CN1262162C - Electronic-component mounting apparatus - Google Patents
Electronic-component mounting apparatus Download PDFInfo
- Publication number
- CN1262162C CN1262162C CNB031082912A CN03108291A CN1262162C CN 1262162 C CN1262162 C CN 1262162C CN B031082912 A CNB031082912 A CN B031082912A CN 03108291 A CN03108291 A CN 03108291A CN 1262162 C CN1262162 C CN 1262162C
- Authority
- CN
- China
- Prior art keywords
- installation
- electronic unit
- circuit board
- installation head
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an electronic part mounting machine capable of quickly mounting much more electronic parts on a board in a condition that load on a Y-axis guide member is reduced. This electronic part mounting machine 1 is provided with a mounting station 4 movable in a Y-axial direction for holding a board P, first and second feeder groups 61 and 62 for supplying the electronic parts to be mounted on the board P, and two mounting heads 7 and 7 for mounting the electronic parts from the respective first and second feeder groups on the board P. The respective mounting heads are independently movable in the X-axial direction in a condition that they are supported by an X-axis guide member 81, and the X-axis guide member is movable in the Y-axial direction in a condition that they are supported by respective Y-axis guide members 91 and 92. Then, the electronic parts sucked by the respective first and second feeder groups are mounted on the board P in a mounting area 101 by the respective mounting heads while the X-axis guide member is not moved.
Description
Technical field
The present invention relates to a kind of electronic unit is installed in electronic component mounting apparatus on the circuit board.
Background technology
In the past, the electronic component mounting apparatus that electronic unit is installed on the circuit board was everybody known (for example, with reference to patent documentation 1).
As such electronic component mounting apparatus (hereinafter referred to as " device "), for example, generally be device 20 as shown in Figure 5.This device 20, as shown in Figure 5, have: electronic unit is loaded on installation head 21 on the circuit board P, can support installation head 21 flexibly movably and be provided with the X-axis guiding parts 22 that makes the driving mechanism that installation head 21 moves along X-direction, can support X-axis guiding parts 22 flexibly movably and be provided with the Y-axis guiding parts 23 that makes the driving mechanism that X-axis guiding parts 22 moves along Y direction along Y direction, 24, the installation station 25 of holding circuit plate P in the moving range of installation head 21, the a plurality of belt feeders 26 that keep various electronic units, 26 ... set is a plurality of feed appliance groups 27 of one group, 27 ...Installation head 21 has a plurality of adsorption mouth 21a, 21a ... with these adsorption mouth 21a, 21a ... maintenance is from the belt feeder 26,26 of any feed appliance group 27 ... the electronic unit of supplying with, and after the maintenance attitude of having revised the electronic unit that keeps, this electronic unit is installed on the assigned position of the circuit board P that is held in the installation station 25.
The motion of device 40 shown in Figure 6 in addition, is also arranged except device shown in Figure 5 20.As shown in Figure 6, this device 40 has: can along X-direction support movably flexibly the X-axis guiding parts 22 of installation head 21, respectively support support component 41,42, the holding circuit plate P at X-axis guiding parts 22 two ends installation station 25, support installation station's support component 43 that installation station 25 can move flexibly along Y direction, be disposed at the feed appliance group 27,27 of installation station's support component 43 left and right sides respectively.In Fig. 6, the parts to identical with parts shown in Figure 5 give the symbol identical with Fig. 5.On device shown in Figure 6 40, installation head 21 also can be moved along X-direction on X-axis guiding parts 22, but owing to it can not move to Y direction, so the extracting position of the electronic unit that takes out from each feed appliance group 27,27 with installation head 21, be configured in installation head 21 under.Therefore, installation head 21 does not have moving of Y direction, can take out and the maintenance electronic unit from each feed appliance group 27,27.Then, after the maintenance attitude of having revised the electronic unit that keeps, installation head 21 is installed in this electronic unit on the assigned position of the circuit board P that is held in the installation station 25.At this moment, the X coordinate of electronic unit installation site is determined that by the mobile of installation head 21 the Y coordinate position is determined by the mobile of installation station 25.This point is the feature of device 40.
And, have with the device of point symmetry array structure as shown in Figure 7 device 40 shown in Figure 6.In Fig. 7,, give the symbol same with Fig. 5 also to the parts same with parts shown in Figure 5.The elemental motion of device 70 shown in Figure 7, roughly the same with device 40 shown in Figure 6, but compare with device 40 shown in Figure 6, device 70 possesses 21,21 and two installation stations 25,25 of two installation head, and each installation head 22,22 can be installed in electronic unit on each circuit board P, the P that is held in each installation station 25,25.This device 70 is compared with device 40 shown in Figure 6, it is characterized by, and can dispose a plurality of feed appliance groups 27,27 in the both sides, front and back of the circuit board P transport path 71 that extends along X-direction ..., can to circuit board P electronic unit be installed efficiently.
Patent documentation 1
Te Kaiping 09-148797 communique
But, on device shown in Figure 5 20, the elemental motion of installation head 21 is to travel to and fro between arbitrarily between the feed appliance group 27 and circuit board P, in order at short notice more electronic unit to be installed on the circuit board P, just must make installation head 21 and X-axis guiding parts 22 high-speed motions.At this moment, 22 of X-axis guiding partss support moving of installation head 21, but Y-axis guiding parts 23,24, except moving of installation head 21, also must support moving of X-axis guiding parts 22 with driving mechanism that installation head 21 is moved along X-direction, and bear very big load.Therefore, just must make the sufficient actuating force and the braking force of X-axis guiding parts 22 high-speed mobile, the result has caused the maximization of the drive source relevant with X-axis guiding parts 22 and high price to be formatted.
The motion that is used to address this problem is a device 40 shown in Figure 6.Promptly, on this device 40, be provided with respectively along the drive source of X-direction drive installation 21 with along the drive source at Y direction drive installation station 25, and omitted as fixing X-axis guiding parts 22 and Y-axis guiding parts that possess the driving mechanism that is used for mobile X-axis guiding parts with this, on device 40, solved because of high-speed mobile and had the problem that the X-axis guiding parts 22 of big load is produced.But installation station 25 is that adding up in light weight with its weight ratio installation head 21 and X-axis guiding parts 22 is prerequisite.Why like this, to be because, then still need move the big drive source of driving mechanism of X-axis guiding parts 22 than firm abridged if the weight ratio installation head 21 of installation station 25 and X-axis guiding parts 22 add up to weight also big.
But, on device shown in Figure 6 40, owing to installation head 21 can not move along Y direction, so, for example work as from each belt feeder 26,26 ... the extracting position that takes out electronic unit just is difficult to take out electronic unit when Y direction has been offset.The skew of this extracting position is the obvious phenomenon that worsens and should not take place originally of productivity ratio that makes circuit board P, but the possibility that takes place because of various reason is arranged.For example, at each belt feeder 26,26 ... on, as shown in Figure 8, each electronic unit 75,75 ... be in each hole 77,77 that is installed in each conveyer belt 76 ... be transferred under the interior state, but because this each hole 77,77 ... with respect to each electronic unit 75,75 ... profile have rich size, so in each hole 77,77 ... each interior electronic unit 75,75 ... the attitude instability.Therefore, each electronic unit 75,75 ... with each hole 77,77 ... the center inconsistent.
In addition, for example, when belt feeder 26 had been used for a long time, not talkative do not have to make the installation site of the belt feeder 26 on electronic component mounting apparatus produce deviation because of the use of this belt feeder 26, and at the extracting position of electronic unit not normal situation takes place.Time spent just might produce each adsorption mouth 21a, 21a of being possessed with installation head 21 being subjected to above compound doing ... situation that can not the attract electrons parts.
And, developed very fine electronic unit recently, and, required the correctness of extracting position for such electronic unit.Therefore, if each hole 77,77 ... each interior electronic unit 75,75 ... the attitude of taking in be adjusted into that to approach fare-you-well then out of question, but, lack the problem points that corresponding ability just becomes device shown in Figure 6 40 for taking in the unusual state of affairs that attitude is offset etc. significantly.
In addition, on device shown in Figure 7 70, also run into and device 40 roughly the same problems, and because on device shown in Figure 7 70, also disposed feed appliance group 27,27 at the opposition side of crossing over circuit board P transport path 71, so just need be corresponding to the installation head 21 and the installation station 25 of these feed appliance groups 27,27.Therefore, the high price that causes installation head 21 and installation station's 25 these parts are set is formatted.
The object of the present invention is to provide a kind of be can be under the state that suppresses to put on the load burden on the Y-axis guiding parts, more electronic unit is installed in electronic component mounting apparatus on the circuit board with the short time, be again the most suitably to keep the electronic component mounting apparatus of low price that takes out the position of electronic unit from feed appliance.
Summary of the invention
In order to address the above problem, the present invention's 1 described electronic component mounting apparatus for example, as shown in Figure 1 and Figure 2, is characterized in that, has:
Circuit board (P) remain on installation station (4) that the electronic unit state can be installed,
Above-mentioned installation station along travel mechanism of installation station (5) that Y direction moves,
For described circuit board is moved into take out of described installation station and along X-direction be provided with the circuit board transport path circuit board conveying mechanism (3),
Should to be installed in the electronic unit on the described circuit board and to be configured in the mobile route both sides of Y direction of described installation station and a plurality of assembly supply devices ( belt feeder 6,6 that is provided with along each X-direction in order to supply with ...),
Can keep respectively described electronic unit installation head (7),
Support the X-axis guiding parts (81) of described installation head flexibly movably and support the Y-axis guiding parts (91,92) of described installation head along described Y direction flexibly movably along described X-direction;
The described installation head that is arranged on described installation station top is moved, make described installation head towards a plurality of described assembly supply devices top and the described circuit board top that remains in the described installation station;
Described installation head be provided with two in the mode that can independently be supported on movably on the described X-axis guiding parts mutually,
Installation head according to a side decides the installation site to the shift action and the installation station of X-direction to the co-operating of the shift action of Y direction, carries out the installation of electronic unit in described installation site,
The opposing party's installation head is in the installation action of a described side's installation head, from being positioned at the assembly supply device attract electrons parts with respect to described the opposing party's of installation station the first side of installation.
In the present invention's 1 described invention, installation station can move along Y direction by travel mechanism of installation station.On the other hand, installation head can move along X-direction by installation head travel mechanism, and, owing to can the X-axis guiding parts be moved along Y direction by the y-axis shift actuation mechanism, so installation head also can move along Y direction except moving along X-direction.Therefore, basically can remain the X-axis guiding parts in installation head under the state of the position of assembly supply device taking-up electronic unit, coordinate (combination) installation head to the shift action of X-direction and the shift action to Y direction of installation station, and electronic unit is installed on the assigned position of circuit board.So in installation action, only mobile basically installation head and installation station need not move the X-axis guiding parts that supports installation head, so can be suppressed at least limit to the load that puts on the X-axis guiding parts on the y-axis shift actuation mechanism.
In addition, suppose that the supply position from assembly supply device to the electronic unit of supplying with electronic unit (for example when installation head, the adsorption mouth of installation head is from the position of assembly supply device absorption and taking-up electronic unit) when departing from assigned position, because installation head does not only move to X-direction, can also move along Y direction with moving of X-axis guiding parts, so can only move small distance along X-axis and Y-axis two steering handle installation head within the limits prescribed, can always take out and keep electronic unit in optimal supply position.
In addition, when whether integrally being offset, before the installation action that carries out electronic unit, can move the position of X-axis guiding parts with the y-axis shift actuation mechanism in the supply position of not knowing a plurality of assembly supply devices in advance with finely tuning.
But, for electronic unit is installed on circuit board by the moving the moving of Y direction that reaches installation station of X-direction of installation head, the parts of each assembly supply device are supplied with the position, must be arranged under the track of the X-direction that installation head moves, and must be configured in the parts installation site on the circuit board that is supported in the installation station movably under the above-mentioned track of installation head, in order to increase the quantity of the assembly supply device that may be provided with, the width along X-direction of the electronic component mounting apparatus that just must extend.
But, in the present invention's 1 described invention, when the lazy weight of assembly supply device, under the track of the X-direction that so-called installation head moves, be meant and be configured in diverse location to assembly supply device, the width along X-direction of the electronic component mounting apparatus that do not extend moves the X-axis guiding parts and carries out taking out with the y-axis shift actuation mechanism, even also can increase the quantity of the assembly supply device that may be provided with installation head.
And, arrange each assembly supply device at two places that the Y coordinate is different along X-direction, promptly, if assembly supply device is lined up two row along X-direction, and installation station and X-axis guiding parts can move to the position corresponding to each row, then can each assembly supply device list the installation electronic unit, on the identical apparatus for mounting component of X-direction width, the assembly supply device of twice can be set.And, at this moment, owing to, can take out electronic unit from two row assembly supply devices with the moving of X-axis guiding parts, thus two X-axis guiding partss of support installation head just needn't be set, thus can reduce cost.
In addition, on assembly supply device, even because in the electronic unit installation action during mobile X-axis guiding parts, also be the mobile electronic unit installation of carrying out based on the X-direction of installation head of moving, reach installation station substantially to Y direction, so, even low in the translational speed of X-axis guiding parts, for the also not influence of operating time of integral body, so can make the y-axis shift actuation mechanism of mobile X-axis guiding parts smaller, and cheap mechanism.
The present invention 2 invention is 1 described electronic component mounting apparatus according to the present invention, and example is characterized in that as shown in Figure 1 and Figure 2,
Described X-axis guiding parts by described y-axis shift actuation mechanism, is crossed over described circuit board transport path, moves to Y direction;
Described assembly supply device, be separately positioned on the mobile route of described y-axis shift actuation mechanism of described X-axis guiding parts, the front side of described circuit board transport path and the both sides of rear side, any zone of (101,102) in the installation region can be installed in adsorbed electronic unit on the described circuit board.
In the present invention's 2 described inventions, because assembly supply device is located at the front side of circuit board transport path and two places of rear side, and can cross over the circuit board transport path by mobile X-axis guiding parts, so possess more assembly supply device, and the X-axis guiding parts is moved along Y direction, take out electronic unit from more assembly supply device and also an electronic unit that takes out is installed on the circuit board.In addition, at this moment, owing to there is no need to be provided with again installation station and installation head, thus can suppress to rise with each parts cost related of these installation stations that increases again and installation head, and more electronic unit can be installed on circuit board.
In addition, if can be mobile installation station's structure of crossing over the circuit board transport path, then at the moving direction of X-axis guiding parts, and front side or rear side at the circuit board transport path, after electronic unit is installed, can cross over the circuit board transport path and carry out the installation of electronic unit at rear side or front side.At this moment, get final product,, also can not postpone the too many operating time so the y-axis shift actuation mechanism low speed of driving X-axis guiding parts is moved even do not apply big load ground owing between the front side of circuit board transport path and rear side, only move an X-axis guiding parts.
The present invention 3 invention is 1 described electronic component mounting apparatus according to the present invention, and example is characterized in that as shown in Figure 1 and Figure 2:
On each installation head, be provided with the parts gesture recognition device that identification is attracted to the attitude of the electronic unit on the adsorption mouth, this parts gesture recognition device, the light-emitting component that is formed a line by horizontal Tile constitutes with the photo detector that becomes row with described light-emitting component arranged opposite.
In the present invention's 3 described inventions, owing to disposed assembly supply device in the mobile route left and right sides of installation station, and, in at least two separate installation head of X-axis guiding parts upper support, so during a side installation head was taken out electronic unit from a side assembly supply device, the opposing party's installation head can be installed on circuit board from the electronic unit of the opposing party's assembly supply device taking-up.According to the electronic unit installation site on the circuit board, the electronic unit that can carry out each installation head simultaneously takes out action and installation action.At this, owing to each assembly supply device is disposed along X-direction, so, do not move X-axis guiding parts ground basically and carry out the installation of electronic unit along Y direction.Therefore, the same with the present invention 1, can suppress to put on the load of y-axis shift actuation mechanism, and, can carry out alternately taking out action and installation action, can be in the identical time install on the circuit board far away than using the single installation head electronic unit that the occasion of installation electronic unit is Duoed on the circuit board from the electronic unit of each installation head.
The present invention 4 invention is 1 described electronic component mounting apparatus according to the present invention, and Fig. 2～shown in Figure 4 for example is characterized in that:
Below the X-axis guiding parts, has parts gesture recognition device (120a, 120b), this parts gesture recognition device, be positioned at the directions X left and right sides that installation station is clipped in the middle, and, when X-direction moved, the attitude from the below to described electronic unit was made a video recording, to discern the attitude of described electronic unit in the described installation head that keeps described electronic unit.
At this, parts gesture recognition device has the image mechanism of video camera for example etc., or by the recognition device of light-emitting component and photo detector combination etc., and can be from the attitude of up and down any direction identification electronic unit.And, parts gesture recognition device, the mobile interlock with the Y direction of X-axis guiding parts similarly moves along Y direction.
In the present invention's 4 described inventions, because parts gesture recognition device to be with the mobile interlock of X-axis guiding parts and can to discern the structure of this electronic unit attitude in the installation head that is keeping electronic unit in order installing toward circuit board when X-direction to move, so, compare with parts gesture recognition device is fixed between assembly supply device and the installation station in the past, owing to can closer be configured on the position between assembly supply device and the installation station, so can shorten the set-up time of electronic unit, and can make the electronic component mounting apparatus miniaturization.In addition, parts gesture recognition device, by when X-direction moves, discerning this electronic unit attitude in order to install toward circuit board with the mobile interlock of X-axis guiding parts and in the installation head that is keeping electronic unit, can be with the location independent ground of X-axis guiding parts, installation head is moved along X-direction, and can confirm the attitude of electronic unit with this, so can be not between in the past assembly supply device and installation station, a plurality of parts gesture recognition devices be set, with the more short-range installation of realization, and can suppress cost.In addition, owing to can expressly move to the installation head that is keeping electronic unit the position of fixing in the past parts gesture recognition device, can realize the distance of electronic unit installation and the high efficiency of time.
The present invention 5 invention is 4 described electronic component mounting apparatus according to the present invention, it is characterized in that: above-mentioned parts gesture recognition device can move along X-direction.
In the present invention's 5 described inventions, because parts gesture recognition device, it is the structure that can move along X-direction, therefore can be corresponding to supplying with the position of electronic unit by the past installation head of assembly supply device and moving, handle so can more promptly carry out the identification of parts attitude, also can carry out the processing of handling corresponding to this identification thereupon at once.And, particularly when being provided with a plurality of installation head, as a parts gesture recognition device, owing to there is no need installation head to be moved redundantly, so just right for the affirmation of parts attitude.In addition, for example, parts gesture recognition device, even in the position that is set between assembly supply device and the installation head, and when the supply of this electronic unit, this parts gesture recognition device can be by moving the interference of avoiding installation head, electronic unit etc. and parts gesture recognition device to X-direction.
The present invention 6 invention is 4 described electronic component mounting apparatus according to the present invention, it is characterized in that:
Above-mentioned parts gesture recognition device, be supported on the above-mentioned X-axis guiding parts, so that can be held in the attitude of the above-mentioned electronic unit on the above-mentioned installation head from below identification, and, can along Y direction move to not with above-mentioned installation head along position that the X-direction motion track overlaps.
In the present invention's 6 described inventions, because parts gesture recognition device is supported on the X-axis guiding parts, so that can be held in the attitude of the electronic unit on the installation head from below identification, and, can along Y direction move to not with installation head along position that the X-direction motion track overlaps, so can be when supplying with electronic unit toward installation head by assembly supply device, avoid the interference of installation head, electronic unit etc. and parts gesture recognition device.
Description of drawings
Fig. 1 is (a) stereogram (b) vertical view of the electronic component mounting apparatus of the embodiment of the invention 1.
Fig. 2 is that (a) vertical view (b) of the electronic component mounting apparatus of the embodiment of the invention 2 is the right hand view of (a).
Fig. 3 is the enlarged drawing of Fig. 2 (b).
Fig. 4 is used to illustrate the absorption height of electronic unit and the accompanying drawing that keeps height and parts gesture recognition device to concern.
Fig. 5 is the stereogram of electronic component mounting apparatus in the past.
Fig. 6 is the stereogram with the electronic component mounting apparatus of the different shape of electronic component mounting apparatus shown in Figure 5.
Fig. 7 is the stereogram with the electronic component mounting apparatus of the different shape of Fig. 5 and electronic component mounting apparatus shown in Figure 6.
Fig. 8 is the vertical view that is used to illustrate each the electronic unit attitude that is installed in component feed band hole.
Among the figure: the P-circuit board, 1,110-electronic component mounting apparatus, 3-circuit board conveying mechanism, 31-circuit board transport path, 4-installation station, travel mechanism of 5-installation station, 52-installation station transport path, 6-belt feeder (assembly supply device), 61～64-feed appliance group (assembly supply device), the 7-installation head, 7a-adsorption mouth, 8-installation head travel mechanism, the 81-X spindle guide is to parts, 9-Y axle travel mechanism, 91, the 92-Y spindle guide is to parts, 120a, 120b-parts gesture recognition device (parts attitude confirming mechanism)
Embodiment
(embodiment 1)
Below, with reference to the embodiment 1 of description of drawings electronic component mounting apparatus of the present invention.But scope of invention is not limited to the example shown in the figure.
As shown in Figure 1, device 1 has: the bedframe 2 of slightly rectangular frame shape, the circuit board P circuit board conveying mechanism 3 that past next procedure side is carried along X-direction from last one procedure side, circuit board P is remained on the installation station 4 of the state that electronic unit can be installed, move the travel mechanism of installation station 5 of installation station 4 along Y direction, take in a plurality of belt feeders 6 of going up the electronic unit of installing toward circuit board P, 6 ... (assembly supply device), each belt feeder 6,6 ... electronic unit be installed to two installation head 7 on the circuit board P, 7, each installation head 7,7 along installation head travel mechanism 8 that X-direction moves, two installation head 7, the 7 y-axis shift actuation mechanism 9 that move to Y direction.
