CN1277671A - 多模式双相冷却组件 - Google Patents
多模式双相冷却组件 Download PDFInfo
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- CN1277671A CN1277671A CN98810597A CN98810597A CN1277671A CN 1277671 A CN1277671 A CN 1277671A CN 98810597 A CN98810597 A CN 98810597A CN 98810597 A CN98810597 A CN 98810597A CN 1277671 A CN1277671 A CN 1277671A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种多模式、双相冷却组件(10)包括第一壳体部(20),第二壳体部(30),和第三壳体部(40)。冷却液(22)被存放在第一壳体部(20)中,而一个或多个电子元件(24)则被安装在所要液池冷却的第一壳体部(20)的外表面上。第二壳体部(30)在其一个内表面上固定有一个或多个喷雾喷嘴(32),而在其一个外表面上与喷雾喷嘴(32)相对应的位置上则安装有一个或多个电子元件(34)。第三壳体部(40)在其内表面上具有一个或多个冷凝器(42),而在外表面上则具有一个或多个散热器(44)。在冷凝器(42)的内表面邻近处提供一个或多个电扇(46),压电风扇或喷雾喷嘴(48)。冷却组件(10)由导热材料制成。
Description
本发明的一般涉及一种用于电子元件的冷却组件,具体涉及一种适用于高功率和低功率电子元件配置的多模式、双相冷却组件。
近年来,随着集成电路(IC)元件的电子封装技术的不断进步,电子元件的集成密度越来越高,从而使得电子设备中所产生的热量也相应地越来越多。其结果是,先进电子设备对散热能力的要求相应地变得越来越高。
通常方法是利用气冷系统来冷却电子设备。而现在,为了减小电子器件的装配尺寸,不得不将许多高热通量部件彼此靠得很近,超出了当前气冷技术的能力。
另外,还常采用的一种方法是利用单相液体冷却系统来冷却电子元件。但是液体冷却需要外置的冷凝旋管和/或显著的管路设备。因此,液体冷却系统相对地尺寸要大,重量要沉,且成本也要高。
用于冷却航空电子设备的现有技术系统中,有多种方法均采用了热管。热管是一种用于中继内部蒸发和冷凝循环的密封热动力学系统。其包括一个外壳,内衬于该外壳内壁的管芯材质,以及用于浸湿该管芯的工作流体。该热管的一端被称为蒸发器,其用于吸收热能。在蒸发器中所形成的蒸汽被传送到该热管的另一端,其被称为冷凝器,并由其来释放热能。而随后液体通过该热管内部的一种管芯结构被回送到蒸发器中,由此便完成了整个过程。此种热管性能的好坏很大程度上取决于工作温度,管芯干燥程度,以及内部产生不可冷凝气体的情况。因此,热管技术仅限于对于低功率电子元件的冷却。
喷雾冷却技术可以被用来冷却高散热电子元件。通常,喷雾冷却的排热级较其它技术要大一些。在喷雾冷却系统中,来自储液器中的液体被泵压到喷雾组件中。随后再将其喷雾到所要冷却的区域。器件所散发的热量将使该液体蒸发,由此吸收或排去了部分的热量。利用泵使剩余的液体和蒸汽流过冷凝器。随后,该泵将冷却后的液体送回到储液器中,以进行循环再用。然而,在喷雾冷却系统工作的过程中,可能会从上述液体或构造材料中释放出一些不可冷凝气体。由于这些不可冷凝气体将占据工作蒸汽的位置,并阻碍蒸汽与冷凝器表面相接触,所以冷凝器的性能将会下降。因此,不可冷凝气体的产生,将会严重损害热管和喷雾冷却组件的排热效率。
在本发明的一种实施例中,提供了一种用于电子元件的多模式、双相冷却组件,其包括3个部分:第一壳体部,第二壳体部,和第三壳体部。
冷却液被保存在第一壳体部或储液器部的内腔中。在该第一壳体部的外表面上安装有一个或多个电子元件。这些电子元件可以是低-到-中等功率的电子元件。
第二壳体部或蒸发器部具有一个或多个固定于内表面上的喷雾喷嘴。而一个或多个高功率电子元件则被安装在其一个外表面上与这些喷雾喷嘴相对的位置上。
第三壳体部或冷凝器部在其内表面上至少具有一个冷凝器,而在外表面上则至少具有一个散热器。
根据本发明的另一种实施例,上述冷却组件包含有电扇,压电风扇,或喷雾喷嘴,以用于避免不可冷凝气体聚集在冷凝器的内表面上,同时用于加大不可冷凝气体和冷却液蒸汽的紊流程度,以促使其相互混合。
图1所示为根据本发明一种实施例的多模式、双相冷却组件的剖面图;
图2所示为根据本发明的另一种实施例的多模式、双相冷却组件的剖面图;
图3所示为根据本发明再一种实施例的多模式、双相冷却组件的剖面图。
参照图1,在本发明的一种实施例中,根据本发明的一种用于冷却电子元件的多模式、双相冷却组件10包括:第一壳体部20,第二壳体部30和第三壳体部40。
第一壳体部20起到了存放冷却液22的液体容器的作用。冷却液22可以选用水、酒精、全氟介质液体,或其它类型的相变液体。在下部20的外表面上安装有一个或多个低功率电子元件24。并通过冷却液22的液池沸腾来冷却电子元件24。尽管出于例示的目的,图1中只显示了一个电子元件24,但实际上电子元件的数目决不仅局限于一个。
第二壳体部30在其内表面上固定有一个或多个喷雾喷嘴32。而在冷却组件10一个外表面上与喷雾喷嘴32相对应的位置上,则安装有一个或多个高功率电子元件34。第一壳体部20中的冷却液22可流通到喷雾喷嘴32处。通过泵26将冷却液22提供给喷雾喷嘴32。一旦与第二壳体部30的受热部分相接触,一部分冷却液22将变为蒸汽36。而其余部分的冷却液22则将仍保持液态,并流回到第一壳体部20。冷却蒸汽36通过第二壳体部30上升到第三壳体部40中。尽管出于例示的目的,图1中只显示一个喷雾喷嘴32和一个高功率电子元件34,但实际上喷雾喷嘴32与高功率电子元件34的数目并不仅局限于一个。
第三壳体部40内表面上包含有一个或多个冷凝表面42,同时在外表面上具有一个或多个散热器44。在冷凝表面42上,冷却蒸汽36将被冷凝。通过冷凝器42与散热器44之间的热交换,可以在冷却组件10的外部除去热量。散热器44可以是散热片,或诸如此类。
在本实施例中,冷却组件10具有一种铜焊和/或金属焊组装结构,允许在其外表面上安装多个电子元件。用于加工冷却组件10的金属材料由铜、不锈钢、铝或诸如此类的材料组成。由于冷却组件10的材料是金属,所以本发明可以被用作电子元件24和34的地参考电平。
参照图2,其所示为根据本发明另一种实施例的用于冷却电子元件的多模式、双相冷却组件10。在此实施例中,第一壳体部20和第二壳体部30的结构与上文中所述实施例的结构相同。然而,第三壳体部40则包含有一个靠近冷凝器42内表面的导流器。尽管图2所示该实施例的导流器是一部电扇46,但实际上导流器并不仅限于电扇,比如说也可以是压电风扇,喷雾喷嘴或任何其它可操作来在某特定介质或组合介质中引起流动的装置。如图3所示,其是利用喷雾喷嘴48来引起流动的。该喷雾喷嘴48可以与第二壳体部30中所用的喷雾喷嘴32相同。同时,导流器的位置并不仅局限于图2和图3中所示的位置。实际上,导流器可以处于冷却组件10的第三壳体部40内部的任何位置,只要其能够引起不可冷凝气体和冷却液蒸汽产生紊流即可。
当通过液池沸腾方式冷却电子元件24或对电子元件34进行喷雾冷却时,将会产生冷却液蒸汽,同时也可能会释放出不可冷凝气体。这些冷却液蒸汽和不可冷凝气体上升到冷却组件10的第三壳体部40中,并趋向于聚集在冷凝器42的内表面上。气体的上述聚集情况将影响冷凝器42的排热效率。另外,由于同时存在不可冷凝气体和冷却液蒸汽,冷却组件10内部的压力将会增大,由此将会使冷却液22的蒸发温度(沸点)升高,从而使得根据本发明的该种双相冷却组件10的相变冷却效率下降。
在第二实施例中,诸如压电风扇,电扇,或喷雾喷嘴等类型导流器的功能是,增加不可冷凝气体和冷却液蒸汽的紊流程度,以使其相互混合,并使得先前所存留的冷却液22从冷却组件10的第三壳体部40的内表面上移走。因此,该实施例的冷却组件10的热交换效率可以得到提高。
其应被理解的是,导流器46或48的数目,以及每个导流器46或48的方向均不受限制,只要其能够引起有效的紊流,使不可冷凝气体和冷却液蒸汽能够有效地混合即可。
尽管如图1,2,3中所示,泵26均被安装在多模式、双相冷却组件10的外部,但实际上也可以将其安装在内部。
另外,不必非得是冷凝表面42,也可以将散热片或不规则表面用作第三壳体部40中的冷凝器。
尽管上文中结合其多种实施例对本发明进行示意性地说明,但在不背离本发明的精神和范围的情况下可以对其进行多种形式的变型。
Claims (6)
1.一种双相冷却组件,包括:
形成了内腔的外壳,该内腔具有第一部分和第二部分,第一部分存放有第一流体,该种第一流体具有第一状态和第二状态,第二部分存放有第二流体和处于第二状态的第一流体;以及
位于第二部分中的导流器,该导流器将第二流体和处于第二状态的第一流体混合在一起,以使第一流体从第二状态变为第一状态,并流回到第一部分中。
2.如权利要求1所述的双相冷却组件,其特征在于第一部分包括储液器,同时第二部分包括蒸发器。
3.如权利要求2所述的双相冷却组件,其特征在于另外包括:
靠近蒸发器的冷凝器,第一流体经过该冷凝器从蒸发器输送回储液器中。
4.如权利要求1所述的双相冷却组件,其特征在于第一流体由全氟化碳流体组成。
5.如权利要求4所述的双相冷却组件,其特征在于第二流体由空气组成。
6.如权利要求5所述的双相冷却组件,其特征在于上述第一和第二状态分别是液态和气态。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/960,395 | 1997-10-29 | ||
US08/960,395 US5924482A (en) | 1997-10-29 | 1997-10-29 | Multi-mode, two-phase cooling module |
Publications (2)
Publication Number | Publication Date |
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CN1277671A true CN1277671A (zh) | 2000-12-20 |
CN1179186C CN1179186C (zh) | 2004-12-08 |
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Application Number | Title | Priority Date | Filing Date |
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CNB988105977A Expired - Fee Related CN1179186C (zh) | 1997-10-29 | 1998-07-31 | 多模式双相冷却组件 |
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Country | Link |
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US (1) | US5924482A (zh) |
EP (1) | EP1049905A4 (zh) |
JP (1) | JP2001521138A (zh) |
KR (1) | KR100367043B1 (zh) |
CN (1) | CN1179186C (zh) |
WO (1) | WO1999022192A1 (zh) |
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- 1998-07-31 KR KR10-2000-7004582A patent/KR100367043B1/ko not_active IP Right Cessation
- 1998-07-31 EP EP98938206A patent/EP1049905A4/en not_active Withdrawn
- 1998-07-31 CN CNB988105977A patent/CN1179186C/zh not_active Expired - Fee Related
- 1998-07-31 JP JP2000518245A patent/JP2001521138A/ja active Pending
Cited By (4)
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CN103982959A (zh) * | 2013-09-29 | 2014-08-13 | 郭舜成 | 热量传递装置、温度冷却装置和温度聚集装置 |
CN103982959B (zh) * | 2013-09-29 | 2017-08-11 | 郭舜成 | 热量传递装置、温度冷却装置和温度聚集装置 |
CN107282463A (zh) * | 2016-04-13 | 2017-10-24 | 伟立精密机械有限公司 | 可程控的自动降温系统 |
CN112696961A (zh) * | 2019-10-23 | 2021-04-23 | 北京航空航天大学 | 一种三级相变换热器 |
Also Published As
Publication number | Publication date |
---|---|
KR100367043B1 (ko) | 2003-01-09 |
EP1049905A4 (en) | 2002-01-09 |
CN1179186C (zh) | 2004-12-08 |
WO1999022192A1 (en) | 1999-05-06 |
EP1049905A1 (en) | 2000-11-08 |
KR20010031540A (ko) | 2001-04-16 |
JP2001521138A (ja) | 2001-11-06 |
US5924482A (en) | 1999-07-20 |
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