CN1246116C - 用于电路基板加工的激光机光学系统校准方法 - Google Patents
用于电路基板加工的激光机光学系统校准方法 Download PDFInfo
- Publication number
- CN1246116C CN1246116C CNB028130383A CN02813038A CN1246116C CN 1246116 C CN1246116 C CN 1246116C CN B028130383 A CNB028130383 A CN B028130383A CN 02813038 A CN02813038 A CN 02813038A CN 1246116 C CN1246116 C CN 1246116C
- Authority
- CN
- China
- Prior art keywords
- focal plane
- correction value
- model
- point
- machined surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10131610.0 | 2001-06-29 | ||
DE10131610A DE10131610C1 (de) | 2001-06-29 | 2001-06-29 | Verfahren zur Kalibrierung des optischen Systems einer Lasermaschine zur Bearbeitung von elektrischen Schaltungssubstraten |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1522187A CN1522187A (zh) | 2004-08-18 |
CN1246116C true CN1246116C (zh) | 2006-03-22 |
Family
ID=7690057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028130383A Expired - Fee Related CN1246116C (zh) | 2001-06-29 | 2002-05-27 | 用于电路基板加工的激光机光学系统校准方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6678061B2 (zh) |
EP (1) | EP1401609B1 (zh) |
JP (1) | JP2004532740A (zh) |
KR (1) | KR20040045404A (zh) |
CN (1) | CN1246116C (zh) |
DE (2) | DE10131610C1 (zh) |
WO (1) | WO2003004212A1 (zh) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US7838794B2 (en) * | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US20030222324A1 (en) * | 2000-01-10 | 2003-12-04 | Yunlong Sun | Laser systems for passivation or link processing with a set of laser pulses |
US7671295B2 (en) * | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US20060141681A1 (en) * | 2000-01-10 | 2006-06-29 | Yunlong Sun | Processing a memory link with a set of at least two laser pulses |
US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
DE10206183A1 (de) * | 2002-02-14 | 2003-08-28 | Siemens Ag | Verfahren zur Bestimmung der Genauigkeit von Bearbeitungsmaschine |
US20040144760A1 (en) | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
KR100486088B1 (ko) * | 2002-08-21 | 2005-04-29 | 주식회사 이오테크닉스 | 포스트 비젼 카메라를 이용한 레이저 마킹시스템의 마킹보정방법 |
DE10317322B4 (de) * | 2003-04-15 | 2007-01-25 | Lasertec Gmbh | Verfahren und Vorrichtung zur Ermittlung der Abtragsleistung eines Laserstrahls und zur Herstellung eines Gesenks in einem Werkstück |
JP2005028423A (ja) * | 2003-07-09 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
DE10336861B3 (de) * | 2003-08-11 | 2004-12-09 | Siemens Ag | Verfahren zur Bestimmung der Oberflächenposition eines Werkstückes innerhalb einer Laserbearbeitungsmaschine |
CA2560092C (en) * | 2004-03-19 | 2013-12-10 | Jrb Engineering Pty Ltd | Optical method of determining a physical attribute of a moving object |
US7265082B2 (en) * | 2004-08-04 | 2007-09-04 | Honeywell International Inc. | Azeotrope-like compositions of 1,1,1,3,3-pentachloropropane and carbon tetrachloride |
US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
WO2006136192A1 (de) | 2005-06-23 | 2006-12-28 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zur bestimmung der fokuslage eines laserstrahls |
US20070114700A1 (en) * | 2005-11-22 | 2007-05-24 | Andrewlavage Edward F Jr | Apparatus, system and method for manufacturing a plugging mask for a honeycomb substrate |
CN101421930A (zh) * | 2006-04-12 | 2009-04-29 | Nxp股份有限公司 | 配置锁相环电路的方法以及系统 |
DE102007025463A1 (de) * | 2007-09-09 | 2009-03-12 | Atn Automatisierungstechnik Niemeier Gmbh | Verfahren und Vorrichtung zur Synchronisation von Laser und Sensorik bei der Verwendung von Scannersystemen |
CN101504491B (zh) * | 2008-02-05 | 2012-04-11 | 中茂电子(深圳)有限公司 | 电路装置与基板接合用光学对位装置及具有该装置的系统 |
DE102008027891A1 (de) * | 2008-03-12 | 2009-04-23 | Rofin Sinar Laser Gmbh | Vorrichtung zum simultanen Laserbearbeiten eines oder einer Mehrzahl von Bauteilen |
US9551575B2 (en) | 2009-03-25 | 2017-01-24 | Faro Technologies, Inc. | Laser scanner having a multi-color light source and real-time color receiver |
