides of workpiece.HFE or eth-HFE liquid 105 are retained in the fluid container 107, and this container 107 is connected on the above-mentioned hole through force (forcing) pump 109 or other appropriate device, and force (forcing) pump 109 usefulness one controllable pressure head is transported to HFE or eth-HFE liquid on hole 103A and the 103B.Not Hui Fa atomizing of liquids and any other treat liquid (such as, water) and from other residue that surface of the work is removed, be collected in the gatherer 110, this gatherer is positioned at the below of workpiece 101, is used for possible purification and recirculation, or is used for handling.
Alternatively, workpiece 101 can be α angular orientation (shown in Fig. 9 for workpiece 101 ') with respect to vertical line, herein the scope at α angle from the several years to about 80 °, and all others situations all keep identical.
We find that be about under the 0.05mm situation at hole width or gap △ w, concerning HFE or eth-HFE, the pressure head value △ p of about 40psi is subjected to the only surface of the work of 5-7sec of HFE or eth-HFE effect with regard to sufficiently dry.We estimate that hole width can be reduced to △ w low speed 0.02mm, and HFE or eth-HFE still form the acceptable continuous injection after by hole 103A and 103B, and this is because low surface tension is all relevant with HFE or eth-HFE with other characteristics.If HFE or eth-HFE liquid are had the liquid of high surfaces tension force by another kind, replace as IPA or DI water, we estimate that as long as continuous injection is maintained at about under the appropriate pressure head of 40 psi, hole width △ w just can not reduce to and not be lower than about 0.05mm.
In the place that keeps high temperature to use with this structure as 40 ℃ HFE or eth-HFE liquid, we find, we can be in 5-7sec (the about 29mm/sec of linear pulling rate) from liquid, pull out the semiconductor chip of 200mm diameter.When this second pulled out end cycle, we found, check according to " bore hole ", and most of semiconductor chip bone dries, and within several seconds after from HFE liquid, shifting out last block semiconductor sheet, the semiconductor chip bone dry.We think that if HFE or eth-HFE fluid temperature are raised to higher temperature, as 50-56 ℃, then semiconductor chip can be pulled out in short period such as 3-5sec, and semiconductor chip one dries up liquid, and it is with regard to bone dry.HFE or eth-HFE liquid at room temperature have than higher vapour pressure (210mmHg post), guaranteed after shifting out semiconductor chip, to stay, but can not be with " bore hole " any HFE of seeing of check or eth-HFE liquid with very fast volatilization.
Some parameter can be used to optimize the dry and purification characteristics of the HFE that uses in structure shown in Figure 9.The firstth, temperature, this discussed in the above.As if when the HFE fluid temperature raise, dry run reached independently, purification process faster generation.Second is optimized parameter is angle φ, under this angle φ, spray (one or both sides) towards and striking work 101.We think, the angle φ that injects somewhere between (φ=0 °) and the nearly vertical incidence (90 ° of φ ≈) here plunderring is best.
The 3rd is optimized parameter is the pressure head △ p that back, hole HFE liquid is applied.As if as if along with pressure head △ p increases, workpiece drying and/or purification improve, but this improvement is more and more saturated, shown in selected drying property τ (drying time)-△ p schematic graph just as shown in Figure 10.
The 4th is optimized parameter is hole width △ w.Along with △ w reduces, the amount of the HFE of directive surface of the work or eth-HFE liquid will reduce, if keep pressure head △ p constant, then use what liquid unimportant.Be lower than when being considered to threshold value or minimum of a value △ w0 when hole width △ w reduces to, the continuous injection effect will be given way and be sprayed in unstable and uncontrollable liquid, and hole width △ w depends on that fluid temperature, surface tension of liquid, pressure reach perhaps other variable.Threshold hole width △ w0 when this transformation taken place will be similar to monotonously and reduce with surface tension, and will be shown as △ w0-surface tension of liquid schematic graph among Figure 11.Therefore, to HFE, threshold hole width △ w0 should be lower than the △ w0 of IPA, and it should be lower than the △ w0 of DI water.Therefore, HFE or eth-HFE liquid have than such as IPA or the wider relevant operating parameter of DI water, as △ p and △ w, are used for drying and/or purification.
