CN1276530A - Probe unit for inspection of base board for assemblying semiconductor chip - Google Patents
Probe unit for inspection of base board for assemblying semiconductor chip Download PDFInfo
- Publication number
- CN1276530A CN1276530A CN00117650A CN00117650A CN1276530A CN 1276530 A CN1276530 A CN 1276530A CN 00117650 A CN00117650 A CN 00117650A CN 00117650 A CN00117650 A CN 00117650A CN 1276530 A CN1276530 A CN 1276530A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- probe unit
- substrate
- inspection
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The present invention is to prevent a damage to a contact probe unit when applying the unit to a based board carrying semiconductor chips due to collision with a land portion of the base board. In a contact probe unit 3 including contact needles 5 disposed in an uppermost layer 8 thereof, a contact needle area 6 thereof is recessed with respect to a peripheral part 7 surrounding the contact needle area 6. The recessed depth D is smaller than the initial projection S (full stroke) of the contact needles 5 so that solder balls 9 are prevented from touching the peripheral parts 10a of needle guide holes 10 when the base board 1 is brought into contact with the peripheral part 7. Therefore, the part carrying the contact needles is prevented from abutting the base board, and is protected from damages that may otherwise arise due to collision with a terminal on the base board.
Description
The present invention relates to be suitable for the substrate that will load semi-conductor chip is carried out the inspection probe unit of the substrate for mounting semiconductor chip of electricity inspection.
In the last few years, in the semiconductor die assembling encapsulation of CPU or LSI etc.,, constantly carrying out miniaturization by means of surface-mountedization of the densification that is accompanied by chip.Thin typeization.Many pinizations.Fine pitchization.For this reason, the main flow of the substrate for mounting semiconductor chip of surface-mounted nude film or flip-chip is also becoming from existing ceramic substrate and is being the multilayer plastic substrate below the 1mm.
In addition, in the open/shorts check of base board for assemblying semiconductor chip, on the table back of the body two sides of substrate, formed under the situation of weld zone (electrode), make inspection, carried out electricity inspection (open/shorts check) with the table back of the body two sides contact of probe from substrate.The figure of the nude film of substrate or flip-chip assemblies one lateral electrode disposes, and will become certainly to be close state, and the figure on the face of an opposite side (side of motherboard is installed) disposes, and will become usually to be rare state.
For such substrate, further make the processing speed high speed again, people as shown in Figure 9, have considered a kind of method that solder ball 9 and chip LSI directly are connected from existing chip that carries out with gold wire bonding and the method for attachment between the substrate.In addition, in the drawings, on the chip fitting surface 1a of substrate for mounting semiconductor chip 1, installing solder ball 9 accordingly, solder ball 9 and terminal T are welded, chip LSI is being connected on the substrate 1 with number with a plurality of terminal T (electrode) of chip LSI.
In addition, as probe unit, it can be the sort of structure shown in Figure 10, being configured to shown in the figure: make pair of conductive spicule 5,21 are attached on two ends of collapse coil spring 22, and carrying out lamination by means of handle, make collapse coil spring 22 and each spicule 5,21 enlarged- diameter body 5a, 21a is contained in the retainer hole 23a on the intermediate member 23 that is arranged on multi-ply construction, intermediate member is clamped in the middle the superiors and undermost each member 8,24, initial loading is offered under the state of collapse coil spring 22, fix each body 5a, 21a.Upside spicule among the figure 5 is used as the inspection pin in addition, and downside spicule 21 becomes as shown in the figure to making and always contacts with outside terminal for connecting member 25.
But as shown in Figure 9, above-mentioned solder ball 9 is provided so that on the chip loading surface 1a that is loaded into substrate 1, all the highlighting from chip loading surface 1a of solder ball 9.In addition, because the densification of chip, for example becoming at the diameter of solder ball 9 is that it is about 200 microns that the pitch that each solder ball is 9 also will become under 100 microns the situation, checks also minor diameterization correspondingly of pin.
