CN1276694C - Flexible printed circuit board - Google Patents
Flexible printed circuit board Download PDFInfo
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- CN1276694C CN1276694C CN 03125489 CN03125489A CN1276694C CN 1276694 C CN1276694 C CN 1276694C CN 03125489 CN03125489 CN 03125489 CN 03125489 A CN03125489 A CN 03125489A CN 1276694 C CN1276694 C CN 1276694C
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- wiring board
- flexible print
- print wiring
- insulating substrate
- terminal structure
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Abstract
The present invention relates to a flexible printed circuit board which comprises an insulating base material, a line layer, a terminal structure layer and a plurality of gold fingers, wherein the line layer is formed on the susrface of the insulating base material and comprises a plurality of conductive line patterns; the terminal structure layer is positioned on at least one lateral side of the insulating base material; the interface of the terminal structure layer and the insulating base material is in a wave shape; the gold fingers are positioned in the terminal structure layer and have a plurality of terminal contact points with the conductive line patterns for mutual connection.
Description
(1) technical field
The relevant a kind of printed circuit board (PCB) of the present invention refers to a kind of flexible print wiring board especially.
(2) background technology
Flexible print wiring board (Flexible Printed Circuit Board; Be called for short FPC) be printed circuit board (PCB) (Printed Circuit Board; PCB) the most complicated in the product, purposes is maximum.FPC is with a flexible copper foil substrate in fact, through processing technology such as etching, stays required circuit at last and is made as the media of electronic product signal transmission.Flexible print wiring board mainly is in order to electronic component mounting, as elements such as integrated circuit (IC) chip, resistance, electric capacity, connectors, so that electronic product can be brought into play set function, usually is applied in the fields such as connection between small-sized or thin type electronic mechanism and hardboard.
FPC has multiple advantage and characteristic: have the height flexibility, but three-dimensional wiring changes shape according to spatial limitation 1..2. high-low temperature resistant, anti-combustion.3. collapsible and do not influence signal transfer function, can prevent electrostatic interference.4. chemical change is stable, stability, Reliability height.5. be beneficial to the design of Related product, in the time of can reducing the assembler and mistake, and the useful life of improving relevant product.6. make the application product volume-diminished, weight significantly alleviates, and function increases, and cost reduces.Therefore, the modern science and technology electronic product emphasize compact, can roll in the flexible trend, the application of soft printed circuit board is quite extensive, and its development also just more seems important in relevant electronic industry.
In general, the function of FPC can be divided into four kinds, and it respectively can be as lead (Lead Line), printed circuit (Printed Circuit), connector (Connector) and multi-functional integration system (Integrationof Function).As FPC during as lead, can be applicable to connection between rigid printed circuit board (PCB) or stereo circuit, movable circuit, high-density circuit etc., for example: fascia, printer, hard disk drive, floppy disk, facsimile machine, mobile phone, notebook computer etc.As FPC during, can be applicable to the slim stereo circuit of high density, for example: camera, video camera, CD-ROM, wrist-watch etc. as printed circuit.As FPC during, can be applicable to the connection between low-cost hardboard as multi-functional integration system.As FPC during, can be applicable to the integration of hardboard lead and connector, for example: computer, camera, medical instruments and equipment as printed circuit.It is of many uses, has contained scopes such as computer, computer peripheral auxiliary system, consumer people's livelihood electrical equipment and automobile.
See also Fig. 1, it is the schematic diagram of the flexible print wiring board structure of prior art.This flexible print wiring board 10 includes an insulating substrate 11, a line layer 12 and a terminal structure layer 13.See also Fig. 2, it is the enlarged diagram of the flexible print wiring board structure of prior art.Wherein this line layer 12 is to be formed at these insulating substrate 11 surfaces and to comprise a plurality of conducting wires pattern 15, this terminal structure layer 13 then is positioned at the side of this insulating substrate 11, be electrically connected in order to conduction, wherein include a plurality of golden fingers 18, and a plurality of terminal connections 19 are arranged to interconnect between golden finger 18 and this a plurality of conducting wires pattern 15.As previously mentioned, flexible print wiring board 10 has the height flexibility, usually need to cooperate different device and bent, and the part of Chang Zuowei bending place is a terminal structure layer 13 and the interface 17 of this insulating substrate 11.Generally speaking; this interface 17 does not pass through any particular design; and according to P=F/A; the principle that pressure and lifting surface area are inversely proportional to; when this interface 17 was rolled over by plate, the pressure that it produced was then born by the interface 16 between each golden finger 18 and the insulating substrate 11, at this moment; because stress is comparatively concentrated, so the interface 16 between golden finger 18 and the insulating substrate 11 usually has the situation of fracture.When between golden finger 18 and the conducting wire pattern 15 be electrically connected broken string the time, just can cause short circuit, and then reduced the yield of product, still more, because this broken string situation also is difficult for being detected at once, if just detect this broken string situation when waiting to finish the part assembling, then spent supernumerary's power and cost this moment, economy is just very poor.
In summary, how to reduce the fracture situation that the interface 16 between golden finger 18 and the insulating substrate 11 is taken place, prevent the generation of short circuit,, promptly become the urgent problem that related industry is now desired most ardently solution improve to produce yield and to reduce production costs simultaneously.
(3) summary of the invention
Therefore just require to provide a kind of flexible print wiring board, not only exempt the situation that in the prior art usually rupture in the interface between the golden finger and insulating substrate, do not need extra step on the processing procedure yet, can satisfy the demand that reduces cost, and further improve the yield of product, can in industry, widely apply enforcement.
Flexible print wiring board according to an aspect of the present invention, it comprises: an insulating substrate; One line layer, it is to be formed at this insulating substrate surface and to comprise a plurality of conducting wires pattern; One terminal structure layer, it is at least one side that is positioned at this insulating substrate, wherein the interface of this terminal structure layer and this insulating substrate is to present a wave-like; And a plurality of golden fingers, its in this terminal structure layer and and this a plurality of conducting wires pattern between a plurality of terminal connections are arranged to interconnect.
According to above-mentioned conception, this interface of this terminal structure layer and this insulating substrate is the bending interface as this flexible print wiring board structure.
According to above-mentioned conception, this wave-like is made up of the identical circular arc of a plurality of flexibility.
According to above-mentioned conception, these a plurality of golden fingers standoff distance between any two is all identical.
According to above-mentioned conception, this standoff distance is bigger, and then the flexibility of these a plurality of circular arcs is littler.
According to above-mentioned conception, this circular arc the center be to be positioned on the vertical center line of this golden finger.
According to above-mentioned conception, this insulating substrate is to be a kind of flexible insulating trip.
According to above-mentioned conception, this flexible insulating trip is that thermoplastic synthetic material is made.
According to above-mentioned conception, this thermoplastic synthetic material is to be selected from polyester (Polyester; PE), poly-2,6-is dioctyl phthalate second diester (Polyethylene-2,6-naphthalatc how; PEN), polyphenylene oxide (Polyphenylenesulfide; PPS), polyimides (Polyimide; PI), inferior acyl acid (Polyamic acid) fiber, tempered glass fibrous composite and fluorine carbon resin one of them.
According to above-mentioned conception, this line layer is to form with mode of printing.
According to above-mentioned conception, this a plurality of conducting wires pattern is that one of them is made by being selected from electro copper foil, calendering (Rolled) Copper Foil, Mock gold, aluminium, nickel-base alloy (Inconel), stainless steel and conducting polymer.
The present invention's flexible print wiring board on the other hand, it is to comprise an insulating substrate; A plurality of line layers, it is upper surface or the lower surface that is formed at this insulating substrate, and each these a plurality of line layer is to comprise a plurality of conducting wires pattern; One terminal structure layer, it is at least one side that is positioned at this insulating substrate, wherein the interface of this terminal structure layer and this insulating substrate is to present a wave-like; And a plurality of golden fingers, its in this terminal structure layer and and this a plurality of conducting wires pattern between a plurality of terminal connections are arranged to interconnect.
According to above-mentioned conception, this interface of this terminal structure layer and this insulating substrate is the bending interface as this flexible print wiring board.
According to above-mentioned conception, this wave-like is made up of the identical circular arc of a plurality of flexibility.
According to above-mentioned conception, these a plurality of golden fingers standoff distance between any two is all identical.
According to above-mentioned conception, this standoff distance is bigger, and then the flexibility of these a plurality of circular arcs is littler.
According to above-mentioned conception, this circular arc the center be to be positioned on the vertical center line of this golden finger.
According to above-mentioned conception, this insulating substrate is to be a kind of flexible insulating trip.
According to above-mentioned conception, this flexible insulating trip is that thermoplastic synthetic material is made.
According to above-mentioned conception, this thermoplastic synthetic material is to be selected from by polyester (Polyester; PE), poly-2,6-is dioctyl phthalate second diester (Polyethylene-2,6-naphthalatc how; PEN), polyphenylene oxide (Polyphenylene sulfide; PPS), polyimides (Polyimide; PI), inferior acyl acid (Polyamicacid) fiber, tempered glass fibrous composite and fluorine carbon resin one of them.
According to above-mentioned conception, these a plurality of line layers are to form with mode of printing.
According to above-mentioned conception, this a plurality of conducting wires pattern is that one of them is made by being selected from electro copper foil, calendering (Rolled) Copper Foil, Mock gold, aluminium, nickel-base alloy (Inconel), stainless steel and conducting polymer.
Flexible print wiring board of the present invention, in this structure, the interface of its terminal structure layer and insulating substrate is difficult for being fractureed, and can prevent to be electrically connected broken string, the just situation that can not be short-circuited between terminal structure layer and the conducting wire pattern; This structure is to present a wave-like at the interface of terminal structure layer and insulating substrate, thereby the area at the interface between golden finger and the insulating substrate becomes big, therefore when this interface is bent, stress is disperseed and pressure diminishes, so the interface between golden finger and the insulating substrate is difficult for being fractureed.
(4) description of drawings
The present invention more understands in depth and can obtain one by following accompanying drawing and detailed description:
Fig. 1 is the structural representation of the flexible print wiring board of prior art.
Fig. 2 is the structure enlarged diagram of the flexible print wiring board of prior art.
Fig. 3 is the structural representation of the flexible print wiring board of a preferred embodiment of the present invention.
Fig. 4 is the enlarged diagram of the flexible print wiring board of a preferred embodiment of the present invention.
Fig. 5 is the golden finger enlarged diagram in the flexible print wiring board structure of a preferred embodiment of the present invention.
Fig. 6 is the golden finger enlarged diagram in the flexible print wiring board structure of another preferred embodiment of the present invention.
(5) embodiment
Flexible print wiring board of the present invention can fully be understood by following embodiment explanation, make person skilled in the art scholar to finish according to this, yet enforcement of the present invention be not to be limited it to implement kenel by the following example.
See also Fig. 3, it is the structural representation of the flexible print wiring board of a preferred embodiment of the present invention.This flexible print wiring board 30 includes an insulating substrate 31, a circuit 32 and a terminal structure layer 33.See also Fig. 4, it is the enlarged diagram of the flexible print wiring board of a preferred embodiment of the present invention, wherein this line layer 32 is to be formed at these insulating substrate 31 surfaces and to comprise a plurality of conducting wires pattern 35, this terminal structure layer 33 then is positioned at a side of this insulating substrate 31, is electrically connected in order to conduction.Certainly, this terminal structure layer 33 is not limited to only be positioned at a side, its also visual demand and be positioned at dual-side simultaneously.Include a plurality of golden fingers 38 in this terminal structure layer 33, and a plurality of terminal connections 39 are arranged to interconnect between golden finger 38 and this a plurality of conducting wires pattern 35.
According to another preferred embodiment of the present invention, flexible print wiring board 30 of the present invention, its insulating substrate 31 is to be a kind of flexible insulating trip, flexibility with height, not only can change shape according to spatial limitation, can not influence signal transfer function when folding yet, its be for thermoplastic synthetic material made, for example: polyester (Polyester; PE), poly-2,6-is dioctyl phthalate second diester (Polyethylene-2,6-naphthalatc how; PEN), polyphenylene oxide (Polyphenylene sulfide; PPS), polyimides (Polyimide; PI), materials such as inferior acyl acid (Polyamic acid) fiber, tempered glass fibrous composite and fluorine carbon resin.The preferably, 32 of this line layers can form by mode of printing, and the conducting wire pattern 35 that is formed at insulating substrate 31 surfaces can be made by multiple unlike material, for example: electro copper foil, calendering (Rolled) Copper Foil, Mock gold, aluminium, nickel-base alloy (Inconel), stainless steel and conducting polymer or the like.
