CN1204422C - Electronic apparatus - Google Patents
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- CN1204422C CN1204422C CN 02123201 CN02123201A CN1204422C CN 1204422 C CN1204422 C CN 1204422C CN 02123201 CN02123201 CN 02123201 CN 02123201 A CN02123201 A CN 02123201A CN 1204422 C CN1204422 C CN 1204422C
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- electronic installation
- modulating signal
- light modulating
- receiving element
- optical
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- 230000003287 optical effect Effects 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 50
- 239000011521 glass Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 28
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 239000013307 optical fiber Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The present invention provides an electronic device which comprises a shell, a transmitting unit and a receiving unit, wherein an optical surface is arranged in the shell of the electronic device; the transmitting unit and the receiving unit are arranged in the shell. The transmitting unit is used for emitting a light modulation signal; the receiving unit is used for receiving the light modulation signal which is transmitted from the transmitting unit and is shot into the receiving unit via the optical surface. Air or light transmission material is filled in the shell to be used as a transmission medium of the light modulation signal. In the electronic device of the present invention, the transmission can be one-to-many or many-to-one without needing a path splitter or a multiplexer and without using a coupling head. Therefore, the present invention can save manufacture cost.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly about a kind of electronic installation that utilizes optical surface as light modulating signal transmission medium.
Background technology
Generally speaking, electronic installation is made of more than one function unit (functional unit), and will bring into play the effect of electronic installation, must finish by working in coordination of each functional unit.Each functional unit must carry out various signal transmission and handle, so that carry out working in coordination between the different function units.
In known techniques, utilizing electric signal (electrical signal) to carry out the signal transmission is one of modal mode, and the transmission medium of electric signal is generally metallic conductor (metal conductor), for example, copper conductor on the printed circuit board (PCB) (printed circuit board), or all kinds of electrical signal line (electric cable).
Yet, when using electric signal to link up each functional unit, can be because the resistance and the electric capacity of conductive medium cause RC signal delay (RC delay), thereby restricting signal transmitting speed, in addition, RC signal delay can cause signal phase to postpone (phase delay), the result can't carry out the synchronous transmission (synchronous transmission) of signal when frequency signal is too high, and can only adopt non-synchronous transmissions (asynchronous transmission) to transmit signal, therefore, more limited the signal transmitting speed.
In addition, when carrying out high-speed transfer, the frequency of electric signal must improve, and high frequency electrical signal is when transmitting (transmission) in transmission medium, not only being subjected to extraneous noise easily disturbs and the generation rub-out signal, but also can produce electromagnetic interference (EMI), further can damage each functional unit in the electronic installation.From another angle, because present employed functional unit is small day by day along with the progress of semiconductor technology, therefore, the intensity of the employed electric signal of electronic installation also relatively weakens, yet, small electrical signals is very easy to be subjected to the interference of extraneous noise when transmission, and then has influenced the effect of electronic installation.
As mentioned above, be the problems of avoiding using electric signal to produce, utilize the light modulating signal to carry out signal and be transmitted as a kind of feasible mode.In known techniques, the light modulating signal is exported from a transmitter unit usually, be passed to a receiving element via optical fiber (optical fiber) then, last receiving element is with light modulating signal reduction becoming electric signal, so that carry out working in coordination between the different function units.Because the transmission frequency range of optical fiber is big, and there is not the problem that electromagnetic interference (EMI) or noise disturb, so can effectively solve the problem that electric signal produced of using.
Yet, because the separation (split) of optical fiber or merge (merge) very difficulty, so the transmission of light modulating signal is generally transmission one to one, that is be by a certain unicast to another single-point, and be difficult for carrying out one-to-many or many-one transmission.From the above, one-to-many or many-one transmission for carrying out the light modulating signal can utilize shunt (splitter) or multiplexer (multiplexer) that a smooth modulating signal is divided into a plurality of smooth modulating signals or a plurality of smooth modulating signals are merged into a light modulating signal respectively.And the shunt or the use of multiplexer not only cause the complicated of electronic installation, and improve the manufacturing cost of electronic installation.
In addition, because transmitter unit is generally a light emitting diode (LED) or a laser diode (LaserDiode), receiving element is generally an inspection optical diode (PIN Diode), and need the connector (connector) of superprecision between above-mentioned semiconductor optoelectronic element and the optical fiber, therefore can increase the manufacturing cost of electronic installation.
