CN1226466C - Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation - Google Patents
Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation Download PDFInfo
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- CN1226466C CN1226466C CN 03142287 CN03142287A CN1226466C CN 1226466 C CN1226466 C CN 1226466C CN 03142287 CN03142287 CN 03142287 CN 03142287 A CN03142287 A CN 03142287A CN 1226466 C CN1226466 C CN 1226466C
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Abstract
The present invention discloses an electronic component treatment method for preventing reduction of electrical properties before electroplating, which comprises the following steps: firstly, electronic components are put in a sealed container to be evacuated and kept for a certain time; hydrophobic solvents, oleophobic solvents or double phobic solvents are led in, and the electronic components are dipped and evacuated for two to five hours; finally, the electronic components are aired at room temperature in the atmosphere. The solvents which have the hydrophobic, oleophobic or double phobic functions are led in the gaps or the holes of the electronic components before electroplating; in the electroplating processes, the hydrophobic, the oleophobic or the double phobic functions of the solvents are utilized to prevent medium water solutions and organic components of electroplating solutions from entering the inner part of the electronic components. Therefore, the electrical properties of the electronic components are prevented from decreasing. The method can be carried out to electrode electroplating in various functional devices, such as capacitors, electrical inductors, wave filters, modules, resistors, sheet type magnetic elements, etc. Applications of resistance to soldering heat and the solderability are enhanced, and the influence of electroplating on the electrical properties of the electronic components can be effectively reduced.
Description
Affiliated technical field
The present invention relates to a kind of electronic devices and components electro-plating pre-treatment method, prevent that the electronic devices and components electrical property from reducing.
Background technology
Since the eighties, along with rapid development of surface mount in the world, lamination sheet type device purposes such as multilayer ceramic capacitor, resistor, multi-layer inductor, wave filter, balun (Ba Lun), resonator oscillator, frequency discriminator, antenna, duplexer, RF switch module are more and more wide.Facts have proved and to adopt three layers of termination electrode technology, can improve anti-welding heat and weldability effectively, adapt to the surface mounting technique requirement.The basal electrode of three layers of termination electrode is the fine silver layer, and target is a nickel dam, and outer electrode is tin or tin one lead alloy layer.Form the plating of three layers of termination electrode structure, plating than general machinery, plastic paste is more complex, it integrates pottery, electronics, chemical industry technology, should make product when improving anti-welding heat and weldability, keep every electrical property to be without prejudice, allow again the chemical ingredients of plating bath does not produce detrimentally affect to the medium body in the electroplating process.In electroplating process, these devices are in the plating bath and charged severe environment of acidity or alkalescence, because end electrode, end electrode and the ceramic dielectric contact zones of laminated device are porous matter, electroplate liquid permeates to device inside by end electrode and layer electrode defects in electroplating process, make the corrosion of the electroplate liquid that electrode is infiltrated in the device and cause its electrical property to descend, electroplate liquid is stayed also can influence the partial properties of device index in the device, all can cause the deterioration of part electrical performance indexes after electroplating.For preventing the device performance degradation, carried out serial test at device and plating, generally all alleviate the device electrical performance fall at present by the method for raising porcelain body sintered density and the method for adjustment electroplate liquid formulation.
Summary of the invention
The purpose of this invention is to provide a kind of electronic devices and components electro-plating pre-treatment method, prevent that the electronic devices and components electrical property from reducing.
In order to achieve the above object, the technical solution used in the present invention is as follows:
In filling the vacuum vessel of electronic devices and components, introduce the hydrophobic treatment agent, continued then to vacuumize 30～300 minutes, clean, under room temperature, atmospheric condition, dry, used treatment agent be silicone oil, siloxanes, dichloro-tetrafluoro for ethane or fluorine-containing organosilicone compounds, or the mixture of above 2 kinds, 3 kinds or 4 kinds.
Electronic devices and components vacuumize processing, and the pumpdown time is generally between 10～60 minutes.
The present invention compares with background technology, and the useful effect that has is:
The treatment agent that adopts processing method of the present invention will have hydrophobic function before plating is introduced in the slit and hole of electronic devices and components, in electroplating process, utilize the hydrophobic property effect of treatment agent, prevent that medium solution and organic constituent in the electroplate liquid from entering electronic devices and components inside, thereby prevent that the electronic devices and components electrical property from descending.The present invention can carry out using when electrode plating improves anti-welding heat and weldability at various functional devices such as electrical condenser, inductance, wave filter, module, resistance, chip magneticss, can effectively reduce the influence of plating to the electronic devices and components electrical property.
Embodiment
Embodiment 1
Vacuumize 0.3 hour in the sealed vessel with holding the wave filter that prints after silver ink firing is finished to be placed on, adopt suction pipe to utilize the container pull of vacuum to introduce methyl-silicone oil then, continued to vacuumize 2 hours, get rid of gas in the laminated filter, it is inner that the methyl-silicone oil treatment agent enters pottery, stop to vacuumize, take out wave filter and adopt zellon to clean, under room temperature, atmosphere, dry standby.Device is electroplated back device differential loss and is reduced by 0.1～0.3dB, and the device differential loss that is untreated reduces by 3～4dB, effectively reduces the electrical property deterioration.
