CN1216515C - Electronic circuit device - Google Patents
Electronic circuit device Download PDFInfo
- Publication number
- CN1216515C CN1216515C CN991096959A CN99109695A CN1216515C CN 1216515 C CN1216515 C CN 1216515C CN 991096959 A CN991096959 A CN 991096959A CN 99109695 A CN99109695 A CN 99109695A CN 1216515 C CN1216515 C CN 1216515C
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- China
- Prior art keywords
- aforementioned
- circuit
- microstrip circuit
- hole
- microstrip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
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- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Waveguides (AREA)
Abstract
The invention provides a electronical circuit component fitted to a motherboard. The unit comprises a multi-layered substrate 31; a circuit component 10 fitted onto the top surface of the multi-layered substrate 31; a microstrip line 9 formed in the internal layer of the multi-layered substrate 31; and a through-hole 32 which is bored in the multi-layered substrate 31 and connects the circuit component 10 and microstrip line 9 to each other. A conductor wall 32a is formed in the through-hole 32, and the microstrip line 9 is connected to the conductor wall 32a; and the through-hole 32 is filled with resin 36, an electrode 32 b is formed on only one end surface of the resin 36, and the circuit component 10 is fitted onto the electrode 32b.
Description
Technical field
The present invention relates to constitute, be installed in the electronic circuit devices such as oscillator that use on the mother substrate by multilager base plate.
Background technology
With the oscillator is that example illustrates existing electronic circuit device.Existing oscillator loop as shown in Figure 6.This oscillation circuit is the oscillation circuit of grounded collector type.Be added with the collector electrode of the oscillistor 51 of supply voltage (E), by stoping capacitor 52 high frequency earthings of direct current; Feedback condenser 53,54 is connected between base stage and the emitter and reaches between emitter and the ground.In addition, between base stage and ground, connecting variable reactance loop 55.Variable reactance loop 55 is connected in parallel with the feedback condenser 53,54 that is connected in series, and aspect frequency of oscillation, it is that ground of equal value works as inductance element.
Variable reactance loop 55 is by oscillating capacitor 56, the first microstrip circuits 57, and the frequency correction is formed with capacitor 58 and variable capacitance diode 59.The oscillating capacitor 56 and the first microstrip circuit 57 are connected in series, and the frequency correction also is connected in series with capacitor 58 and variable capacitance diode 59.In addition, the frequency correction that is connected in series is connected in parallel with capacitor 58 and variable capacitance diode 59 and the first microstrip circuit 57.Again, an end of oscillating capacitor 56 is connected with the base stage of oscillistor 51, and an end of the first microstrip circuit 57 and the anode of variable capacitance diode 59 be ground connection all.
In addition, be used to change the control voltage (V) of frequency of oscillation, the second microstrip circuit 60 by using as the choke induction coil is added on the negative electrode of variable capacitance diode 59.
Fig. 7 is illustrated in the profile that constitutes the oscillator major part of oscillation circuit on the multilager base plate 61.On the upper surface of multilager base plate 61, laying oscillistor 51, stop the capacitor 52 of direct current, feedback condenser 53,54, frequency correction capacitor 58 circuit elements such as grade (in Fig. 7, only having represented frequency correction capacitor 58).In addition, the first microstrip circuit, 57, the second microstrip circuits 60 are made of the conductor layer 61a of internal layer, and the oscillator size is reduced.Therefore, for example, be connected with capacitor 58 with the frequency correction, make first via (below, via is called through hole) 62 in order to make the first microstrip circuit 57.Equally, be connected with capacitor 58 with the frequency correction, make second through hole 63 in order to make the second microstrip circuit 60.The tie point A of Fig. 6, B represent to form the position of first through hole 62 and second through hole 63.
