CN1212555C

CN1212555C - Radiator

Info

Publication number: CN1212555C
Application number: CN 02141173
Authority: CN
Inventors: 林书如
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2002-07-08
Filing date: 2002-07-08
Publication date: 2005-07-27
Anticipated expiration: 2022-07-08
Also published as: CN1467601A

Abstract

The present invention relates to a radiator which is applied to heat radiation of a microprocessor. The radiator comprises radiating fins, a binding medium body and a base board, wherein the radiating fins are in a sheet shape, and are vertically bound on the binding medium body in a board shape at intervals; the base board is correspondingly bound on the binding medium body in a board shape, and is made of aluminium matrix composite materials. The base board is bound with the binding medium body face to face, aluminum accounts for 60 to 70 wt% or 65 to 75 wt% of the base board, the specific heat of the aluminum is equivalent to the specific heat of the existing copper, and the density is lower than that of the copper. Thus, the present invention has high heat conductivity and light weight, and the shock and the vibration test of the radiator are not affected.

Description

Heating radiator

Technical field

The present invention relates to a kind of heating radiator, be meant a kind of heating radiator that is applied to microprocessor especially.

Background technology

The design of primitive compuer except the fan that utilizes power supply unit itself is assisted the main frame heat radiation, does not have other relevant heat dissipation design; The but progress of making rapid progress along with computer system, every component speeds speed more and more fast, data access raises successively, and then disperse more thermal energy, thus, also relatively make the temperature of computer system high, therefore in the computer system suitable heat abstractor must be arranged, can guarantee that just computer system keeps stable running.

In order to ensure the stable running of computer system, the computer components that can produce heat in computer system generally all are combined with the design of heat sinking function, wherein can directly use heating radiator at the lower element of the evolution of heat, the higher element (for example microprocessor) of the evolution of heat then can cooperate fan to implement heat radiation by heating radiator, after heating radiator is derived the heat that produces, utilize again air-flow that fan produces with the heat absorption on the heating radiator with take away.

In the past, the heat radiator of heating radiator normally adopts the mode of cutting to form, and it is bigger by the thickness of cutting way gained heat radiator, thereby promote in microprocessor fabrication techniques, the execution usefulness of existing microprocessor more and more higher now, for the enhance heat effect just adopts comparatively frivolous heat radiator, and on substrate of the same area by the how frivolous heat radiator of welding manner setting, as shown in Figures 1 and 2, so that heating radiator provides bigger area of dissipation, increase radiating efficiency, and improve the radiating efficiency in the mode that number is set that increases frivolous heat radiator except aforementioned, also can adopt more large-scale heating radiator (after the area of substrate improves, heat radiator can be provided with more), derive with the heat that effectively microprocessor is produced.

Because the specific heat of metallic copper is higher, thus at present material (no matter being heat radiator 40 or substrate 50) that adopts copper as heating radiator more, but when above-mentioned heating radiator maximizes, the density of copper (8.9 gram per centimeters ³) also can make the bigger pressure of microprocessor carrying, except the anxiety of the microprocessor of damaging by pressure is arranged, also can impact and the problem of vibration-testing, even make product overweight.

Summary of the invention

In view of this, the technical problem to be solved in the present invention provides a kind of new heating radiator, makes heating radiator when having the advantage of high specific heat, has low-density advantage, so that the heating radiator of Da Xinghuaing is had lighter weight gradually.

In order to achieve the above object, the invention provides a kind of heating radiator, be applied to the heat radiation of microprocessor, and include heat radiator, bonding mediator and substrate, wherein heat radiator is a sheet, and each heat radiator is at interval and vertically is bonded in tabular bonding mediator, and substrate is the tabular of corresponding bonding mediator, and it is bonding with face with bonding media dignity, and its material is metallic aluminium and silit in the aluminum matrix composite, wherein the density of silit is little than aluminium, and heat conductivity is excellent, and metallic aluminium accounts for 60～70 number percents or 65～75 number percents of substrate weight, and because the specific heat of this substrate (370～380 cards/(gram degree centigrade)) with copper (specific heat 380 cards/(gram degree centigrade)) quite, and density (2.4 gram per centimeters ³)) but be than copper (8.9 gram per centimeters ³) little.

The present invention is by adopting the substrate made with metallic aluminium in the aluminum matrix composite and silit (specific heat 370～380 cards/(gram degree centigrade), density 2.4 gram per centimeters ³) have and the copper substrate of known technology (specific heat 380 cards/(gram degree centigrade), density 8.9 gram per centimeters ³) suitable specific heat, but little than the density of copper substrate, make that heating radiator of the present invention is able to have lighter weight when not having influence on pyroconductivity, and unlikely impact and the vibration-testing that influences heating radiator.