Circuit board conveying mechanism 3 possesses the circuit board transport path 31 that circuit board P is carried toward the next procedure side along X-direction from last one procedure side.Circuit board conveying mechanism 3 has: be disposed at circuit board transport path 31 upstream sides upstream delivery section 3a, be disposed at the downstream delivery section 3b in circuit board transport path 31 downstreams.Have conveyer belt (omit diagram) etc. on each delivery section 3a, 3b, for example according to the example of Fig. 1, circuit board P is being carried on state on the conveyer belt, is carrying along X-direction to the right from the left side.Between upstream delivery section 3a and downstream delivery section 3b, be provided with the interval that installation station 4 can be set.
Travel mechanism of installation station 5 has: can support the support component 51 of installation station 4 flexibly movably, installation station's driving mechanism (omit diagram) at drive installation station 4 under the state that is supported on support component 51.Support component 51 is at the substantial middle of bedframe 2 and the parts that extend along Y direction, and the circuit board delivery section 3a, the 3b that extend along X-direction are slightly at right angles cut off.Because support component 51, can support installation station 4 flexibly movably and extend, so have the function that installation station 4 is led along Y direction along Y direction.Therefore, installation station 4 moves along the installation station's transport path 52 that is formed by support component 51.And, as installation station's driving mechanism, for example, can use line motor, in addition can be with the driving mechanism that makes up the driving mechanism of servo motor and belt combination or servo motor and ball-screw etc.
When installation station's driving mechanism was driven, installation station 4 just can move to the position of leaving Y direction from position and the circuit board transport path 31 along circuit board transport path 31.Installation station 4, along location on the position of circuit board transport path 31 and keep by upstream delivery section 3a from the circuit board P that transports of one procedure side, and downstream delivery section 3b is giving along the circuit board P that on the position of circuit board transport path 31 electronic unit is installed in installation station 4.That is, on this position (that is, the circuit board holding position of holding circuit plate P), installation station 4 carries out circuit board P and transmits between circuit board conveying mechanism 3.In addition, in the transmission of carrying out the road plate P between the circuit board conveying mechanism in the installation station, for example, have the circuit board conveying mechanism the same with circuit board conveying mechanism 3.And, when the 4 holding circuit plate P of installation station, between two sidepiece 4a, 4a, clamp and holding circuit plate P.
Certainly, can suitably change the belt feeder 6,6 that constitutes each feed appliance group 61～64 ... quantity is set.In addition, also can the belt feeder 6,6 of each feed appliance group 61～64 will be constituted ... quantity be set, be provided with to such an extent that lack and form other feed appliance group than quantity shown in Figure 1, can be at least one side of this other feed appliance configuration set in the right side and the left side of each feed appliance group 61～64.
Y-axis shift actuation mechanism 9 possesses: the downstream Y-axis guiding parts 92 of the upstream Y-axis guiding parts 91 of the door shape of leap upstream delivery section 3a, the door shape of leap downstream delivery section 3b.On each Y- axis guiding parts 91,92, be provided with guide part 91a, 92a along Y direction.
Installation head travel mechanism 8 possesses: extend X-direction and can support the rectangular X-axis guiding parts 81 of two installation head 7,7, the installation head driving mechanism (omitting diagram) that two installation head 7,7 are moved along X-direction flexibly movably.The two ends of X-axis guiding parts 81 are supported on each guide part 91a, the 92a top of each Y-axis guiding parts 91,92.Like this, X-axis guiding parts 81, by crossbearer between upstream Y-axis guiding parts 91 and downstream Y-axis guiding parts 92, and by each guide part 91a, 92a guiding and can move along X-direction.In addition, y-axis shift actuation mechanism 9 possesses the Y-axis driving mechanism (omitting diagram) that X-axis guiding parts 81 is moved along Y direction, and when this Y-axis driving mechanism was driven, X-axis guiding parts 81 just moved along Y direction.When mobile, X-axis guiding parts 81 is kept with respect to X-direction does not have deflection, and the bearing of trend of X-axis guiding parts 81 state always parallel with X-direction.As the Y-axis driving mechanism, for example, can use driving mechanism by the combination of servo motor and belt, in addition, can use by the driving mechanism of servo motor and ball-screw combination or line motor etc.
In addition, about moving of X-axis guiding parts 81, owing to two installation head 7,7 in X-axis guiding parts 81 upper supports,, on each Y- axis guiding parts 91,92, form bigger load burden so except the load of X-axis guiding parts 81, added the load of installation head 7,7 again.In more detail, because X-axis guiding parts 81 and two installation head 7,7 weight altogether, weight than above-mentioned installation station 4 is big, so moving of X-axis guiding parts 81 and moving of installation station 4, the load burden that puts on each Y- axis guiding parts 91,92 is also big than the load burden that puts on support component 51.
Two installation head 7,7 can be supported on a side the side of X-axis guiding parts 81 flexibly movably.These two installation head 7,7 can move independently of each other.Therefore, in case drive above-mentioned installation head driving mechanism, then each installation head 7,7 just moves by X-axis guiding parts 81 guiding and along X-direction.As the installation head driving mechanism, for example, can use line motor, in addition, can use by the driving mechanism of servo motor and belt combination or the driving mechanism that makes up by servo motor and ball-screw.In addition, when using line motor, can shared stator on two installation head 7, but must on each installation head, possess movable member.In addition, with belt or ball-screw the time, two installation head must possess belt or ball-screw separately.
Each installation head 7,7 has adsorption mouth 7a, the 7a of specified quantity ..., and each installation head 7,7 these adsorption mouth of usefulness 7a, 7a ... from each 61～64 absorption of feed appliance group and maintenance electronic unit.Detailed is, the installation head 7 in left side that is Fig. 1 basically is from the first and the 3rd feed appliance group 61,63 attract electrons parts, and the installation head 7 on right side is from the second and the 4th feed appliance group 62,64 attract electrons parts.But when the electronic unit of the first and the 3rd feed appliance group 61,63 had been used up, the installation head 7 in left side also can be from the second and the 4th feed appliance group 62,64 attract electrons parts, and, also passable under opposite situation.In example shown in Figure 1, on each installation head 7,7, possessed four adsorption mouth 7a, 7a ..., but can suitably change adsorption mouth 7a quantity on the installation head 7,7.Certainly, the adsorption mouth 7a quantity on each installation head 7,7 also can be different.
These adsorption mouth 7a, 7a ..., lined up an example along X-direction, and adsorption mouth 7a, the 7a of installation head 7,7 ... orientation, consistent with each other on Y direction.That is two whole adsorption mouth 7a, 7a that installation head 7,7 is possessed ..., along X-direction by the shape that is arranged in a straight line.And, adsorption mouth 7a, the 7a of each installation head 7 on Fig. 1 ... formed a line, but also can increase the quantity of adsorption mouth 7a and be configured to multiple row.
