CN1207015A - Heat sink for electronic device - Google Patents
Heat sink for electronic device Download PDFInfo
- Publication number
- CN1207015A CN1207015A CN 97104657 CN97104657A CN1207015A CN 1207015 A CN1207015 A CN 1207015A CN 97104657 CN97104657 CN 97104657 CN 97104657 A CN97104657 A CN 97104657A CN 1207015 A CN1207015 A CN 1207015A
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- CN
- China
- Prior art keywords
- electronic installation
- fin
- fixed part
- heat abstractor
- radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The heat sink for electronic device includes electric connector, sub-circuit board, sink, support device and fixing element, in which the electric connector is placed on the base plate, on which the plug-in slot is set, and the sub-circuit board can be plugged into the slot. The electronic device is mounted on the sub-circuit board, and on the electronic device the sink is mounted, and said radiator also possesses several sink fins, in which at least one sink fin is equipped with fixing portion. The support device is placed between the base plate and the described fixing portion, and said sink is fastened to the support device by matching its fixing portion with the above-mentioned fixing element, so that it can prevent the sub-circuit board from loosing.
Description
The present invention relates to a kind of heat abstractor of electronic installation, can be the electronic installation heat radiation on the sub-circuit board that is plugged on electric connector, and this radiator locking is on sub-circuit board and substrate.
Development along with Information technology, for example expansion of the increase of computer function, memory span etc., all can utilize the grafting of sub-circuit board and electric connector to realize, particularly the upgrading of the central processing unit of messaging device (Central Processing Unit-CPU) also develops towards this direction.Central processing unit all was installed on the substrate in the past, and wherein radiator such as radiator fan or fin is to be installed on this central processing unit in modes such as buckle, adhesion or lockings, contacts the heat conduction that causes with central processing unit by radiator, reaches the effect of heat radiation.But along with the grafting sub-circuit board as the upgrading mode, central processing unit no longer is installed on the substrate, is installed on the sub-circuit board and is plugged in the electric connector and change into, the radiator of central processing unit becomes the pattern of a cantilever gradually.Yet, the moment of torsion that weight caused of radiator and in use or the vibrations that produce of when carrying, radiator is got loose with contacting of sub-circuit board, even cause sub-circuit board to get loose, and then influence using and operating of messaging device with contacting of electric connector.And known in the past heat abstractor all considers at the situation that central processing unit is installed on substrate, if central processing unit is installed on the situation that is plugged to electric connector behind the sub-circuit board again, then can't solve.
The object of the present invention is to provide a kind of heat abstractor of electronic installation, the radiator that is installed in the central processing unit on the sub-circuit board can be fixed and supports, prevent because of vibrations or since the weight of radiator cause between sub-circuit board and the electric connector contact loosening.
For achieving the above object, the heat abstractor of a kind of electronic installation of the present invention can be installed on the electronic installation, and it comprises: electric connector which is provided with inserting groove; Sub-circuit board which is provided with electronic installation and also can be plugged in the described electric connector inserting groove; Radiator is installed on the described electronic installation and its at least one fin is provided with fixed part; At least one bracing or strutting arrangement is arranged on the fixed part of described fin; And at least one is fixed in fixture on the Support Position with described fin fixed part.
For achieving the above object, the heat abstractor of another kind of electronic installation of the present invention, can be installed on the electronic installation also is the electronic installation heat radiation, it comprises: electric connector which is provided with inserting groove; Sub-circuit board which is provided with electronic installation and can be plugged in the inserting groove of described electric connector; Radiator is installed on the described electronic installation, and described radiator is provided with and ranked first fin and at least one second fin more, and described second fin is provided with fixed part; At least one bracing or strutting arrangement is arranged on the fixed part of fin and supports second fin; At least one fixture is fixed on the fixed part of described fin on the bracing or strutting arrangement.
For achieving the above object, the heat abstractor of another electronic installation of the present invention, can be installed on the substrate also is the electronic installation heat radiation, it comprises: an electric connector, be installed on the substrate, which is provided with inserting groove; One sub-circuit board which is provided with electronic installation and also can be plugged in the inserting groove of described electric connector; One radiator is installed on the described electronic installation, and described radiator is provided with a plurality of fin, and wherein at least one fin is provided with fixed part; At least one bracing or strutting arrangement is arranged between substrate and the described fixed part; At least one retaining element is installed on described fixed part; First pad is installed between described bracing or strutting arrangement and the fixed part or between fixture and the fixed part.
For achieving the above object, another heat abstractor of the present invention is installed on the electronic installation, and it comprises: a main part, which is provided with first surface and second surface, and described first surface is used to be installed in described electronic installation; A plurality of fin stretch out from described second surface, and wherein at least one fin is provided with fixed part.
The advantage of apparatus of the present invention is the radiator fixed support that will be installed on the sub-circuit board, prevent that sub-circuit board from becoming flexible with the generation that contacts between the electric connector, make the mechanical connection that electrically reaches between circuit board and the electric connector keep stable state, and simple in structure, easy for installation.
Below in conjunction with accompanying drawing, describe the preferred embodiments of the present invention in detail, wherein:
Fig. 1 is the stereogram of electronic installation heat abstractor of the present invention;
Fig. 2 is the three-dimensional exploded view of electronic installation heat abstractor of the present invention;
Fig. 3 is the stereogram of second embodiment of the invention;
Fig. 4 is the heat abstractor stereogram of second embodiment of the invention.
As depicted in figs. 1 and 2, the heat abstractor 200 of electronic installation of the present invention is installed on the substrate 99, and this heat abstractor 200 mainly comprises: an electric connector 10, be installed on the substrate 99, and which is provided with inserting groove 11; One sub-circuit board 20 can be plugged in the inserting groove 11 of described electric connector 10, which is provided with central processing unit 21, and described central processing unit 21 has an installation surface 211; One radiator 30 can be adhered with bonding agent, is installed on the described central processing unit 21 with the bolt locking or in modes such as bayonet unit buckles and (Figure 1 shows that the mounting means of adhesion).Described radiator 30 has body 31, described body 31 has first surface 32 and second surface 33, wherein first surface 32 is used to be installed in the installation surface 211 of described central processing unit 21, first fin 34 and second fin 35 stretch out from second surface 33 respectively, wherein second fin 35 is positioned at the outside and the close substrate 99 of radiator 30, and described second fin 35 also is provided with through hole 36 can be for fixing.Between substrate 99 and described through hole 36, be provided with support column 40, be used to support the weight of radiator 30, described support column 40 has the screw 41 of perforation, but have 50 lockings of screw thread fitted bolt in the screw 41 on substrate 99, another bolt 50 passes the through hole 36 of described second fin 35 and the screw 41 of support column 40, and radiator 30 is locked on support column 40.Because the weight that support column 40 bears radiator 30, and by bolt 50 locking radiators 30, therefore, the weight of radiator 30 can not cause turning moment or cause any vibrations, makes the mechanical connection that electrically reaches between sub-circuit board 20 and the electric connector 10 keep stable state.
Fig. 3 and Fig. 4 represent another embodiment of the present invention.Wherein, radiator 60 in the heat abstractor 400 stretches out and is provided with a plurality of first fin 64 and from the second surface 63 of body 61 and ranked second fin 65, wherein second fin 65 is positioned at the position near substrate 99, and outermost second fin 65 in this row left and right sides also is provided with through hole 66 and can be used for fixing.In addition, between the bolt 50 and second fin 65, and between second fin 65 and the support column 40, a microscler plate gasket 70 is set respectively, described pad 70 has the effect of clamping second fin 65, also can increase bolt 50 with the effect of radiator 60 lockings on support column 40.
Be appreciated that in other embodiment, also second fin that has fixed part in the radiator can be arranged on other positions, and bracing or strutting arrangement is fixed on the substrate place such as computer chassis or frame in addition, also can reach identical effect.
Claims (23)
1. the heat abstractor of an electronic installation can be installed on the electronic installation, it is characterized in that, the heat abstractor of described electronic installation comprises: electric connector which is provided with inserting groove; Sub-circuit board which is provided with electronic installation and also can be plugged in the described electric connector inserting groove; Radiator is installed on the described electronic installation and its at least one fin is provided with fixed part; At least one bracing or strutting arrangement is arranged on the fixed part of described fin; At least one is fixed in fixture on the Support Position with described fin fixed part.
2. the heat abstractor of electronic installation as claimed in claim 1 is characterized in that, described radiator can be adhered to the surface of described electronic installation.
3. the heat abstractor of electronic installation as claimed in claim 1 is characterized in that, described radiator can be locked in described sub-circuit board by bolt.
4. the heat abstractor of electronic installation as claimed in claim 1 is characterized in that, described sub-circuit board can be provided with bayonet unit, is used for the described radiator of buckle.
5. the heat abstractor of electronic installation as claimed in claim 1 is characterized in that, described radiator is provided with a plurality of fin, and wherein at least one fin is provided with fixed part.
6. the heat abstractor of electronic installation as claimed in claim 5 is characterized in that, the length of the described fin that is provided with fixed part is longer.
7. the heat abstractor of electronic installation as claimed in claim 6 is characterized in that, the fixed part of described fin is a through hole.
8. the heat abstractor of electronic installation as claimed in claim 7 is characterized in that, described fixture can be a bolt.
9. the heat abstractor of electronic installation as claimed in claim 8 is characterized in that, can be provided with pad between described bracing or strutting arrangement and the described fixed part or between described fixture and the described fixed part.
10. the heat abstractor of an electronic installation can be installed on the electronic installation and for electronic installation dispels the heat, it is characterized in that it comprises: electric connector which is provided with inserting groove; Sub-circuit board which is provided with electronic installation and can be plugged in the inserting groove of described electric connector; Radiator is installed on the described electronic installation, and described radiator is provided with and ranked first fin and at least one second fin more, and described second fin is provided with fixed part; At least one bracing or strutting arrangement is arranged on the fixed part of fin and supports second fin; At least one fixture is fixed on the fixed part of described fin on the bracing or strutting arrangement.
11. the heat abstractor of electronic installation as claimed in claim 10 is characterized in that, described radiator can be adhered to the surface of described electronic installation.
12. the heat abstractor of electronic installation as claimed in claim 10 is characterized in that, described second fin is positioned at the position near substrate, and described second fin with fixed part is positioned at outermost.
13. the heat abstractor as claim 10 or 12 described electronic installations is characterized in that the length of described second fin is longer.
14. the heat abstractor of electronic installation as claimed in claim 13 is characterized in that, the fixed part of described fin is a through hole.
15. the heat abstractor of electronic installation as claimed in claim 14 is characterized in that, described fixture can be a bolt.
16. the heat abstractor of electronic installation as claimed in claim 15 is characterized in that, between described bracing or strutting arrangement and fixed part, or can be provided with the pad with through hole between fixture and the fixed part.
17. the heat abstractor of electronic installation as claimed in claim 16 is characterized in that, described pad can be a long shaped plate linear element.
18. the heat abstractor of an electronic installation, can be installed on the substrate also is the electronic installation heat radiation, it is characterized in that it comprises: an electric connector, be installed on the substrate, and which is provided with inserting groove; One sub-circuit board which is provided with electronic installation and also can be plugged in the inserting groove of described electric connector; One radiator is installed on the described electronic installation, and described radiator is provided with a plurality of fin, and wherein at least one fin is provided with fixed part; At least one bracing or strutting arrangement is arranged between substrate and the described fixed part; At least one retaining element is installed on described fixed part; First pad is installed between described bracing or strutting arrangement and the fixed part or between fixture and the fixed part.
19. the heat abstractor of electronic installation as claimed in claim 18 is characterized in that, the fixed part of described fin is a through hole.
20. the heat abstractor of electronic installation as claimed in claim 18 is characterized in that, described fixture is a bolt.
21. a heat abstractor is installed on the electronic installation, it is characterized in that it comprises: a main part, which is provided with first surface and second surface, described first surface is used to be installed in described electronic installation; A plurality of fin stretch out from described second surface, and wherein at least one fin is provided with fixed part.
22. heat abstractor as claimed in claim 21 is characterized in that, the outward extending distance of fin that is provided with described fixed part is longer.
23. heat abstractor as claimed in claim 21 is characterized in that, the fixed part of described fin is a manhole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97104657 CN1207015A (en) | 1997-07-30 | 1997-07-30 | Heat sink for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97104657 CN1207015A (en) | 1997-07-30 | 1997-07-30 | Heat sink for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1207015A true CN1207015A (en) | 1999-02-03 |
Family
ID=5167451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97104657 Pending CN1207015A (en) | 1997-07-30 | 1997-07-30 | Heat sink for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1207015A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100376027C (en) * | 2005-03-11 | 2008-03-19 | 佛山市顺德区顺达电脑厂有限公司 | Positioning fixture of heat sink module and assembling method |
-
1997
- 1997-07-30 CN CN 97104657 patent/CN1207015A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100376027C (en) * | 2005-03-11 | 2008-03-19 | 佛山市顺德区顺达电脑厂有限公司 | Positioning fixture of heat sink module and assembling method |
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Legal Events
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|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |