CN1264169A - Device and method for testing integral circuit packaging pin welding - Google Patents
Device and method for testing integral circuit packaging pin welding Download PDFInfo
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- CN1264169A CN1264169A CN00100744A CN00100744A CN1264169A CN 1264169 A CN1264169 A CN 1264169A CN 00100744 A CN00100744 A CN 00100744A CN 00100744 A CN00100744 A CN 00100744A CN 1264169 A CN1264169 A CN 1264169A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
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- Length Measuring Devices By Optical Means (AREA)
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Abstract
To improve inspection precision for connection failure by calculating a disagreement for the image position of a lead in first and second image information and detecting whether the connection between the conductive land of a printed circuit board and the lead of an IC package is appropriate by making comparison with a predetermined reference. Illumination light is applied to the surrounding of a soldered part S connecting a conductive land 110 of a printed-circuit board 100 and a lead 12 of an IC package from an illumination light source 520. Then, image information for an upper surface around the soldered part S is inputted by a first camera 510 and at the same time image information for a side surface part around the soldered part S is inputted by a second camera 530, thus obtaining a light intensity image. Then, a disagreement for the image position of the lead 12 is calculated by the intensity image of the first and second cameras 510 and 530 with a computer 550 and is compared with a predetermined reference, thus detecting whether the connection between the conductive land 110 and the lead 12 is appropriate or not.
Description
The present invention relates to and be used for detecting a kind of device and a kind of method that is installed in IC (integrated circuit) the packaging pin welded condition on the printed circuit board (PCB) (PCB).
Usually, little electronic chip such as semiconductor chip or resistance chip all are by welded and installed so that be electrically connected to the circuit pattern layer of a PCB.
For example, as shown in fig. 1, in a kind of IC 10 of flat packaging, in a kind of quad flat package (QFP), a plurality of conductive pins 12 are outstanding from four limits of rectangular mold pressurizing resin 11.These pins 12 are connected to the conductive welding disk 110 of PCB 100 by welding portion s, as shown in Figure 2.
In general, when flat packaging IC 10 is installed on the PCB 100, if the ordered state of pin such as its position, direction, interval and highly do not satisfy certain conditions, pin 12 lifts and can not touch the conductive welding disk 110 of PCB 100 so, as shown in Figure 2, so that can not weld normally, and cause a defective electrical connection.
Therefore, in the real process that flat packaging IC is installed, must provide the step of conductive welding disk 110 with the welded condition of pin 12 of a kind of PCB of detection 100.
Fig. 3 A shows a kind of method and apparatus that is used to detect connection IC packaging pin state of routine to 5C.With reference to these accompanying drawings, a CCD camera 301 is installed, make it have the welding portion s that main incident light axis is connected with the conductive welding disk 110 of PCB 100 perpendicular to the lead-in wire of IC 10. Annular light source 302 and 303 is up and down sequentially arranged so that with camera 301 main incident light axis a common optical axis is arranged.In this case, by alternately illuminating welding portion s, the deformation state that lifts as the IC pin can detect by the brightness and the darkness of displayed image on the monitor 304.
According to the method for above-mentioned conventional sense pin, under the situation that light source 303 is turned off down, last light source 302 impinges upon around the welding portion s.Under this lighting environment, obtain by camera 301 with top image around the welding portion s.When the brightness that obtains image and darkness transformed to binary data, became clear with a surface performance that is similar to a plane in a plane, shown in Fig. 3 B.Here, the upper end face of each pin 12 end of IC encapsulation 10, the end portion of welding portion s upper surface and pad 110 all show bright.
Next, under the situation that last light source 302 is turned off, the irradiate light of following light source 303 at welding portion s so that obtain a new image.The brightness and the darkness that obtain image transform to binary data so that demonstrate the sloping portion of welding portion s, shown in Fig. 3 C.
Shown in Fig. 3 A and 3B, a surveyed area a is set corresponding to the above-mentioned image that transforms to binary data.The size of a slice region and the regional predetermined reference value of permission compare in this surveyed area a, so that the connection status between pin 12 and the pad 110 can be determined.
Yet when pin 12 lifts, shown in Fig. 4 A, be formed at welding portion s under the situation of lower surface of pin 12, this pin 12 generally is placed on the welding portion s.In this case, the planar section of welding portion s exposes.Therefore, in each pictorial information that obtains by the illumination light of alternately launching upper and lower light source 302 and 303, shown in Fig. 4 B and 4C, the thin slice quantitative change must be bigger than tolerance value in the surveyed area, so that the result who detects is treated to a defective of lifting.
Yet,, may exist various types of pins to lift according to the spacing between the pin or because weld period is added to the pin widths that pin attraction each other causes.For example, under welding portion s is formed on situation under the pin 12, when pin 12 is connected in welding portion s top, shown in Fig. 5 A, weld normally without any different with one from the pictorial information demonstration that camera 301 obtains, as shown in Fig. 5 B and 5C, be used for determining that pin lifts the detecting reliability reduction of defective.
Fig. 6 A is that some demonstrations utilize triangulation method to detect the another kind of conventional method of IC packaging pin welded condition and the view of device to 6D.With reference to these accompanying drawings, in the detection method and device of conventional pin, from Laser emission light source 301 emission laser beam, utilize one to be installed near laser emitting source 301 rotatable rotary speculums 302, be deformed into a crack shape with a belt-like form.This laser beam is incident upon the end of pin 12.That part of pictorial information of the laser beam irradiation that obtains from CCD gamma camera 304 is through a completely reflecting mirror 303.When this image was transformed binary data, the line of disconnection was revealed, shown in Fig. 6 B.At this, the height between the expression line apart from d sign pin 12.When utilizing triangulation method to obtain altitude information, just can obtain altitude information, shown in Fig. 6 C at each picture element of each bar line.Also have,, can obtain the altitude information of every part of welding portion s, shown in Fig. 6 D by changing attitude of rotating reflective mirror 302 and the light beam that throws a crack shape to welding portion s.
Therefore, by the more above-mentioned altitude information that obtains and a reference data, can detect the deformation state that lifts as pin.Ref. No. 305 expressions are used for mobile laser emitting source 301, rotate a position determining means of the optional position on speculum 302 and camera 304 to the X-Y coordinates, so that detect the pin that corresponding IC encapsulates four limits.For example, an X-Y robot is installed as position determining means.Correspondence encapsulates the pin that arrange on four limits along IC, and laser emitting source 301 rotates speculum 302, and completely reflecting mirror 303 and camera 304 can rotate 90 ° by position determining means is each.
Although above-mentioned conventional sense method has precision preferably, the shortcoming of this instrument is to cost an arm and a leg.Also have, because the height-limited system of slit-shaped laser beam, according to the elevation information error of a number that goes between or a lead-in wire of spacing generation, so reliability has just reduced.Moreover because use the high-brightness laser light beam, common IC welded encapsulation is to walk abreast with the detection that utilizes a camera and LED illumination.Therefore, must provide an additional isolated plant, thus the complexity that the entire infrastructure of this device just becomes and time of being used to detect extended.Also have,, when a laser beam emission, just produce a selectable reflection according to the angle of welding portion surface tilt because welding portion is corresponding to the surface of speculum.Therefore this is difficult to obtain 3 dimension information of corresponding all belt-like zones.
In order to address the above problem, the purpose of this invention is to provide a kind of method and apparatus that is used to detect an IC packaging pin welding, connect the accuracy of detection of defective by this method and apparatus, the precision that for example is connected by welding to the detection of the defective that the IC packaging pin of PCB pad lifts is enhanced.
In addition in order to achieve the above object, provide a kind of method of the connection status that is used to detect the IC packaging pin that is connected by welding to the PCB conductive welding disk at this, it detects by carrying out the image processing step with an image input device, it is to assign to realize to the weld part that the PCB conductive welding disk is electrically connected with the IC packaging pin by emissive lighting light, first pictorial information of first image input device acquisition on welding portion that has the image axle vertical by installation with PCB, second pictorial information of second image input device acquisition on welding portion that has the optical axis of a predetermined angular of visual relatively inclined light shaft by installation, and according to the inconsistent numerical value of first and second pictorial information calculating pin position of image, and the inconsistent numerical value that will calculate and preset reference value are relatively, the welding situation or bad that is connected between the conductive welding disk that detects PCB then and the IC packaging pin.
Be preferably in the present invention, second pictorial information is by an acquisition in four cameras, these four cameras are corresponding to encapsulate the pin that arrange on each limit along IC, be installed in radially around first image input device with equal intervals, and they have the visual optical axis that forms 25 ° of-30 ° of angles corresponding to the visual optical axis of first image input device.
