CN1224513C - Method for making main structure body of peizoelectric ink-jet chip - Google Patents
Method for making main structure body of peizoelectric ink-jet chip Download PDFInfo
- Publication number
- CN1224513C CN1224513C CN02102586.XA CN02102586A CN1224513C CN 1224513 C CN1224513 C CN 1224513C CN 02102586 A CN02102586 A CN 02102586A CN 1224513 C CN1224513 C CN 1224513C
- Authority
- CN
- China
- Prior art keywords
- main structure
- structure body
- ink jet
- piezoelectric ink
- jet chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims abstract description 43
- 238000005245 sintering Methods 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 210000001161 mammalian embryo Anatomy 0.000 claims description 29
- 241000446313 Lamella Species 0.000 claims description 16
- 238000002360 preparation method Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 11
- 238000007731 hot pressing Methods 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 235000014676 Phragmites communis Nutrition 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 33
- 238000007650 screen-printing Methods 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000377 silicon dioxide Substances 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 239000011797 cavity material Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000032696 parturition Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention relates to a method for manufacturing a main structure of a piezoelectric ink-jet chip, and the whole piezoelectric ink-jet chip is made of the same material. A lead zirconate titanate (PZT) sheet band is made by a scraper forming method, multilayer stack is carried out to the PZT sheet band in a precise contraposition operation mode after pattern process is carried out, and then heat pressing or water pressing is carried out to obtain a raw blank made of PZT material. After heat pressing is carried out to the raw blank made of PZT material, a lower electrode layer is added to the raw blank by screen printing. After the lower electrode layer is dried, a PZT layer used as a vibration sheet layer is added to the raw blank by screen printing. After the PZT layer is dried, an upper electrode layer is added to the raw blank by screen printing. Finally, the raw blank, the lower electrode layer, the PZT layer and the upper electrode layer are jointly sintered. Consequently, the present invention can obtain a main structure with a basal plate and an actuating sheet which are both made of PZT material under the same sintering temperature. The main structure is attached to a jet hole sheet so as to obtain a piezoelectric ink-jet chip.
Description
Technical field
The present invention relates to a kind of manufacture method of piezoelectric ink jet chip, be particularly related to a kind of manufacture method of main structure body of piezoelectric ink jet chip, especially refer to a kind of substrate and vibration lamella that makes the main structure body, all be the approaching or identical material of sintering condition, and carries out the manufacture method of main structure body of the piezoelectric ink jet chip of co-sintered.
Background technology
The main structure body of present piezoelectric ink jet chip, be that piezoelectric thick is arranged on zirconium or the silica substrate, under the piezoelectric actuated situation different with substrate and black chamber material, the extremely difficult common burning temperature that finds the desirable sintering temperature that can take into account different materials, thereby be difficult to produce real densification, the good chip of PZT characteristic.The known piezoelectric ink jet chip structure of relevant this class can be with reference to United States Patent (USP) the 6th, 142, No. 616 bulletin, and in order to yield to tridimensional processability problems, the new construction that this case proposed is still the chip of being produced at the silica substrate material.
Burn the problem of temperature altogether, if be the example explanation with the main structure body of zirconium matter substrate, about about 1700 ℃ of the desirable sintering temperature of zirconium dioxide, but constitute about 1200 ℃ of the sintering temperature of the PZT material layer of braking plate, the optimal sintering temperature difference of two kinds of materials is very big.Though the material layer vibration characteristics of high temperature sintering is preferable in the ordinary course of things, the structure of zirconium matter substrate burn altogether temperature can be subject to the PZT material layer need be at lower temperature sintering, therefore sintering can not be promoted to required 1700 ℃ of zirconium matter substrate.
Main structure body with silica substrate is the example explanation again, and the optimal sintering temperature of silicon dioxide is starkly lower than the sintering temperature (1200 ℃) that constitutes braking plate PZT material layer about about 900 ℃.Therefore, the common burning temperature of silica substrate structure is subject to the sintering temperature of silicon dioxide substrate on the contrary, so can't will burn temperature increase altogether to required 1200 ℃ of PZT material layer sintering.
The temperature problem that the dissimilar materials that solution known chip main structure body is difficult to overcome burns altogether, the most direct way is created a kind of manufacture method exactly, make the main structure structure base board of piezoelectric ink jet chip, black cavity material layer and vibration level be identical material, so just can solve above-mentioned common burning temperature problem.
Summary of the invention
Main purpose of the present invention, be to provide a kind of manufacture method of making the main structure body of piezoelectric ink jet chip, make the substrate, black chamber layer material and the vibration component that constitute chip all for the approaching or identical material of sintering condition constitutes, thereby solve the common burning temperature problem of piezoelectric ink jet chip when sintering.