In first and second through holes 62,63, form conducting wall 62a, 63a with methods such as plating.In addition, portion's potting resin 64,64 within it, form electrode 65,66 and electrode 67,68 respectively at its two ends.Like this, in first through hole 62, electrode 65 and 66 and conducting wall 62a interconnect, in second through hole 63, electrode 67 and 68 and conducting wall 63a interconnect.These through holes 62,63 generically are called joint and insert through hole, are used for high-density mounting.
In addition, on the electrode 65,67 of the upper surface of multilager base plate 61, placing the electrode part 58a of frequency correction, 58b with capacitor 58.Electrode part 58a and electrode 65, electrode part 58b and electrode 67 interconnect by scolding tin 69,69 respectively.Electrode 66,68 on the lower surface of multilager base plate 61 is not connected with other loop.In addition, the first microstrip circuit 57 is connected with conducting wall 62a, and the second microstrip circuit 60 is connected with conducting wall 63a.Like this, the frequency correction is connected with the first microstrip circuit 57 and the second microstrip circuit 60 with capacitor 58.
In addition, on the lower surface of multilager base plate 61, be provided with the outer contact layer 61b relative with the second microstrip circuit 60, this conductor layer 61b ground connection with the first microstrip circuit 57.As a result, the first microstrip circuit 57 and the second microstrip circuit 60 impedance with regulation.
In addition, utilize the given control voltage (V) that is added on the variable capacitance diode 59, can adjust the impedance of the first microstrip circuit 57, reach given frequency of oscillation.This adjustment is called the balance adjustment, for example, can be undertaken by add suitable grooving in the first microstrip circuit 57.
More than the oscillator that constitutes like this be placed on and constitute on the mother substrate (not illustrating among the figure) that sends received signal device etc., use as local oscillator that sends the received signal device or carrier oscillator.At this moment, the lower surface of multilager base plate 61 (being conductor layer 61b) is placed with respect to the upper surface of mother substrate.In addition, on the upper surface of mother substrate, be provided with earthing conductor (not illustrating among the figure), therefore, under oscillator is placed in state on the mother substrate, be formed at first through hole 62 on the multilager base plate 61 and be formed at second electrode 66,68 on the through hole 63 relative with earthing conductor on the mother substrate.
As a result, between the earthing conductor of electrode 66 and mother substrate, and between the earthing conductor of electrode 68 and mother substrate, form the electric capacity 70,71 (referring to Fig. 6) that swims.This electric capacity 70,71 that swims becomes between the tie point A and ground that is added in Fig. 6 respectively, and the state between tie point B and the ground.Therefore, the swim electric capacity 70 and the first microstrip circuit 57 are connected in parallel, and the electric capacity 71 that swims is connected in parallel with variable capacitance diode 59.
As a result, the resistance value of reactance loop 55 integral body increases, shown in the line X of Fig. 8, for example, for the oscillator of 1700MHz, be installed on the mother substrate before and the changes delta F of frequency of oscillation afterwards approximately can reach 9MHz (after the installation, frequency reduces).Therefore,, control voltage (V) must be improved, under the restricted situation of maximum of control voltage (V), the problem that to set same frequency can be produced for by same frequency of oscillation vibration.This oscillator being used under the situation about sending on the received signal device etc., can not get given local oscillation frequency and carrier frequency.
Summary of the invention
Characteristics such as frequency of oscillation after the objective of the invention is to reduce to be installed on the mother substrate are with respect to the variation of the characteristics such as frequency of oscillation before being installed on the mother substrate.
In order to solve foregoing problems, electronic circuit device of the present invention has multilager base plate; Be installed in the circuit element on the aforementioned multilager base plate upper surface; Microstrip circuit in aforementioned multilager base plate internal layer formation; With pass aforementioned multilager base plate, connect the through hole of aforementioned circuit element and aforementioned microstrip circuit; Form conducting wall in aforementioned through-hole, aforementioned microstrip circuit is connected with aforementioned conducting wall, potting resin in aforementioned through-hole only forms electrode on the end face of an end of having filled aforementioned resin, aforementioned circuit element is installed on the former electrodes.