Also have, in order to obtain above-mentioned purpose on the other hand, provide a kind of device that is used to detect the connection status of the conductive welding disk by being welded to connect IC packaging pin to a PCB at this, this detection is to carry out the image processing step by image input device, and wherein this device comprises: one is installed as first image input device with visual optical axis vertical with PCB; A belt lighting source, it is set to cause the main incident light axis of first image input device to form a central axis; At least one second image input device, it is set to have the visual optical axis of a predetermined angular of visual inclined light shaft of relative first image input device, and a presentation manager, it is used for the pictorial information by the input of first and second image input devices is processed into pictorial data.
The present invention is preferably, as second image input device, four relative first image input devices of camera are installed radially with equal intervals, with the pin of arranging corresponding to each limit that encapsulates four limits along IC, it is 25 ° of-30 ° of angles that the image axle of first image input device and the image axle of second image input device are installed to be between them, the image axle of first image input device and the image axle of second image input device are installed to be and make them have focus on every side any of welding portion that the conductive welding disk of PCB is connected with the IC packaging pin, and lighting source comprises a light emitting devices.
Above-mentioned purpose of the present invention and advantage will become clearer by describing embodiment in detail with reference to following accompanying drawing:
Fig. 1 is a perspective view that shows flat pack style IC;
Fig. 2 is one and is used for being depicted in the cross sectional view that a PCB goes up installation flat pack style IC;
Fig. 3 A is the view that is used for describing being used to detecting an example of the conventional method of IC packaging pin welding and device to Fig. 5 C;
Fig. 6 A is the view that is used for describing being used to detecting another example of the conventional method of IC packaging pin welding and device to Fig. 6 D;
Fig. 7 is a demonstration according to the view that is used to detect the device of IC packaging pin welding of the present invention;
Fig. 8 A is to be used to describe the view that is used to detect a kind of method of IC packaging pin welding according to of the present invention to Figure 11 C;
Figure 12 A is the view of describing to obtain by the pictorial information of pin welding portion some steps of welding quality testing result to Figure 15 C;
Figure 16 A and 16B are in detect the method for IC packaging pin welding according to the present invention, describe some views with respect to the measuring principle of the pin height of PCB;
Figure 17 A and 17B are in the method for detection IC packaging pin according to the present invention welding, describe the view with respect to the lead end location determining method of pin; And
Figure 18 is a flow chart of describing according to the method for detection IC packaging pin of the present invention welding.
With reference to figure 7, the device that is used to detect an IC packaging pin welded condition according to the present invention comprises: a CCD camera 510 that has approx perpendicular to the visual optical axis 511 of PCB 100, a ring illumination light source 520 that is installed in around first camera 510, a plurality of the 2nd CCD cameras 530, a presentation manager 540, and one be used for output image information data computing machine 550.
According to the present invention, first camera 5 10 and second camera 530 are installed to be to cause on any point around the welding portion s of PCB100 conductive welding disk 110 and IC packaging pin 12 junctions focus.Therefore, between detection period, the IC packaging pin can be sequentially moves through examined one by one so that pin can be arranged on the focal length of first and second cameras 510 and 530, that is, move by a preset space length by a drive source such as stepper motor.
Also have, in lighting source 520, the brightness of illumination light is to be controlled according to the spacing and the width of IC packaging pin by an illumination control apparatus 521.Preferable is that lighting source 520 comprises a light emitting devices (LED).
A kind of method that the above-mentioned device that is used to detect the welding of IC packaging pin according to the present invention of use according to the present invention detects the welding of IC packaging pin is described below.
Figure 18 is a flow chart of describing according to the method for detection IC packaging pin of the present invention welding.With reference to this flow chart, lighting source 520 is opened projection illumination light (step 1) on the welding portion s of IC packaging pin 12 and conductive welding disk 110 junctions of PCB 100 and on every side.At this, light vertically is incident upon the upper surface of pin 12, be incident upon on the conductive welding disk 110 of welding portion (solder sphere) s and PCB 100, and from reflection here.Subsequently, one of four second cameras 530 that encapsulate the one side that will detect corresponding to flattened type IC are selected.
In step 2, the going up table of welding portion s and pictorial information is imported into first camera 510, simultaneously, the limit exterior view image information of welding portion s also is imported into second camera 530.Therefore, obtain the image of brightness and darkness and being stored in the presentation manager 540.
