TW588406B - Contamination control method for a semiconductor equipment with runcard situation - Google Patents

Abstract

A contamination control method for a semiconductor equipment with runcard situation. First, a runcard is received, and the contamination status of equipment running a parent lot is acquired. If the contamination status of the equipment is not back-end-shared, the contamination status of a process definition and a process stage corresponding to the runcard are set as the contamination status of the equipment. Otherwise, the contamination status of a process stage running the parent lot is acquired. If the status of the process stage is back end or cooper end, the contamination status of the process definition and the process stage corresponding to the runcard are set as the contamination status of the process stage.

Description

588406 Case No. 92105880 Revised in the following month 丨 _ V. Description of the invention (1) The technical field to which the invention belongs The invention relates to a method for controlling pollution of semiconductor devices, and in particular, to a method for semiconductor devices in the case of process cards Pollution control method for semiconductor equipment in the case of a process card that effectively manages the contamination status of the lot (L ot). In the semiconductor manufacturing process of the prior art, for research and development experiments, adjustment of process parameters, or modification of process conditions required by customers, the IC Foundry will generate a run card to describe the corresponding information in detail, such as the semiconductor device number , Wafer number, wafer number, recipe, or reticle for experiments. Brother 1 is a schematic diagram showing the relationship between the process definition (PD), process definition, main route, and the corresponding process card defined in the Manufacturing Execution System (MES) in advance. As shown in the figure, the main process definition (main route) A is a process definition defined in advance in the manufacturing execution system. The main process definition A includes 6 process definitions (or process stations) 〇PA1, 〇PA2, 0PA3, 0PA4, 0PA5, and 0PA6; process card B contains 3 main process definitions BIO, B20, and B30, and process card main process definition B10 contains process definition 0PB11, process card main process definition B20 contains process definitions PB21, 0PB22, and 0PB23. Card master process definition B 3 0 contains process definitions 0PB31, OPB32, and 0PB33. Among them, each process definition includes relevant conditions, judgments, processes and corresponding equipment.

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The process rule is revised on the month, § The process equipment machine executes to the main process definition A ili I, and the batch specified by the process card B will carry out the process definition. For example, the process card batch The second wafer in the shipment carries out the process operation of the process card master process definition B 操作 0; the fourth, fifth, and sixth wafers of the flow ^] carry out the process card master process definition β2ont and the flow card is approved in the shipment. The first, second, third, fourth, fifth, and sixth wafers are entered into the process card. The main process defines the B30 process operation. For example, in a semiconductor foundry, a batch of goods, 4-conductor equipment, and vehicles are all marked with a Contaminatiion Status to indicate the degree of contamination of unsuitable shipments, semiconductor equipment, or vehicles. When the batch of goods is to be processed on the semiconductor device, the manufacturing execution system (MES) will first determine whether the contamination status of the corresponding batch, the semiconductor device and the carrier> dyeable status are consistent. When they are compatible or compatible with each other, For example, semiconductor equipment can receive X batches such as 'in the contaminated state' before this batch can be processed on the semiconductor equipment. Among them, the purpose of judging the pollution state is to avoid contamination of wafers or semiconductor devices. However, because the process card situation in a semiconductor foundry is a special case, 'for manufacturing execution systems in a semiconductor plant, such as the International Business Machines (IBM) Corporation's IV IEW, it cannot target semiconductor equipment in the process card situation. Pollution control provides an effective management mechanism, so that semiconductor equipment pollution control in the case of process cards must be conducted artificially and empirically, which increases the burden on operators and the risk of pollution to equipment, and violates the trend of factory automation. Summary of the Invention

0503-9030TWFKN1); TSMC2002-0759; yianhou.ptd page 7 588406 i No. 921QR receipt η 5. Description of the invention (3) In view of this, the main objective of the present invention is for semiconductor devices and semiconductor devices approved Pollution control method In order to achieve the above-mentioned purpose of the invention, the pollution of semiconductor equipment in the case of a private card is carried out. According to the pollution control method of a semiconductor body equipment according to the embodiment of the present invention, first, when the pollution status of the equipment of the parent batch is shared, Then set the corresponding execution process card pollution status to the equipment that executes the mother batch. When the equipment machine that executes the mother batch receives the contamination, it is not a back-end or copper process card. 'If it is, then set the pollution status of the corresponding execution flow section to implement the mother batch system. In addition, it also includes the child of the mother batch and comparing the pollution status of the child batch with the corresponding status. If the contamination status of the sub-consignment is in the process stage, the contamination status of the sub-consignment is rejected to comply with the corresponding process status, and the contamination status of the sub-consignment is compared with the contamination status. If the contamination status of the sub-consignment is contaminated, the sub-consignment is rejected. If the contamination status of the sub-consignment is in line with the amendment, in order to provide a contaminated state of the stomach, > the contamination status of the consignment is acceptable, and can be received by the control method First class. If the contamination status of the contaminated process is fixed, the status of the process card in the batch process stage of the process card does not match the process card of the sub-batch card. State is synonymous with system state. Is the back-end, and when the process of rejecting the definition of the pollution-like route restructuring process stage and the corresponding route stage provides the semi-conductor and obtaining the sharing of the non-back-end process stage, the process stage process and process Step state. change. Changes in contamination process cards. If contaminated

If it does not meet the process definition of the corresponding process card, process the corresponding process card. The pollution status defined by the process of the process card,

0503-9030TWFKN1); TSMC2002-0759; yianhou.ptd Page 8 588406 Amendment No. 92105880_ V. Description of the invention (4) The sub-batch will be processed on the corresponding process card's equipment machine. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, the embodiments are described in detail below with reference to the accompanying drawings. Embodiment Figure 2 (including Figures 2A and 2B) is a flowchart showing the operation flow of a semiconductor device pollution control method in the case of a process card according to an embodiment of the present invention. First, referring to FIG. 2A, first, as in step S21, a process card for R & D experiments, adjustment of process parameters, or modification of process conditions required by the customer is received. Next, in step S22, the pollution status of the equipment machine currently executing a mother batch is obtained. Among them, this mother batch is the batch specified by the process card, and the mother batch can include multiple child batches. Generally speaking, for semiconductor manufacturing, the setting of the pollution status can be divided into three levels of structure, as shown in Figure 3, where the innermost is the pollution status of the equipment machine, followed by the process-defined pollution status, and the outermost is Pollution state of the entire process stage (where one process stage can include multiple process definitions, and one process definition can include one process and machine. In addition, the process definition and the pollution state of the equipment must be in the process stage Within the acceptable range of pollution status. In this process stage, STAGE! Includes the process definition PDi and the process definition ρ]) 2, and the process definition process definition m includes the equipment machine EQpi and the design unit respectively.

588406 Case number 921058Rfl V. Description of the invention (5) Front end of the table; B stands for Back End; C stands for Copper End; and R stands for Back End

Shared), which can include both b and C states. If the pollution status of the equipment machine currently executing the parent batch is not shared by the backend (R) (No in step S23), if step 4 is set, set the pollution status and manufacturing process corresponding to the process card defined by this process card The pollution status of this stage is the pollution status of the equipment machine that is executing this parent batch. For example, when the pollution status of the semiconductor device that is executing this parent batch is front-end (F), set the corresponding pollution status of the process card process definition and the pollution status of the process stage to front-end (F); when the semiconductor When the pollution status of the equipment is the back end (B), the pollution status defined by the process and the pollution status at the process stage are set as the back end (B); and when the pollution status of the semiconductor device is the copper process end (C), then The process-defined pollution state and the process stage pollution state are set to the copper process end (C). It is worth noting that the pollution status classification at the above process stage is not limited to this. For different types of semiconductor equipment classification, the corresponding pollution status category can also be increased. At the same time, it can be replaced for different peripheral applications. If the pollution status of the equipment that is currently executing the parent batch is shared by the rear end (Yes in step S23), then in step S25, the pollution status of the processing stage of the parent batch is obtained. If the pollution status of the parent batch during the manufacturing process is not the back end B or the copper process end C (No in step S26), then in step 827, refuse to perform the relevant operation of this process card 'and as in step S 2 8. Issue a warning message to notify relevant personnel. And if the pollution status of the process stage of this female buckle is the back end b or