DE102009015920B4 (de) | 2009-03-25 | 2014-11-20 | Faro Technologies, Inc. | Vorrichtung zum optischen Abtasten und Vermessen einer Umgebung |
CN101733561B (zh) * | 2009-11-04 | 2012-04-11 | 中国科学院长春光学精密机械与物理研究所 | 激光修调薄膜电阻中快速精确调整焦面的方法 |
US9529083B2 (en) | 2009-11-20 | 2016-12-27 | Faro Technologies, Inc. | Three-dimensional scanner with enhanced spectroscopic energy detector |
DE102009057101A1 (de) | 2009-11-20 | 2011-05-26 | Faro Technologies, Inc., Lake Mary | Vorrichtung zum optischen Abtasten und Vermessen einer Umgebung |
US9210288B2 (en) | 2009-11-20 | 2015-12-08 | Faro Technologies, Inc. | Three-dimensional scanner with dichroic beam splitters to capture a variety of signals |
US9113023B2 (en) | 2009-11-20 | 2015-08-18 | Faro Technologies, Inc. | Three-dimensional scanner with spectroscopic energy detector |
US9628775B2 (en) | 2010-01-20 | 2017-04-18 | Faro Technologies, Inc. | Articulated arm coordinate measurement machine having a 2D camera and method of obtaining 3D representations |
US9879976B2 (en) | 2010-01-20 | 2018-01-30 | Faro Technologies, Inc. | Articulated arm coordinate measurement machine that uses a 2D camera to determine 3D coordinates of smoothly continuous edge features |
DE112011100300T5 (de) | 2010-01-20 | 2013-03-07 | Faro Technologies, Inc. | Integriertes Temperaturmesssystem für Teile |
US8875409B2 (en) * | 2010-01-20 | 2014-11-04 | Faro Technologies, Inc. | Coordinate measurement machines with removable accessories |
US9163922B2 (en) | 2010-01-20 | 2015-10-20 | Faro Technologies, Inc. | Coordinate measurement machine with distance meter and camera to determine dimensions within camera images |
US9607239B2 (en) | 2010-01-20 | 2017-03-28 | Faro Technologies, Inc. | Articulated arm coordinate measurement machine having a 2D camera and method of obtaining 3D representations |
DE102010020925B4 (de) | 2010-05-10 | 2014-02-27 | Faro Technologies, Inc. | Verfahren zum optischen Abtasten und Vermessen einer Umgebung |
CN102248817B (zh) * | 2010-05-21 | 2013-07-03 | 深圳泰德激光科技有限公司 | 激光打标的校正方法和校正装置以及激光打标系统 |
US9168654B2 (en) | 2010-11-16 | 2015-10-27 | Faro Technologies, Inc. | Coordinate measuring machines with dual layer arm |
JP2012148316A (ja) * | 2011-01-19 | 2012-08-09 | Keyence Corp | レーザー加工装置 |
JP5385356B2 (ja) * | 2011-10-21 | 2014-01-08 | 株式会社片岡製作所 | レーザ加工機 |
JP6030299B2 (ja) * | 2011-12-20 | 2016-11-24 | 株式会社ディスコ | レーザー加工装置 |
DE102012100609A1 (de) | 2012-01-25 | 2013-07-25 | Faro Technologies, Inc. | Vorrichtung zum optischen Abtasten und Vermessen einer Umgebung |
US9513107B2 (en) | 2012-10-05 | 2016-12-06 | Faro Technologies, Inc. | Registration calculation between three-dimensional (3D) scans based on two-dimensional (2D) scan data from a 3D scanner |
US10067231B2 (en) | 2012-10-05 | 2018-09-04 | Faro Technologies, Inc. | Registration calculation of three-dimensional scanner data performed between scans based on measurements by two-dimensional scanner |
DE102012109481A1 (de) | 2012-10-05 | 2014-04-10 | Faro Technologies, Inc. | Vorrichtung zum optischen Abtasten und Vermessen einer Umgebung |
TWI555599B (zh) * | 2013-02-25 | 2016-11-01 | 先進科技新加坡有限公司 | 在雷射劃刻裝置中執行光束特徵化之方法,及可執行此方法之雷射劃刻裝置 |
WO2015045834A1 (ja) * | 2013-09-30 | 2015-04-02 | 独立行政法人産業技術総合研究所 | マーカ画像処理システム |
US9766473B1 (en) * | 2014-02-03 | 2017-09-19 | Automation Engineering, Inc. | Automated UV calibration, motorized optical target and automatic surface finder for optical alignment and assembly robot |
CN106573331B (zh) * | 2014-08-20 | 2020-09-04 | 阿卡姆股份公司 | 能量射束大小验证 |
CN106573305B (zh) * | 2014-08-20 | 2019-02-12 | 阿卡姆股份公司 | 用于能量射束偏转速度验证的方法和装置 |
US9341467B2 (en) * | 2014-08-20 | 2016-05-17 | Arcam Ab | Energy beam position verification |
TWI577484B (zh) * | 2014-11-20 | 2017-04-11 | 財團法人工業技術研究院 | 三維雷射加工裝置及定位誤差校正方法 |
CN105328350A (zh) * | 2015-10-09 | 2016-02-17 | 江苏大金激光科技有限公司 | 自动检测穿孔的激光切割头 |
CN105642894B (zh) * | 2015-10-14 | 2018-09-07 | 哈尔滨福沃德多维智能装备有限公司 | 振镜控制激光扫描精度校正方法 |