Manufacture method provided by the present invention mainly is to obtain a strip with the scraper method of forming, and the patterned processing in back is carried out the multilayer storehouse with the operation of accurate contraposition again, then the storehouse finished product is bestowed hot pressing or hydraulic pressure, thereby finishes the living embryo of identical material; This gives birth to embryo and bestow wire mark interpolation lower electrode layer again after hot pressing, and wire mark one deck vibration lamella again after the drying, bestow wire mark again after the drying and add upper electrode layer, dried at last, cut after, can obtain substrate and all be the main structure body of identical material with braking plate by accurate degrease and sintering; After this, if the spray supporting spring of fitting again can be finished a piezoelectric ink jet chip.Aforementioned strip and vibration lamella can be selected lead zirconate titanate (PZT) material for use, but not exceed with this material.
Specifically, the invention provides a kind of manufacture method of main structure body of piezoelectric ink jet chip, comprise at least:
One preparation discrete structure layer step: get a lead zirconate titanate strip, and make this strip patterning one by one, become the thin layer that plurality of sections can be overlapped into the main structure body of one or more piezoelectric ink jet chip;
One preparation main structure body is given birth to the embryo step: utilize accurate contraposition to make the thin layer behind this process patterning make multilayer contraposition storehouse, and then in addition pressing, thereby finish embryo throughout one's life, ink runner and black chamber are contained in the inside of described living embryo;
One adds the vibration component step on this living embryo: give birth at this and add a lower electrode layer on embryo, add a vibration lamella after the drying, add a upper electrode layer after the drying again; And
One cutting and sintering step: after the living embryo that previous step is finished is dried, cut,, finish the main structure body of this piezoelectric ink jet chip again via accurate degrease and sintering.
Described vibration lamella is the lead zirconate titanate thin layer.
The pressing of the thin layer of described storehouse is to utilize a hydraulic pressure to handle.
The pressing of the thin layer of described storehouse is to utilize a hot-pressing processing.
The step of the structure sheaf of described interpolation lower electrode layer and vibrating reed adopts the mode of wire mark to add.
The present invention also provides a kind of manufacture method of main structure body of piezoelectric ink jet chip, comprises at least:
The strip of one preparation lead zirconate titanate (PZT), and via the machinery step of patterning in addition becomes this strip can be stacked into jointly a thin layer that includes the structure in ink runner and black chamber;
One makes the step that the main structure body is given birth to embryo: utilize accurate contraposition that this thin layer is carried out multilayer contraposition storehouse, bestow hot pressing or hydraulic pressure then and handle, thereby finish a living embryo that utilizes PZT material multilayer storehouse to be constituted;
One adds the step of vibration component: add a lower electrode layer on these life clothes, increase by a vibration lamella after the drying step again, give a hot pressing, hydraulic pressure or oven dry again and handle; And
The step of one degrease and sintering: add a upper electrode layer behind the sintering again, and then bestow with polarization and handle, thereby finish the main structure body of a piezoelectric ink jet chip.
Wherein also comprise a preposition step: this preposition step can comprise that size mixing step and a scraper moulding of a preparation PZT powder step, make lead zirconate titanate (PZT) strip step.
Described lower electrode layer is to utilize the mode of wire mark to make an addition on this life embryo.
Described vibration lamella is to utilize the mode of wire mark to make an addition on this lower electrode layer.
The present invention makes the main structure structure base board of piezoelectric ink jet chip, black cavity material layer and vibration level be identical material, solves to burn temperature problem altogether, and effect is remarkable.
Description of drawings
The structure section schematic diagram of Fig. 1, general piezoelectric ink jet chip.
The flow chart of Fig. 2, the first embodiment of the present invention.
The flow chart of Fig. 3, the second embodiment of the present invention.
Embodiment
The structure section of general piezoelectric ink jet chip mainly comprises as shown in Figure 1 with siliceous or zirconium matter substrate 10 bonding other PZT material layers, forms shapes such as ink runner 11 and black chamber 12 in the main structure body, attaches spray nozzle sheet 20 and vibration component 30 again; It is characterized in that described vibration component 30 comprises that a lower electrode layer 33, PZT vibrate lamella 32, upper electrode layer 31 and some electrode contacts.
First embodiment:
Please contrast organigram and the flow chart shown in Figure 2 of Fig. 1, its manufacture method can comprise:
One, preparation discrete structure layer (A1): get a strip, and make strip be patterned as the thin layer that plurality of sections can be overlapped into one or more piezoelectric ink jet chip main structure section configuration one by one, comprising important structures such as ink runner 11 and black chambeies 12; The preferably, this strip can be selected for use and vibrate the approaching or identical material manufacturing of lamella 32 sintering conditions, for example selects lead zirconate titanate (PZT) material for use.
Two, preparation main structure body is given birth to embryo (A2): utilize accurate contraposition to make the thin layer after the aforementioned patternization make multilayer contraposition storehouse, and in addition pressing then, thus finishing one utilizes same material to carry out the living embryo that the multilayer storehouse is constituted; The preferably, aforementioned pressing can be selected to handle with hot pressing or hydraulic pressure;
Three, adding vibration component (A3) on the embryo giving birth to: giving birth to and bestowing wire mark on the embryo and add lower electrode layer 33, wire mark one deck vibration lamella again after the drying adds upper electrode layer 31 again after the drying; Optional or identical material approaching, for example aforesaid lead zirconate titanate (PZT) material selected of this vibration lamella with the sintering temperature of aforementioned strip; And
Four, cutting and sintering (A4): after above-mentioned living embryo dried, cuts,, finish a piezoelectric ink jet chip main structure body again via accurate degrease and sintering.
On the main structure body, add a spray nozzle sheet 20 at last again, can finish a piezoelectric ink jet chip.
Second embodiment: please refer to flow chart shown in Figure 3, comprising:
One, lead zirconate titanate (PZT) strip (B1) of preparation specific pattern: can be subdivided into preparation PZT powder step, the step of sizing mixing and scraper moulding and make lead zirconate titanate (PZT) strip step.After finishing,, make strip become the thin layer of a plurality of piezoelectric ink jet chip main structure section configurations, comprising important structures such as ink runner 11 and black chambeies 12 again via the step of mechanical patternsization;
Two, make the main structure body and give birth to embryo (B2): utilize accurate contraposition that aforementioned thin layer is carried out the step of multilayer contraposition storehouse, bestow hot pressing or hydraulic pressure then and handle, thereby finish a living embryo that utilizes PZT material multilayer storehouse to be constituted;
Three, add vibration component (B3): on living embryo, bestow the wire mark step, add the lower electrode layer 33 that last layer is made of silver palladium alloy (Ag-Pd), drying is carried out another wire mark step after handling again, increases the vibration lamella 32 that one deck PZT is constituted, and handles through hot pressing, hydraulic pressure or oven dry again; And
Four, degrease, sintering and interpolation upper electrode layer (B4): the electrode layer that utilizes sputter (Sputtering) step interpolation gold (Au) is then bestowed to finish the main structure body of a piezoelectric ink jet chip after the polarization processing as upper electrode layer 31.
Above-mentioned main structure body can as long as fit a spray nozzle sheet 20 again, can be finished the assembling of a piezoelectric ink jet chip through after the cutting.
The present invention utilizes the approaching or identical layer material storehouse of sintering condition, the common burning condition of main structure body is reached unanimity, so when sintering, can take comparatively ideal sintering temperature to carry out sintering according to the material behavior of main structure body, to significantly reduce the production difficulty of piezoelectric ink jet chip, make finished product obtain preferable vibration characteristics.
Though the present invention with preferred embodiment openly as above, right its purpose is not in order to limit the present invention, anyly have the knack of those of ordinary skills, without departing from the spirit and scope of the present invention, do some the design and the retouching of the equivalence of being permitted when having the ability, the right of these equivalence designs must be included in the claim scope of the present invention.
Claims (9)
1, a kind of manufacture method of main structure body of piezoelectric ink jet chip comprises at least:
One preparation discrete structure layer step: get a lead zirconate titanate strip, and make this strip patterning one by one, become the thin layer that plurality of sections can be overlapped into the main structure body of one or more piezoelectric ink jet chip;
One preparation main structure body is given birth to the embryo step; Utilize accurate contraposition to make the thin layer behind this process patterning make multilayer contraposition storehouse, and then in addition pressing, thereby finish the embryo in all one's life, ink runner and black chamber are contained in the inside of described living embryo;
One adds the vibration component step on this living embryo: give birth at this and add a lower electrode layer on embryo, add a vibration lamella after the drying, add a upper electrode layer after the drying again; And
One cutting and sintering step: after the living embryo that previous step is finished is dried, cut,, finish the main structure body of this piezoelectric ink jet chip again via accurate degrease and sintering.
2, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that described vibration lamella is the lead zirconate titanate thin layer.
3, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that, the pressing of the thin layer of described storehouse is to utilize a hydraulic pressure to handle.
4, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that the pressing of the thin layer of described storehouse is to utilize a hot-pressing processing.
5, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that, the step of the structure sheaf of described interpolation lower electrode layer and vibrating reed adopts the mode of wire mark to add.