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Correction line: (Yes in step S26), as in step S29, set the corresponding pollution status defined by the process of the card and the pollution status of the process stage ..., the pollution status of the process stage of this parent batch is being executed . ^ ’Please continue to refer to Figure 2B, such as step S30, specify the parent batch 1: ^ ^ to, the main process definition of the corresponding process card’ This action is in semiconductor system =% is Route Change ". Note that the contamination status of the J ^ batch is the same as that of the parent batch. Then = as in step S 31, compare the contamination status of each sub-batch with the contamination status during the process stage of the corresponding process card. , -The contamination status of the shipments that do not meet the requirements of the corresponding process card = woody forgiveness (No in step S32), then, as in step s33, the corresponding route change behavior of this sub-batch is rejected, and as in step S34, # 出 —Warning message to ϊ 关: Customs personnel: If the contamination status of the sub-batch conforms to the process of the process card: Erbaijiu / Canmu-like sadness (Yes in step S32), as in step S35, the sub-batch Goods: The status is compared with the pollution status defined by the process of the corresponding process card. Similarly, the above judgment to determine whether the contamination status of the sub-batch during the process stage or the pollution status defined by the process is acceptable is whether the degree of contamination of the sub-batch is less than the process stage or degree. In addition, as mentioned above, whether the contamination status of different sub-consignments of the parent batch can be referred to by the process card is consistent with the process card status refers to the contamination status of the process stage or the process-defined product, that is, the process definition of the sub-batch There can be multiple sub-consignments in the tolerance process, and different processes are scheduled. If the contamination status of the sub-batch does not conform to the contamination status defined by the process card of the corresponding process card (No in step S36), then in step 837, the sub-batch is rejected on the semiconductor device for the process process defined by the corresponding process card process,

0503-9030TWFl (Nl); TSMC2002-0759; yianhou.ptd Page 11 588406 Case No. 92105880 Rev. V. Description of the invention (7) S 3 4, issue a warning message to notify the relevant personnel. If the contamination status of the sub-batch conforms to the contamination status defined by the process of the process card (YES in step S 36), then the sub-batch is processed on the semiconductor device by the corresponding process card process definition as in step S 38. After the sub-batch is processed in the semiconductor device (YES in step S39), as in step S40, for different sub-batches, the pollution status of the sub-batch can be set to the pollution of the semiconductor device corresponding to the process card process. State, as in step S 41, according to the contamination state of each sub-consignment and the contamination state of the parent consignment, reset the contamination state of the parent consignment. Therefore, the method for controlling pollution of semiconductor equipment in the case of the process card provided by the present invention can effectively manage the pollution status of the semiconductor equipment and the batch in the case of the process card, thereby strengthening the manufacturing execution system, such as the International Business Machines Corporation. SIVI EW's management capabilities for semiconductor equipment pollution prevent equipment from being contaminated, reduce the burden on operators, and improve the automation goals of the overall semiconductor foundry. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and retouches without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

0503-9030TWFl (Nl); TSMC2002-0759; yianhou.ptd Page 12 588406 __Case No. 921Q5880_Year Month and Day__ Brief description of the diagram Figure 1 is a schematic diagram showing the main process definition, process definition and corresponding process Card relationship. FIG. 2A and FIG. 2B are flowcharts showing an operation flow of a method for controlling pollution of a semiconductor device in the case of a flow card according to an embodiment of the present invention. Fig. 3 is a schematic diagram showing a setting structure of a pollution state in semiconductor manufacturing. Symbol description A ~ Main process definition; β ~ Process card; 0ΡΑ1 ..... 0ΡΑ6 ~ Process definition; Β1 0, Β2 0, B30 ~ Process card main process definition; 0ΡΒ11 ..... 0ΡΒ33 ~ Process definition; S21 , S22 ..... S41 ~ operation steps; STAGE1 ~ process stage; PD1, PD2 ~ process definition; EQP1, EQP2 ~ equipment machine.

