CN1244137C - Pollution controlling method for semiconductor equipment with runcard - Google Patents
Pollution controlling method for semiconductor equipment with runcard Download PDFInfo
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- CN1244137C CN1244137C CNB031091164A CN03109116A CN1244137C CN 1244137 C CN1244137 C CN 1244137C CN B031091164 A CNB031091164 A CN B031091164A CN 03109116 A CN03109116 A CN 03109116A CN 1244137 C CN1244137 C CN 1244137C
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Abstract
The present invention relates to a pollution control method of a semiconductor device under the condition of a Runcard. Firstly, a Runcard is received, and the pollution state of a device machine table for executing mother batch cargoes can be obtained. If the pollution state is not the back end share, a manufacturing process definition for correspondingly executing the Runcard and the pollution state of a manufacturing process stage are stated for executing the pollution state of the device machine table of the mother batch cargoes. When the pollution state of the device machine table for executing the mother batch cargoes is the back end share, the pollution state of the manufacturing process stage for executing the mother batch cargoes can be obtained. When the pollution state of the manufacturing process stage is not a back end or a copper manufacturing process end, the Runcard is refused to be executed, or else, a manufacturing process definition for correspondingly executing the Runcard and the pollution state of the manufacturing process stage is stated for executing the pollution state of the manufacturing process stage of the mother batch cargoes.
Description
Technical field
The present invention is relevant for a kind of groundwater pollution control of semiconductor equipment, and be particularly to a kind of can be at the groundwater pollution control of semiconductor equipment under the Runcard situation of effectively managing for the pollutional condition of semiconductor equipment and unit of cargo (Lot) under the Runcard situation.
Background technology
In semiconductor fabrication, for research and development experiment, process parameter adjustment or the process conditions correction of customer requirement, semiconductor foundries (IC Foundry) can produce a Runcard describe corresponding information in detail, as semiconductor equipment numbering, wafer (Wafer) quantity, wafer number, processing procedure program (Recipe) or the graticle information such as (Reticle) that is used to test.
Fig. 1 shows manufacturing execution system (Manufacturing Execution System, the main program defining of predefined MES) (Process Definition, PD), the schematic diagram that concerns of program defining, main road line (Main Route) and corresponding Runcard.As shown in the figure, the program defining of predefined in main program defining (main road line) the A manufacturing execution system has comprised 6 program defining (or being called the processing procedure station) OPA1, OPA2, OPA3, OPA4, OPA5 and OPA6 among the main program defining A; Runcard B has comprised 3 main program defining B10, B20 and B30, and Runcard master's program defining B10 comprises program defining OPB11, Runcard master's program defining B20 comprises program defining PB21, OPB22 and OPB23, and Runcard master's program defining B30 comprises program defining OPB31, OPB32 and OPB33.Wherein, each program defining comprises relevant condition, judgement, processing procedure and corresponding apparatus board.
In this example, when the process apparatus board is carried out program defining OPA3 to main program defining A, to be carried out the defined program defining of Runcard B by the unit of cargo of Runcard B appointment (Lot), for instance, the 1st, 2,3 wafer in the Runcard unit of cargo are carried out the process operations of Runcard master's program defining B10; The 4th, 5,6 wafer in the Runcard unit of cargo are carried out the process operations of Runcard master's program defining B20; And the 1st, 2,3,4,5,6 wafer in the Runcard unit of cargo are carried out the process operations of Runcard master's program defining B30.
In the semiconductor foundries, each unit of cargo, semiconductor equipment and carrier as FOUP, all indicate a pollutional condition (Contamination Status), represent the degree of fouling of corresponding unit of cargo, semiconductor equipment or carrier.When unit of cargo is desired to carry out corresponding fabrication process on semiconductor equipment, manufacturing execution system (MES) can judge whether the pollutional condition of pollutional condition, semiconductor equipment and the carrier of corresponding unit of cargo meets earlier, when meeting each other or compatibility, in the time of can accepting the pollutional condition of unit of cargo as semiconductor equipment, this unit of cargo just can be carried out fabrication process on semiconductor equipment.Wherein, judge that the purpose of pollutional condition is in order to avoid causing the pollution of wafer or semiconductor equipment.
Yet, because the Runcard situation in the semiconductor foundries belongs to special situation, for the manufacturing execution system in the semiconductor factory, SIVIEW as IBM (IBM) company, it can't provide effective administrative mechanism at the pollution control of the semiconductor equipment under the Runcard situation, make the pollution control of the semiconductor equipment under the Runcard situation to carry out with artificial and rule of thumb mode, increase operating personnel's burden and equipment contamination risk, and violate the trend of plant area's automation.
