CN1239824A - Flash memory with separated grid and source injection and its manufacture - Google Patents
Flash memory with separated grid and source injection and its manufacture Download PDFInfo
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- CN1239824A CN1239824A CN98115224.4A CN98115224A CN1239824A CN 1239824 A CN1239824 A CN 1239824A CN 98115224 A CN98115224 A CN 98115224A CN 1239824 A CN1239824 A CN 1239824A
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- 238000004519 manufacturing process Methods 0.000 title claims description 31
- 238000002347 injection Methods 0.000 title claims description 13
- 239000007924 injection Substances 0.000 title claims description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 63
- 238000007667 floating Methods 0.000 claims abstract description 61
- 229920005591 polysilicon Polymers 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 6
- 229910021332 silicide Inorganic materials 0.000 claims description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 238000005468 ion implantation Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- 230000005641 tunneling Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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Abstract
Floating grid and control grid are formed in the same polycrystalline silicon and there are one tunneling oxide layer below the floating grid and one grid oxide layer below the control grid with the tunneling oxide layer being thinner than the grid oxide layer. The floating grid and the control grid are limited in one identical polycrystalline silicon, thus the channel width between the control grid and the floating grid is easy to control and unit array may be manufactured reliably and repeatedly.
Description
The present invention relates to a kind of flash memory and manufacture method thereof, particularly a kind of flash memory and manufacture method thereof with separated grid (Split Gate) and source injection (Source Side Injection).Its floating grid (Floating Gate) and control gate (Control Gate) are by little shadow formation simultaneously with etching process of a polysilicon layer.
Existing flash memory is a kind of erasable programmable formula read-only memory (EPROM), also is a kind of permanent memory (Non-Volatile Memory).Usually the EPROM memory cell has two grids, wherein is divided into forming with polysilicon (Poly-Silicon) being used for the floating grid of stored charge, and is used for the control gate of control data access.Above-mentioned floating grid is positioned at the control gate below, and it is in the state of " floating " usually, be connected with any outside line, and control gate is common and word line (Word Line) joins.The characteristic of flash memory is to carry out memory clearing (Erase) work of " one then one " (Block By Block) mode, and speed is very fast, and about 1 to 2 second time can be finished memory clearing work.General erasable programmable formula read-only memory speed is fast, because erasable programmable formula read-only memory is the memory clearing work of carrying out " one then one " (Bit by Bit) mode, wants approximate number minute just can finish the removing of data at least.The document of relevant flash memory is a lot, and for example U.S. Patent No. 5,045, the 488 described flash memory structures that are a kind of modified form.
Please refer to Figure 1A, shown in it is according to U.S. Patent No. 5,045, the generalized section of a kind of flash memory unit structure of 488.Wherein, floating grid 11 and control gate 12 being arranged on silicon base 10, for example is polysilicon layer.Between floating grid 11 and the control gate 12 insulating barrier 13 is arranged, and above-mentioned floating grid 11, insulating barrier 13 and the control gate 12 common structures that constitute piled grids 14 in the silicon base 10 of piled grids 14 both sides, there be the drain region 15 and source area 16 of dopant ion respectively.The architectural feature of this kind flash memory cell is to have the piled grids 14 of so-called isolating construction, just its floating grid 11 and control gate 12 are the horizontal direction distributions along silicon base 10, and have only part control gate 12 and floating grid 11 together vertically superposed, and its floating grid 11 has the corner (SharpCorner) 17 of sharp shape.The sharp-pointed structure of corner 17 can provide bigger electric field, so electronics can be delivered to control gate 12 by floating grid 11 fast, makes the action of flash memory cell have the speed of erasing faster (fast erase capability).
But, in traditional flash memory, no matter be the double level polysilicon or the memory cell structure of three layers of formed flash memory of polysilicon, by the formed overlay structure of two-layer polysilicon, grid control ditch crack district (Gate Controlled Gap Region) between polysilicon layer and polysilicon layer, be difficult for reaching ideal state, for example the ditch crack district at 17 places of the corner among the figure is wayward.Multilayer polysilicon unit (Cell) causes the difficulty of subsequent etch because to open up web (Topography) structure very big, and easy residual beam structure (Stringer) causes short circuit each other between the different unit; And, to open up under the web structure at this, the composition of gate regions pattern can't form at peripheral circuit and memory cell region simultaneously simultaneously.
And; in traditional manufacturing technique; when considering the problem of integrated level and cost etc.; the shared one source pole of common meeting; and form symmetric memory cell; the structure shown in Figure 1B for example; so highly open up under the web technology at this; if when having the situation of bad aligning (Mis-alignment) to take place; not only make the characteristic of memory cell differ greatly, shown in Figure 1B, the result of its property difference generation of ditch crack district of corner 17 and 17 ' locate; make two symmetrical unit, its programming (Programming) efficient can be quite asymmetric or read electric current.