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Claims (1)

588406 Case No. 92105880 Λ3 Sixth, the scope of patent application for amendments to a method of pollution control of semiconductor equipment in the case of a process card, including the following steps: Receive a process card; When the executive end is shared, determine the pollution status of the corresponding execution section During execution, obtain the status of pollution and the pollution status of the segment when the copper process is executed or when a copper process is performed. 2 If the pollution of the equipment is changed, the route must be changed. The child batch is based on the execution of the process card; when the mother batch is executed at the end of the mother batch and the mother batch, the mother batch is rejected, and the phase process phase state is set. Please patent the scope control method, change the patent scope control method, compare the contamination of the shipment; the contamination of the shipment is the pollution status of the equipment of one of the parent batch; the pollution status of the equipment is not one Then the pollution status of the equipment of the parent batch is set as the pollution status defined by a process and the pollution status of a process stage equipment platform as the pollution status of the back-end shared goods during the manufacturing stage; the pollution status of the manufacturing stage is not A back end must execute the process card; and the pollution status of the process stage is the back end or the process pollution status defined by the process card should be the process described in item 1 of the process stage of the parent batch In the case of a card, the semiconductor further includes the process described in item 2 of the at least one sub-batch of the parent batch. In the case of a card, the semiconductor further includes the following steps: The process of the process card 0503-9030TWFKN1); TSMC2002-0759; yianhou.ptd Page 14 588406 Amendment Case No. 921058Rf) 6. If the contamination status in the scope of patent application, refuse to change the route of the corresponding sub-consignment; Right the contamination of the sub-consignment If the status is consistent with the pollution status of the process stage of the corresponding process card, then the pollution status of the sub-batch is compared with the pollution status defined by the process of the corresponding process card; If the contamination status of the process card is defined by the process card, then the sub-consignment is refused to be processed by the process card corresponding to the process card; and if the contamination status of the sub-batch meets the contamination state of the process card by the process definition, then the sub-consignment is rejected. The batches are processed on one of the equipment cards corresponding to the process card. 4 · The method for pollution control of semiconductor equipment in the case of the process card described in item 3 of the scope of patent application, and further includes issuing a warning if the pollution status of the sub-batch does not correspond to the pollution status of the process stage of the corresponding process card message. 5 · If the method of pollution control of semiconductor equipment in the case of the process card described in item 3 of the scope of application for patents, including the pollution status of the sub-batch does not conform to the pollution status defined by the process of the corresponding process card, a warning is issued message. 6 · The method for pollution control of semiconductor equipment in the case of the process card as described in item 3 of the scope of patent application, further comprising when the sub-batch is processed and processed, the pollution status of the sub-batch is set to the corresponding process card The pollution status of the equipment. 7. The method for pollution control of semiconductor equipment in the case of the process card described in item 6 of the scope of patent application, further including the heavy pollution status based on the sub-batch. 0503-9030TWl (Nl); TSMC2002-0759; yianhou.ptd Page 15 588406 __Case No. 92105880_year_month__ VI. Scope of patent application The pollution status of this mother batch is newly set. 8. The method for pollution control of a semiconductor device in the case of a process card as described in item 1 of the scope of the patent application, wherein the pollution state of a process card defined by a process and the pollution state of a process stage are set to be executed by the parent. Contamination status of the equipment of the batch. 0503-9030TWFKN1); TSMC2002-0759; yianhou.ptd page 16