The 5th is optimized parameter is that workpiece passes the linear pulling rate r that liquid sprays.Herein, the drying of regulation and/or conversion characteristic reduce and continue to improve along with pulling rate r only, but this must be by considering desirable workpiece drying and/or clarification time balance in addition, and along with speed r reduces, this drying and/or clarification time will be similar to 1/r and be directly proportional.
The 6th is optimized parameter is to be used for HFE or eth-HFE liquid are ejected into number of perforations N on the workpiece in a side.In Fig. 8, each side is provided with the N=2 injector.People can select N=1, and 2,3 or any other rational number, and, if keep enough far away at the injector of regulation one side, so that their non-interfering words, then drying and/or conversion characteristic should improve along with increase N.If two adjacent injector locations are near to being enough to the phase mutual interference, then this can increase effective workpiece drying time, but conversion characteristic can improve or reduce, and this depends on workpiece and surrounding environment.
As shown in Figure 12, workpiece 111-1, the order of 111-2,111-3 can be in the Curve Path P between two supercharging device 113A and the 113B near vertical ground (on route vector V direction) shift out, two supercharging device 113A and 113B have machine-direction oriented hole 114A1,114A
2, 114B1 and 114B
2, these holes are with respect to selected incidence angle φ of surface of the work, HFE or eth-HFE liquid are ejected on one side or two opposed limits of workpiece.HFE or eth-HFE liquid storage are in fluid container 117, and container 117 is connected on the hole through a booster pump 119 or other suitable device, and booster pump 119 usefulness one controllable pressure head △ p is transported to HFE liquid among hole 113A and the 113B.
As shown in figure 13, workpiece 121 can be between two supercharging device 123A and 123B (on the direction in vector V) tractive flatly, each supercharging device all has one or more vertical orientated hole 124A and 124B, they are ejected into HFE or eth-HFE liquid on one side or opposed both sides of workpiece with the incidence angle selected with respect to surface of the work.HFE or eth-HFE liquid 125 are stored in the fluid container 127, and this container 127 is connected on the hole through a booster pump 129 or other suitable device, and booster pump 129 usefulness one controllable pressure head △ p is transported to HFE or eth-HFE among hole 124A and the 124B.The atomizing of liquids of not volatilization and any other treatment fluid (such as, water) and other residue of removing from surface of the work are collected in the gatherer 130, and this gatherer 130 is positioned at the below of workpiece 121, is used for possible purification and recirculation, or is used for handling.
The linear speed r that pressure head △ p, hole width △ w, fluid temperature T, workpiece move horizontally and the selection of other parameter, basically with Fig. 9 or 12 in the same.Compare with the vertical stratification among Fig. 9, Figure 12 or one of them advantage of structure of 13 are, can move two or more workpiece 121 so continuously through jet, operate single workpiece continuity method so that drying and/or purification process can resemble, wherein each workpiece moves through one and sprays the zone of carrying out continuously.One of them possible shortcoming of horizontal method shown in Figure 13 is, HFE that ejects or eth-HFE liquid can not volatilize when striking work immediately, they may flow along workpiece vertically downward, and are ejected into another part HFE or the interaction of eth-HFE liquid on the workpiece adjacent part simultaneously or influence the latter with about.
Utilize moving horizontally/the angular injection structure as shown in figure 14,, also can make it reduce to minimum if can not eliminate this possible shortcoming.In the structure of Figure 14, workpiece 131 is between the first oblique hole 134A and the second oblique hole (not shown), with the horizontal tractive of a linear velocity r (on the direction of vector V), so that HFE or eth-HFE liquid are ejected on the side or opposed both sides of workpiece.Liquid on each side of workpiece sprays along an oblique line contact workpiece, and this oblique line has relevant oblique angle θ as shown in the figure.HFE or eth-HFE liquid 135 are stored in the fluid container 137, this container 137 is connected on each hole through a booster pump 139 or other appropriate device, booster pump 139 is transported to HFE or eth-HFE liquid on the first supercharging device 133A and the second supercharging device (not shown), this first and second supercharging device has corresponding first and second holes, and it can be the hole control pressure head △ p of △ w by hole width that booster pump 139 has.Hui Fa atomizing of liquids and any other treatment fluid (as water) and all be collected in the gatherer 140 that is arranged in workpiece 131 belows with other residue that surface of the work is removed are not used for possible purification and recirculation, or are used for handling.The selection of pressure head △ p, hole width △ w, fluid temperature T, linear velocity r that workpiece moves horizontally and other parameter basically with Fig. 9,12 or 13 in the same.Carry out single workpiece the structure of Figure 14 can resemble among Figure 13 and handle or batch processing, but the not volatilization HFE or the eth-HFE liquid at the part workpiece place of spraying therein, do not influence HFE basically or eth-HFE liquid is ejected on the adjacent part of workpiece.
The structure of Figure 14 has one the 7th to optimize parameter, i.e. the oblique angle θ that uses for atomizing of liquids.As if best oblique angle θ (selectively) depend on linear velocity r, and depend on representational speed s (vertically), with linear velocity r the horizontal tractive of workpiece is passed through injector, Hui Fa HFE or eth-HFE liquid is not under representational speed s, can vertically run down to the surface of workpiece 131: as if along with s (vertically) increases, the least inclination θ that this method can be worked under aneroid-liquid disturbed condition also increases.
Figure 15 illustrates alternative structure that another kind is used for drying and/or purifies workpiece 141.Workpiece 141 is carried by a processing region 142, and in this zone, the sub-circular of one or more strands of second liquid moves the surface of the work that stream (spraying or most of liquid) C1, C2 stride across each desire processing and moves.Nominally sub-circular move stream C1, C2 wherein each center of circle c1, c2 preferably away from the surface of the work setting, so that the every bit on the workpiece all stands to have liquid stream C1, the C2 of non-zero liquid velocity.Alternatively, nominal center c1, the c2 of liquid stream C1, C2 can be positioned on the exposing surface of workpiece 141.
Liquid stream C1, the C2 of each circulatory motion are formed as mechanically driver type or magnetically-actuated formula liquid stirrer by a cycling mechanism 143, and this cycling mechanism 143 partly or entirely is immersed in second liquid.The angular velocity omega relevant with each sub-circular type of flow C1, C2 can from per second less than 1 radian (such as, 0.2 radian per second (rad/sec)) to per second hundreds of radian (such as, 500rad/sec) select in the scope.Second liquid 144 preferably is stored in the fluid container 145, and is transported to workpiece processing region 142 by pump 146 in the selected time interval, and cycling mechanism 143 makes second liquid move in the mode of sub-circular herein.
Workpiece 141 moves through processing region 142 by one or more mechanical arm 147A and 147B (or a vacuum cup or disk or adhesive disc work piece holder), and is subjected to circus movement stream C1, the C2 effect of second liquid.Alternatively, workpiece 141 can be maintained fixed motionless, and the surface of the work that the inswept desire of circus movement stream C1, C2 is handled.After surface of the work is crossed with second liquid handling, second liquid that uses in this occasion selectively flows into or leaves in addition in the supercharging device 148 of consumable liquid, and or enters or (preferably) beats to circulate and pass liquid filtering mechanism 149 and leave in the fluid container 145.
Be subjected to the place that one second liquid circus movement flows C1 or C2 effect 141 of workpiece, the nominal radius r 1 of this type of flow or r2 preferably handle the diameter of surface of the work greater than desire.Be subjected to the place of two or more circus movement stream C1 and C2 effect at workpiece 141, one of them of these types of flow or the nominal radius r 1 of the two and/or r2 selectively select half of being a bit larger tham diameter of work, and two strands of liquid flow C1, C2 collaborative work, also fully this surface of the work is covered so that move the surface of the work that strides across the desire processing, as shown in figure 14.Nominal center c1 and the c2 of liquid stream C1 and C2 so are set then, so that the surface of the work that desire is handled moves between these nominal centers.
Shown in the device as shown in figure 16, two or more workpiece 151 and 152 can closer to each other or adjacent positioned, and three pressure head 153A, 153B and 153C can be as shown in the figure, and contiguous these workpiece location are so that purify and surface that dry workpiece exposes.Wherein each all has one or more spray- hole 154A and 154C respectively for outside pressure head 153A and 153C, so that the dry and/or purification of one of them exposing surface of adjacent workpieces is provided.Middle or inner pressure head 153B has one or more spray-hole 154B1 and 154B2, and they are positioned on its each side, so that spray the exposing surface 151 and 152 of adjacent workpieces respectively.Hole 150 also comprises container or the charging-tank 157 and the compression pump 159 of one second liquid 155, and this compression pump 159 is transported to pressure head 153A, 153B and 153C with second liquid of supercharging.A liquid header 160 is arranged in the below of jeting area workpiece 151 and 152, and its collect to drip the liquid from workpiece, is used for possible recirculation and uses.