To such substrate for mounting semiconductor chip, make the substrate that should check with above-mentioned probe unit and probe unit near when, as shown in figure 11, sometimes to be pressed into and check pin (upside spicule) 5 until this inspections pin 5 becomes to till the total travel state interior state of pin supporting hole 10 of the superiors' member 8 (top of checking pin 5 submerge).As mentioned above, when the minor diameter pin supporting hole 10 that is accompanied by inspection pin 5 also minor diameter, will produce solder ball 9 and meet on the edge 10a of pin supporting hole 10, and cause the problem of damage for pin supporting hole 10.The electrode of other shape in addition, is not limited to solder ball, even if also can produce the problems referred to above as electrode.
In order to solve such problem, prevent that the electrode because of bumped substrate one side from damaging the purpose of probe unit when being implemented in the inspection to substrate for mounting semiconductor chip, in the present invention, this probe unit is a kind of like this inspection probe unit of substrate for mounting semiconductor chip: carry out electricity when checking being equipped with a plurality of terminal substrate for mounting semiconductor chip to semi-conductor chip or in order to be connected with external circuit, with the face of above-mentioned substrate for mounting semiconductor chip face-off on, be mapped to haunt freely to be provided in above-mentioned a plurality of terminals and be endowed a plurality of inspection pins that bullet is sent out potential energy on the projected direction, make the part that is equipped with above-mentioned a plurality of inspection pins, be arranged with to making for the part that the part that is equipped with above-mentioned a plurality of inspection pins is fenced up and touching before above-mentioned inspection pin on the above-mentioned terminal submerges fully, the part of above-mentioned probe unit touches on the above-mentioned substrate for mounting semiconductor chip.
If adopt this method, owing to can prevent when checking, make a part that is equipped with the inspection pin of the probe unit part that fences up is touched earlier on the substrate, by means of this, the part that is equipped with the inspection pin is touched on the substrate, so can prevent to cause damage to the edge in the hole of supporting the inspection pin.
In addition, also doing becomes such probe unit: the part of above-mentioned probe unit is made of the protuberance that is arranged on the above-mentioned probe unit, make touching before above-mentioned inspection pin on the above-mentioned terminal submerges fully that the part of above-mentioned probe unit just touches on the above-mentioned substrate for mounting semiconductor chip.If like this, then can obtain and above-mentioned same effect, simultaneously, can also form and be provided with protuberance with other member.
Fig. 1 shows the summary of the testing fixture of using substrate for mounting semiconductor chip of the present invention.
Fig. 2 is the key position oblique view based on the present invention's probe unit.
Fig. 3 is the side view of deciding what is right and what is wrong based on the key position of the present invention's probe unit.
The key position oblique view of the probe unit of Fig. 4 shows illustrated example 2.
The cross-sectional side view of deciding what is right and what is wrong of the key position of the probe unit of Fig. 5 shows illustrated example 3.
The probe unit key position oblique view of Fig. 6 shows illustrated example 4.
The side view of Fig. 7 shows the state of substrate deflection when checking.
Fig. 8 is the figure corresponding with the Fig. 7 that shows illustrated example 5.
The side view of the model utility of Fig. 9 shows the loading main points of loading chip on substrate.
Figure 10 is the key position of the existing probe unit side view of deciding what is right and what is wrong.
The key position expansion sectional view of Figure 11 has illustrated the faulted condition in the existing probe unit.
Below, the concrete example shown in at length describes embodiments of the invention with reference to the accompanying drawings.In addition, in using probe unit of the present invention, its structure also can with in the prior embodiment shown in structure identical, give same label and omit its detailed explanation for those parts identical with the part shown in the conventional example.
The side view of Fig. 1 shows the summary of using the testing fixture of using probe unit of the present invention, and what illustrate is that substrate for mounting semiconductor chip 1 carries out electricity inspection state before.Among the figure, the peripheral part of substrate 1 is supported by the chuck 2 that is used for pushing substrate.Among the figure substrate 1 above be that chip loads a side, be the side that motherboard is installed below, than motherboard one side to be installed many for chip one this side's of side pin count usually, its electrode configuration area is also narrow.
