CN1282503A - 具有散热系统的混合电路 - Google Patents

具有散热系统的混合电路 Download PDF

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CN1282503A
CN1282503A CN98812403A CN98812403A CN1282503A CN 1282503 A CN1282503 A CN 1282503A CN 98812403 A CN98812403 A CN 98812403A CN 98812403 A CN98812403 A CN 98812403A CN 1282503 A CN1282503 A CN 1282503A
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Prior art keywords
hybrid circuit
end pin
pin
circuit
heat
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Pending
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CN98812403A
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K·雷耐尔特
F·坦普林
I·斯库拉斯
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TE Connectivity Solutions GmbH
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Tyco Electronics Logistics AG
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Publication of CN1282503A publication Critical patent/CN1282503A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Control Of Temperature (AREA)

Abstract

焊接混合电路(1)到印刷板的至少一个连接管脚(5),其对混合电路(1)所匹配的热转化电阻,以这样一种方式大于其它连接管(2)的,即务使所述连接管脚(5)不会达到给定功率水平下所使用焊料的熔化温度。

Description

具有散热系统的混合电路
本发明涉及一种混合电路，它包含特别适合SMD的端脚排列结构，该端脚排列结构具有多个用来将混合电路焊接到电路板上的端脚，其中，至少一部分由于混合电路功耗产生的热可以通过电路板的端脚而发散掉。
混合电路或层状电路是电子分组件，其中，平面导电连线结构和无源元件，特别是电阻，通过特定的薄膜技术，施放在陶瓷衬底上，并使这些在公共陶瓷衬底上的平面结构适应于和其他的元件，例如集成电路(IC)或继电器(relay)相连或混合在一起。这些加进来的元件通常适合于进行表面安装，也即，采用已知的SMD(表面安装器件)技术，将它们放置在混合电路的连接焊垫上，并且绝大多数借助于回流(reflow)焊接焊接在那儿。
在陶瓷载体材料上的混合电路允许在最小可能的结构空间上具有高的功率水平。这通常伴随有强的组件加热。必须使这强的加热从元件上去除或耗散掉。通常，该耗散的一部分通过元件表面进行，而另一部分则通过端脚进行。如果热量不能通过端脚充分地耗散掉，或者，如果热量超过将端脚焊接到电路板上所用焊料的熔化温度，则混合电路本身就与电路板脱焊。如果个别的焊接点熔化并变成粘糊状，那么通过各该个别的端脚的确仍保持着电连接，但混合电路相对于电路板的机械稳定性就不再存在了。
这一问题对SMD应用尤为重要，其中，混合电路从总体上说也要能够适应于SMD。为了获得高的集成密度，当今的混合电路绝大多数均以单列直插式分组件的形式焊接至电路板。为了利用三维空间，因此将它们垂直安装在只有一排端子的电路板或衬底上。这样，上面提到的稳定性问题并未使其自身感觉到，特别是对通过穿孔安装将单列直插式混合组件安装至电路板的的情况尤其如此，但对采用SMD技术所安装的这样一类组件，情况就不是这样。迄今，为了限制端脚的温度增加，所以对混合电路安装上额外的热沉，也即，元件中的功率水平必须经受更强的限制。
本发明的目的是提供一种在开头所提到的那种类型的混合电路，它具有供散热和温度受限止的改进系统，而无需额外的热沉加至混合电路。
对于在开头所得到的那种类型的混合电路，该目的是这样来实现的，即至少提供一个端脚，其对混合电路的热转化电阻以这样一种方式高于其他端脚的，即务使该端脚不会达到给定功耗下所使用焊料的熔化温度。
本发明的进一步的发展乃相关的权利要求所属内容。
下面将参照唯一的附图，通过实施例对本发明作更为详细的描述，该附图表示按照本发明一混合电路连同端脚排列结构的侧视图。
按照本发明，有目的地对通过端脚散热的控制是这样来实现的，即，某些端脚是热绝缘的，或配备以更高的热转化电阻，俾使这些端脚在可能发生热量增加时也并不自动地脱焊。
通过薄膜或厚膜技术在管脚端子下印刷上一个或多个中间层，并由，例如绝缘介质或玻璃构成可以或多或地产生有益的强热绝缘影响。在其顶部，放置有常见的导电连线或电阻层，通过该导电连线或电阻层，实现混合电路与相关各端脚的连接。这样任意是热绝缘的，但如果需要，同样可以保持与这些端脚的有利的电连接，当然也即使虚拟管脚也是可能的。通过选择各个端脚或管脚组，可以容易地控制通过端脚的散热，从而特别有可能将热有目的地引入至电路板的特定部分。
图中示出的端子排列，通常也称为是端子梳，是由许多端脚2组成的，而端脚则由冲压金属片部件制成，但无需成对排列成如图所示的那样。如图所示，可将混合电路1嵌置在(c1amped)上弯的叉齿3之间，从而使它们全部排列成与端脚2的公共安装平面垂直，因此也与衬底或电路板平面垂直。在叉齿3内侧，可以配备有焊料镶嵌在其间，从而当将整个排列结构焊接到电路板上时，同样形成端子梳和混合电路之间的焊接连接。如图所示，端子排各个外端脚5可有益地具有一排列在其下面的绝缘层4，从而可以使热耗散通过中央端脚2进行，而混合电路的脱焊得以防止，这是因为外端脚5不会达到所使用焊接材料的熔化温度。

