CN1212754C - 电路板及其制造方法 - Google Patents
电路板及其制造方法 Download PDFInfo
- Publication number
- CN1212754C CN1212754C CNB021595763A CN02159576A CN1212754C CN 1212754 C CN1212754 C CN 1212754C CN B021595763 A CNB021595763 A CN B021595763A CN 02159576 A CN02159576 A CN 02159576A CN 1212754 C CN1212754 C CN 1212754C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- resin
- metal dust
- metal
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
经过时间(时) | 0 | 200 | 400 | 600 |
电阻(欧/厘米) | ||||
实施例4 | 1.0×1015 | 1.5×1013 | 1.2×1013 | 1.0×1013 |
对比例1 | 1.0×1016 | 1.2×1010 | 1.0×105 | 1.0×103 |
Claims (4)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001397528 | 2001-12-27 | ||
JP2001397528 | 2001-12-27 | ||
JP2002247483 | 2002-08-27 | ||
JP2002247483 | 2002-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1430463A CN1430463A (zh) | 2003-07-16 |
CN1212754C true CN1212754C (zh) | 2005-07-27 |
Family
ID=26625336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021595763A Expired - Fee Related CN1212754C (zh) | 2001-12-27 | 2002-12-27 | 电路板及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6764747B2 (zh) |
KR (1) | KR100515492B1 (zh) |
CN (1) | CN1212754C (zh) |
TW (1) | TW561804B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004017440A1 (de) * | 2004-04-08 | 2005-11-03 | Enthone Inc., West Haven | Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen |
JP5124984B2 (ja) * | 2005-05-20 | 2013-01-23 | 日立化成工業株式会社 | 印刷配線板 |
US7982137B2 (en) * | 2007-06-27 | 2011-07-19 | Hamilton Sundstrand Corporation | Circuit board with an attached die and intermediate interposer |
KR100906408B1 (ko) * | 2007-12-13 | 2009-07-09 | 한국기계연구원 | 레이져 직접묘화 방법으로 전도성회로패턴을 형성한연성회로기판과 그 제조시스템 및 제조방법 |
KR100992285B1 (ko) * | 2008-03-13 | 2010-11-05 | 대성전기공업 주식회사 | 발광다이오드 소켓 어셈블리 및 그 제조방법 |
JP2010252092A (ja) * | 2009-04-16 | 2010-11-04 | Tyco Electronics Japan Kk | 導波管 |
KR101049219B1 (ko) | 2010-05-25 | 2011-07-13 | 한국기계연구원 | 레이저를 이용한 회로 형성 방법 및 그에 의하여 형성된 회로 기판 |
KR101134873B1 (ko) * | 2010-09-02 | 2012-04-13 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
TWI452960B (zh) * | 2010-11-25 | 2014-09-11 | Kuang Hong Prec Co Ltd | 具有熱傳導性質的模塑互連組件及其製造方法 |
KR101991760B1 (ko) * | 2016-11-23 | 2019-10-01 | (주)드림텍 | 3차원 전자 회로 패턴 구현 방법 및 3차원 전자 회로 패턴 구현 시스템 |
JP2020068339A (ja) * | 2018-10-26 | 2020-04-30 | カンタツ株式会社 | 多層基板形成方法および多層基板形成装置 |
CN112795206A (zh) * | 2021-03-08 | 2021-05-14 | 昆山睿翔讯通通信技术有限公司 | 一种激光直接成型部件及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3222660B2 (ja) | 1993-10-26 | 2001-10-29 | 松下電工株式会社 | 基材表面の処理方法 |
JPH08290478A (ja) * | 1995-04-18 | 1996-11-05 | W R Grace & Co | 表面に微細な凹みを有する樹脂成形体の製造方法 |
JP3498937B2 (ja) * | 1997-05-08 | 2004-02-23 | 三井化学株式会社 | 樹脂基板およびその製造方法 |
-
2002
- 2002-12-13 KR KR10-2002-0079493A patent/KR100515492B1/ko active IP Right Grant
- 2002-12-17 TW TW91136384A patent/TW561804B/zh not_active IP Right Cessation
- 2002-12-27 CN CNB021595763A patent/CN1212754C/zh not_active Expired - Fee Related
- 2002-12-27 US US10/329,558 patent/US6764747B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW561804B (en) | 2003-11-11 |
US6764747B2 (en) | 2004-07-20 |
TW200301673A (en) | 2003-07-01 |
KR100515492B1 (ko) | 2005-09-20 |
CN1430463A (zh) | 2003-07-16 |
KR20030057314A (ko) | 2003-07-04 |
US20030129371A1 (en) | 2003-07-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1212754C (zh) | 电路板及其制造方法 | |
CN1161228C (zh) | 涂覆树脂的复合箔及其制造,用其制造多层覆铜层压板和多层印刷线路板 | |
CN1182766C (zh) | 经表面加工的电沉积铜箔及其制造方法和用途 | |
CN1279114C (zh) | 绝缘树脂组合物及其制备方法、多层布线板及其生产方法 | |
CN1798481A (zh) | 在聚酰亚胺树脂上形成无机薄膜图案的方法 | |
CN1638957A (zh) | 贴附树脂的金属箔、粘合金属的层压板、使用它们的印刷电路板及其制造方法 | |
CN1961622A (zh) | 电路基板及其制造方法 | |
CN1961623A (zh) | 多层电路板及其制造方法 | |
CN1190115C (zh) | 用于制造印刷线路板的复合材料 | |
CN1906705A (zh) | 导电性微粒和各向异性导电材料 | |
CN1281629A (zh) | 多层印刷电路板的制造方法 | |
CN1657279A (zh) | 表面处理铜箔和电路基板 | |
CN1925982A (zh) | 具有绝缘层形成用树脂层的带载体箔的电解铜箔、覆铜箔层压板、印刷电路板、多层覆铜箔层压板的制造方法及印刷电路板的制造方法 | |
CN1768559A (zh) | 多层印刷电路板 | |
CN1653873A (zh) | 多层电路结构的形成方法和具有多层电路结构的基体 | |
CN1914965A (zh) | 制造电路载体的方法以及该方法的应用 | |
CN1863435A (zh) | 印刷基板的制造方法 | |
CN1177751A (zh) | 树脂刻蚀溶液和刻蚀方法 | |
CN1694603A (zh) | 印制电路板的电解镀金方法 | |
CN1168221A (zh) | 多层印刷电路板以及多层印刷电路板的制造方法 | |
CN1756654A (zh) | 薄片材料及布线板 | |
CN1234915C (zh) | 涂覆稳定层的铜箔、涂覆法和含绝缘衬底与铜箔的层压件 | |
CN1697588A (zh) | 图案形状物及其制造方法 | |
CN1104832C (zh) | 独立导体电路电镀的方法 | |
CN1574480A (zh) | 连接装置及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ENMU TEYU SUSONGCUN CO., LTD. Free format text: FORMER OWNER: MITSUI CHEMICAL INDUSTRY CO., LTD. Effective date: 20111219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111219 Address after: Yamagata Prefecture, Japan Patentee after: Bournemouth Tegu speed Songcun Corporation Address before: Tokyo, Japan, Japan Patentee before: Mitsui Chemical Industry Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050727 Termination date: 20171227 |