AU2016341984B2 (en) | 2015-10-21 | 2021-10-14 | Amo Development, Llc | Laser beam calibration and beam quality measurement in laser surgery systems |
DE102015122844A1 (de) | 2015-12-27 | 2017-06-29 | Faro Technologies, Inc. | 3D-Messvorrichtung mit Batteriepack |
DE102016222186B3 (de) | 2016-11-11 | 2018-04-12 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Kalibrieren zweier Scannereinrichtungen jeweils zur Positionierung eines Laserstrahls in einem Bearbeitungsfeld und Bearbeitungsmaschine zum Herstellen von dreidimensionalen Bauteilen durch Bestrahlen von Pulverschichten |
DE102017213511A1 (de) * | 2017-08-03 | 2019-02-07 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zur Lasermaterialbearbeitung und Lasermaschine |
CN107684669B (zh) | 2017-08-21 | 2020-04-17 | 上海联影医疗科技有限公司 | 用于校正对准设备的系统和方法 |
US10919111B2 (en) | 2018-12-05 | 2021-02-16 | Robert Bosch Tool Corporation | Laser engraver mirror adjustment system |
US20210129442A1 (en) * | 2019-10-31 | 2021-05-06 | Concept Laser Gmbh | Method for Calibration of at Least One Irradiation Device of an Apparatus for Additively Manufacturing Three-Dimensional Objects |
US11733187B2 (en) | 2021-02-12 | 2023-08-22 | Arcam Ab | Verification plates with automated evaluation of melt performance |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4682894A (en) * | 1985-03-21 | 1987-07-28 | Robotic Vision Systems, Inc. | Calibration of three-dimensional space |
US5772656A (en) * | 1993-06-04 | 1998-06-30 | Summit Technology, Inc. | Calibration apparatus for laser ablative systems |
US5557410A (en) * | 1994-05-26 | 1996-09-17 | Lockheed Missiles & Space Company, Inc. | Method of calibrating a three-dimensional optical measurement system |
DE4437284A1 (de) * | 1994-10-18 | 1996-04-25 | Eos Electro Optical Syst | Verfahren zum Kalibrieren einer Steuerung zur Ablenkung eines Laserstrahls |
US5530548A (en) * | 1994-11-07 | 1996-06-25 | Automotive Systems Laboratory, Inc. | Calibratable optical distance sensing system and method |
US5663795A (en) * | 1995-09-07 | 1997-09-02 | Virtek Vision Corp. | Method of calibrating laser positions relative to workpieces |
US5867261A (en) * | 1997-04-28 | 1999-02-02 | International Business Machines Corporation | Surface inspection tool |
US6101455A (en) * | 1998-05-14 | 2000-08-08 | Davis; Michael S. | Automatic calibration of cameras and structured light sources |
DE19831340C1 (de) * | 1998-07-13 | 2000-03-02 | Siemens Ag | Verfahren und Anordnung zum Kalibrieren einer Laserbearbeitungsmaschine zum Bearbeiten von Werkstücken |
-
2001
- 2001-06-29 DE DE10131610A patent/DE10131610C1/de not_active Expired - Fee Related
-
2002
- 2002-04-15 US US10/121,731 patent/US6678061B2/en not_active Expired - Fee Related
- 2002-05-27 KR KR10-2003-7016862A patent/KR20040045404A/ko not_active Application Discontinuation
- 2002-05-27 WO PCT/DE2002/001950 patent/WO2003004212A1/de active IP Right Grant
- 2002-05-27 DE DE50202123T patent/DE50202123D1/de not_active Expired - Fee Related
- 2002-05-27 EP EP02740382A patent/EP1401609B1/de not_active Expired - Lifetime
- 2002-05-27 JP JP2003510213A patent/JP2004532740A/ja active Pending
- 2002-05-27 CN CNB028130383A patent/CN1246116C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20030002055A1 (en) | 2003-01-02 |
JP2004532740A (ja) | 2004-10-28 |
DE10131610C1 (de) | 2003-02-20 |
CN1522187A (zh) | 2004-08-18 |
DE50202123D1 (de) | 2005-03-03 |
EP1401609A1 (de) | 2004-03-31 |
KR20040045404A (ko) | 2004-06-01 |
EP1401609B1 (de) | 2005-01-26 |
US6678061B2 (en) | 2004-01-13 |
WO2003004212A1 (de) | 2003-01-16 |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI VIA MACHINE CO., LTD. Free format text: FORMER OWNER: SIEMENS AG Effective date: 20060623 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20060623 Address after: Kanagawa Patentee after: Hitachi VIA Mechanics Ltd. Address before: Munich, Germany Patentee before: Siemens AG |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060322 Termination date: 20110527 |