CN1237612C - 非接触互连系统 - Google Patents
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- 239000000463 material Substances 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 3
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- 235000012431 wafers Nutrition 0.000 description 6
- 238000006880 cross-coupling reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
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- 230000013011 mating Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
在计算机芯片封装与电路板之间提供了一种非接触互连系统。芯片封装具有带不连续的端子接合区图案的基本平的下表面。电路板具有基本平的上表面,该上表面与芯片封装的下表面隔开并且与之平行。该上表面上的不连续电路焊盘图案与端子接合区对准。多个不连续插入构件配置在端子接合区与电路焊盘之间,并且具有的图案相应于已对准的端子接合区和电路焊盘的图案并与之对准。插入构件具有优选的介电常数的材料,该介电常数高于填充在插入构件之间的材料的介电常数。
Description
发明背景
本发明一般涉及不使用接触而在计算机芯片封装与电路板之间获得的互连。随着半导体设备变得更复杂,由于机械互连的困难性,硅晶片或“管芯”和相称的电路硬件之间的互连持续发展并变得更复杂。这部分是由于电子电路的小型化以及高密度。对于高频应用,电子部件中的信号以较快速度传输,并且半导体封装正在变薄和更紧凑。在某些高频应用中,很难使用依靠金属接触或端子的传统互连。
已知的机械互连使用传统的端子引线和插座或其他阳的与阴的结构或互相啮合的弹簧连接。使用这些金属到金属的互连,主要是在端子之间提供了擦抹作用以去掉污染与氧化剂。在小型的半导体互连中,端子是如此的小以至于很难提供必要的擦抹并在相对的端子或接触之间获得可靠的接触力。即使可能的话,传统的焊接连接很困难,这是因为半导体互连系统的小型或紧密分隔的部件需要与非常复杂困难的工具一起使用。
因此,本发明涉及一种连接器,它不依赖于机械接触,而是在两个端子或接触之间使用电或磁场耦合来传输信号。
发明内容
因此,本发明总的目的是提供一种新的和改进的非接触互连系统,它特别适合于在计算机芯片封装和电路板之间提供连接。
本发明的另一个目的是提供一种互连结构,这种结构不使用金属到金属的接触来提供连接,而在绝缘材料分隔的第一与第二端子阵列之间使用电容耦合。
本发明的一个实施例中,提供了安装到平面支撑上的计算机芯片封装。该支撑在其上面具有多个接触焊盘或是线路,还提供了导线或其他连接以把芯片输出连接到接触焊盘。接触焊盘安装在支撑的一个面上,然后,该支撑被定位在电路板上,以使支撑的接触焊盘与相应的电路板上的相对的接触焊盘或线路对准并与之相对。电容耦合用来传输两个相对的接触焊盘之间的信号。
在另一个实施例中,计算机芯片封装安装到平面支撑上,该支撑还具有多个接触焊盘,它们在支撑两边成图案排列。这些接触由通路(vias)彼此互连以使封装在其下表面具有一系列不连续端子接合区。电路板也具有上表面,其上带有与计算机芯片封装下表面上的端子接合区对准的不连续电路焊盘的图案。在芯片封装的端子接合区与电路板上的电路焊盘之间,提供了一个或多个不连续的绝缘插入构件。这些插入构件排列成一个图案,该图案对应于端子接合区和电路焊盘的图案,并且该插入构件还与端子接合区和电路焊盘对准,并位于端子接合区和电路焊盘之间。插入构件材料是一种具有相当高的介电常数的材料,该介电常数最好大于200。
插入构件可以粘附到端子接合区或电路焊盘上,或者,如在另一个实施例中描述的,插入构件可以由配置在芯片封装下表面与电路板上表面之间的平面载体支撑。该平面载体可以由绝缘的合成橡胶材料制造,而且该插入构件可以在平面载体构件中被过量模制。
从下面结合附图进行的详细描述中,本发明的其他目的、特征、优点将会很明显。
附图简要说明
相信本发明的特点是新颖的,在附加的权利要求中会特别加以陈述。通过参考下面结合附图进行的详细描述可以很好的理解本发明连同其目的和优点,在附图中,同样的附图标记代表同样的元件。其中,
图1是通过根据本发明的非接触互连系统的一个实施例截取的剖视图;