6, a kind of manufacture method of main structure body of piezoelectric ink jet chip comprises at least:
One preparation lead zirconate titanate strip, and via the machinery step of patterning in addition becomes this strip can be stacked into jointly a thin layer that includes the structure in ink runner and black chamber;
One makes the step that the main structure body is given birth to embryo: utilize accurate contraposition that this thin layer is carried out multilayer contraposition storehouse, bestow hot pressing or hydraulic pressure then and handle, thereby finish a living embryo that utilizes lead zirconate titanate multilayer storehouse to be constituted;
One adds the step of vibration component: add a lower electrode layer on this life embryo, increase by a vibration lamella after the drying step again, give a hot pressing, hydraulic pressure or oven dry again and handle; And
The step of one degrease and sintering: add a upper electrode layer behind the sintering again, and then bestow with polarization and handle, thereby finish the main structure body of a piezoelectric ink jet chip.
7, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, wherein also comprise a preposition step: this preposition step can comprise that size mixing step and a scraper moulding of a preparation lead zirconate titanate powder step, make lead zirconate titanate strip step.
8, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, it is characterized in that described lower electrode layer is to utilize the mode of wire mark to make an addition on this life embryo.
9, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, it is characterized in that described vibration lamella is to utilize the mode of wire mark to make an addition on this lower electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02102586.XA CN1224513C (en) | 2002-01-25 | 2002-01-25 | Method for making main structure body of peizoelectric ink-jet chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02102586.XA CN1224513C (en) | 2002-01-25 | 2002-01-25 | Method for making main structure body of peizoelectric ink-jet chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1433888A CN1433888A (en) | 2003-08-06 |
| CN1224513C true CN1224513C (en) | 2005-10-26 |
Family
ID=27627616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02102586.XA Expired - Fee Related CN1224513C (en) | 2002-01-25 | 2002-01-25 | Method for making main structure body of peizoelectric ink-jet chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1224513C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308147C (en) * | 2003-10-31 | 2007-04-04 | 飞赫科技股份有限公司 | Method for manufacturing ink-jet printing head |
| CN100336663C (en) * | 2003-10-31 | 2007-09-12 | 飞赫科技股份有限公司 | Piezoelectric ink-jet head and its manufacturing method |
-
2002
- 2002-01-25 CN CN02102586.XA patent/CN1224513C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1433888A (en) | 2003-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0455342B1 (en) | Piezoelectric/electrostrictive actuator having at least one piezoelectric/electrostrictive film | |
| EP0718900B1 (en) | Piezoelectric/electrostrictive film element with a diaphragm having at least one stress releasing end section | |
| EP0468796A1 (en) | Piezoelectric/electrostrictive actuator having ceramic substrate | |
| EP1796183A1 (en) | Piezoelectric/electrostriction film type element and production method therefor | |
| US6198203B1 (en) | Piezoelectric vibrating member and its producing process | |
| KR0172602B1 (en) | Laminated ceramic device and method of manufacturing the same | |
| KR20060044731A (en) | Piezoelectric porcelain and piezoelectric element | |
| US6963157B2 (en) | Lead zirconate titanate fiber, smart board using lead zirconate titanate fiber, actuator utilizing smart board, and sensor utilizing smart board | |
| CN101265090A (en) | Strontium and barium doping lead niobium-stibium zirconate-titanate series piezoelectric ceramic and preparation method thereof | |
| JPH0549270A (en) | Piezoelectric/electrostrictive actuator | |
| CN109390462A (en) | Quasi- shear mode multilayer co-firing piezoelectric actuator and its multilayer co-firing preparation method | |
| CN1224513C (en) | Method for making main structure body of peizoelectric ink-jet chip | |
| CN1176499A (en) | Method for producing ceramic diaphragm structure | |
| US20060138900A1 (en) | Piezoelectric/electrostrictive body, piezoelectric/electrostrictive laminate, and piezoelectric/electrostrictive actuator | |
| JP4496579B2 (en) | Piezoelectric ceramic composition | |
| KR100370638B1 (en) | Membraneless piezoelectric/electrostrictive micro actuator and fabricating method thereof | |
| JP4022801B2 (en) | Manufacturing method of ceramic piezoelectric element | |
| CN1127430A (en) | Piezoelectric/electrostrictive film element and method of producing the same | |
| CN2760028Y (en) | Cement-based piezoelectric composite material | |
| JP3272004B2 (en) | Piezoelectric / electrostrictive film type element | |
| CN106064943A (en) | Bismuth-based leadless piezoelectric ceramic and piezoelectric actuator using the same | |
| JP2004059369A (en) | Piezoelectric porcelain composition and piezoelectric actuator for inkjet head using the same | |
| JP2585322B2 (en) | Piezo actuator | |
| JPH06232465A (en) | Laminate type piezoelectric actuator | |
| CN1045231C (en) | Ceramic diaphragm structure having convex diaphragm portion and method of producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |