CN1282085A - Stacking ceramic capacitor - Google Patents
Stacking ceramic capacitor Download PDFInfo
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- CN1282085A CN1282085A CN00120332A CN00120332A CN1282085A CN 1282085 A CN1282085 A CN 1282085A CN 00120332 A CN00120332 A CN 00120332A CN 00120332 A CN00120332 A CN 00120332A CN 1282085 A CN1282085 A CN 1282085A
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 39
- 239000000919 ceramic Substances 0.000 claims abstract description 68
- 239000002245 particle Substances 0.000 claims abstract description 30
- 238000009825 accumulation Methods 0.000 claims description 52
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011800 void material Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 15
- 238000010304 firing Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000006071 cream Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 210000002469 basement membrane Anatomy 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001595 contractor effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A laminated body 3, where a ceramic layer 7 and internal electrodes 5 and 6 are laminated alternately and external electrodes 2 and 2 are provided at the end part of the laminated body 3, are provided. The internal electrodes 5 and 6 reach at least either of pair of edges of the ceramic layer 7, which face each other so that the internal electrodes 5 and 6 are led out to a facing end surface of the laminate 3, with the internal electrodes 5 and 6 being lead out to the end surface of the laminate 3 connected, respectively to the external electrodes 2 and 2. At the internal electrodes 5 and 6, facing each other inside the laminate 3 via the ceramic layer 7, a void part 9 where partially no conductor particle 8 ceramic particle 10 exists is provided.
Description
The present invention system is for example about having the accumulation body of internal electrode pattern and ceramic layer, at the stacking ceramic capacitor of the end of this accumulation body setting with the outer electrode of above-mentioned internal electrode conducting, particularly, when firing, be difficult for the stacking ceramic capacitor of the be full of cracks of generation accumulation body inside about the slim person of interior electrode layer below 3 μ m.
Stacking ceramic capacitor system is piled up by most layers ground by the ceramic layer that the dielectric with internal electrode forms, and in the inside of this accumulation body, internal electrode is relative, and above-mentioned internal electrode is guided on the opposing end faces of this accumulation body alternately.And, forming outer electrode in the end of the end face that comprises the accumulation body that these internal electrodes are guided out, this outside electrode is connected to the above-mentioned internal electrode relative in the inside of accumulation body.
The above-mentioned accumulation body 3 of this kind stacking ceramic capacitor for example has layer structure shown in Figure 3.The i.e. ceramic layer 7,7 that forms by dielectric with internal electrode 5,6 ... piled up with order shown in Figure 3, and then do not formed the ceramic layer 7,7 of internal electrode 5,6 in its both sides ... respectively by the overlapping accumulation of plural layer.And in the end of the accumulation body 3 of the layer structure with this kind, internal electrode 5,6 exposes alternately, as shown in Figure 1, form above-mentioned outer electrode 2,2 in the end of this accumulation body 3.
This kind stacking ceramic capacitor is not that as shown in Figure 31 unit ground of part is out of the ordinary manufactured usually, in fact is to adopt manufacture method described as follows.Promptly, the ceramic powders and the organic bond of miniaturization at first mix, make slurries, with this by means of scraping the skill in using a kitchen knife in cookery very thin expansion on the film carrier that forms by polyethylene terephthalate thin film etc., dry, mounting is on the film of supporting ceramic green sheet, be cut to desirable size to cut haircut, at its single face by means of screen painting method printing conductive cream, dry.By means of this, as shown in Figure 6, internal electrode pattern 2a, ceramic green sheet 1a, the 1b that 2b is arranged of plural component in length and breadth obtained.
Then, pile up ceramic green sheet 1a, the 1b of plural pieces, and then pile up several ceramic green sheet 1,1 that does not have internal electrode pattern 2a, 2b up and down with above-mentioned internal electrode pattern 2a, 2b ..., accumulation body is made in its pressing.Herein, above-mentioned ceramic green sheet 1a, 1b are that intermeshing internal electrode pattern 2a, 2b have only half length person of staggering at length direction.Afterwards, this accumulation body is cut into the size of the individual dice of hope, make to pile up and give birth to small pieces, fire this and give birth to small pieces.So can obtain Fig. 1 and accumulation body shown in Figure 3.
Then, two ends coating conductive paste, baking by means of fire the accumulation body of finishing 3 at this impose plating in the surface of the electrically conductive film that has toasted, and finish the stacking ceramic capacitor as shown in Figure 1 that forms outer electrode 2,2 at two ends.
For example as the cutaway view of the accumulation body of the above-mentioned stacking ceramic capacitor of performance, become as Fig. 2 person.The cutaway view of accumulation body tie up to conductive particle and conductive particle between hole portion insert ceramic particle, portion buries with the hole.
As the accumulation body 3 of the ceramic layer 7 of above-mentioned stacking ceramic capacitor in, in ceramic layer 7 with internal electrode 5,6 because the contractive action of variations in temperature has different dying, be easy to generate fine be full of cracks (microcrack) in the inside of accumulation body 3.Particularly at the high accumulation horizon more than 100 layers, this tendency is more remarkable.
Therefore, the present invention system is in view of the problem of above-mentioned known techniques, and purpose is to provide: in the inner excessive stress of generation that is difficult for of accumulation body, be difficult for the stacking ceramic capacitor of generation be full of cracks.
In order to reach above-mentioned purpose, seeing through the space part 9 that ceramic layer 7 internal electrode 5,6 relative in the inside of accumulation body 3 is provided with does not partly have conductive particle 8 in the present invention.By means of the space part 9 of this internal electrode 5,6, relax the stress of generation between internal electrode 5,6 and ceramic layer 7, to prevent generation by means of the be full of cracks of the inside of the accumulation body of firing 3.
Promptly according to stacking ceramic capacitor of the present invention, have: pile up ceramic layer 7 and internal electrode 5 alternately, 6 accumulation body 3, and be arranged on the outer electrode 2 of the end of described accumulation body 3,2, by means of making described internal electrode 5,6 arrive the wherein side of ora terminalis of mutual relative at least one pair of of ceramic layer 7 respectively, on the opposing end surface of accumulation body 3, derive internal electrode 5 respectively, 6, and the internal electrode 5 of deriving on the end face with same accumulation body 3,6 are connected to described outer electrode 2, on 2, by ceramic layer 7, the relative internal electrode 5 in the inside of accumulation body 3, part is set on 6 does not have conductive particle 8, the space part 9 that does not also have ceramic particle 10.
The space part 9 of above-mentioned internal electrode 5,6 is one the space of size by the internal electrode plane graph, ceramic particle is arranged more than 10, the gross area of space part occupy internal electrode 5,6 area 25～75%.This kind stacking ceramic capacitor is fit to be used in the thin person of thickness below 3 μ m of above-mentioned internal electrode 5,6.
Herein, the area of so-called internal electrode 5,6 system comprises the area of the internal electrode 5,6 of space part 9, i.e. the outward appearance area of internal electrode 5,6.For example internal electrode 5,6 is the situation of the conductive pattern of rectangle, becomes the product of its size in length and breadth.
In this stacking ceramic capacitor, be provided with and partly do not have conductive particle 8, also do not have a space part 9 of ceramic particle seeing through ceramic layer 7 internal electrode 5,6 relative in the inside of accumulation body 3, so when firing, be difficult for producing because the stress that difference caused of contractive action effectively prevents the generation of chapping.
But space part 9 preferably occupies about 50% of internal electrode 5,6, more specifically is 25～75% area.Less than 25% o'clock, can't fully prevent the generation of chapping at the area ratio that occupies internal electrode 5,6 of space part 9.Again, the area ratio that occupies internal electrode 5,6 of space part 9 is as surpassing 75%, and the relative area of internal electrode 5,6 reduces, and is difficult for obtaining needed static capacity.
Fig. 1 is a part of default stereogram of expression according to the example of stacking ceramic capacitor of the present invention.
Fig. 2 is the significant points amplification view of A portion of Fig. 1 of the same stacking ceramic capacitor of expression.
Fig. 3 is the exploded perspective view of each layer of accumulation body of the example of the same stacking ceramic capacitor of discrete representation.
Fig. 4 is the significant points enlarged drawing of B portion of Fig. 3 of the same stacking ceramic capacitor of expression.
Fig. 5 is the significant points enlarged drawing of C portion that shows Fig. 4 of same stacking ceramic capacitor.
Fig. 6 is the separation stereogram of each layer of the expression stacking states of making the ceramic green sheet that stacking ceramic capacitor uses.
(explanation of label)
2 outer electrodes
3 accumulation bodies
5 internal electrodes
6 internal electrodes
7 ceramic layers
9 space parts
10 ceramic layers
Then, on one side with reference to drawing, concrete on one side and describe example of the present invention in detail.At first, the dielectric ceramics material powder of barium titanate etc. is dispersed in be dissolved in ethanol,
The organic bond of the abietic resin of the solvent of product alcohol, fourth carbitol, toluene, kerosene etc., polyvinyl butyral resin, ethyl cellulose, allyl resin etc. is adjusted ceramic slurries.These ceramic slurries are coated with very thin homogeneous thickness on the basement membrane of polyethylene terephthalate thin film etc., dry, membranaceous ceramic green sheet made.Afterwards, this ceramic green sheet is cut to suitable size.
Then, as shown in Figure 6, on ceramic green sheet 1a, the 1b of this severing, use conductive paste, distinctly print 2 kinds internal electrode pattern 2a, 2b.For example conductive paste system uses: for 100 weight % of Ni powder, add bond ethyl cellulose 3～12 weight %, solvent
Product alcohol 80～120 weight %, so-called barium titanate powder 10～20 weight % of material altogether, evenly mixing, dispersion person.
Use the Ni conductive paste of this kind, printing internal electrode pattern 2a, 2b on ceramic green sheet 1a, 1b.
With the ceramic green sheet 1a, the 1b that are printed this kind internal electrode pattern 2a, 2b as shown in Figure 6 intermeshing pile up, and then overlappingly be deposited in the ceramic green sheet 1,1 that internal electrode pattern 2a, 2b are not printed in its both sides, so-called pseudo-sheet with its pressing, obtains accumulation body.And then this accumulation body cut off in length and breadth, be divided into each and every one scutellate accumulation body.Afterwards, as shown in Figure 1, the two ends coating Ni high conductive paste of the accumulation body 3 of being derived respectively at internal electrode 5,6 is fired these accumulation bodies, obtains to have the accumulation body of finishing 3 of firing of as shown in Figure 3 layer structure.
And then on this Ni cream etc., electroplate Cu with as conducting film, electroplated Ni on this conducting film, and then impose Sn thereon or scolding tin is electroplated, form outer electrode 2,2.By means of this, finish stacking ceramic capacitor.
Firing in the engineering of aforesaid accumulation body, internal electrode 5,6 one is fired, at first cause the arrangement once again of the metallic of the conductive paste that forms internal electrode pattern, the conductive particle that forms internal electrode pattern and ceramic layer 7 between, grow up in this interface direction.By means of this, as shown in Figure 2, the conductive particle 8 that forms internal electrode 5,6 forms in the flat particle of growing up with the interface direction of ceramic layer 7 again, the flat conducting particles of this kind with the interface direction of ceramic layer 7 with 11 state that links to each other, form membranaceous internal electrode 5,6.The thickness of this internal electrode 5,6 is below the 3 μ m.
Again, firing in the engineering of aforesaid accumulation body 3, internal electrode 5,6 one is fired, and at first forms the arrangement once again of metallic of the conductive paste of internal electrode pattern, and the thickness of internal electrode pattern reduces.Arrange an end of a period afterwards once again, the sintering that forms the conductive paste of internal electrode pattern begins, and when this sintering, the metallic in the conductive paste is because capillary effect desires to concentrate on a place.At that time, internal electrode pattern thickening gradually.Its result is: before firing with fire after the almost not change of thickness of internal electrode pattern and internal electrode 5,6.On the other hand, ceramic layer 7 has only thickness to reduce in sintering procedure.Therefore, by means of the gap of internal electrode 5,6 and ceramic layer 7, produce the non-existent space part 9 of electrically conductive film at internal electrode 5,6.The control method of the size of this kind space part 9 etc., can enumerate: adjust the composition that internal electrode forms the conductive paste of usefulness (amount of metal, altogether the material amount, in conjunction with dosage), maybe this fires section etc. for the particle diameter of this conductive particle.
Fig. 2 is a modal representation: the stacking ceramic capacitor of finishing is imbedded, remained under the propylene base system state of resin, grind in the direction vertical with the stacked direction of ceramic layer 7, its section is exposed, by means of the microphotograph that observation by light microscope obtained.The A enlarged drawing partly that just is equivalent to Fig. 1.
As shown in Figure 2, be formed on ceramic layer 7 between the interface direction of flat conductive particle general 11 continuous ceramic layer 7 be linked to be the internal electrode 5,6 of row.But this internal electrode 5,6 is not all partly all continuous fully, forms the space part 9 that does not yet have electrically conductive film to exist, do not have ceramic particle to exist yet everywhere.The conductive particle 8 that links to each other between contiguous voids portion 9 ties up to below 20.
Fig. 4 is a modal representation: the stacking ceramic capacitor of finishing is imbedded, remained under the propylene base system state of resin, stacked direction in ceramic layer 7 grinds, its section is exposed, by means of the microphotograph that the plane obtained of observation by light microscope internal electrode 5,6.The B enlarged drawing partly that just is equivalent to Fig. 3.And then Fig. 5 is the C portion of amplification mode presentation graphs 4.
In the part of space part shown in Figure 49, conducting particles 8, ceramic particle 10 all do not have to exist.In Fig. 5, can see ceramic particle 10 in the behind of space part 9.The size in each place of this space part 9 is that ceramic particle is more than 10.Again, the space part 9 of this kind internal electrode 5,6 occupies about 50% of internal electrode 5,6, more specifically is 25～75% area.
Then, embodiment more specifically of the present invention and its corresponding comparative example are described.
(embodiment)
Making is dispersed in the dielectric ceramics material powder of barium titanate etc. and is dissolved in
The ceramic slurries of the organic bond of the ethyl cellulose of the solvent of product alcohol etc. etc. are evenly coated it on basement membrane of polyethylene terephthalate thin film etc. thinly, dry, make membranaceous ceramic green sheet.Afterwards, this ceramic green sheet is peeled off by basement membrane, plural pieces is made the ceramic green sheet in 150nm four directions.
On the other hand, for 100 weight % of Ni powder, add ethyl cellulose 8 weight % as bond,
The pure 100 weight % of product evenly mix, disperse as solvent, adjust conductive paste.Use this Ni cream, by means of internal electrode pattern 1a, the 1bs of screen printer at the indivedual formation of each and every one ceramic green sheet thickness 2.5 μ m as shown in Figure 6.
To be printed the ceramic green sheet of this kind internal electrode pattern alternately to specify the sheet number overlapping, the following overlapping ceramic green sheet that does not print internal electrode pattern thereon, so-called pseudo-sheet, with they at stacked direction under 120 ℃ temperature, with the exert pressure pressing of 200t, obtain accumulation body.
With this accumulation body severing is the size of 3.2 mm * 1.6 mm, behind the both ends of accumulation body coating Ni cream, fires with 1320 ℃ temperature, obtains the accumulation body of finishing 3 of firing shown in Figure 1.And then afterwards small pieces are inserted no electrolysis cartridge type electroplating bath, electroplate the Cu film, electroplated Ni film on this Cu film.And, on this Ni film, impose scolding tin or Sn in regular turn and electroplate.By means of this, form outer electrode 2,2, obtain stacking ceramic capacitor as shown in Figure 1.
Propylene base system state of resin is being imbedded, remained in to 50 of this stacking ceramic capacitors, grinding in the direction vertical, by means of the stacking states of observation by light microscope internal electrode 5,6 and ceramic layer 7 with the stacked direction of internal electrode 5,6.Its result is as shown in Figure 2, though be formed on ceramic layer 7 between the interface direction of flat general 11 continuous ceramic layer 7 of conductive particle be linked to be the internal electrode 5,6 of row, but also form the space part 9 that does not have electrically conductive film, pottery everywhere at this internal electrode 5,6.Connect be the interface direction be linked to be the space part of internal electrode 5,6 of row and space part between conductive particle 8 be 15 to the maximum.
And then propylene base system state of resin is being imbedded, remained in to 50 of other stacking ceramic capacitors, and grind in the stacked direction of internal electrode 5,6, the plane of internal electrode 5,6 is exposed, by means of observation by light microscope.Its result is: as shown in Figure 5, have all non-existent space part 9 of electrically conductive film, pottery at internal electrode 5,6.The area that this space part 9 occupies the plane of electrode 5,6 is about 49%.
Just add up to the be full of cracks of inside of 100 stacking ceramic capacitor investigation accumulation body 3, do not see the generation of be full of cracks.And then use 50 other stacking ceramic capacitors of making simultaneously, with its island electrode of outer electrode 2,2 solderings on circuit substrate at two ends, grind this stacking ceramic capacitor afterwards, similarly investigate the having or not of be full of cracks of the inside of accumulation body 3, also do not see the generation of be full of cracks.
(comparative example)
In the aforementioned embodiment, the 100 weight % that the amount of the common material that is formed by barium titanate powder etc. in the Ni cream that forms internal electrode 5,6 usefulness is made as for the Ni powder are 10 weight %, and then the temperature rising gradient when making the firing of small pieces of severing slowly rise fired outside, make stacking ceramic capacitor in the same manner with same embodiment.
Propylene base system state of resin is being imbedded, remained in to 50 of this stacking ceramic capacitors, grinding in the direction vertical, by means of the stacking states of observation by light microscope internal electrode 5,6 and ceramic layer 7 with the stacked direction of internal electrode 5,6.Though its result for be formed on ceramic layer 7 between conductive particle probably be linked to be the internal electrode 5,6 of row, but do not have the space part 9 of electrically conductive film, pottery everywhere in the yet sparse formation of this internal electrode 5,6.
And then propylene base system state of resin is being imbedded, remained in to 50 of other stacking ceramic capacitors, and grind in the stacked direction of internal electrode 5,6, the plane of internal electrode 5,6 is exposed, by means of observation by light microscope.Its result is: though have all non-existent space part 9 of electrically conductive film, pottery at internal electrode 5,6, its ratio of occupying the plane of electrode 5,6 is 23%.
Again, just add up to the be full of cracks of inside of 100 stacking ceramic capacitor investigation accumulation body 3, do not see the generation of be full of cracks.And then use 50 other stacking ceramic capacitors of making simultaneously, with its island electrode of outer electrode 2,2 solderings on circuit substrate at two ends, grind this stacking ceramic capacitor afterwards, similarly investigate the having or not of be full of cracks of the inside of accumulation body 3, see that 18 produce be full of cracks.
As above-mentioned, according to the present invention, can obtain to be difficult for being created in when firing, because the bad stacking ceramic capacitor of the different be full of cracks that produce of ceramic particle and the contractive action of internal electrode.