Above substrate 1, be provided with and be equipped with when being used for making it to load the top side probe unit 3 of a plurality of inspection pins of a side contacts, below base plate for packaging 1, then be provided with to be equipped with and make it a side probe unit 4 below motherboard is installed a plurality of inspection pins that a lateral electrode contacts with chip.Like this, after each of a side probe unit 3 checked that chip that pin touches substrate 1 loads on the lateral electrode on make, each that makes a following side probe unit 4 checked that the motherboard that pin touches base plate for packaging 1 installs on the lateral electrode.In addition, make to become these each states, can each probe unit 3,4 be moved up and down with the drive unit that comes that do not draw.
The key position of Fig. 2 oblique view of deciding what is right and what is wrong shows the middle body of a top side probe unit 3.On this on probe unit 3, shown in Figure 9 as conventional example, corresponding with the terminal T of the chip LSI that will load and for dispose a plurality of inspection pins 5 severally.Then, being equipped with each inspection pin of checking pin 5 sets part 6 and is set to fall in for the peripheral part 7 around this part.This processing is set with falling in can be when forming the superiors' member 8 of probe unit, with formation such as processing simultaneously, as shown in Figure 3, can make initial burst outgoing direction aspect ratio (total travel) S that checks pin 5 low, and making its depth D for when substrate 1 touches on the peripheral part 7, solder ball 9 can not contact with the edge 10a of pin supporting hole 10.Say D≤S/2 ideally.
When the probe unit 3 that makes such formation is checked the substrate 1 of object near conduct, check that pin 5 just contacts with solder ball 9, and, in order to add contact loading to a certain degree, also to make probe unit 3 and substrate 1 further close, as shown in Figure 3, peripheral part 7 is touched on the solder ball installed surface 1a of substrate 1.As mentioned above, owing to check that pin sets part 6 and is provided with for peripheral part 7 with falling in, do not checking that pin sets on the edge 10a of the pin supporting hole 10 that forms opening on the part so solder ball 9 can not touch, thereby can prevent from edge 10a to be caused damage because of this touching.
If employing the present invention as long as check that the relation that pin sets part 6 and its foreign side part is a concavo-convex relationship, can have all distortion and is not limited to the foregoing description 1, figure 4 illustrates illustrated example 2.In addition, only give same label and omit detailed description thereof for the part identical with above-mentioned illustrated example.
The probe unit of Fig. 4 on the inspection pin in the superiors' member 8 being set the part that part 6 fences up, in this line top that fences up, is provided with a plurality of protuberances 11 intermittently.This protuberance 11 can form the height suitable with above-mentioned depth D.In this illustrated example 2, after checking that pin 5 touches on the solder ball 9, when probe unit 3 and substrate 1 near the time because each protuberance 11 will touch on the solder ball installed surface 1a of substrate 1, so also have the effect same with above-mentioned illustrated example.
In the formation of raised part 11, certainly the same with above-mentioned illustrated example processing simultaneously when the above-mentioned the superiors of moulding member 8 still, also can set firmly other member, for example, also can stick banded or tabular member.In addition, if though the words of ribbon-shaped members can be carried out compression deformation because of what have elasticity, as long as be equivalent to above-mentioned D at the height that makes elasticity almost lose the moment completely because of distortion.Therefore as long as, also can use the member of all materials of carrying out elastic compression beyond banded, even if in these cases, also be with above-mentioned the same, and the height of almost losing the moment completely in elasticity is equivalent to above-mentioned D and gets final product.
Adopt way as described above, just can be processed into the superiors' member 3 and orlop member 4 same shapes, just can prevent highization of the cost of lamination member because of publicization of mould etc.In addition, also have the position and the shape that can freely determine to be provided with protuberance 11 grades, the effect of increased design freedom according to object.
In addition, above-mentioned tabular member under the blocked up situation of its thickness, also can be done to become its part is nuzzled.Under situation about imbedding like this, be not limited to tabular member, as shown in Figure 5, also can be embedded to the big part of the diameter of cylindrical member 12 with the level coaxially in the hole 23a of intermediate member 23, the part that diameter is little be set to up from the superiors' member 8 outstanding just in time for the amount t of regulation (=D).In this case, also can obtain and above-mentioned same effect.In addition, be not limited to cylindrical shape, other bar-like shape or drum etc. also can.In addition, can also use the member of their axis direction contraction in length, and make it to have the potential energy that bullet upward sends out and like that the collapse coil spring is accommodated to being fixed in for example above-mentioned hole 23a.In this case, also can till tight coiling, compress the collapse coil spring and make it just in time outstanding above-mentioned t amount so.
In addition, as shown in Figure 6, can also be on the inspection pin in the superiors' member 8 being set the part that part 6 fences up, be arranged on that rectangular area on the whole girth forms and apart from checking that height that pin sets the upper surface of part 6 is t (=D) a convex frame 13.In this case, the same with above-mentioned illustrated example also have an effect that it is fenced up.
In addition, in above-mentioned illustrated example, though illustrate in substrate 1 one sides the example of solder ball 9 is set,, do not have the shape of the specific electrode that is provided with in substrate 1 one sides.For example in the electrode of plane terminal, owing to when touch its terminal surface, the danger of the edge 10a that damages pin supporting hole 10 is arranged, so even if also be effective for other all terminal shapes.
In addition, in above-mentioned illustrated example, though be to be mapped with the small size of checking the chip loading station in the object, around the narrow range of the middle body of the superiors' member 8, protuberance 11 or convex frame 13 are set, but, forming under the situation of substrate 1 with plastic base or the ceramic substrate below the 1mm, under situation about checking with the sort of testing fixture shown in Figure 1, be subjected to influence at the concentrated load of chip loading part office generation, as shown in Figure 7, outermost side Monday at substrate 1 will produce deflection.So the inspection pin 5 of the correspondence of downside probe unit 4 just can not contact with the electrode of the outermost side Monday part that a side is installed at the motherboard that sets electrode in fact on whole of substrate 1 comparatively.
As shown in Figure 8, adopt protuberance 11 is arranged near the most peripheral of the superiors' member 8 way and since become touch substrate 1 for protuberance 11 when checking most peripheral partly on, so can prevent above-mentioned deflection.In addition, because the rigidity of probe unit 3 is than higher, so even if only protuberance 11 is set at most peripheral on partly, the inspection pin that also can bring into play middle body fully sets the above-mentioned effect in the part 6.
As mentioned above, if employing the present invention, because when checking, the part that the part of the inspection pin that is equipped with probe unit is fenced up touches substrate earlier, therefore, can prevent to be equipped with the part of checking pin and touch on the substrate, the terminal that can prevent substrate one side touches on the edge in the hole of supporting to check pin and causes edge damage, not only the terminal to the outstanding shape of solder ball etc. is effectively, also has same effect for other the terminal of various shapes.In addition, employing is arranged on way on the probe unit to protuberance, when can receive with above-mentioned same effect, owing to can form and be provided with protuberance with other member, so when not needing to change the design of probe unit self, can also freely set the position and the shape of protuberance, thereby use and be easy to.
Claims (2)
1, a kind of inspection probe unit of substrate for mounting semiconductor chip, this probe unit is carrying out electricity when checking to semi-conductor chip or the substrate for mounting semiconductor chip that is equipped with a plurality of terminals in order to be connected with external circuit, with the face of above-mentioned substrate for mounting semiconductor chip face-off on, be mapped to haunt freely to be provided in above-mentioned a plurality of terminals and be endowed a plurality of inspection pins that bullet is sent out potential energy on the projected direction
It is characterized in that:
Make the part that is equipped with above-mentioned a plurality of inspection pins, be arranged so that for the part that the part that is equipped with above-mentioned a plurality of inspection pins is fenced up to touch before above-mentioned inspection pin on the above-mentioned terminal submerges fully that the part of above-mentioned probe unit touches earlier on the above-mentioned substrate for mounting semiconductor chip with falling in.
2, a kind of inspection probe unit of substrate for mounting semiconductor chip, this probe unit is carrying out electricity when checking to semi-conductor chip or the substrate for mounting semiconductor chip that is equipped with a plurality of terminals in order to be connected with external circuit, with the face of above-mentioned substrate for mounting semiconductor chip face-off on, be mapped to haunt freely to be provided in above-mentioned a plurality of terminals and be endowed the inspection pin that bullet is sent out potential energy on the projected direction
It is characterized in that:
The part of above-mentioned probe unit is made of the protuberance that is arranged on the above-mentioned probe unit, makes touching before above-mentioned inspection pin on the above-mentioned terminal submerges fully, and the part of above-mentioned probe unit touches earlier on the above-mentioned substrate for mounting semiconductor chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP148729/1999 | 1999-05-27 | ||
| JP11148729A JP2000340924A (en) | 1999-05-27 | 1999-05-27 | Inspection probe unit for substrate mounting semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1276530A true CN1276530A (en) | 2000-12-13 |
| CN1211664C CN1211664C (en) | 2005-07-20 |
Family
ID=15459311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001176501A Expired - Fee Related CN1211664C (en) | 1999-05-27 | 2000-05-26 | Probe unit for inspection of base board for assemblying semiconductor chip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2000340924A (en) |
| KR (1) | KR100743587B1 (en) |
| CN (1) | CN1211664C (en) |
| TW (1) | TW541421B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314970C (en) * | 2003-05-01 | 2007-05-09 | 山一电机株式会社 | Probe unit and its manufacturing method |
| CN100472215C (en) * | 2004-04-27 | 2009-03-25 | 日本麦可罗尼克斯股份有限公司 | Electric connector |
| CN100520414C (en) * | 2004-12-14 | 2009-07-29 | 株式会社爱德万测试 | Contact pin and probe card |
| CN101051056B (en) * | 2006-04-05 | 2011-05-18 | 株式会社联箭技术 | Method of manufacturing mini probe guiding device and mini probe unit |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI230796B (en) * | 2002-11-19 | 2005-04-11 | Nhk Spring Co Ltd | Electric probe system |
| KR100734296B1 (en) * | 2005-12-19 | 2007-07-02 | 삼성전자주식회사 | Socket pin having a self cleaning function and test apparatus including the socket pin |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6276273A (en) * | 1985-09-30 | 1987-04-08 | 日本電気株式会社 | Ic socket |
| JPH06308196A (en) * | 1993-04-22 | 1994-11-04 | Nitto Denko Corp | Test head structure |
| JP2940483B2 (en) * | 1996-08-28 | 1999-08-25 | 日本電気株式会社 | MCM inspection jig |
| JPH10132895A (en) * | 1996-10-25 | 1998-05-22 | Furukawa Electric Co Ltd:The | Electric characteristic inspection device of semiconductor device and its production method |
-
1999
- 1999-05-27 JP JP11148729A patent/JP2000340924A/en active Pending
-
2000
- 2000-05-09 TW TW089108833A patent/TW541421B/en not_active IP Right Cessation
- 2000-05-15 KR KR1020000025746A patent/KR100743587B1/en not_active IP Right Cessation
- 2000-05-26 CN CNB001176501A patent/CN1211664C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314970C (en) * | 2003-05-01 | 2007-05-09 | 山一电机株式会社 | Probe unit and its manufacturing method |
| CN100472215C (en) * | 2004-04-27 | 2009-03-25 | 日本麦可罗尼克斯股份有限公司 | Electric connector |
| CN100520414C (en) * | 2004-12-14 | 2009-07-29 | 株式会社爱德万测试 | Contact pin and probe card |
| CN101051056B (en) * | 2006-04-05 | 2011-05-18 | 株式会社联箭技术 | Method of manufacturing mini probe guiding device and mini probe unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000077271A (en) | 2000-12-26 |
| TW541421B (en) | 2003-07-11 |
| CN1211664C (en) | 2005-07-20 |
| KR100743587B1 (en) | 2007-07-27 |
| JP2000340924A (en) | 2000-12-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050720 Termination date: 20120526 |