When the conductive welding disk 110 of pin 12 and PCB 100 formed a flat surface respectively, the pictorial information that is input to camera obtained enough good relative brightness.On the contrary, when welding portion s had the reflecting surface of a band pre-determined tilt angle, the pictorial information that is input to camera demonstrated dimness.
Therefore, when pin normally welds, shown in Fig. 8 A, be input to the pin image 12 of first and second cameras 510 and 530 ' and pad image 110 ' be shown, respectively shown in Fig. 8 B and 8C.Here, image becomes " 0 " corresponding to the inconsistent numerical value of pin end position.
Although pin 12 is longer, when pin 12 normally welds and do not have the amount of lifting, shown in Fig. 9 A, be input to the pin image 12 of first and second cameras 510 and 530 ' and pad image 110 ' also be shown, respectively shown in Fig. 9 B and 9C.So in this case, image also remains on " 0 " corresponding to the inconsistent numerical value of pin end position.
Yet, shown in Figure 10 A or 11A, when pin 12 when welding portion s lifts, be input to the pin image 12 of first and second cameras 510 and 530 ' and pad image 110 ' be shown, respectively shown in Figure 10 B and 10C and Figure 11 B and 11C.So in these cases, no matter the shape of welding portion s, image produces corresponding to inconsistent numerical value D1 of pin end position and D2.
In step 3, shown in Figure 12 A and 12B, through said process, be input to first and second cameras 510 and 530 corresponding to pin, the brightness of the image of pad and welding portion and darkness are transformed the binary data of B﹠W point.Therefore, obtain an a binary image and surveyed area a is set.In this binary image, as shown in drawings, pin image 12 ' and pad image 110 ' demonstrations be bright, yet owing to pattern noise pin image 12 ' the lead-in wire end do not clearly illustrate.
In step 4, when the quantity of white point among a of inspection area is projected to a trunnion axis X, the data that obtain data shown among Figure 13 A and acquisition at first by differential to obtain the data shown in Figure 13 B.At this, the position that has a maximum value by hypothesis is that the lead-in wire of pin is brought in and determined an approximate position.For the image that obtains by second camera 530, be determined with respect to the apparent position of the lead end of pin.
In step 5,, from the image of brightness and darkness, obtain an accurate marginal position with respect to the lead end of pin in the lead end position that obtains pin approx.Promptly shown in Figure 14 A and 14B, pin image 12 ' lead end on a window w is set.Next, in window the brightness projection of vertical column to trunnion axis X1 to obtain data presented among Figure 15 A.Obtain to leach the data of noise by the gaussian filtering of carrying out above-mentioned data, shown in Figure 15 B.
In step 6, leach the data (Figure 15 C) that the data of noise obtain by differential and compare with a given threshold values.If these data are less than or equal to threshold values, it is " 0 " that the value of data keeps.Otherwise keep existing value.Shown in Figure 15 D, be determined according to the peaked position of mass centre corresponding to the chevron shape, shown in Figure 15 D, and this position is confirmed as the accurate position of lead end of a corresponding pin.According to the present invention, because the marginal position of the lead end of pin can be defined as a decimal system point in a picture element, so precision improves to some extent.
In step 7 and 8, the difference between the position of the pin lead end that obtains by two images that obtained by first and second cameras 510 and 530 (position inconsistent) is obtained.If the threshold values that should allow is greater than the inconsistent value of position, the welded condition of pin is confirmed as normally.If this permission threshold values is less than or equal to the inconsistent value of this position, the welded condition of pin is confirmed as a pin and lifts defective.
Figure 16 A and 16B be, and be inconsistent according to the pin lead end positions that two images that obtain from first and second cameras 510 and 530 obtain, and describes to measure the principle of pin height.When the pin lead end is arranged in a some P, corresponding point and their position P on the photographic plane of first and second cameras 510 and 530
cAnd P
sThere is not difference.When pin is vertically moved to a some Q, the position P on first and second cameras 510 and 530 the photographic plane
cAnd P
sBe similar to.
Yet, when pin when a R lifts, the position R on first and second cameras 510 and 530 the photographic plane
cAnd R
sSeparate widely, that is, the inconsistent of position just produced.Because inconsistent amount in this position and pin height H have a predefined function relation, the pin actual height of PCB can obtain from the inconsistent value in position on first and second cameras 510 and 530 image planes that obtain by measurement relatively.