If undertaken by the mode described in Figure 16, then can be dry simultaneously and/or purify the workpiece of two or more settings adjacent one another are, as the situation that in actual batch method, perhaps can take place.Distance of separation D1 and/or D2 between two adjacent workpiece 151 and 152, should keep equaling at least the distance of minimum separation D (min) that selectes, so that enough allowance distance D (gaps are provided, 1) and D (gap, 2), be used for pressure head 153B and relevant spray-hole 154B1 and 154B2, between adjacent workpiece 151 and 152, pass through.These allowances distance preferably comprise each spray-hole 154B1 and 154B2 and adjacent workpieces corresponding exposing surface return (back off) distance.
Jet 154A, 154B1,154B2 and 154C can be horizontal orientation, rectilinear orientation or inclined orientation, as shown in Fig. 9,13 and 14, and can select separately every kind of spray regime.For example, because the heterogeneity of 151 two exposing surfaces of workpiece,, can be respectively vertical or be the oblique angle by hole 154A and the formed spray regime of 154B1.To the workpiece among Fig. 6,9,12,13,14,15 and 16,, can select separately two spray regimes that exposing surface is wherein limited above each.Alternatively, if desired, can be only dry and/or purify Fig. 6,9,12,13,14,15 and 16 one of them surface of exposing or sides.
Figure 17 A-17E illustrates and another kind of HFE or eth-HFE liquid is transported to method on the workpiece.In Figure 17 A, the exposing surface of workpiece 161, rotate around the selected rotating shaft that passes exposing surface with selected angular frequency, and along with the surface rotation, with one or more pieces 163-n (n=1,2,3 ...) HFE base fluid body (such as, HFE or eth-HFE liquid) be ejected on the surface of the work, these layers HFE base fluid body schematically illustrates with lines from the teeth outwards.Each sheet can have identical HFE base fluid body among each layer 163-n.Alternatively, wherein two or multi-disc can be with different HFE base fluid bodies as blasting materials, so that utilize the pollutant on the surface of the work that different HFE base fluid bodies is had different responses for each sheet 163 1 n.
Among Figure 17 A two or multi-disc HFE base fluid body 165-n needn't be parallel to each other, and can be the mixtures of planar chip (165-1) or curve sheet (165-2,165-3) or planar chip and curved layer; And if these sheets are not parallel to each other, shown in Figure 17 B, then these sheet liquid the pivot place of workpiece 161 or near needn't intersect each other.
In Figure 17 C, two or the different HFE base fluid body 167-1 of multi-disc are ejected on the surface of rotational workpieces 161 with 167-2 along different line segments, preferably when the angular velocity omega of surface of the work to select, when a selected rotating shaft that passes exposing surface rotated, each line segment all covered the whole work-piece surface.Shown in Figure 17 A, two 167-1 can have identical HFE base fluid body as jetting fluid with 167-2.Can be from selectively, two 167-1 can respectively have different HFE base fluid bodies with 167-2, so that utilize the pollutant on the surface of the work that different HFE base fluid bodies is had different responses.
In Figure 17 D, the liquid stream 169 of one or more strands of HFE base fluid bodies, along with surface of the work with a selected angular velocity omega, around the rotating shaft rotation of passing exposing surface, and be stored on the last selected position, rotational workpieces 161 surfaces, and rotation (centrifugal force etc.) effect by surface of the work makes HFE base fluid physical efficiency stride across part or whole work-piece unfolded surface.
In Figure 17 E, the exposing surface (not shown) of the workpiece 161 that desire is purified is placed into the exposing surface of contact HFE base fluid body 171 grooves, or immerses in this groove.The surface of exposing is with a selected angular velocity omega, around a selected rotating shaft rotation of passing exposing surface.Between above-mentioned surface of revolution and adjacent HFE base fluid body, form a kind of (1) above-mentioned surface and be exposed under the HFE base fluid body combination with (2) shearing force.Shearing force can utilize HFE base fluid body to be easy to " back-out " to the rotary speed on described surface and tail off.The shearing force size can move around HFE base liquid tank inside by the surface that workpiece is exposed and keep very high, and therefore at present adjacent liquid not free next " fast rotational " fully is to the angular speed of rotation exposing surface.