For making purpose of the present invention, structural attitude and function thereof are had further understanding, conjunction with figs. is described in detail as follows now:

Description of drawings

Fig. 1 is the exploded view of the heating radiator of known technology;

Fig. 2 is the combination figure of the heating radiator of known technology;

Fig. 3 is the exploded view of heating radiator of the present invention;

Fig. 4 is that the part of heating radiator of the present invention is in conjunction with figure; And

Fig. 5 is the combination figure of heating radiator of the present invention.

Embodiment

As Fig. 3, Fig. 4 and shown in Figure 5, heat sink applications disclosed according to the present invention is in the heat radiation of microprocessor, and include heat radiator 10, bonding mediator 20 and substrate 30, wherein the material of heat radiator 10 is a metallic copper, and it is a sheet, the material of bonding mediator 20 can be for planting suitable with the copper at least metal of specific heat arbitrarily, and it is one tabular, the material of substrate 30 is a metal-base composites, and nonmetallic materials wherein are littler than the density of metal material, and the excellent heat conductivity of tool, this sentences metallic aluminium in the aluminum matrix composite and the potpourri of silit is an example, wherein metallic aluminium accounts for 60～70% or 65～75% of substrate 30 weight, silit then accounts for 30～40% or 25～35% of substrate 30 weight with respect to metallic aluminium, thereby its specific heat (370～380 card/(grams degree centigrade) and copper (380 cards/(gram degree centigrade)) is quite, and density (2.4 gram per centimeters ³) but than copper (density 8.9 gram per centimeters ³) little, and substrate 30 is the tabular of corresponding bonding mediator 20.

As Fig. 3, Fig. 4 and shown in Figure 5, when making heating radiator of the present invention, must be one by one at interval and vertically be bonded in bonding mediator 20 with the heat radiator 10 of the slices mode by welding, then, make the one side of the not bonding heat radiator 10 of bonding mediator 20 bonding with substrate 30 with diffusion fusing mode (Diffusion welding) again, the bonding mode of this kind diffusion welding can't change the primary characteristic and the plastic yield of mother metal during the course.

Certainly, the bonding mode of " crossing the tin stove " that also can adopt of 20 of heat radiator 10 and bonding mediators makes blocks of heat radiator 10 be bonded in bonding mediator 20 seriatim.

As Fig. 2 and shown in Figure 5, known heating radiator mainly is made up of copper heat radiator 40 and copper substrate 50, and between the two by the welding manner combination, thereby when the size of known heating radiator maximizes, though copper heat radiator 40 and copper substrate 50 have specific heat (380 cards/(gram degree centigrade)) higher, and make the heat conductivity advantage of higher, but it is but because of density (8.9 gram per centimeters ³) bigger, so the heavier problem of weight is arranged, thereby influence the impact and the vibration-testing of heating radiator, but, the present invention is by replacing known copper substrate 50 with the metallic aluminium in the aluminum matrix composite and silit as the substrate 30 of its material, and adopt the bonding medium of bonding mediator 20 as 30 of heat radiator 10 and substrates, and because the substrate made from metallic aluminium and silit 30 has the specific heat suitable with copper (370～380 cards/(gram degree centigrade)), and have density (2.4 gram per centimeters little than copper ³), therefore heating radiator of the present invention can make heating radiator self have lighter weight when not having influence on pyroconductivity, and unlikely impact and the vibration-testing that influences heating radiator.

As from the foregoing, heating radiator disclosed according to the present invention, (density of silit wherein is little than aluminium with the metallic aluminium in the aluminum matrix composite and silit owing to adopt, and heat conductivity is excellent) substrate made replaces the copper substrate in the known technology, substrate among this present invention (specific heat 370～380 card/(gram degree centigrade), density 2.4 gram per centimeters ³) have and copper (380 card/(grams degree centigrade), density 8.9 gram per centimeters ³) suitable specific heat, and have the density little than copper, therefore heating radiator of the present invention can make heating radiator self have lighter weight when not having influence on pyroconductivity, and unlikely impact and the vibration-testing that influences heating radiator.Moreover, the present invention also by bonding mediator as the bonding medium between substrate and heat radiator, therefore can increase that each is interelement bonding.

The above is preferred embodiment of the present invention only, is not to be used for limiting practical range of the present invention; Be that all equalizations of doing according to scope of patent protection of the present invention change and modification, be all scope of patent protection of the present invention and contain.

Claims

1, a kind of heating radiator is applied to the heat radiation of microprocessor, it is characterized in that including:

One bonding mediator is one tabular;

The multi-disc heat radiator, each interval and vertically being located at separately on this bonding mediator; And

One substrate, for corresponding with this bonding mediator tabular, and the one side that this heat radiator is not set with this bonding mediator combines, the material of this substrate is a metal-base composites, nonmetallic materials wherein are littler than the density of metal material, the specific heat of this substrate is between between 370～380 card/(grams degree centigrade), and the density of this substrate is 2.4 gram per centimeters ³The material of this substrate is aluminium and silit; The shared weight of aluminium is 60～70% of general assembly (TW) in this substrate.