Summary of the invention
In view of this, main purpose of the present invention for provide a kind of can be at the groundwater pollution control of the semiconductor equipment of effectively managing for the pollutional condition of semiconductor equipment and unit of cargo under the Runcard situation.
In order to reach above-mentioned purpose of the present invention, can reach by the groundwater pollution control of semiconductor equipment under the Runcard situation provided by the present invention.
The groundwater pollution control of semiconductor equipment at first, receives a Runcard, and obtains the pollutional condition of the equipment board of carrying out mother batch under the Runcard situation of making according to the semiconductor of the embodiment of the invention.If pollutional condition is not when sharing the rear end, the program defining of then setting corresponding execution Runcard and the pollutional condition of the pollutional condition of process stage for the equipment board of execution mother batch.
When the pollutional condition of the equipment board of carrying out mother batch is that the rear end is when sharing, then obtain the pollutional condition of the process stage of carrying out mother batch, and when the pollutional condition of process stage is not during for rear end or copper wiring end, then refusal is carried out Runcard, if the time, then setting the program defining of corresponding execution Runcard and the pollutional condition of process stage is the pollutional condition of carrying out the process stage of mother batch.
In addition, comprise that the more sub-unit of cargo with mother batch carries out the route change.Then, the pollutional condition with the process stage of the pollutional condition of sub-unit of cargo and corresponding Runcard compares.If the pollutional condition of sub-unit of cargo does not meet the pollutional condition of the process stage of corresponding Runcard, the route of then refusing corresponding sub-unit of cargo changes.If the pollutional condition of sub-unit of cargo meets the pollutional condition of the process stage of corresponding Runcard, then the pollutional condition with the program defining of the pollutional condition of sub-unit of cargo and corresponding Runcard compares.
If the pollutional condition of sub-unit of cargo does not meet the pollutional condition of the program defining of corresponding Runcard, then refuse the fabrication process that sub-unit of cargo carries out corresponding Runcard.And, then sub-unit of cargo is carried out the fabrication process of corresponding Runcard in the equipment board of corresponding Runcard if the pollutional condition of sub-unit of cargo meets the pollutional condition of the program defining of Runcard.
Description of drawings
Fig. 1 is the relation that a schematic diagram shows main program defining, program defining and corresponding Runcard.
Fig. 2 is that a flow chart shows the operating process according to the groundwater pollution control of semiconductor equipment under the Runcard situation of the embodiment of the invention.
Fig. 3 is the set truss that a schematic diagram shows pollutional condition in the semiconductor manufacturing.
The figure number explanation
A master's program defining
B Runcard
OPA1 ..., the OPA6 program defining
B10, B20, B30 Runcard master program defining;
OPB11 ..., the OPB33 program defining
S21, S22 ..., the S41 operating procedure
The STAGE1 process stage
PD1, PD2 program defining
EQP1, EQP2 equipment board
Embodiment
Fig. 2 (comprising Fig. 2 A and Fig. 2 B) is for showing the operating process according to the groundwater pollution control of semiconductor equipment under the Runcard situation of the embodiment of the invention.
Please refer to Fig. 2 A, at first, as step S21, reception is at research and development experiment, process parameter adjustment or the client is a desired Runcard for the process conditions correction.Then, as step S22, obtain the pollutional condition of carrying out the equipment board of a mother batch at present.Wherein, this mother batch is the unit of cargo of the specified processing of Runcard, and can comprise a plurality of sub-unit of cargos in the mother batch.
Generally speaking, in the semiconductor manufacturing, the setting of pollutional condition can be divided into the tri-layer framework, as shown in Figure 3, wherein, penetralia is the pollutional condition of equipment board, secondly be the pollutional condition of program defining, outermost is the pollutional condition of whole process stage (Stage), wherein, a process stage can comprise a plurality of program defining, and can comprise an equipment board in a program defining, in addition, the pollutional condition of program defining and equipment board must can accept within the scope at the pollutional condition of process stage.In this example, comprise program defining PD1 and program defining PD2 among the process stage STAGE1, and program defining PD1 and program defining PD2 comprise equipment board EQP1 and equipment board EQP2 respectively.
Then can divide into F, B, C and R as for pollutional condition.Wherein, F represents front end (Front End); B represents rear end (Back End); C represents copper wiring end (Copper End); And on behalf of the rear end, R share (BackEnd Shared), promptly can comprise the state of B and C simultaneously.
If carrying out the pollutional condition of the equipment board of this mother batch at present is not for sharing (R) (step S23 denys) in the rear end, then as step S24, the pollutional condition of setting the pollutional condition of program defining of corresponding this Runcard of execution and process stage is for carrying out the pollutional condition of the equipment board of this mother batch.For instance, when the pollutional condition of carrying out the semiconductor equipment of this mother batch was front end (F), then setting the pollutional condition of this Runcard program defining of corresponding execution and the pollutional condition of process stage was front end (F); When the pollutional condition of semiconductor equipment was rear end (B), then setting the pollutional condition of program defining and the pollutional condition of process stage was rear end (B); And when the pollutional condition of semiconductor equipment was copper wiring end (C), then setting the pollutional condition of program defining and the pollutional condition of process stage was copper wiring end (C).
Pollutional condition classification that it should be noted that above-mentioned process stage is not limited thereto, and the semiconductor equipment classification for dissimilar also can increase its corresponding pollutional condition classification, simultaneously, also can substitute to some extent for different periphery application.
If carrying out the pollutional condition of the equipment board of this mother batch at present is that (R) (step S23 is) shared in the rear end, then as step S25, obtains the pollutional condition of carrying out the process stage of this mother batch at present.If the pollutional condition of carrying out the process stage of this mother batch is not (step S26 not) during for rear end B or copper wiring end C, then as step S27, refusal is carried out the associative operation of this Runcard, and as step S28, send a caution message, to notify the related personnel.And when if the pollutional condition of carrying out the process stage of this mother batch is rear end B or copper wiring end C (step S26 is), then as step S29, the pollutional condition of setting the pollutional condition of program defining of corresponding this Runcard of execution and process stage is for carrying out the pollutional condition of the process stage of this mother batch.
Afterwards, please continue with reference to figure 2B, as step S30, specify the main program defining of the sub-unit of cargo of mother batch to corresponding Runcard, this action is called " route changes (Route Changc) " in the semiconductor manufacturing.What note is that in the time of at the beginning, the pollutional condition of sub-unit of cargo is identical with the pollutional condition of mother batch.Then, as step S31, the pollutional condition of the process stage of the pollutional condition of each sub-unit of cargo and corresponding Runcard is compared.
If the pollutional condition of sub-unit of cargo does not meet the pollutional condition (step S32 denys) of the process stage of corresponding Runcard, then as step S33, the route of corresponding this sub-unit of cargo of refusal changes behavior, and as step S34, sends a caution message, to notify the related personnel.And if the pollutional condition of sub-unit of cargo meets the pollutional condition (step S32 is) of the process stage of Runcard, then as step S35, the pollutional condition of the program defining of the pollutional condition of sub-unit of cargo and corresponding Runcard is compared.
Similarly, the pollutional condition whether above-mentioned pollutional condition of judging sub-unit of cargo meets Runcard process stage or program defining refers to whether the pollutional condition of process stage or program defining can accept the pollutional condition of sub-unit of cargo, i.e. the degrees of tolerance that whether sets less than process stage or program defining of the degree of fouling of sub-unit of cargo.In addition, as previously mentioned, can have a plurality of sub-unit of cargos in the mother batch, and different sub-unit of cargos can be specified the into different processing procedure of shape by Runcard.
If the pollutional condition of sub-unit of cargo does not meet the pollutional condition (step S36 denys) of the program defining of corresponding Runcard, then as step S37, refuse sub-unit of cargo carries out corresponding Runcard program defining in semiconductor equipment fabrication process, and as step S34, send a caution message, to notify the related personnel.And if the pollutional condition of sub-unit of cargo meets the pollutional condition (step S36 is) of the program defining of Runcard, then as step S38, sub-unit of cargo carries out the fabrication process of corresponding Runcard program defining in semiconductor equipment.
The group unit of cargo in semiconductor equipment carry out fabrication process finish after (step S39 is), as step S40, for different sub-unit of cargos, the pollutional condition of sub-unit of cargo can be made as the pollutional condition of the semiconductor equipment of the corresponding Runcard of carrying out fabrication process, and as step S41, according to the pollutional condition of each sub-unit of cargo and the pollutional condition of mother batch, reset the pollutional condition of mother batch.
Therefore, groundwater pollution control by semiconductor equipment under the Runcard situation provided by the present invention, can be at effectively managing for the pollutional condition of semiconductor equipment and unit of cargo under the Runcard situation, thereby reinforcement manufacturing execution system, SIVIEW as International Business Machine Corporation (IBM) bears to avoid equipment contamination risk, minimizing operating personnel for the managerial ability that semiconductor equipment pollutes, and promotes the automation target of overall semiconductor foundries.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any those who are familiar with this art; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (8)
1. the groundwater pollution control of semiconductor equipment under the traveler situation comprises the following steps:
Receive a traveler;
Obtain the pollutional condition of an equipment board of carrying out a mother batch, wherein can comprise a plurality of sub-unit of cargos in this mother batch;
If carrying out the pollutional condition of this equipment board of this mother batch and not being is a rear end when sharing, then set the pollutional condition of a program defining of corresponding this traveler of execution and the pollutional condition of a process stage according to the pollutional condition of the equipment board of carrying out this mother batch;
When the pollutional condition of the equipment board of carrying out this mother batch is shared for this rear end, then obtain the pollutional condition of the process stage of carrying out this mother batch;
When the pollutional condition of the process stage of carrying out this mother batch is not when being a rear end or a copper wiring end, then refusal is carried out this traveler; And
When the pollutional condition of the process stage of carrying out this mother batch be this rear end or this copper wiring end, the pollutional condition of pollutional condition and this process stage of then setting this program defining of corresponding this traveler of execution was the pollutional condition of the process stage of this mother batch of execution.
2. the groundwater pollution control of semiconductor equipment is characterized in that under the traveler situation as claimed in claim 1, comprises that more at least one sub-unit of cargo with this mother batch carries out the route change.
3. the groundwater pollution control of semiconductor equipment is characterized in that under the traveler situation as claimed in claim 2, more comprises the following steps:
The pollutional condition of this sub-unit of cargo is compared with the pollutional condition of this process stage that mutually should traveler;
If the pollutional condition of this sub-unit of cargo does not meet mutually the pollutional condition of this process stage that should traveler, then the route that refusal mutually should sub-unit of cargo changes;
If the pollutional condition of this sub-unit of cargo meets mutually the pollutional condition of this process stage that should traveler, pollutional condition that then will this sub-unit of cargo compares with the pollutional condition of this program defining that mutually should traveler;
If the pollutional condition of this sub-unit of cargo does not meet mutually the pollutional condition of this program defining that should traveler, then refuse sub-unit of cargo carry out mutually should traveler fabrication process; And
If the pollutional condition of this sub-unit of cargo meets the pollutional condition of this program defining of this Runcard, then will this sub-unit of cargo carry out the fabrication process that phase should Runcard in an equipment board that mutually should Runcard.
4. the groundwater pollution control of semiconductor equipment is characterized in that under the Runcard situation as claimed in claim 3, more comprises if the pollutional condition of this sub-unit of cargo does not meet mutually the pollutional condition of this process stage that should Runcard, sends a caution message.
5. the groundwater pollution control of semiconductor equipment is characterized in that under the Runcard situation as claimed in claim 3, and the pollutional condition that more comprises this sub-unit of cargo does not meet mutually the pollutional condition of this program defining that should Runcard, then sends a caution message.
6. the groundwater pollution control of semiconductor equipment under the Runcard situation as claimed in claim 3, it is characterized in that, comprise more when this sub-unit of cargo and carry out fabrication process and finish that pollutional condition that then will this sub-unit of cargo is made as the pollutional condition of this equipment board that phase should Runcard.
7. the groundwater pollution control of semiconductor equipment is characterized in that under the Runcard situation as claimed in claim 6, comprises that more the pollutional condition according to this sub-unit of cargo resets the pollutional condition of this mother batch.
8. the groundwater pollution control of semiconductor equipment under the Runcard situation as claimed in claim 1, it is characterized in that, set the pollutional condition of a program defining of corresponding this Runcard of execution and the pollutional condition of a process stage and carry out the pollutional condition of the equipment board of this mother batch for this.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43248002P | 2002-12-11 | 2002-12-11 | |
| US60/432,480 | 2002-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1507006A CN1507006A (en) | 2004-06-23 |
| CN1244137C true CN1244137C (en) | 2006-03-01 |
Family
ID=34061823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031091164A Expired - Lifetime CN1244137C (en) | 2002-12-11 | 2003-04-03 | Pollution controlling method for semiconductor equipment with runcard |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1244137C (en) |
| TW (1) | TW588406B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105990185B (en) * | 2015-02-27 | 2020-02-11 | 中芯国际集成电路制造(上海)有限公司 | Processing method, system and device for executing operation on semiconductor object |
-
2003
- 2003-03-18 TW TW092105880A patent/TW588406B/en not_active IP Right Cessation
- 2003-04-03 CN CNB031091164A patent/CN1244137C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1507006A (en) | 2004-06-23 |
| TW588406B (en) | 2004-05-21 |
| TW200410294A (en) | 2004-06-16 |
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