In sum, owing in electronic installation, utilize optical fiber to transmit the light modulating signal except being used shunt or multiplexer, also need to use connector to connect optical fiber and photovalve, so can improve the manufacturing cost of electronic installation, and shunt, multiplexer and connector are set occupy certain space, therefore under the limited situation in electronic installation inner space, more may be difficult to carry out.Therefore, how providing a kind of simple, effective light modulating signal transmission medium, is one of important topic of current electronics technology really.
Summary of the invention
At the problems referred to above, purpose of the present invention can be transmitted the electronic installation of light modulating signal for providing a kind of in simple mode.
For achieving the above object, the technical solution used in the present invention is as follows:
A kind of electronic installation, this electronic installation comprises a housing, transmitter unit and receiving element.Be provided with an optical surface (optical surface) in this housing, and be provided with translucent material, and transmitter unit and receiving element are arranged on the light transmissive material of housing, and transmitter unit sends a smooth modulating signal, and the light modulating signal is passed through and injected receiving element behind the optical surface.
Can the filling air in the housing of above-mentioned electronic installation or translucent material (bulk material) etc., with transmission medium as the light modulating signal.
As mentioned above, because in electronic installation of the present invention, the transmission medium of light modulating signal is the air or the translucent material of enclosure interior space institute filling, but not use optical fiber, therefore, the light modulating signal can be one-to-many or many-one transmission in electronic installation of the present invention, and need not cooperate shunt or multiplexer.In addition, because transmitter unit is injected the light modulating signal in the air or translucent material of enclosure interior space institute filling, and receiving element accesses the light modulating signal that (pick-up) transmits in the air of enclosure interior space institute filling or translucent material, therefore, electronic installation of the present invention need not use connector, and then can save the manufacturing cost of electronic installation of the present invention.
Description of drawings
Fig. 1 is the synoptic diagram according to the electronic installation of preferred embodiment of the present invention;
Fig. 2 is the synoptic diagram according to the electronic installation of another preferred embodiment of the present invention, and wherein electronic installation comprises a plurality of transmitter units and receiving element;
Fig. 3 is the synoptic diagram according to the electronic installation of another preferred embodiment of the present invention, and wherein electronic installation comprises a plurality of receiving elements and integrated circuit (IC) wafer.
Embodiment
Below enumerate preferred embodiment, and with reference to relevant drawings, technical scheme of the present invention, feature and effect are described in further detail, wherein components identical is marked with identical reference marks.
Please refer to shown in Figure 1ly, comprise a housing 11, a transmitter unit 13 and a receiving element 15 according to the electronic installation 1 of preferred embodiment of the present invention.
In the present embodiment, transmitter unit 13 is arranged in the housing 11 with receiving element 15, and transmitter unit 13 is in order to send a smooth modulating signal, and receiving element 15 is in order to receive the light modulating signal.
From the above, electronic installation 1 can comprise more that one is arranged at the circuit substrate (not shown) in the housing 11, and optical surface 111 can be to be arranged on the circuit substrate.
In another preferred embodiment of the present invention, electronic installation can be to comprise a plurality of transmitter units and a plurality of receiving element.For example, please refer to shown in Figure 2ly, comprise a housing 11, a transmitter unit 13, a transmitter unit 14, a receiving element 15 and a receiving element 16 according to the electronic installation 1 of another preferred embodiment of the present invention.
In the present embodiment, receiving element 15 has an optical filter 151 and an optical filter 161 respectively with receiving element 16, as previously mentioned, optical filter 151 and optical filter 161 can filter the light modulating signal that self-emission unit 13 and transmitter unit 14 are sent, that is be, optical filter 151 can filter the special wavelength light modulating signal in the light modulating signal that self-emission unit 13 and transmitter unit 14 sent, and optical filter 161 can filter another special wavelength light modulating signal in the light modulating signal that self-emission unit 13 and transmitter unit 14 sent, therefore, the electronic installation 1 of present embodiment can transmit the light modulating signal with one-to-many or many-to-one mode, and need not cooperate shunt or multiplexer.
In more detail, when transmitter unit 13 and transmitter unit 14 send the light modulating signal that wavelength is 400nm～550nm separately, and optical filter 151 and optical filter 161 are can see through wavelength respectively and be the light modulating signal of 450nm and 500nm the time, receiving element 15 and receiving element 16 all can access the light modulating signal that transmitter unit 13 and transmitter unit 14 are sent simultaneously, and receiving element 15 can to receive from transmitter unit 13 and transmitter unit 14 wavelength be the information that the light modulating signal of 450nm is transmitted, it is the information that the light modulating signal of 500nm is transmitted that receiving element 16 can receive from transmitter unit 13 and transmitter unit 14 wavelength.Allly be familiar with this operator and all understand, in the above-described embodiment, need not cooperate multiplexer just can transmit the light modulating signal in many-to-one mode.
In addition, when transmitter unit 13 or transmitter unit 14 sends the light modulating signal that wavelength is 450nm, and optical filter 151 and optical filter 161 are all can see through wavelength and be the light modulating signal of 450nm the time, receiving element 15 all can access the light modulating signal that transmitter unit 13 or transmitter unit 14 are sent simultaneously with receiving element 16, and receiving element 15 and receiving element 16 can to receive from transmitter unit 13 or transmitter unit 14 wavelength be the identical information that the light modulating signal of 450nm is transmitted, that is be that receiving element 15 can receive the light modulating signal that wavelength is 450nm synchronously with receiving element 16.Allly be familiar with this operator and all understand, in the above-described embodiment, need not cooperate shunt just can transmit the light modulating signal in the mode of one-to-many.
Be noted that aforesaid transmitter unit and receiving element can be to be electrically connected to an integrated circuit (IC) wafer (IC chip) respectively, or be respectively the semiconductor element in the integrated circuit (IC) wafer.Below be the example explanation with the pass of receiving element and integrated circuit (IC) wafer.
As shown in Figure 3, the electronic installation 1 according to another preferred embodiment of the present invention comprises a housing 11, a transmitter unit 13, a receiving element 15, an integrated circuit (IC) wafer 17, a receiving element 181 and an integrated circuit (IC) wafer 18.
As shown in the figure, receiving element 15 is electrically connected with integrated circuit (IC) wafer 17, therefore, the light modulating signal that is sent when transmitter unit 13 is via optical surface 111 reflections or when scattering to receiving element 15, receiving element 15 can convert the light modulating signal that is received to electric signal, and electric signal is sent to integrated circuit (IC) wafer 17, and integrated circuit (IC) wafer 17 can be carried out logical operation according to the electric signal that receiving element 15 is sent, so that bring into play its function.
Receiving element 181 is the semiconductor element in the integrated circuit (IC) wafer 18, therefore, the light modulating signal that is sent when transmitter unit 13 is via optical surface 111 reflections or when scattering to receiving element 181, receiving element 181 can convert the light modulating signal that is received to electric signal, and electric signal is sent to integrated circuit (IC) wafer 18, so that integrated circuit (IC) wafer 18 can be carried out logical operation according to the electric signal that receiving element 181 is sent, so that bring into play its function.
From the above, transmitter unit 13 can be to be electrically connected to another integrated circuit (IC) wafer (not shown), this another integrated circuit (IC) wafer (not shown) transmits another electric signal to transmitter unit 13, so that transmitter unit 13 sends the light modulating signal according to this another electric signal.In addition, transmitter unit 13 can also be the semiconductor element in another integrated circuit (IC) wafer (not shown).
In the present embodiment, transmission medium 113 can be a glass substrate, and transmitter unit 13 and receiving element 15 can be optoelectronic semiconductor components, and be arranged on the transmission medium 113 to cover crystalline substance (flip-chip) mode, integrated circuit (IC) wafer 18 can also be arranged on the transmission medium 113 with covering crystal type, and this helps the light modulating signal transmission between transmitter unit 13, receiving element 15 and integrated circuit (IC) wafer 18 and the transmission medium 113.In addition, optical surface 111 can be attached to transmission medium 113 other lip-deep reflectance coating or scattering films.
Allly being familiar with this operator and should understanding, can be a computer, an electronic communication equipment, an electronic measuring instrument or information household electrical appliances (Information Appliance) according to electronic installation of the present invention.
In sum, because according to electronic installation of the present invention is to utilize the air of enclosure interior space institute filling or the translucent material transmission medium as the light modulating signal, but not use optical fiber, therefore, the transmission of light modulating signal in electronic installation of the present invention can be one-to-many or many-one, and need not cooperate shunt or multiplexer.In addition, because transmitter unit is injected the light modulating signal in the air or translucent material of enclosure interior space institute filling, and receiving element accesses the light modulating signal that transmits in the air of enclosure interior space institute filling or translucent material, so, need not use connector according to electronic installation of the present invention, therefore the manufacturing cost that can save electronic installation of the present invention.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained among the claim scope of this case its equivalent modifications of carrying out or change.
Claims (11)
1. electronic installation, it is characterized in that: this electronic installation comprises:
One housing is provided with an optical surface in it, and is provided with a translucent material;
One transmitter unit, it is arranged on the light transmissive material of this housing and in order to send a smooth modulating signal; And
One receiving element, it is arranged on the light transmissive material of this housing and this light modulating signal is injected this receiving element via this optical surface.
2. electronic installation as claimed in claim 1 is characterized in that: wherein this optical surface is a reflecting surface.
3. electronic installation as claimed in claim 1 is characterized in that: wherein this optical surface is a scattering surface.
4. electronic installation as claimed in claim 1 is characterized in that: wherein this optical surface is a plane of refraction.
5. electronic installation as claimed in claim 1 is characterized in that: wherein this optical surface is arranged on the inside surface of this housing.
6. electronic installation as claimed in claim 1 is characterized in that: more comprise:
One circuit substrate, it is arranged in this housing, and this optical surface is arranged on this circuit substrate.
7. electronic installation as claimed in claim 1 is characterized in that: wherein this receiving element comprises an optical diode (photo diode), in order to receive this light modulating signal.
8. electronic installation as claimed in claim 7 is characterized in that: wherein this receiving element more comprises an optical filter, and in order to filter this light modulating signal to detect a special wavelength light modulating signal, this optical diode receives this special wavelength light modulating signal.
9. electronic installation as claimed in claim 8, it is characterized in that: more comprise another receiving element, it has another optical diode and another optical filter, this another optical filter filters this light modulating signal to detect another special wavelength light modulating signal, and this another optical diode receives this another special wavelength light modulating signal.
10. electronic installation as claimed in claim 1 is characterized in that: wherein this translucent material is a glass, and this receiving element chip bonding is arranged at this glass surface.
11. electronic installation as claimed in claim 1 is characterized in that: wherein this translucent material is a glass, and this transmitter unit chip bonding is arranged at this glass surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02123201 CN1204422C (en) | 2002-06-12 | 2002-06-12 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02123201 CN1204422C (en) | 2002-06-12 | 2002-06-12 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1464318A CN1464318A (en) | 2003-12-31 |
| CN1204422C true CN1204422C (en) | 2005-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02123201 Expired - Fee Related CN1204422C (en) | 2002-06-12 | 2002-06-12 | Electronic apparatus |
Country Status (1)
| Country | Link |
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| CN (1) | CN1204422C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101964686A (en) * | 2010-10-25 | 2011-02-02 | 江苏飞格光电有限公司 | BiDi-SC type miniature photoelectric transceiver module |
| CN101964684A (en) * | 2010-10-25 | 2011-02-02 | 江苏飞格光电有限公司 | BiDi-LC type small photoelectric receiving and transmitting module |
| CN101964687A (en) * | 2010-10-25 | 2011-02-02 | 江苏飞格光电有限公司 | BiDi-FC-type small size photoelectric receiving and transmitting module |
| CN102054825A (en) * | 2010-10-25 | 2011-05-11 | 江苏飞格光电有限公司 | BiDi-ST type miniaturization photoelectric transmit-receive module |
-
2002
- 2002-06-12 CN CN 02123201 patent/CN1204422C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1464318A (en) | 2003-12-31 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| ASS | Succession or assignment of patent right |
Owner name: QIMENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHAO YUANREN Effective date: 20060421 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20060421 Address after: 2, building 3, No. three, section 88, Chongqing North Road, Taipei, Taiwan Patentee after: Qimeng Science & Technology Co., Ltd. Address before: Kaohsiung city of Taiwan Province Patentee before: Zhao Yuanren |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050601 Termination date: 20120612 |