Figure 17 A and 17B are the views that is used for describing corresponding to the location determining method of pin lead end of the present invention.The optical center of supposing first and second cameras 510 and 530 is respectively O
cAnd O
s, and when P point by first and second cameras 510 and 530 optical axises that intersect of the circumference of an illusion and since circumference aggregating characteristic, be positioned at circumference inconsistent all become " 0 ", the position of being had a few on every side.At this, because some P flatly moves right, so the inconsistent value of position becomes maximum and little by little reduces and become " 0 " again at a P ' at the Q point.
Therefore, lift and the lead-in wire edge of pin when being positioned at a some T, when pin because arc angle ∠ is O
cQO
s=θ 2 just becomes greater than at the arc angle ∠ of P O
cPO
s=θ 1, just produced so the position of image is inconsistent.
Yet, because according to geometrical property θ 1＜θ 3＜θ 2 of circumference, when will be through around the some R of lead end in circle center of examined pin the time, the inconsistent maximization in position so that relatively the pin height of PCB can measure more accurately.
As mentioned above, at pin welding method that is being used for detecting the IC encapsulation according to the present invention and device, the image of brightness and darkness be from first camera with vertical optical axis be arranged in its limit on and have second camera acquisition of an optical axis of the inclined light shaft of relative first camera.Then, the apparent position of pin lead end utilizes a common image processing method to be provided with from the brightness of acquisition and the image of darkness.Therefore, accurate edge can obtain from the image of original brightness and darkness because pin goes between, so improved the accuracy of detection of pin welded condition.
Claims (9)
1. method that is used to detect the connection status of the IC packaging pin that is connected by welding to the printed circuit board (PCB) conductive welding disk, it detects by carrying out the image processing step with an image input device, and wherein this method comprises following step:
The welding portion that emissive lighting light is electrically connected with the IC packaging pin to the printed circuit board (PCB) conductive welding disk;
By being installed as first pictorial information of first image input device acquisition on welding portion that has perpendicular to the visual optical axis of printed circuit board (PCB);
Obtain second pictorial information on welding portion by second image input device that is installed as visual relatively optical axis and has the optical axis of a pre-determined tilt angle, and
The inconsistent numerical value of pin position of image according to the calculating of first and second pictorial information, and the inconsistent numerical value that will calculate and preset reference value are relatively, the welding situation or bad that is connected between the conductive welding disk that detects printed circuit board (PCB) then and the IC packaging pin.
2. method according to claim 1, it is characterized in that second pictorial information is by an acquisition in four cameras, these four cameras are corresponding to encapsulating the pin that arrange on each limit along IC, be installed in radially around first image input device with equal intervals.
3. method according to claim 1, it is characterized in that second pictorial information is by an acquisition in four cameras, these four cameras are corresponding to encapsulate the pin that arrange on each limit along IC, be installed in radially around first image input device with equal intervals, and they have the visual optical axis that forms 25 ° of-30 ° of angles corresponding to the visual optical axis of first image input device.
4. device that is used to detect the connection status of the conductive welding disk by being welded to connect IC packaging pin to a printed circuit board (PCB), this detection is to carry out the image processing step by image input device, wherein this device comprises:
One is installed as first image input device with visual optical axis vertical with printed circuit board (PCB);
A belt lighting source, it is set to cause the main incident light axis of first image input device to form a central axis;
At least one second image input device, it is set to have the visual optical axis of a predetermined angular of visual inclined light shaft of relative first image input device, and
A presentation manager, it is used for the pictorial information by the input of first and second image input devices is processed into pictorial data.
5. device according to claim 4 is characterized in that as second image input device, and four relative first image input devices of camera are installed radially with equal intervals.
6. device according to claim 4 is characterized in that four relative first image input devices of camera install radially with equal intervals, with the pin of arranging corresponding to each limit that encapsulates four limits along IC.
7. according to claim 4 or 5 described devices, it is 25 ° of-30 ° of angles that the image axle that it is characterized in that first image input device and the image of second image input device spool are installed to be between them.
8. according to claim 4 or 5 described devices, the image axle that it is characterized in that first image input device and the image axle of second image input device are installed to be and make them have focus on every side any of welding portion that the conductive welding disk of printed circuit board (PCB) is connected with the IC packaging pin.