In addition, electronic circuit device of the present invention constitutes as oscillator, aforementioned oscillator has the resonant element of setting frequency of oscillation, and aforementioned microstrip circuit has the first microstrip circuit at least, with the aforementioned first microstrip circuit as aforementioned resonant element.
In addition, the aforementioned circuit element of electronic circuit device of the present invention has the variable capacitance diode that changes aforementioned frequency of oscillation, also has the inductance coil of supplying with control voltage to aforementioned variable capacitance diode, aforementioned microstrip circuit also has the second microstrip circuit, and the aforementioned second microstrip circuit is as aforementioned inductance coil.
Description of drawings
Fig. 1 is the loop diagram of electronic circuit device of the present invention;
Fig. 2 is the upward view of electronic circuit device of the present invention;
Fig. 3 is the profile of the major part of electronic circuit device of the present invention;
Fig. 4 is the key diagram of the through hole of electronic circuit device of the present invention;
Fig. 5 is installed in the key diagram of the state on the mother substrate for electronic circuit device of the present invention;
Fig. 6 is the loop diagram of existing electronic circuit device;
Fig. 7 is the profile of the major part of existing electronic circuit device;
Fig. 8 is the performance plot of the frequency of oscillation variation of explanation electronic circuit device of the present invention and existing electronic circuit device.
Embodiment
Below in conjunction with accompanying drawing electronic circuit device of the present invention is described.
At first, in Fig. 1, the collector electrode of oscillistor 1, by capacitor 2 high frequency earthings that stop direct current, feedback condenser 3,4 is connected between base stage and the emitter, and between emitter and the ground.In addition, emitter is connected with ground by the series loop in emitter bias resistance 5 and parallel resonance loop 6.Between base stage and ground, connecting variable reactance loop 7.Variable reactance loop 7 is connected in parallel with respect to the feedback condenser 3,4 that is connected in series, and aspect frequency of oscillation, works as inductance element of equal valuely.
Variable reactance loop 7 is by oscillating capacitor 8, the first microstrip circuit 9, the frequency correction is formed with capacitor 10 and variable capacitance diode 11, and the oscillating capacitor 8 and the first microstrip circuit 9 are connected in series, and the frequency correction also is connected in series with capacitor 10 and variable capacitance diode 11.In addition, the frequency correction that is connected in series is connected in parallel with capacitor 10 and variable capacitance diode 11 and the first microstrip circuit 9.One end of oscillating capacitor 8 is connected with the base stage of oscillistor 1, and an end of the first microstrip circuit 9 and the anode of variable capacitance diode 11 be ground connection all.
Be used to change the control voltage (V) of frequency of oscillation, the second microstrip circuit 12 by using as the choke induction coil is added on the negative electrode of variable capacitance diode 11.
In addition, be connected the emitter of oscillistor 1 and the parallel resonance loop 6 between the ground, can reduce the hunting power loss of emitter bias resistance 5, it is made of the 3rd microstrip circuit 6a and resonating capacitor 6b, and its resonance frequency is set for consistent with frequency of oscillation.
Oscillator signal from oscillistor 1 sends amplifies by amplifying with transistor 21.Therefore, oscillator signal by in conjunction with capacitor 22, inputs to the base stage of amplifying with transistor 21 from the emitter of oscillistor 1.Export from amplifying through the oscillator signal that amplifies with the collector electrode of transistor 21.Supply voltage (E) is supplied to the collector electrode that amplifies with transistor 21 by the 4th emblem ripple transport tape circuit 23.Be connected the collector electrode and the resonating capacitor between the ground 24 that amplify with transistor 21,, constitute the parallel resonance loop with the 4th microstrip circuit 23, consistent by making its resonance frequency with frequency of oscillation, can eliminate high order harmonic component.
In addition, amplification is connected to each other with the emitter of transistor 21 and the collector electrode of oscillistor 1, and in amplifying with transistor 21 and oscillation-use transistor 1, having almost is that identical collector current flows through jointly.Bias voltage is delivered on the base stage of each transistor 1,21 by base biasing resistor 25,26,27, between the collector and emitter of each transistor 1,21, is added with roughly the same voltage.
Above-mentioned oscillation circuit can (referring to Fig. 2, Fig. 3) be gone up formation at multilager base plate 31.On the upper surface of multilager base plate 31, placing oscillistor 1, feedback condenser 3, base biasing resistor 25 circuit elements such as grade (in Fig. 3, for convenience of description, only representing frequency correction capacitor).First to fourth microstrip circuit 9,12,6a, 23 are formed on the internal layer of multilager base plate 31.Therefore, for example, on oscillating capacitor 8 and frequency correction interlinkage a, first via (following via is called through hole) 32 is set with the capacitor 10 and the first microstrip circuit 9; On the interlinkage b of frequency correction, second through hole 33 is set with capacitor 10 and the variable capacitance diode 11 and the second microstrip circuit 12; On the interlinkage c of the collector electrode that amplifies usefulness transistor 21 and the 4th microstrip circuit 23 and resonating capacitor 24, the 3rd through hole 34 is set; On the interlinkage d of emitter bias resistance 5 and the 3rd microstrip circuit 6a and capacitor 6b, the 4th through hole 35 is set.
These first to fourth through hole 32,33,34,35 as shown in Figure 2, connects to the lower surface of multilager base plate 31.
On the lower surface of multilager base plate 31, be provided with and be used for the earthy conductor 31a that is connected with mother substrate (referring to Fig. 5), the conductor 31b of oscillator signal output usefulness, the conductor 31c of supply voltage (E) usefulness, the conductor 31d of control voltage (V) usefulness and earthy conductor 31f etc.
Fig. 3 is the profile of the major part of first through hole 32 of expression and second through hole 33.The 3rd through hole 34 and the 4th through hole 35 roughly are same structures, but do not illustrate among the figure.
In Fig. 3, in first through hole 32 and second through hole 33, with methods such as platings formation conducting wall 32a, 33a.In addition, at the inner potting resin 36,36 of through hole; Electrode 32b, 33b only respectively on the end face of an end of through hole (upper surface of circuit element is housed) form.Therefore, the conducting wall 32a of first through hole 32 and electrode 32b interconnect; The conducting wall 33a and the electrode 33b of second through hole 33 interconnect.These through hole 32,33 usefulness resins 36,36 are filled, because electrode 32b, 33b lives stopple, generically can be described as joint and inserts through hole, can be used for high-density mounting.In addition, the electrode 32b on the upper surface of multilager base plate 31 on the 33b, is placing the electrode part 10a of frequency correction with capacitor 10 respectively, 10b, and electrode part 10a and electrode 32b, electrode part 10b and electroplax 33b interconnect by scolding tin 37,37.
In addition, do not illustrate among the figure, on electrode 32b, also placing oscillating capacitor 8, they connect with scolding tin.
The negative electrode of variable capacitance diode 11 is placed on the electrode 33b, utilizes scolding tin 37 to connect.The anode of variable capacitance diode 11 and earthing conductor 31g connect with scolding tin 37.
Again, the first microstrip circuit, 9, the second microstrip circuits 12 are made of the conductor layer 31e of the internal layer of multilager base plate 31, and respectively with conducting wall 32a, 33a connects.Thereby the frequency correction is connected with the first microstrip circuit 9 and the second microstrip circuit 12 with capacitor 10.
In addition, on the lower surface of multilager base plate 31, be provided with the outer contact layer 31f relative with the second microstrip circuit 12 with the first microstrip circuit 9.This conductor layer 31f ground connection.As a result, the first microstrip circuit 9 and the second emblem ripple transport tape circuit 12 have given characteristic impedance.
On the end face of the other end of the resin 36,36 in being filled in first through hole 32 and second through hole 33 (lower surface of multilager base plate 31), be not formed for clogging the electrode of these through holes 32,33.Therefore, as shown in Figure 4, the conducting wall 32a of each through hole 32,33,33a forms ring-type, on the lower surface of multilager base plate 31 as can be seen.
In addition, utilize the given control voltage (V) that is added on the variable capacitance diode 11, can adjust the impedance of the first microstrip circuit 9, reach given frequency of oscillation.This adjustment is called the balance adjustment, for example, can be by on the first microstrip circuit 9, methods such as adding grooving are carried out.
Then, use resin 38 to cover the whole lower surface of multilager base plate 31, oscillator has just been finished.
More than the oscillator of the present invention that constitutes like this, for example, the local oscillator or the carrier oscillator that can be used as the transmission received signal device of mobile telephone etc. use.At this moment, as shown in Figure 5, constitute the multilager base plate 31 of electronic circuit device of the present invention, also can be placed on the mother substrate 41 that constitutes transmission received signal device with other circuit element 42.
In addition, under the state of placing multilager base plate 31, the lower surface of multilager base plate 31 is relative with the upper surface of mother substrate 41.The result, be arranged at earthing conductor 41a under the situation on the upper surface of mother substrate 41, the conducting wall 32a of first through hole 32, the conducting wall 33a of second through hole 33 is relative with earthing conductor 41a, but because conducting wall 32a, 33a is a ring-type, therefore, area that this is relative and existing relative area relatively become less.Like this, by the relative electric capacity 28 (referring to Fig. 1) that swims that forms of conducting wall 32a, littler than the existing electric capacity 70 that swims shown in Figure 6 with the direction of earthing conductor 41a; Equally, by the relative electric capacity 29 (referring to Fig. 1) that swims that forms of conducting wall 33a, littler than the existing electric capacity 71 that swims shown in Figure 6 with the direction of earthing conductor 41a.
Because like this, under electronic circuit device of the present invention was installed in situation on the mother substrate 41, the changes delta F of frequency of oscillation was little.Shown in the Y line of Fig. 8, this frequency change is roughly-3MHz.This variation be existing the variation (9MHz) 1/3rd.
With first and second through holes 32,33 is same, if can only be on the lower surface of multilager base plate 31, find out the 3rd through hole 34 and the 4th the through hole 35 interior conducting walls (not illustrating among the figure) that form, the resonance frequency of the 4th microstrip circuit 23 and resonating capacitor 24 then, and the variation of resonant frequency of the 3rd microstrip circuit 6a and resonating capacitor 6b is little.
In the above description, be that example has illustrated electronic circuit device with the oscillator, but be not limited to oscillator, also applicable in other electronic circuit device that uses the microstrip circuit, also can obtain good effect.
As mentioned above, electronic circuit device of the present invention, the circuit element that will be installed in the multilager base plate upper surface with through hole is connected with the microstrip circuit that internal layer at multilager base plate forms, potting resin in the through hole, only on the end face of an end of filling aforementioned resin, form electrode, on electrode, install back circuit unit, multilager base plate is placed under the situation on the mother substrate, even the conducting wall of through hole is relative with the earthing conductor of mother substrate, because the electric capacity that swims that forms by conducting wall and earthing conductor is little, so the characteristic variations of electronic loop is little.
In addition, because electronic circuit device of the present invention constitutes as oscillator, oscillator has the resonant element of setting frequency of oscillation, and the microstrip circuit has at least the first microstrip circuit, with the first microstrip circuit as resonant element, therefore, under situation about oscillator being installed on the mother substrate, additional little to the electric capacity that swims of resonant element.Therefore, even oscillator is installed on the mother substrate, the variation of frequency of oscillation is also little.
In addition, electronic circuit device of the present invention, because circuit element has the variable capacitance diode that changes frequency of oscillation, also has the inductance coil that control voltage is supplied to variable capacitance diode, the microstrip circuit also has the second microstrip circuit, therefore this second microstrip circuit is as inductance coil,, under situation about oscillator being installed on the mother substrate, additional little to the electric capacity that swims of variable capacitance diode.Therefore, the frequency range that is caused by variable capacitance diode is narrow and small.
Claims (3)
1. electronic circuit device, it has multilager base plate; Be installed in the circuit element on the aforementioned multilager base plate upper surface; Microstrip circuit in aforementioned multilager base plate internal layer formation; With pass aforementioned multilager base plate, connect the through hole of aforementioned circuit element and aforementioned microstrip circuit; It is characterized by, in aforementioned through-hole, form conducting wall, make aforementioned microstrip circuit be connected potting resin in aforementioned through-hole with aforementioned conducting wall, only on the end face of an end of having filled aforementioned resin, form electrode, aforementioned circuit element is installed on the former electrodes.
2. electronic circuit device as claimed in claim 1, it is characterized by, the aforementioned electronic loop apparatus constitutes as oscillator, aforementioned oscillator has the resonant element of setting frequency of oscillation, aforementioned microstrip circuit has the first microstrip circuit at least, with the aforementioned first microstrip circuit as aforementioned resonant element.
3. electronic circuit device as claimed in claim 2, it is characterized by, aforementioned circuit element has the variable capacitance diode that changes aforementioned frequency of oscillation, also has the inductance coil of supplying with control voltage to aforementioned variable capacitance diode, aforementioned microstrip circuit also has the second microstrip circuit, with the aforementioned second microstrip circuit as aforementioned inductance coil.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP202145/98 | 1998-07-16 | ||
| JP202145/1998 | 1998-07-16 | ||
| JP10202145A JP2000036712A (en) | 1998-07-16 | 1998-07-16 | Electronic circuit unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1243417A CN1243417A (en) | 2000-02-02 |
| CN1216515C true CN1216515C (en) | 2005-08-24 |
Family
ID=16452717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN991096959A Expired - Fee Related CN1216515C (en) | 1998-07-16 | 1999-07-06 | Electronic circuit device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2000036712A (en) |
| KR (1) | KR20000011723A (en) |
| CN (1) | CN1216515C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001307946A (en) * | 2000-04-24 | 2001-11-02 | Hitachi Aic Inc | Chip type capacitor |
| TW517447B (en) * | 2000-05-30 | 2003-01-11 | Alps Electric Co Ltd | Semiconductor electronic circuit unit |
| TW498602B (en) * | 2000-05-30 | 2002-08-11 | Alps Electric Co Ltd | Circuit unit |
| JP6845118B2 (en) * | 2017-10-25 | 2021-03-17 | 株式会社Ｓｏｋｅｎ | High frequency transmission line |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2874329B2 (en) * | 1990-11-05 | 1999-03-24 | 日本電気株式会社 | Method for manufacturing multilayer printed wiring board |
| JP2707903B2 (en) * | 1992-01-28 | 1998-02-04 | 日本電気株式会社 | Manufacturing method of multilayer printed wiring board |
| JPH06152141A (en) * | 1992-10-29 | 1994-05-31 | Canon Inc | Multilayer electronic circuit board |
| JP2616572B2 (en) * | 1995-03-31 | 1997-06-04 | 日本電気株式会社 | Method for manufacturing multilayer printed wiring board |
-
1998
- 1998-07-16 JP JP10202145A patent/JP2000036712A/en not_active Withdrawn
-
1999
- 1999-07-06 CN CN991096959A patent/CN1216515C/en not_active Expired - Fee Related
- 1999-07-15 KR KR1019990028604A patent/KR20000011723A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1243417A (en) | 2000-02-02 |
| KR20000011723A (en) | 2000-02-25 |
| JP2000036712A (en) | 2000-02-02 |
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