Therefore main purpose of the present invention provides a kind of flash memory and manufacture method thereof, uses identical polysilicon layer to form floating grid and control gate, does not produce so do not have above-mentioned shortcoming.In addition, the width of polysilicon gap (Spacer) among the present invention, no matter be the generation in the gap of first polysilicon layer or second polysilicon layer, between unit and unit, all can repeat to make, and control its width easily, have reliability and the cell array that can repeat to make so the present invention can produce one.
According to purpose of the present invention, a kind of manufacture method with flash memory of separated grid and source injection is proposed, comprising: a silicon base is provided; Form a gate oxide; Form a separated grid light shield in the control gate top that desire forms,, remove the separated grid light shield again so that the part gate oxide is removed; Form a tunnel oxide, and gate oxide is long thicker by long tunnel oxide the time, and the thickness of tunnel oxide is littler than gate oxide thickness, and adjacent with gate oxide: deposit one first polysilicon layer; Deposit a tungsten silicon layer; Remove part first polysilicon layer and tungsten silicon layer with little shadow and etching method, to form a control gate and a floating grid; Deposit one second polysilicon layer; Second polysilicon layer is removed in etching, respectively forming a clearance wall at control gate and floating grid both sides, and forms a ditch crack between floating grid and control gate; Form the one source pole district with a light shield in the tunnel oxide below again; And in this formation one drain region, gate oxide below, with the formed Frash memory in separate grids of the method, the width in Qi Gou crack can be controlled by formed clearance wall of polysilicon or other conductive layer.
According to another object of the present invention, a kind of flash memory structure with separated grid and source injection is provided, comprising: the semiconductor substrate; One gate oxide is formed in the part semiconductor substrate, has the plan structure of an elongated shape; One tunnel oxide is formed in the part semiconductor substrate, and has the plan structure of an elongated shape, and adjacent with gate oxide; One control gate comprises with a polysilicon layer being formed at the gate oxide top; One floating grid also is formed at the tunnel oxide top with a polysilicon layer; A plurality of clearance walls respectively are formed at the both sides of control gate and floating grid; One ditch crack is formed between control gate and the floating grid; The one source pole district is formed at at semiconductor-based the end, and part is positioned at the floating grid below; And a drain region, be formed at at semiconductor-based the end.This flash memory structure is floating grid and the control gate that forms flash memory with an identical polysilicon layer, easily the ditch gap length degree between the control gap wall.
According to a further object of the present invention, a kind of flash memory structure with separated grid and source injection is provided, is formed in the semiconductor substrate, this kind flash memory structure comprises: a gate oxide, be formed in the part semiconductor substrate, have the plan structure of an elongated shape; One tunnel oxide is formed in the part semiconductor substrate, also has the plan structure of an elongated shape, and adjacent with gate oxide, and tunnel oxide thickness is thinner than gate oxide thickness; One control gate is formed at the gate oxide top; One floating grid forms simultaneously with control gate, and floating grid is formed at the tunnel oxide top; A plurality of clearance walls respectively are formed at the both sides of control gate and floating grid; And a ditch crack, be formed between control gate and the floating grid.The clearance wall of this flash memory is formed by a polysilicon or other conductive layer, in order to the width in effective control ditch crack.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by a preferred embodiment, and cooperate appended view, be described in detail below, wherein
Figure 1A is a kind of generalized section of existing flash memory unit structure;
Figure 1B is a kind of generalized section of flash memory unit structure of existing common-source;
Fig. 2 A～2D is a kind of manufacture craft profile with flash memory structure of separated grid and source injection of one embodiment of the present invention; And
Fig. 3 is the layout of separated grid memory cell array of the present invention shown in Fig. 2 D.
Please refer to Fig. 2 A～2D, a kind of manufacture craft profile of its expression one embodiment of the present invention with flash memory structure of separated grid and source injection.At first, please refer to Fig. 2 A, above the semiconductor-based end 200 (for example being silicon base), form the gate oxide 201 on the about 150 Izod right sides of a thickness.Then, form a separated grid light shield, 201 etchings of part gate oxide are removed, remove the separated grid light shield afterwards again in one of silicon base 200 control gate 202 tops to be formed.Then, again in silicon base 200 tops, form tunnel oxide (the Tunnel Oxide on the about 90 Izod right sides of a thickness, or claim second gate oxide) 203, this moment, original gate oxide 201 can continue long to about 180 Izod right sides, shown in Fig. 2 A, the thickness of tunnel oxide 203 is littler than the thickness of gate oxide 201.