Claims (3)
1. stacking ceramic capacitor, have: pile up ceramic layer (7) and internal electrode (5) alternately, (6) accumulation body (3), and be arranged on the outer electrode (2) of the end of described accumulation body (3), (2), by means of making described internal electrode (5), (6) arrive the wherein side of ora terminalis of mutual relative at least one pair of of ceramic layer (7) respectively, on the opposing end surface of accumulation body (3), derive internal electrode (5) respectively, (6), and the internal electrode of deriving on the end face with same accumulation body (3) (5), (6) be connected to described outer electrode (2), (2) on, it is characterized in that:
Part is set on the relative internal electrode (5) in the inside of described accumulation body (3), (6) not to be existed conductive particle (8), does not have a space part (9) of ceramic particle (10) yet.
2. stacking ceramic capacitor as claimed in claim 1 is characterized in that,
Be present in space part (9) in the internal electrode (5), (6) occupy internal electrode (5), (6) area 25～75%.
3. stacking ceramic capacitor as claimed in claim 1 or 2 is characterized in that, the thickness of described internal electrode (5), (6) is below 3 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP205588/1999 | 1999-07-21 | ||
| JP11205588A JP2001035747A (en) | 1999-07-21 | 1999-07-21 | Laminated ceramic capacitor |
| JP205588/99 | 1999-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1282085A true CN1282085A (en) | 2001-01-31 |
| CN100466120C CN100466120C (en) | 2009-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001203320A Expired - Lifetime CN100466120C (en) | 1999-07-21 | 2000-07-10 | Stacking ceramic capacitor |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2001035747A (en) |
| KR (1) | KR100676035B1 (en) |
| CN (1) | CN100466120C (en) |
| HK (1) | HK1032664A1 (en) |
| TW (1) | TW452807B (en) |
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| CN106384667A (en) * | 2010-08-18 | 2017-02-08 | 太阳诱电株式会社 | Laminated ceramic electronic component |
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| JPH07326537A (en) * | 1994-05-30 | 1995-12-12 | Murata Mfg Co Ltd | Production of ceramic laminated electronic component |
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| JPH11340074A (en) * | 1998-05-28 | 1999-12-10 | Matsushita Electric Ind Co Ltd | Manufacture of grain boundary insulation type laminated semiconductor capacitor |
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-
1999
- 1999-07-21 JP JP11205588A patent/JP2001035747A/en active Pending
-
2000
- 2000-06-28 TW TW089112762A patent/TW452807B/en not_active IP Right Cessation
- 2000-07-10 CN CNB001203320A patent/CN100466120C/en not_active Expired - Lifetime
- 2000-07-19 KR KR1020000041291A patent/KR100676035B1/en active IP Right Grant
-
2001
- 2001-05-08 HK HK01103230.3A patent/HK1032664A1/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101145448B (en) * | 2006-09-12 | 2012-03-28 | Tdk株式会社 | Stacked capacitor and electronic device |
| CN106384667A (en) * | 2010-08-18 | 2017-02-08 | 太阳诱电株式会社 | Laminated ceramic electronic component |
| CN106384667B (en) * | 2010-08-18 | 2018-09-28 | 太阳诱电株式会社 | Laminate-type ceramic electronic component |
| US10409709B2 (en) | 2015-09-25 | 2019-09-10 | Huawei Technologies Co., Ltd. | Debugging method, multi-core processor and debugging device |
| CN109313984A (en) * | 2016-04-26 | 2019-02-05 | Tdk电子股份有限公司 | The application of multilayer device and external electrode |
| US11145461B2 (en) | 2016-04-26 | 2021-10-12 | Tdk Electronics Ag | Multilayer component and use of outer electrodes |
Also Published As
| Publication number | Publication date |
|---|---|
| TW452807B (en) | 2001-09-01 |
| KR100676035B1 (en) | 2007-01-29 |
| CN100466120C (en) | 2009-03-04 |
| HK1032664A1 (en) | 2001-07-27 |
| KR20010015363A (en) | 2001-02-26 |
| JP2001035747A (en) | 2001-02-09 |
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