9. device according to claim 4 is characterized in that lighting source comprises a light emitting devices.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR993376 | 1999-02-02 | ||
| KR1019990003376A KR100304649B1 (en) | 1999-02-02 | 1999-02-02 | Method for inspecting lead pins of IC package and apparatus therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1264169A true CN1264169A (en) | 2000-08-23 |
Family
ID=19573065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00100744A Pending CN1264169A (en) | 1999-02-02 | 2000-02-02 | Device and method for testing integral circuit packaging pin welding |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2000228579A (en) |
| KR (1) | KR100304649B1 (en) |
| CN (1) | CN1264169A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1815250B (en) * | 2005-02-02 | 2010-08-25 | 雅马哈发动机株式会社 | Board checking device, board checking method |
| CN103260346A (en) * | 2012-02-15 | 2013-08-21 | 索尼公司 | Circuit board |
| CN104483331A (en) * | 2014-12-03 | 2015-04-01 | 东莞市神州视觉科技有限公司 | Three-dimensional detection method, three-dimensional detection device and three-dimensional detection system for connector contact pin |
| CN104515775A (en) * | 2013-10-01 | 2015-04-15 | 由田新技股份有限公司 | Optical detection device and method |
| CN106338847A (en) * | 2016-10-27 | 2017-01-18 | 深圳市深科达智能装备股份有限公司 | Display module automatic lighting detector |
| CN106604628A (en) * | 2015-10-20 | 2017-04-26 | 泰科电子(上海)有限公司 | System for determining installation state of pin of electrical connector |
| CN109490308A (en) * | 2018-09-25 | 2019-03-19 | 唐山英莱科技有限公司 | A kind of detection device and method |
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| WO2005003682A1 (en) * | 2003-07-08 | 2005-01-13 | Heon Jeong | Apparatus for detecting adhered portion or edge of sheet |
| JP2007033048A (en) | 2005-07-22 | 2007-02-08 | Ricoh Co Ltd | Solder bonding determination method, soldering inspection method, soldering inspection device, soldering inspection program, and recording medium |
| TWI320497B (en) * | 2005-12-09 | 2010-02-11 | Taiwan Tft Lcd Ass | Multiple-angle imaging machine, multiple-angle inspection system and method for blemish measurement of a flat panel display |
| KR101497947B1 (en) * | 2013-09-10 | 2015-03-03 | 주식회사 고영테크놀러지 | Method of inspecting a solder joint |
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-
1999
- 1999-02-02 KR KR1019990003376A patent/KR100304649B1/en not_active IP Right Cessation
-
2000
- 2000-02-02 CN CN00100744A patent/CN1264169A/en active Pending
- 2000-02-02 JP JP2000025651A patent/JP2000228579A/en active Pending
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| CN1815250B (en) * | 2005-02-02 | 2010-08-25 | 雅马哈发动机株式会社 | Board checking device, board checking method |
| CN103260346A (en) * | 2012-02-15 | 2013-08-21 | 索尼公司 | Circuit board |
| CN103260346B (en) * | 2012-02-15 | 2018-04-10 | 索尼公司 | Circuit board |
| CN104515775A (en) * | 2013-10-01 | 2015-04-15 | 由田新技股份有限公司 | Optical detection device and method |
| CN104483331A (en) * | 2014-12-03 | 2015-04-01 | 东莞市神州视觉科技有限公司 | Three-dimensional detection method, three-dimensional detection device and three-dimensional detection system for connector contact pin |
| CN106604628A (en) * | 2015-10-20 | 2017-04-26 | 泰科电子(上海)有限公司 | System for determining installation state of pin of electrical connector |
| CN106604628B (en) * | 2015-10-20 | 2019-07-12 | 泰科电子(上海)有限公司 | System for determining the installation condition of the pin of electric connector |
| CN106338847A (en) * | 2016-10-27 | 2017-01-18 | 深圳市深科达智能装备股份有限公司 | Display module automatic lighting detector |
| CN109490308A (en) * | 2018-09-25 | 2019-03-19 | 唐山英莱科技有限公司 | A kind of detection device and method |
| CN109490308B (en) * | 2018-09-25 | 2021-08-06 | 唐山英莱科技有限公司 | Welding seam detection device and method |
| CN115280588A (en) * | 2020-03-19 | 2022-11-01 | 三洋电机株式会社 | Sealed battery |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000054979A (en) | 2000-09-05 |
| JP2000228579A (en) | 2000-08-15 |
| KR100304649B1 (en) | 2001-09-13 |
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