Embodiment 2
Vacuumize 0.3 hour in the sealed vessel with holding the wave filter that prints after silver ink firing is finished to be placed on, adopt suction pipe to utilize the container pull of vacuum to introduce CF then
2ClCF
2Cl (the dichloro-tetrafluoro is for ethane) treatment agent continued to vacuumize 2 hours, got rid of gas in the laminated filter, and it is inner that solvent enters pottery, stopped to vacuumize, and took out wave filter and adopted zellon to clean, and dried standby under room temperature, atmosphere.Device is electroplated back device differential loss degradation 0.1～0.2dB, and the device differential loss that is untreated reduces by 3～4dB, effectively reduces the electrical property deterioration.
Embodiment 3
Vacuumize 0.3 hour in the sealed vessel with holding the electrical condenser that prints after silver ink firing is finished to be placed on, adopt suction pipe to utilize the container pull of vacuum to introduce CF then
2ClCF
2Cl (the dichloro-tetrafluoro is for ethane) treatment agent continued to vacuumize 2 hours, got rid of gas in the laminated filter, and it is inner that treatment agent enters pottery, stopped to vacuumize, and took out wave filter and adopted zellon to clean, and dried standby under room temperature, atmosphere.(loss tangent of 0.1PF～0.22uF) is less than 0.8% (20 ℃, IMHz IVDC, 75%), and (loss tangent of 0.1PF～0.22uF) is less than 3.5% (20 ℃, IMHzIVDC, 75%) for the NPO electrical condenser that is untreated to electroplate back NPO electrical condenser.
Embodiment 4
Vacuumize 0.3 hour in the sealed vessel with holding the electrical condenser that prints after silver ink firing is finished to be placed on, adopt suction pipe to utilize the container pull of vacuum to introduce methyl-silicone oil then, continued to vacuumize 2 hours, get rid of gas in the laminated filter, it is inner that the methyl-silicone oil treatment agent enters pottery, stop to vacuumize, take out electrical condenser and adopt zellon to clean, under room temperature, atmosphere, dry standby.(loss tangent of 0.1PF～0.22uF) is less than 1.2% (20 ℃, IMHz IVDC, 75%), and (loss tangent of 0.1PF～0.22uF) is less than 3.5% (20 ℃, IMHz IVDC, 75%) for the NPO electrical condenser that is untreated to electroplate back NPO electrical condenser.
Embodiment 5
Introduce methyl-silicone oil in filling the sealed vessel of wave filter, vacuumized 2 hours, get rid of gas in the laminated filter, it is inner that the methyl-silicone oil treatment agent enters pottery, stops to vacuumize, and takes out wave filter and adopt zellon to clean, and dries standby under room temperature, atmosphere.Device is electroplated back device differential loss degradation 0.1～0.3dB, and the device differential loss that is untreated reduces by 3～4dB, effectively reduces the electrical property deterioration.
Claims (2)
1. electronic devices and components electro-plating pre-treatment method, it is characterized in that: in filling the vacuum vessel of electronic devices and components, introduce the hydrophobic treatment agent, continued then to vacuumize 30～300 minutes, clean, under room temperature, atmospheric condition, dry, used treatment agent be silicone oil, siloxanes, dichloro-tetrafluoro for ethane or fluorine-containing organosilicone compounds, or the mixture of above 2 kinds, 3 kinds or 4 kinds.
2. electronic devices and components electro-plating pre-treatment method according to claim 1, it is characterized in that: electronic devices and components vacuumize processing, and the pumpdown time is generally between 10～60 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03142287 CN1226466C (en) | 2003-08-13 | 2003-08-13 | Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03142287 CN1226466C (en) | 2003-08-13 | 2003-08-13 | Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1487123A CN1487123A (en) | 2004-04-07 |
| CN1226466C true CN1226466C (en) | 2005-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 03142287 Expired - Fee Related CN1226466C (en) | 2003-08-13 | 2003-08-13 | Pre-electroplating treatment process of electronic element and device to prevent electrical performance degradation |
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| CN (1) | CN1226466C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449013A (en) * | 2018-10-19 | 2019-03-08 | 福建火炬电子科技股份有限公司 | A method of prevent electroplate liquid from invading terminal electrode of multi-layer ceramic capacitor |
| CN112316844A (en) * | 2020-10-30 | 2021-02-05 | 广东风华高新科技股份有限公司 | Surface modification solution and application thereof |
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2003
- 2003-08-13 CN CN 03142287 patent/CN1226466C/en not_active Expired - Fee Related
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| CN1487123A (en) | 2004-04-07 |
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