Please refer to Fig. 2 B, deposit first polysilicon layer 204 of about 2000 dusts of a thickness in silicon base 200 tops, and can continue to deposit the tungsten silicon layer 205 of about 1200 dusts of a thickness.Also can not form tungsten silicon layer 205 herein, only need in above-mentioned formation first polysilicon layer 204, thickness is deposited into the 4000 Izods right side gets final product, and first polysilicon layer 204 can also be a multi-crystal silicification metal level (polycide) or self-aligned metal silicide layer (Salicide).Then; after little shadow and etched step process; remove part first polysilicon layer 204 and tungsten silicon layer 205; and form the part of control gate 202 and floating grid 206 simultaneously; polysilicon in residual 200～1000 dusts of having an appointment of other parts; in order to grill-protected oxide layer 201 and tunnel oxide 203, shown in Fig. 2 B.Owing to form in the time of control gate 202 and floating grid 206, open up the web structure so can exempt the height that runs in the manufacture craft, also there is not the crossbeam problem that stays in the traditional manufacturing technique.
Please refer to Fig. 2 C, in above-mentioned silicon base 200 surface depositions one second polysilicon layer 207, about 2000～5000 Izod right sides of thickness.Then, second polysilicon layer 207 is removed in etching, and forms clearance wall 208 in control gate 202 and floating grid 206 both sides, and forms a ditch crack 209 between floating grid 206 and control gate 202.Clearance wall 208 is herein formed by any conductive layer, and the width in the ditch crack 209 among the present invention can be controlled by polysilicon gap wall 208 or other conductive layer.At last, form source area and drain region more respectively, for example the ion with higher-energy injects, and drive in high temperature and to form one source pole district 210, make the enough anti-high voltage of source area 210, and form a drain region 211, obtain the separated grid memory construction of Fig. 2 D with ion implantation.
In addition, in the present invention, if be connected with each other at the clearance wall 208 of control gate 202 with floating grid 206 both sides, an available thermal-oxidative production process obtains a preferable ditch crack 209.For example when etching second polysilicon layer 207, keep hundreds of approximately dust thickness, again with the polysilicon oxidation of thermal oxidation mode, to reach the high-quality ditch crack 209 of protection with these hundreds of dusts.
Please refer to Fig. 3, it illustrates the layout of the separated grid memory cell array shown in Fig. 2 D of the present invention.The field oxide region 31, floating grid 32, control gate 33, the drain contact 34 and common source line 35 that comprise the sequestering memory unit among the figure.
According to separated grid memory of the present invention, the manner of execution that reads, programmes and erase of its unit is as described in Table 1:
Table 1
| Control gate | Drain electrode | Source electrode | Substrate | |
| Programming | ????2V | ????0V | ????12V | ????0V |
| Erase | ????12V | ????0V | ????0V | ????0V |
| Read | ????3.3V | ????2V | ????0V | ????0V |
When if the memory cell desire is carried out the action of programming, with drain contact 34 and substrate ground connection; Bestowing the current potential that is slightly larger than critical voltage (about about usually 1V) at the control gate 33 of memory, for example is about 2V; And impose on common source line 35 with a high potential, for example be about 12V, by the voltage about this high voltage coupling one about 9V to floating grid 32, hot carrier on the passage will be expelled on the floating grid by source terminal at this moment, because the efficient very high (this is the characteristics of source injection) of programming is so program current can fall very lowly.
When memory cell is carried out the action of erasing, with drain contact 34, common source line 35 and substrate ground connection; And impose on control gate 33 with a high potential, and for example be about 12V, utilize the Fu Lenuohai between polysilicon layer and polysilicon layer to wear tunnel (Fowler Norheim Tunneling) effect, reach the effect of erasing with low current.
When memory cell during, drain contact 34 is coupled to voltage about about 2V at read cycle; Common source line 35 and substrate ground connection; And control gate 33 imposed a reading potential, and for example be about 3.3V, it is higher that it reads electric current.
Therefore, one of feature of the present invention is to form the floating grid and the control gate of flash memory with an identical polysilicon layer, and does not have the uppity situation in ditch crack between floating grid and the control gate, and is easy to the ditch gap length degree between the control gap wall.
When being control gate and floating grid, two of feature of the present invention forms, so can exempt the shortcoming that easily causes remaining beam structure after the subsequent etch that the height of multilayer polysilicon in the traditional manufacturing technique is opened up the web structure.
In sum, though the present invention is illustrated in conjunction with a preferred embodiment, so it is not in order to limit the present invention, to those skilled in the art, without departing from the spirit and scope of the present invention, to can be used for various modifications.
Claims (44)
1. manufacture method with flash memory of separated grid and source injection comprises:
One silicon base is provided;
Form a gate oxide;
Form a separated grid light shield, the part gate oxide is removed, remove this separated grid light shield again;
Form a tunnel oxide;
Deposit one first polysilicon layer;
Remove this first polysilicon layer of part, to form a control gate and a floating grid;
Deposit one second polysilicon layer;
Remove this second polysilicon layer, respectively forming a clearance wall, and between this floating grid and control gate, form a ditch crack at this control gate and floating grid both sides;
Form the one source pole district in described tunnel oxide below; And
Form a drain region in described gate oxide below;
Wherein, described separated grid light shield is positioned at described control gate top.
2. manufacture method as claimed in claim 1, wherein, the about 150 Izod right sides of described gate oxide thickness.
3. manufacture method as claimed in claim 1, wherein, the about 90 Izod right sides of described tunnel oxide thickness.
4. manufacture method as claimed in claim 1, wherein, when forming described tunnel oxide, described gate oxide thickness is formed up to about 180 Izod right sides again.
5. manufacture method as claimed in claim 1, wherein, described tunnel oxide thickness is littler than described gate oxide thickness.
6. manufacture method as claimed in claim 1, wherein, described tunnel oxide is adjacent with described gate oxide.
7. manufacture method as claimed in claim 1, wherein, about 4000 dusts of the described first polysilicon layer thickness.
8. manufacture method as claimed in claim 1 wherein, deposits a tungsten silicon layer after described first polysilicon layer of deposition.
9. manufacture method as claimed in claim 1 wherein, when removing described first polysilicon layer of part, is removed described tungsten silicon layer.
10. manufacture method as claimed in claim 8, wherein, about 2000 dusts of the described first polysilicon layer thickness.
11. manufacture method as claimed in claim 8, wherein, about 1200 dusts of described tungsten silicon layer thickness.
12. manufacture method as claimed in claim 1, wherein, described first polysilicon layer can be a multi-crystal silicification metal level.
13. manufacture method as claimed in claim 1, wherein, described first polysilicon layer can be a self-aligned metal silicide layer.
14. manufacture method as claimed in claim 1; wherein; remove described first polysilicon layer of part with in the step that forms described control gate and floating grid, in the polysilicon of residual 200～1000 dusts of having an appointment of other parts, in order to protect described gate oxide and tunnel oxide.
15. manufacture method as claimed in claim 1, wherein, about 2000～5000 Izod right sides of the described second polysilicon layer thickness.
16. manufacture method as claimed in claim 1, wherein, described source area partly is arranged in the described silicon base of described floating grid below.
17. manufacture method as claimed in claim 1, wherein, the method that forms described source area is with high-energy ion to be injected, and drives in high temperature.
18. manufacture method as claimed in claim 1, wherein, the method that forms described drain region is to adopt ion implantation.
19. the flash memory with separated grid and source injection comprises:
The semiconductor substrate;
One gate oxide is formed at part at described the semiconductor-based end, has the plan structure of an elongated shape;
One tunnel oxide is formed at part at described the semiconductor-based end, has the plan structure of an elongated shape, and adjacent with described gate oxide;
One control gate is formed at described gate oxide top;
One floating grid is formed at described tunnel oxide top;
A plurality of clearance walls respectively are formed at the both sides of described control gate and floating grid;
One ditch crack is formed between described control gate and the floating grid;
The one source pole district is formed at at described the semiconductor-based end, and part is positioned at described floating grid below; And
One drain region is formed at at described the semiconductor-based end.
20. flash memory as claimed in claim 19, wherein, the described semiconductor-based end is a silicon base.
21. flash memory as claimed in claim 19, wherein, described control gate comprises a polysilicon layer that is formed at described gate oxide top.
22. flash memory as claimed in claim 21, wherein, described control gate comprises a tungsten silicon layer that is formed at described polysilicon layer top.
23. flash memory as claimed in claim 19, wherein, described control gate comprises a multi-crystal silicification metal level that is formed at described gate oxide top.
24. flash memory as claimed in claim 19, wherein, described control gate comprises a self-aligned metal silicide layer that is formed at described gate oxide top.
25。Flash memory as claimed in claim 19, wherein, described floating grid comprises a polysilicon layer that is formed at described gate oxide top.
26. flash memory as claimed in claim 25, wherein, described floating grid also comprises a tungsten silicon layer that is formed at described polysilicon layer top.
27. flash memory as claimed in claim 19, wherein, described floating grid comprises a multi-crystal silicification metal level that is formed at described gate oxide top.
28. flash memory as claimed in claim 19, wherein, described floating grid comprises a self-aligned metal silicide layer that is formed at described gate oxide top.
29. flash memory as claimed in claim 19, wherein, described a plurality of clearance walls are formed by polysilicon.
30. flash memory as claimed in claim 19, wherein, described a plurality of clearance walls are formed by electric conducting material.
31. the flash memory with separated grid and source injection is formed in the semiconductor substrate, this flash memory comprises:
One gate oxide is formed at part at described the semiconductor-based end, has the plan structure of an elongated shape;
One tunnel oxide is formed at part at described the semiconductor-based end, has the plan structure of an elongated shape, and adjacent with described gate oxide, and described tunnel oxide thickness is thinner than described gate oxide thickness;
One control gate is formed at described gate oxide top;
One floating grid forms simultaneously with described control gate, and described floating grid is formed at described tunnel oxide top;
A plurality of clearance walls respectively are formed at the both sides of described control gate and floating grid; And
One ditch crack is formed between described control gate and the floating grid.
32. flash memory as claimed in claim 31, the wherein said semiconductor-based end is a silicon base.
33. flash memory as claimed in claim 31, wherein said control gate comprise a polysilicon layer that is formed at described gate oxide top.
34. flash memory as claimed in claim 33, wherein said control gate also comprise a tungsten silicon layer that is formed at described polysilicon layer top.
35. flash memory as claimed in claim 31, wherein said control gate comprise a multi-crystal silicification metal level that is formed at described gate oxide top.
36. flash memory as claimed in claim 31, wherein said control gate comprise a self-aligned metal silicide layer that is formed at described gate oxide top.
37. flash memory as claimed in claim 31, wherein said floating grid comprise a polysilicon layer that is formed at described gate oxide top.
38. flash memory as claimed in claim 37, wherein said floating grid also comprise a tungsten silicon layer that is formed at described polysilicon layer top.
39. flash memory as claimed in claim 31, wherein said floating grid comprise a multi-crystal silicification metal level that is formed at described gate oxide top.
40. flash memory as claimed in claim 31, wherein said floating grid comprise a self-aligned metal silicide layer that is formed at described gate oxide top.
41. flash memory as claimed in claim 31, wherein said a plurality of clearance walls are formed by a polycrystalline silicon material.
42. flash memory as claimed in claim 41, wherein said polysilicon is in order to control the width in described ditch crack.
43. flash memory as claimed in claim 31, wherein said a plurality of clearance walls are formed by a conductive layer.
44. flash memory as claimed in claim 43, wherein said conductive layer is in order to control the width in described ditch crack.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98115224.4A CN1110085C (en) | 1998-06-24 | 1998-06-24 | Flash memory with separated grid and source injection and its manufacture |
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| CN98115224.4A CN1110085C (en) | 1998-06-24 | 1998-06-24 | Flash memory with separated grid and source injection and its manufacture |
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| CN1239824A true CN1239824A (en) | 1999-12-29 |
| CN1110085C CN1110085C (en) | 2003-05-28 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309083C (en) * | 2003-08-28 | 2007-04-04 | 力晶半导体股份有限公司 | Separated grid flash memory unit and its mfg. method |
| CN100386862C (en) * | 2005-02-28 | 2008-05-07 | 海力士半导体有限公司 | Method for fabricating flash memory device |
| CN100446186C (en) * | 2006-10-09 | 2008-12-24 | 上海华虹Nec电子有限公司 | Floating grid preparation method used for grid dividing structure flash memory |
| CN1758443B (en) * | 2004-02-24 | 2010-06-16 | 精工电子有限公司 | High voltage operating field effect transistor, and bias circuit therefor and high voltage circuit thereof |
-
1998
- 1998-06-24 CN CN98115224.4A patent/CN1110085C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309083C (en) * | 2003-08-28 | 2007-04-04 | 力晶半导体股份有限公司 | Separated grid flash memory unit and its mfg. method |
| CN1758443B (en) * | 2004-02-24 | 2010-06-16 | 精工电子有限公司 | High voltage operating field effect transistor, and bias circuit therefor and high voltage circuit thereof |
| CN100386862C (en) * | 2005-02-28 | 2008-05-07 | 海力士半导体有限公司 | Method for fabricating flash memory device |
| CN100446186C (en) * | 2006-10-09 | 2008-12-24 | 上海华虹Nec电子有限公司 | Floating grid preparation method used for grid dividing structure flash memory |
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| CN1110085C (en) | 2003-05-28 |
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