In addition, shown in Fig. 1 (b), each installation head 7,7 possesses video camera 7b, 7b (for example, ccd video camera) respectively.Each video camera 7b, 7b take the circuit board P, the shooting that are maintained in the installation station and are incorporated in each belt feeder 6,6 ... electronic unit, and export the image of these shootings to control device (do not have diagram).Like this, by control device confirm to be maintained at the circuit board P in the installation station 4 attitude (hereinafter referred to as " maintenance attitude "), be incorporated in each belt feeder 6,6 ... the attitude (hereinafter referred to as " taking in attitude ") etc. of electronic unit.In addition, on each installation head 7, that the photo detector that possess the light-emitting component (for example, light-emitting diode) that formed a line by level, forms a line in the face of light-emitting component constitutes, in order to confirm to be adsorbed on each adsorption mouth 7a, 7a ... on the parts gesture recognition device (do not have diagram) of attitude (hereinafter referred to as " absorption attitude ") of electronic unit.
Parts gesture recognition device is configured in the electronic unit that is adsorbed on adsorption mouth 7a, the 7a between light-emitting component and the photo detector, Yi Bian and rotate adsorption mouth 7a, 7a, Yi Bian measure the absorption attitude with the method for measuring the covered width of light.
Then, when driving above-mentioned installation head driving mechanism and Y-axis driving mechanism, two installation head 7,7 just move along X-axis and Y-axis two directions in the movable range of regulation neatly.On Fig. 1 (b), the rectangle of with dashed lines is represented the movable range 100 of two installation head 7,7.In this movable range 100, each installation head 7 is from any one feed appliance group 61～64 attract electrons parts, and in any one zone of the oval-shaped installation region that dots 101,102 of Fig. 1 (b), the electronic unit of absorption is installed on the circuit board P.Detailed is, installation head 7,7 is from first and second feed appliance group 61,62 attract electrons parts the time, in installation region 101, the electronic unit of absorption is installed on the circuit board P, similarly, installation head 7,7 is installed to the electronic unit of absorption on the circuit board P in installation region 102 from the 3rd and the 4th feed appliance group 63,64 attract electrons parts the time.Certainly, when electronic unit being installed on the circuit board P, circuit board remained on corresponding to the installation station 4 under the zone of installation region 101,102 being in holding state.
But, because each belt feeder 6,6 ... between the interval (particularly, be attracted to adsorption mouth 7a, 7a ... on each electronic unit between the interval) with each adsorption mouth 7a, 7a ... between the interval about equally, so can be once from the electronic unit of each feed appliance group 61～64 absorption corresponding to the adsorption mouth 7a quantity of each installation head 7,7.In addition, supply with the belt feeder of large-scale electronic unit, by with illustrated belt feeder 6,6 ... the arranged spaced of integral multiple, and can with each adsorption mouth 7a, 7a ... between the interval correspondence.
Below, the action of the device 1 with above-mentioned formation is described.
In the action of device 1, be maintained in the installation station 4 from the circuit board P that last one procedure side transports by upstream delivery section 3a.In other words, installation station 4 moves in advance along the position of circuit board transport path 31 and standby, remains on the circuit board P that transports between two sidepiece 4a, the 4a and be in to clamp and the state of locating circuit board P.
Subsequently, drive installation station driving mechanism, installation station 4 move to installation region 101 under.Certainly, at this moment because installation station 4 keeping circuit board P, thus circuit board P also be positioned at installation region 101 under.Then, take the circuit board P be held in the installation station 4 with the video camera 7b of the installation head 7 in left side among Fig. 1 and keep attitude, and the correction that keeps attitude.And, the correction of using the video camera 7b by the installation head 7 on right side among Fig. 1 also can keep attitude.So-called " correction that keeps attitude ", be meant maintenance attitude, and the installation attitude and the side-play amount of X-axis and Y direction of the electronic unit reality of installing when mounted of confirming circuit board P by control device, and control the mobile of each installation head 7,7 and installation station 4 according to these side-play amounts.
On the other hand, (for example, the installation head 7 in left side among Fig. 1 is hereinafter referred to as " left installation head 7 " for two installation head 7,7 one of them installation head 7.), move to the first feed appliance group 61 directly over, and from the one or more electronic units of the first feed appliance group 61 absorption.At this moment, because left installation head 7 possesses a plurality of adsorption mouth 7a, 7a ... so, can once adsorb a plurality of electronic units.Certainly, also can once adsorb electronic unit corresponding to adsorption mouth 7a number, like this, also very desirable to the installation effectiveness of electronic unit.
In addition, left installation head 7 was taken the attitude of taking in of the preceding electronic unit of absorption in advance with the video camera 7b of left installation head 7 before the action that enters the attract electrons parts, and took in the correction of attitude.So-called " taking in the correction of attitude " is meant by control device and confirms the attitude of taking in of taking, and confirms a side of driving mechanism of drive installation at least and Y-axis driving mechanism and control left installation head 7 and carry out minute movement to a side of X-axis and Y-axis at least according to it.Like this, each adsorption mouth 7a, 7a ... can be always at only position attract electrons parts.
Thereafter, a drive installation driving mechanism, then left installation head 7 is moved to installation region 101 at the state that has adsorbed electronic unit.In this moves, undertaken the absorption attitude of the electronic unit that is adsorbed mouth 7a absorption is confirmed by the parts gesture recognition device of left installation head 7, and adsorb the correction of attitude.So-called " correction of absorption attitude ", be meant absorption attitude that control device confirms to be identified, and actual installation attitude and the axial side-play amount of θ (deviation angle) that goes up the reality when installing toward circuit board P, and according to the anglec of rotation of its side-play amount control adsorption mouth 7a, and, confirm with respect to the X-axis of the assigned position of the absorption position of the adsorption mouth of electronic unit and the side-play amount of Y direction by control device, and control moving of each installation head 7,7 and installation station 4 according to its side-play amount.In addition, each adsorption mouth 7a, 7a ..., can suitably rotate according to the control of control device.
Then, left installation head 7 is installed in the electronic unit of absorption on the circuit board P.At this moment, in installation region 101, determined installation site, and electronic unit has been installed on the circuit board P in this installation site to the electronic unit of circuit board P.So-called " installation site ", be meant on considering the correction of the maintenance attitude of above-mentioned circuit board P and basis to the correction of the absorption attitude of electronic unit, with the driving of driving mechanism left installation head 7 is moved to X-direction, and by the driving of installation station's driving mechanism the moving to Y direction of installation station 4, make the mounting points coordinate of circuit board P and the installation code point of electronic unit (for example, the center of electronic unit) consistent location.In a word, coordinate exactly left installation head 7 to the shift action of X-direction and the shift action to Y direction of installation station 4, determine the installation site with this, and carry out the installation of electronic unit in this installation site.
In addition, (for example, the installation head 7 on right side among Fig. 1 is hereinafter referred to as " right installation head 7 " for the installation head 7 of the opposing party in two installation head 7,7.), in the installation action of left installation head 7, from the second feed appliance group, 62 attract electrons parts.Certainly, even at this moment, also carry out the correction of taking in attitude and absorption attitude to electronic unit.
At this, when the quantity of the adsorption mouth 7a between left installation head 7 and right installation head 7 is identical or roughly the same, be basically when left installation head 7 is carried out installation action, the absorption of right installation head 7 action FEFO.Why like this, to be that right installation head 7 can once be adsorbed a plurality of electronic units owing to respect to left installation head 7 a plurality of electronic units of absorption are installed on the circuit board P singly.Therefore, right installation head 7, as entering the preparation of the installation action of electronic unit next time, can be as much as possible near the left installation head 7 in the installation action under adsorbing the state of electronic unit.With this, can shorten with two installation head 7,7 and go up the set-up time that electronic unit is installed toward circuit board P.
Then, two installation head 7,7 alternately repeat the installation action and the absorption action of electronic unit mutually, finish up to the electronic unit of circuit board P is installed.Subsequently, drive installation station driving mechanism moves to installation station 4 along the position of circuit board transport path 31, and carries out new boards P and the handing-over of the circuit board P that the electronic unit that is through with is installed between circuit board conveying mechanism 3.After, device 1 repeats above-mentioned action, carries out installation to the electronic unit of circuit board P successively with this.
In addition, when the electronic unit that should go up install toward circuit board P (kind or quantity) when just the electronic unit on first and second feed appliance group 61,62 is not enough, also can supply with electronic unit from least one side's of the 3rd and the 4th feed appliance group 63,64 feed appliance group.At this moment, X-axis guiding parts 81 and two installation head 7,7 can move to the position that can draw electronic units from the 3rd and the 4th feed appliance group 63,64, and the installation station 4 of holding circuit plate P also move to installation region 102 along Y direction.Carry out a series of action of above-mentioned two installation head 7,7 then, carry out installation to the electronic unit that is configured in the circuit board P under the installation region 102.
In addition, in the above description, to the installation action of the correction of taking in attitude of electronic unit, each installation head 7,7 time, be the structure that X-axis guiding parts 81 moves along Y direction, but also can be the structure of keeping X-axis guiding parts 81 motionless states.
More than, on the device 1 of embodiment 1, obtained following action effect, existing is its action effect arrangement following each clause.
● the shift action along X-direction by two installation head 7,7, and the shift action along Y direction of installation station 4 basically can be installed in electronic unit on the circuit board P in installation station.Therefore, just installation station 4 and two installation head 7,7 of being driven, the shift action of heavy X-axis guiding parts 81 with quality of two installation head 7,7, owing to be in the installation of electronic unit, to carry out basically, so there is no need in order in installation action, to shorten the processing time, with the heavy X-axis guiding parts of high-speed mobile.Therefore, can be suppressed at Min. to the load burden that puts on y-axis shift actuation mechanism 9, and not need the y-axis shift actuation mechanism 9 that is used for the heavy X-axis guiding parts of high-speed mobile is maximized, can realize the reduction of cost.
● when each installation head 7,7 attract electrons parts, owing to aging the grade produces each belt feeder 6,6 ... the reason that the not normal grade in position is set, occur sometimes revising from each installation head 7,7 and each belt feeder 6,6 ... supply with the situation of next electronic unit and its position relation.At this moment, owing to not only can be only installation head 7 be moved along X-direction, can also move X-axis guiding parts 81 and installation head 7 is moved along Y direction, so can carry out the correction of taking in attitude to electronic unit of so-called teaching in advance at control device, like this can be at optimal position attract electrons parts.
● each driving by Y-axis driving mechanism and installation station's driving mechanism no matter in any zone that circuit board transport path 31 is clipped in installation region 101,102 therebetween, can be installed in electronic unit on the circuit board P.Therefore, needn't installation station 4 and each installation head 7 be set to separately respectively circuit board transport path 31 about a side the feed appliance group (for example, first and second feed appliance group 61,62) the feed appliance group of special use and opposite side (for example, the 3rd and the 4th feed appliance group 63,64) special use.Like this, can be suppressed at Min. to the parts cost related, and can on device 1, dispose more feed appliance group (a plurality of belt feeder).
● owing to disposed installation station 52 is clamped in therebetween two first and second feed appliance groups 61,62 (or the 3rd and the 4th feed appliance group 63,64), so when the installation head 7 in two installation head 7,7 was carried out the absorption action of electronic unit, another installation head 7 was carried out the installation action of electronic unit.In addition, installation action and absorption action because each installation head 7,7 hockets are so for circuit board P, can install electronic unit continuously in the resting place hardly with two installation head 7,7.So, to compare during with an installation head 7, the available same time is installed more electronic unit on circuit board P.
(embodiment 2)
Below, with reference to the embodiment 2 of description of drawings electronic component mounting apparatus of the present invention.But scope of invention is not limited to the example shown in the figure.And in Fig. 2～Fig. 4, the direction vertical with Y direction with X-axis is Z-direction.
In addition, for the inscape identical, use same-sign and omit explanation, only at its difference of following explanation with the device 1 of embodiment 1.
As Fig. 2 (b) and shown in Figure 3, on device 110, below X-axis guiding parts 81, be positioned at the left and right sides of the directions X of clamping installation station 4, disposed parts gesture recognition device (parts attitude confirming mechanism) 120a, 120b respectively.
This parts gesture recognition device 120a, 120b, image mechanism (omitting diagram) with ccd video camera etc., and from X-axis guiding parts 81 on the part that installation head 7 sides of Y direction are protruded, be attracted to each adsorption mouth 7a, 7a from the below shooting ... on the attitude of electronic unit, and the image of taking to control device (omitting diagram) output.
Control device (omitting diagram), according to photographed images by the absorption attitude of the electronic unit of parts gesture recognition device output, calculate with should be toward the departure of circuit board P installation site, and output control signals such as adsorption mouth drive unit (omitting diagram), X-axis guiding parts 81 and travel mechanism of installation station 5 that the rotating shaft direction that drives adsorption mouth 7a, 7a is moved.
Adsorption mouth drive unit (omitting diagram) for example, can be used line motor, servo motor etc., and according to the control signal of above-mentioned control device (omitting diagram) adsorption mouth 7a, 7a is moved along the rotating shaft direction.
Below, the identification of the electronic unit absorption attitude of the device 110 of above-mentioned formation is handled and to the action of the correcting process of this absorption attitude, carried out following explanation.
At first, drive above-mentioned installation head driving mechanism (omitting diagram) and Y-axis driving mechanism (omitting diagram), with this make a installation head 7 in two installation head 7,7 move to any one feed appliance group 61～64 of first～the 4th directly over, then, by adsorption mouth 7a, the 7a of installation head 7 from one or more belt feeders 6 ... adsorb one or more electronic units.
Subsequently, installation head 7, the driving by installation head driving mechanism (omitting diagram) is moved to installation region 101,102 at the state that is adsorbing electronic unit.At this moment, this installs the X coordinate of coordinate, and so that installation head 7 is moved and is adjusted to X-direction, the Y coordinate is by travel mechanism of installation station 5 installation station 4 is moved and carries out suitable adjustment to Y direction.
Then, adsorbing the installation head 7 of electronic unit, in the way of moving, by the top of parts gesture recognition device 120 along X-direction.At this moment, parts gesture recognition device 120, the absorption attitude of taking the electronic unit that adsorbs by adsorption mouth 7a from the below, and to the photographic images of control device output as the identifying information of this absorption attitude.
Then, control device, according to this photographic images, calculate absorption attitude, the position that promptly is adsorbed and angle, and calculate absorption attitude that is calculated and the side-play amount (deviation angle) that should be installed in the direction of rotation of the normal mounting attitude (position or angle) on the circuit board P, and be used to revise the Correction and Control signal of this side-play amount to the output of adsorption mouth drive unit.
The adsorption mouth drive unit is according to the anglec of rotation of this side-play amount control adsorption mouth 7a.That is, adsorption mouth 7a is the structure that can rotate according to the control of control device.
Then, control device, calculating is with respect to by the X-direction of the absorption position of the electronic unit of adsorption mouth 7a absorption and the side-play amount of Y direction, and controls the mobile control signal that installation head 7 and installation station 4 move according to this side-play amount to outputs such as installation head driving mechanism, travel mechanisms of installation station 5.
Like this, the correction of the rotating shaft direction skew of implementation adsorption mouth 7a, the correction that installation head 7 is offset in X-direction, installation station 4 carry out the correcting process of the absorption attitude of electronic unit in the correction that Y direction is offset with this.
Device 110 according to such present embodiment 2, because on X-axis guiding parts 81, the left and right sides that is positioned at the directions X of clamping installation station 4 has disposed parts gesture recognition device 120, so adsorbed the installation head 7 of electronic unit, and when mobile to the position that this electronic unit is installed to circuit board P, must be by the top of this parts gesture recognition device 120.Therefore, because can be with the location independent of X-axis guiding parts and the attitude of installation head 7 identification component when X-direction moves, so can electronic unit be installed with shorter distance, to realize the high efficiency of distance and time.
And, compare with situation in the past being fixed on the bedframe 2 between belt feeder 6 and the installation station 4, parts gesture recognition device, owing to shortened the distance between belt feeder 6 (first～the 4th feed appliance group 61～64) and the installation station 4, so can shorten displacement, the traveling time of the installation head 7 that is used to install electronic unit, and can make electronic component mounting apparatus 110 miniaturizations.And, at this moment, for example if the 4 first～the 4th feed appliance group 61～64 is set, then can possess 4 parts gesture recognition devices corresponding to each belt feeder group, further shorten the displacement of installation head 7 with this, but, also can similarly realize with two parts gesture recognition devices, so can suppress cost and more suitable according to the present invention.
In addition, the parts gesture recognition device 120 in present embodiment 2 is not limited to the structure that is fixed on the X-axis guiding parts 81, for example, also can be with the drive mechanism of regulation and with this structure that can move along X-direction.At this moment, because installation head 7 can move near the attract electrons position component, so parts gesture recognition device 120 can promptly carry out the identification of absorption attitude of electronic unit and the computing of side-play amount, also can promptly adsorb the correction of attitude thereupon.And even have only a parts gesture recognition device 120 for two installation head 7, the displacement that does not increase the installation head 7 that is used for the identification component attitude just can be corresponding, so more can suppress cost.
In addition, as shown in Figure 4, adsorption mouth 7a is the attract electrons parts on absorption height 701, then, electronic unit are risen to maintenance height 702, and move to the installation site of circuit board P.Therefore, with the absorption position of adsorption mouth 7a position with the parts gesture recognition device 120 that protrudes from X-axis guiding parts 81, that is, do not make the part protruded from the X-axis guiding parts 81 of parts gesture recognition device 120 with not overlapping, can move with retreating yet to the Ya direction with track that installation head 7 moves to X-direction.At this moment, for example, can avoid the contact or the interference of installation head 7, adsorption mouth 7a, electronic unit etc. reliably.And aforesaid parts gesture recognition device 120 is for avoiding contact, the interference of installation head 7, adsorption mouth 7a, electronic unit etc. similarly when the structure that X-direction moves.
In addition, more than explanation is parts gesture recognition device 120, takes the structure of the absorption attitude of electronic unit from the below of installation head 7, but also can be the structure of taking from any direction up and down.
In addition, more than explanation is parts gesture recognition device 120, the image mechanism that possesses ccd video camera etc., and adsorb the structure of attitude correcting process with the image of the absorption attitude of taking electronic unit, but except image mechanism, also can be light-emitting component and the photo detector that possesses diode etc., and the structure of situation of blocking of using up or reflection condition identification absorption attitude.
In addition, the present invention is not limited to the above embodiments 1 and embodiment 2, without departing from the spirit and scope of the present invention, can carry out the various improvement and the change of design.
For example, also can be except video camera 7b, the 7b of each installation head 7,7 and parts gesture recognition device 120a, 120b or except these video cameras 7b, 7b and parts gesture recognition device 120a, 120b etc., append again fixed (for example, can be fixed in bedframe 2) video camera, and the absorption attitude of taking the electronic unit etc. of IC parts etc. with this video camera.And the assembly supply device of supply electronic unit also is not limited to belt feeder 6, also can use volume feed appliance, pellet type feed appliance, or they are used in combination.
(invention effect)
According to the 1st invention, because in the installation action of mounting electronic parts on circuit board, base Originally be mobile mounting head and installation station, and X-axis guiding parts that needn't the movable support mounting head, institute Put on the load of the X-axis guiding parts of y-axis shift actuation mechanism with the ground inhibition of energy Min..
In addition, because mounting head not only moves to X-direction, also can be with the X-axis guiding parts Move and move to Y direction, so can be mounting head within the limits prescribed along X-axis and Y-axis side To an only mobile small distance, and can be always take out and the maintenance electronic unit at the extracting position of the best.
According to the 2nd invention because installation station and mounting head needn't be set again, so suppressed with again The relevant cost of each parts that these installation stations and mounting head are set rises, and can be more electricity Subassembly is installed on the circuit board.
According to the 3rd invention, the same with the 1st invention, can suppress to put on the y-axis shift actuation mechanism Load, and, because the taking-up action of the electronic unit of each mounting head that can hocket and installing Action, thus with using single mounting head the situation that electronic unit is installed on the circuit board is compared, Can more electronic unit be installed at circuit board with the same time.
According to the 4th invention, compared with the past, because arrangement components feedway closer With the position of installation station, thus the set-up time of electronic unit can be shortened, and can make the ministry of electronics industry The miniaturization of part erecting device. And, can be with the X-axis guiding parts irrespectively mounting head along X-axis Direction moves, and can identify the attitude of electronic unit with this, can not arrange as in the past at parts A plurality of parts gesture recognition devices between feedway and the installation station and realize more short-range peace Dress, and can suppress cost. In addition, since can be expressly keeping electronic unit The position that is fixed wtih parts gesture recognition device that mounting head moves in the past just can be installed to circuit board On, so can realize the distance of electronic unit installation and the high efficiency of time.
According to the 5th invention, corresponding to position from assembly supply device to mounting head that supplied with electronic unit by Put and moving-member gesture recognition device, more promptly carry out the identification of electronic unit attitude with this, Can carry out rapidly the processing corresponding to this identifying processing thereupon. In addition, particularly disposing During a plurality of mounting head, even a parts gesture recognition device is arranged, also needn't move redundantly and be used for The mounting head of identification component attitude.
According to the 6th invention, when supplying with electronic unit by assembly supply device to mounting head, can keep away Exempt from the interference of mounting head, electronic unit etc. and parts gesture recognition device.