图2是通过计算机芯片封装截取的剖视图,其示出了本发明的第二个实施例;
图3是通过计算机芯片封装截取的剖视图,其示出了本发明的第三个实施例。
优选实施例的详细说明
图1示出了非接触互连系统的第一实施例,该系统一般用10表示,它与计算机芯片封装12一起示出,并提供了计算机芯片封装12与下面的基片14(例如印刷电路板)之间的连接。图2示出了非接触互连系统的第二实施例,该系统一般用10A表示,它也位于芯片封装12和电路板14之间。
在两个实施例10和10A中,计算机芯片封装12可能包括硅晶片16,该硅晶片安装在壳体22的壁20的上表面18上,硅晶片配置在壳体22内。不连续的、导电的端子接合区24的图案被淀积在壁20的上表面18上。硅晶片16通过多个导线26连接到这些导电接合区24上。在这个实施例中,端子接合区24通过下支撑壁18经由单独的各自的通路28连接到不连续的导电端子接合区或接触焊盘30的匹配图案上,接触焊盘30配置在芯片封装12的支撑壁18的下表面32上。
任何一个互连系统10或10A的电路板14具有大体上平的上表面34,上表面34平行于芯片封装12的下表面32排列。不连续的电路焊盘36的图案可以以下面的图案配置在上表面34上:使得每一个焊盘36对准在芯片封装支撑壁的下表面上的单独的一个端子接合区30。电路焊盘28按常规方式电连接到电路板14上各自的电路。
多个不连续的插入构件38位于支撑壁20底部上的端子接合区30与配置在电路板14的顶部相对表面的电路焊盘36之间。实施例中的插入构件38,38’分别由插入间隙40,40’彼此隔开,如图1和图2中所示,插入构件38,38’被水平隔开,并具有与端子接合区30和电路片36两者的图案相应的图案,而且一般与该图案对准。插入构件最好由高介电常数的材料制造,以防对角线的或邻近的端子接合区30与电路片36之间的耦合,其中高介电常数是相对于间隙40的材料的介电常数而言的。插入构件38,38’的介电常数至少比间隙40,40’(通常是空气)的材料的介电常数高一个数量级,并且,插入构件38,38’的介电常数最好至少为200。然而,随着信号频率的增加,插入构件所需介电常数的数值可能减小。在这些实施例中,端子接合区最好与电路板片36有类似或同样的尺寸并且与其对准,以便确保所需的一对接合区与焊盘之间的耦合,而确保没有不想要的成角度的邻近的接合区与焊盘之间的耦合。
在图1中,插入构件38由载体构件42支撑,该载体构件42最好是平面的,并且配置在芯片封装的下表面32与电路的上表面34之间。该载体构件42(如图所示)延伸到计算机芯片封装12的整个长度和宽度,并且最好由绝缘材料(例如塑料)制造,或者由绝缘和柔性材料(例如橡胶或合成橡胶)形成。插入构件可以被过量模制到载体构件42,并且载体构件42可以包括形成在其中的一系列的孔,这些孔适应于过量模制过程。插入构件38的介电常数最好比载体构件42的介电常数高一个数量级,以防止不需要的和非选择的对角线耦合。
图2示出了非接触互连系统10A的第二个实施例,其中,在图1的第一实施例中所用的载体构件42已经被取消了。在这个实施例中,插入构件38’被粘附到端子接合区30和电路片36的一边或两边。例如,插入构件可以通过适当的印制方法被淀积到端子接合区30或电路焊盘36上。然而,仍然在插入构件之间提供了间隙40’。而且,插入构件38’的介电常数应该比填充间隙40’的任何材料(例如空气)高一个数量级以防止对角线耦合。
在图1和图2所示的互连系统10和10A的两个实施例中,插入构件38,38’是不连续构件,并如上所述,在间隙40,40’处隔开。优选地,插入构件尺寸基本上与对准的端子接合区30和电路焊盘36的尺寸相同。电信号被电容性地从端子接合区30通过插入构件38,38’传输到电路焊盘36。插入构件之间的间隙40,40’具有比插入构件低的介电常数,它们提供了对角线端子接合区30与电路焊盘36之间的绝缘击穿(break)。由于电信号最好通过高介电常数的材料被耦合,则信号将趋向于不穿过间隙40,40’,其中间隙40,40’位于相对高介电常数材料的插入构件之间。因此,不连续的或隔开的插入构件大大地减少了端子接合区30与电路焊盘36对角线组之间的交叉耦合和串扰。
应该了解,那些术语的应用,例如在此处和权利要求中的“上”、“下”、“顶”、“底”、“垂直的”以及类似的术语,在任何方面都不是要加以限制,这样的术语仅仅提供了对本发明的清楚与简明的叙述和了解,就如同在附图中所见到的那样。很明显,互连系统10和10A在使用或应用中是全方位的。
本发明的第三个实施例在图3中示出,其中,非接触互连系统110在计算机芯片封装112和基片114(例如电路板)之间示出。
芯片封装112包括具有底支撑壁116的壳体115和安装在支撑壁116的基本平的上表面120上的硅片118。支撑壁116支撑不连续的端子接合区122图案,端子接合区122位于壁116的上表面120上,并且由各自的导线124互连到硅晶片118。端子接合区122的图案限定了其间的多个间隙123。本实施例中的支撑壁116提供了与如图1和图2实施例中使用的插入构件的功能同样的功能。
这个系统110的电路板114一般成平行关系配置在芯片封装112的支撑壁116的下面。该电路板114具有平的上表面126,该上表面126带有与端子接合区122对准的不连续电路焊盘128的图案。类似于不连续端子接合区122的图案所限定的空隙123,不连续电路焊盘128的该图案也限定了在其间的空隙129。电路焊盘128电连接到在电路板114上的各自的电路。
在本发明中:该计算机芯片封装112的支撑壁116直接被配置在芯片封装的端子接合区122与电路板114的电路焊盘128之间。在这个实施例中,壁116的下表面121直接安装在电路焊盘128上。在另一个实施例中,该壁可以由高介电常数(比充填在间隙123与空隙129中的材料(即空气)的介电常数高)的材料制造,以防止相邻端子接合区122之间的交叉耦合以及防止相邻电路片128之间的交叉耦合。在再一个实施例中,该壁由具有至少为200的介电常数的材料制造。当然,许多材料或复合材料能提供这样所需的介电常数,然而,随着信号频率的增加,壁116的所需的介电常数的数值会减少。在附加的实施例中,相对于端子接合区122之间的间隙123以及电路焊盘128之间的空隙129的宽度,壁116的厚度应当薄一些,以增加对准的端子接合区122与电路焊盘128之间的耦合,并防止邻近的端子接合区122或邻近的电路焊盘128之间的交叉耦合。
从以上可以看出,计算机芯片封装的一部分(即壁116)有效地用于提供硅晶片118与电路板114之间的电磁耦合。本质上,壁116既提供了支撑结构又在多个电容器中提供了插入绝缘介质,其中,端子接合区122和电路焊盘128在由壁116提供的插入绝缘介质的相对边上分别起到半个电容器的作用。信号在芯片封装的端子接合区122和电路板114的电路焊盘128之间电容性传输。因此,所有其他的附加互连部件被除去,并且,电路板114与电路焊盘128一起能够互连地被安装到直接邻近芯片封装的支撑壁116的底表面。
应该理解,本发明在不脱离其精神与重要特性下,可以使用其他形式来实施。因此,当前的举例和实施例在各方面认为是作为举例说明而非限制,并且本发明不限于这里所给出的细节。
Claims (11)
1.一种计算机芯片封装和电路板之间的非接触互连系统,该非接触互连系统包括:
具有平的下表面的计算机芯片封装,该下表面上带有不连续的端子接合区图案;
具有平的上表面的电路板,该上表面与芯片封装的下表面隔开并且与之平行,该电路板包括位于其上并对准所述端子接合区的不连续的电路焊盘图案,
其特征在于:
在端子接合区和电路焊盘之间设置了多个独立的和不连续的插入构件,插入构件的图案与端子接合区与电路焊盘的互相对准的图案相对应并与之对准。
2.如权利要求1中所述的非接触互连系统,其中所述的端子接合区配置在计算机芯片封装的壁的下表面,该端子接合区穿过所述壁由通路连接到来自封装的硅晶片的导线。
3.如权利要求1中所述的非接触互连系统,其中所述插入构件被粘附到所述端子接合区或电路焊盘中的一个。
4.如权利要求1中所述的非接触互连系统,其中所述不连续的插入构件限定了的它们之间的间隙,所述插入构件材料的介电常数比充填间隙的材料的介电常数高。
5.一种计算机芯片封装和电路板之间的非接触互连系统,该非接触互连系统包括:
具有平的下表面的计算机芯片封装,该下表面上带有不连续的端子接合区图案;
电路板,具有上表面并且包括与所述的端子接合区对准的不连续的电路焊盘的图案,其中该上表面与芯片封装的下表面隔开并且与之平行;以及
多个不连续的插入构件,它们由配置在芯片封装的下表面和电路板的上表面之间的载体构件支撑,该载体构件在所述芯片封装下表面和所述电路板上表面之间横向延伸,该插入构件排列成一种图案,该图案与所述的端子接合区和电路焊盘图案相应并对准,并且所述插入构件具有比所述的载体构件的介电常数高的介电常数。
6.如权利要求5中所述的非接触互连系统,其中所述端子接合区位于计算机芯片封装的壁的下表面,该端子接合区穿过所述壁由通路连接到来自封装的硅晶片的导线。
7.如权利要求5中所述的非接触互连系统,其中所述插入构件被模制在所述平的载体构件中。
8.如权利要求5中所述的非接触互连系统,其中所述平面载体构件由绝缘合成橡胶材料制造。
9.一种计算机芯片封装和电路板之间的非接触互连系统,该非接触互连系统包括:
配置在封装中的计算机芯片,该计算机芯片具有从其延伸的多根导线,用于把所述计算机芯片的电路连接到其他电路,其特征在于:
该封装包括支撑壁,该支撑壁由具有给定介电常数的材料构成,用于支撑芯片并将该封装安装到电路板上,所述封装还包括配置在所述支撑壁的上表面上并连接到所述芯片导线的多个不连续的导电端子接合区;以及
倚靠在所述封装支撑壁的电路板,该电路板包括基本上平的上表面,该上表面具有不连续的电路焊盘的图案,其图案使单独的电路焊盘与所述封装的单独的端子接合区对准。
10.如权利要求9中所述的非接触互连系统,其中所述支撑壁构成了所述封装的外壁。
11.如权利要求9中所述的非接触互连系统,其中所述支撑壁具有至少为200的介电常数。
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US09/548,940 US6612852B1 (en) | 2000-04-13 | 2000-04-13 | Contactless interconnection system |
US09/548,636 | 2000-04-13 | ||
US09/548,636 US6362972B1 (en) | 2000-04-13 | 2000-04-13 | Contactless interconnection system |
US09/548,940 | 2000-04-13 |
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CN1422440A CN1422440A (zh) | 2003-06-04 |
CN1237612C true CN1237612C (zh) | 2006-01-18 |
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CNB018079083A Expired - Fee Related CN1237612C (zh) | 2000-04-13 | 2001-04-12 | 非接触互连系统 |
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EP (1) | EP1273040A2 (zh) |
JP (1) | JP3701242B2 (zh) |
KR (1) | KR20020090233A (zh) |
CN (1) | CN1237612C (zh) |
AU (1) | AU2001251588A1 (zh) |
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DE2902002A1 (de) * | 1979-01-19 | 1980-07-31 | Gerhard Krause | Dreidimensional integrierte elektronische schaltungen |
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US6728113B1 (en) * | 1993-06-24 | 2004-04-27 | Polychip, Inc. | Method and apparatus for non-conductively interconnecting integrated circuits |
JPH0998005A (ja) * | 1995-09-29 | 1997-04-08 | Nec Corp | 配線基板 |
US6396712B1 (en) * | 1998-02-12 | 2002-05-28 | Rose Research, L.L.C. | Method and apparatus for coupling circuit components |
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2001
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JP2003531496A (ja) | 2003-10-21 |
WO2001080316A3 (en) | 2002-03-21 |
AU2001251588A1 (en) | 2001-10-30 |
EP1273040A2 (en) | 2003-01-08 |
CN1422440A (zh) | 2003-06-04 |
JP3701242B2 (ja) | 2005-09-28 |
TW547773U (en) | 2003-08-11 |
WO2001080316A2 (en) | 2001-10-25 |
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