In the present invention, flexible print wiring board 30 is as the interface of bending place, the interface 37 of terminal structure layer 33 and this insulating substrate 31 just, and it is to present a wave-like.As shown in Figure 4, the wave-like of this interface 37 is made up of the identical circular arc of a plurality of flexibility, and each golden finger 38 between any two (L1 with the L2 between) length of all being separated by identical apart from d.See also Fig. 5, it is the golden finger enlarged diagram in the flexible print wiring board structure of a preferred embodiment of the present invention.When this interface 37 is bent, the pressure that it produced is to be born by the arc surface 50 between each golden finger 38 and the insulating substrate 31, at this moment, according to P=F/A, the principle that pressure and lifting surface area are inversely proportional to, because lifting surface area is become by interface originally 36 and becomes arc surface 50 greatly, therefore pressure diminishes, different with the situation that in the prior art stress is concentrated on interface 36, the present invention makes stress be spread out by this arc surface 50, therefore, the interface 37 between golden finger 38 and the insulating substrate 31 also just is difficult for the time rupturing in bending, and being electrically connected also between golden finger 38 and the conducting wire pattern 35 broken and situation of short circuit with regard to not taking place.According to invention of the present invention, the wave-like of this interface 37 is designed according to golden finger 38 standoff distance d between any two, heals greatly as this standoff distance d, and then the flexibility of this circular arc is littler.In addition, the center of this arc surface 50 is to be positioned on the vertical center line L1 of this golden finger 38, like this, and when interface 37 stressed bendings, stress just can be distributed on the whole arc surface 50 fifty-fifty, and then more increases the stability of whole flexible print wiring board 30 when bending.In addition, the reason of on average being disperseed owing to stress, flexible print wiring board 30 of the present invention will have more elasticity than the circuit board that in the prior art with the plane is the bending interface, therefore when carrying out the bending of printed circuit board (PCB), can repeatedly be bent and will be difficult for rupturing.
According to another preferred embodiment of the present invention, the interface of this wave-like is not limited to have in the foregoing description the single face circuit board (Single Side FPC) of uniline layer, and the present invention is also applicable to double-sided PCB with multilayer line layer (Double Side FPC) or multilayer circuit board (Multi-layerFPC).The best, structure in this double-sided PCB (or multilayer circuit board) is similar to the above embodiments, yet it has the line layer of bilayer (or multilayer), then will not give unnecessary details all the other identical structures herein, its characteristics are that similarly the interface between this terminal structure layer and this insulating substrate is to be a wave-like, therefore when bending, the interface of this wave-like has bigger elasticity, also is difficult for taking place the situation of fracture.In addition, the present invention is also applicable to soft or hard combined circuit plate (Rigid-Flex Circuit).
See also Fig. 6, it is the golden finger enlarged diagram in the flexible print wiring board structure of another preferred embodiment of the present invention.Wherein, arc surface 52 between golden finger 38 and the insulating substrate 31 is to be down an arc surface, similarly, when this interface 37 is bent, the pressure that it produced is to be born by the arc surface 52 between each golden finger 38 and the insulating substrate 31, at this moment, lifting surface area is become by interface originally 36 and becomes arc surface 52 greatly, therefore pressure diminishes, this embodiment makes stress be spread out by this arc surface 52, just make the interface 37 between golden finger 38 and the insulating substrate 31 be difficult for when bending, rupturing, make this flexible print wiring board structure have more elasticity simultaneously.Similarly, the center of this circular arc 52 is to be positioned on the vertical center line L1 of this golden finger 38, like this, and when interface 37 stressed bendings, stress just can be distributed on the whole arc surface 52 fifty-fifty, and then more increases the stability of whole flexible print wiring board 30 when bending.
In addition, the waveform interface between terminal structure layer and insulating substrate in the above-mentioned preferred embodiment, it does not need extra processing procedure or step to form, and as long as when this flexible print wiring board structure formation, replacing general mould with bending mould pressurizes and gets final product, therefore, flexible print wiring board of the present invention not only structurally has its characteristics and effect, on processing procedure, also only need change a little just can finish easily, and can be under the situation that does not increase extra processing procedure, reach easily to improve and produce yield, the purpose that reduces cost.In sum, flexible print wiring board of the present invention, really exempted the shortcoming that is run in the prior art, when bending flexible print wiring board of the present invention, waveform interface between terminal structure layer and insulating substrate is difficult for being fractureed, thereby can prevent to be electrically connected the generation of broken string and short circuit condition, and not only promoted the yield of flexible print wiring board widely, more reduced production cost.And, flexible print wiring board of the present invention has better elastic, even through repeatedly bending also because most stress is the arc surface at this wave interface to be disperseed, and difficult fracture the, thereby can provide a structural stability high flexible print wiring board.
Claims (12)
1. flexible print wiring board, it comprises:
One insulating substrate;
One line layer, it is to be formed at this insulating substrate surface and to comprise a plurality of conducting wires pattern;
One terminal structure layer, it is at least one side that is positioned at this insulating substrate, wherein the interface of this terminal structure layer and this insulating substrate is to present a wave-like; And
A plurality of golden fingers, its in this terminal structure layer and and this a plurality of conducting wires pattern between a plurality of terminal connections are arranged to interconnect.
2. flexible print wiring board as claimed in claim 1, this interface that it is characterized in that this terminal structure layer and this insulating substrate are the bending interfaces as this flexible print wiring board.
3. flexible print wiring board as claimed in claim 1 is characterized in that this wave-like is made up of the identical circular arc of a plurality of flexibility.
4. flexible print wiring board as claimed in claim 3 is characterized in that these a plurality of golden fingers standoff distance between any two is all identical.
5. flexible print wiring board as claimed in claim 4 is characterized in that this standoff distance is bigger, and then the flexibility of these a plurality of circular arcs is littler.
6. flexible print wiring board as claimed in claim 5, the center that it is characterized in that this circular arc are to be positioned on the vertical center line of this golden finger.
7. flexible print wiring board as claimed in claim 1 is characterized in that this insulating substrate is to be a kind of flexible insulating trip.
8. flexible print wiring board as claimed in claim 7 is characterized in that this flexible insulating trip is that thermoplastic synthetic material is made.
9. flexible print wiring board as claimed in claim 8, it is characterized in that this thermoplastic synthetic material is to be selected from polyester, poly-2,6-how dioctyl phthalate second diester, polyphenylene oxide, polyimides, inferior acyl acid fiber, tempered glass fibrous composite and fluorine carbon resin one of them.
10. flexible print wiring board as claimed in claim 1 is characterized in that this line layer is to form with mode of printing.
11. flexible print wiring board as claimed in claim 1 is characterized in that this a plurality of conducting wires pattern is that one of them is made by being selected from electro copper foil, rolled copper foil, Mock gold, aluminium, nickel-base alloy, stainless steel and conducting polymer.
12. a flexible print wiring board, it comprises:
One insulating substrate;
A plurality of line layers, it is upper surface or the lower surface that is formed at this insulating substrate, and each these a plurality of line layer comprises a plurality of conducting wires pattern;
One terminal structure layer, it is at least one side that is positioned at this insulating substrate, wherein the interface of this terminal structure layer and this insulating substrate is to present a wave-like; And
A plurality of golden fingers, its in this terminal structure layer and and this a plurality of conducting wires pattern between a plurality of terminal connections are arranged to interconnect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03125489 CN1276694C (en) | 2003-09-23 | 2003-09-23 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03125489 CN1276694C (en) | 2003-09-23 | 2003-09-23 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1602134A CN1602134A (en) | 2005-03-30 |
| CN1276694C true CN1276694C (en) | 2006-09-20 |
Family
ID=34658758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03125489 Expired - Fee Related CN1276694C (en) | 2003-09-23 | 2003-09-23 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1276694C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100546441C (en) * | 2006-07-19 | 2009-09-30 | 比亚迪股份有限公司 | A kind of manufacture method of multi-layer flexible circuit board |
-
2003
- 2003-09-23 CN CN 03125489 patent/CN1276694C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1602134A (en) | 2005-03-30 |
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Granted publication date: 20060920 Termination date: 20120923 |