Claims (6)
1. electronic component mounting apparatus is characterized in that having:
Circuit board remain on installation station that the electronic unit state can be installed,
Described installation station along travel mechanism of installation station that Y direction moves,
For described circuit board is moved into take out of described installation station and along X-direction be provided with the circuit board transport path the circuit board conveying mechanism,
For supply with should be installed in the electronic unit on the described circuit board and be configured in the mobile route both sides of Y direction of described installation station and a plurality of assembly supply devices that are provided with along each X-direction,
Can keep respectively described electronic unit installation head,
Support the X-axis guiding parts of described installation head flexibly movably and support the Y-axis guiding parts of described installation head along described Y direction flexibly movably along described X-direction;
The described installation head that is arranged on described installation station top is moved, make described installation head towards a plurality of described assembly supply devices top and the described circuit board top that remains in the described installation station;
Described installation head be provided with two in the mode that can independently be supported on movably on the described X-axis guiding parts mutually,
Installation head according to a side decides the installation site to the shift action and the installation station of X-direction to the co-operating of the shift action of Y direction, carries out the installation of electronic unit in described installation site,
The opposing party's installation head is in the installation action of a described side's installation head, from being positioned at the assembly supply device attract electrons parts with respect to described the opposing party's of installation station the first side of installation.
2. electronic component mounting apparatus according to claim 1 is characterized in that:
Described X-axis guiding parts by described y-axis shift actuation mechanism, is crossed over described circuit board transport path, moves to Y direction,
Described assembly supply device, be separately positioned on the mobile route of described y-axis shift actuation mechanism of described X-axis guiding parts, the front side of described circuit board transport path and the both sides of rear side, any zone of (101,102) in the installation region can be installed in adsorbed electronic unit on the described circuit board.
3. electronic component mounting apparatus according to claim 1 is characterized in that:
On each installation head, be provided with the parts gesture recognition device that identification is attracted to the attitude of the electronic unit on the adsorption mouth, this parts gesture recognition device, the light-emitting component that is formed a line by horizontal Tile constitutes with the photo detector that becomes row with described light-emitting component arranged opposite.
4. electronic component mounting apparatus according to claim 1 is characterized in that:
Below the X-axis guiding parts, has parts gesture recognition device, this parts gesture recognition device, be positioned at the directions X left and right sides that installation station is clipped in the middle, and, when X-direction moved, the attitude from the below to described electronic unit was made a video recording, to discern the attitude of described electronic unit in the described installation head that keeps described electronic unit.
5. electronic component mounting apparatus according to claim 4 is characterized in that:
Described parts gesture recognition device can move along X-direction.
6. electronic component mounting apparatus according to claim 4 is characterized in that:
Described parts gesture recognition device, can along Y direction move to not with described installation head along position that the X-direction motion track overlaps.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002092465 | 2002-03-28 | ||
| JP200292465 | 2002-03-28 | ||
| JP2002336412A JP4203303B2 (en) | 2002-03-28 | 2002-11-20 | Electronic component mounting equipment |
| JP2002336412 | 2002-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1449241A CN1449241A (en) | 2003-10-15 |
| CN1262162C true CN1262162C (en) | 2006-06-28 |
Family
ID=28793504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031082912A Expired - Fee Related CN1262162C (en) | 2002-03-28 | 2003-03-27 | Electronic-component mounting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4203303B2 (en) |
| KR (1) | KR100954936B1 (en) |
| CN (1) | CN1262162C (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4104062B2 (en) * | 2002-12-13 | 2008-06-18 | 松下電器産業株式会社 | Electronic component mounting equipment |
| JP2006147624A (en) * | 2004-11-16 | 2006-06-08 | Juki Corp | Electronic component mounting device |
| US7899561B2 (en) | 2004-12-15 | 2011-03-01 | Panasonic Corporation | Operating time reducing method, operating time reducing apparatus, program and component mounter |
| KR100651815B1 (en) * | 2005-01-14 | 2006-12-01 | 삼성테크윈 주식회사 | Chip mounter |
| JP2010171215A (en) * | 2009-01-23 | 2010-08-05 | Seiko Instruments Inc | Component supply device |
| CN102361544B (en) * | 2011-09-28 | 2013-05-01 | 岑书宁 | Circuit board surface mount technology (SMT) |
| US9530557B2 (en) | 2012-06-21 | 2016-12-27 | Hanwha Techwin Co., Ltd. | Working machine powered in a non-contact manner |
| JP6075722B2 (en) * | 2012-06-21 | 2017-02-08 | ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． | Work machine |
| CN105392357B (en) * | 2015-12-17 | 2019-05-10 | 惠州市德赛自动化技术有限公司 | A kind of fully-automatic plug-in machine |
| CN105828531A (en) * | 2016-05-13 | 2016-08-03 | 李丙生 | Back adhesive laminating equipment |
| CN109564878B (en) * | 2016-08-05 | 2023-05-16 | 韩华精密机械株式会社 | Joining system |
| JP7427652B2 (en) * | 2019-03-08 | 2024-02-05 | ヤマハ発動機株式会社 | A system and component mounting system consisting of a mounting data creation support device, a mounting data creation support method, a visual inspection machine, and a control device. |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3720213B2 (en) | 1999-05-31 | 2005-11-24 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| JP2001267798A (en) * | 2000-03-17 | 2001-09-28 | Murata Mfg Co Ltd | Component mounting device |
| KR20010114161A (en) * | 2000-06-21 | 2001-12-29 | 마츠시타 덴끼 산교 가부시키가이샤 | Device and method for mounting parts |
| KR100349947B1 (en) * | 2000-09-04 | 2002-08-24 | 주식회사 텔피온 | Auto injection machine and method of pcb press fit connector |
-
2002
- 2002-11-20 JP JP2002336412A patent/JP4203303B2/en not_active Expired - Fee Related
-
2003
- 2003-03-27 CN CNB031082912A patent/CN1262162C/en not_active Expired - Fee Related
- 2003-03-27 KR KR1020030019205A patent/KR100954936B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100954936B1 (en) | 2010-04-27 |
| JP4203303B2 (en) | 2008-12-24 |
| CN1449241A (en) | 2003-10-15 |
| JP2004006605A (en) | 2004-01-08 |
| KR20030078719A (en) | 2003-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1190121C (en) | Method and device for mounting parts | |
| CN1262162C (en) | Electronic-component mounting apparatus | |
| CN1258312C (en) | Device for transfering/holding sheetlike member and its method | |
| CN1204801C (en) | Component mounting machine and method | |
| CN1102333C (en) | Apparatus for feeding chip components and cartridge type chip component container | |
| CN1303860C (en) | Working system for substrate | |
| US9844170B2 (en) | Component mounting machine | |
| CN1071536C (en) | Automatic electronic parts mounting apparatus | |
| CN1191749C (en) | Device and method for mounting parts | |
| CN1189761A (en) | Electronic-parts mounting apparatus | |
| CN1819416A (en) | Linear electronic device | |
| CN1604731A (en) | Electronic component mounting apparatus | |
| CN101053294A (en) | Mounter and board positioning method | |
| CN1691887A (en) | Electronic component mounting method and electronic component mounting apparatus | |
| CN1662133A (en) | Electronic parts installation device | |
| CN1843758A (en) | Printing device and printing method | |
| CN1320361A (en) | Method and apparatus for mounting component | |
| CN1774167A (en) | Tape feeder for component mounter and method of automatically setting tape initial position by the same | |
| CN1759644A (en) | Electronic component mounting device | |
| CN1708218A (en) | Maintenance management apparatus for electronic parts assembling apparatus | |
| CN1723749A (en) | Electronic component placement machine and electronic component placement method | |
| CN1189071C (en) | Mounting machine and its part mounting method | |
| CN1741728A (en) | Element identifying device and surface mounting machine with the same element identifying device | |
| CN1592574A (en) | Adsorption position corrector of electronic device in electronic device mounting machine | |
| CN1290397C (en) | Parts installation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060628 Termination date: 20130327 |