Claims (3)

1．一种混合电路，它包含一种特别适合于SMD的端子排列结构，所述排列结构具有多个端脚(2)，用来焊接混合电路(1)至电路板，其中，由于混合电路(1)的功耗所生成的至少一部分的热量可以通过所述端脚(2)耗散到所述电路板，其特征在于，至少一个端脚(5)具有对所述混合电路(1)的热转化电阻，以这样一种方式高于其他端脚(2)的，使该端脚(5)不会达到给定功耗下所使用焊料的熔化温度。
2．如权利要求1所述的混合电路，其特征在于，所述端脚(5)的至少部分热绝缘通过所述端脚(5)的末层下的至少一个中间层加以完成。
3．如权利要求1或2所述的混合电路，其特征在于，个别端脚(5)或管脚组的位置连同所增加转化电阻的选择如此进行，使得热量可以有目的地释放到所述混合电路的相应部分中。
CN98812403A 1997-12-23 1998-11-12 具有散热系统的混合电路 Pending CN1282503A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19757612A DE19757612C1 (de) 1997-12-23 1997-12-23 Hybridschaltung mit einem System zur Wärmeableitung
DE19757612.5 1997-12-23

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CN1282503A true CN1282503A (zh) 2001-01-31

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US (1) US6469248B1 (zh)
EP (1) EP1042946B1 (zh)
CN (1) CN1282503A (zh)
AT (1) ATE212497T1 (zh)
DE (2) DE19757612C1 (zh)
WO (1) WO1999034657A2 (zh)

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CN1797080A (zh) * 2004-12-30 2006-07-05 鸿富锦精密工业（深圳）有限公司 Emi防护装置
US8112884B2 (en) 2007-10-08 2012-02-14 Honeywell International Inc. Method for providing an efficient thermal transfer through a printed circuit board
CN114040595B (zh) * 2021-11-12 2023-05-16 中国电子科技集团公司第三十八研究所 一种ccga-微波器件混装印制板组件回流焊接方法及工装

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Publication number Publication date
DE19757612C1 (de) 1999-07-08
WO1999034657A2 (de) 1999-07-08
ATE212497T1 (de) 2002-02-15
WO1999034657A3 (de) 1999-10-21
US6469248B1 (en) 2002-10-22
EP1042946A2 (de) 2000-10-11
EP1042946B1 (de) 2002-01-23
DE59802927D1 (de) 2002-03-14

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