CN1198367C - 卡用连接器装置 - Google Patents
卡用连接器装置 Download PDFInfo
- Publication number
- CN1198367C CN1198367C CNB021025827A CN02102582A CN1198367C CN 1198367 C CN1198367 C CN 1198367C CN B021025827 A CNB021025827 A CN B021025827A CN 02102582 A CN02102582 A CN 02102582A CN 1198367 C CN1198367 C CN 1198367C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- card
- spring leaf
- contact
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 claims abstract description 22
- 230000037431 insertion Effects 0.000 claims abstract description 22
- 238000005452 bending Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 abstract description 2
- 229920003266 Leaf® Polymers 0.000 description 75
- 230000000903 blocking effect Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001017857A JP3784646B2 (ja) | 2001-01-26 | 2001-01-26 | カード用コネクタ装置 |
| JP017857/2001 | 2001-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1367553A CN1367553A (zh) | 2002-09-04 |
| CN1198367C true CN1198367C (zh) | 2005-04-20 |
Family
ID=18883971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021025827A Expired - Fee Related CN1198367C (zh) | 2001-01-26 | 2002-01-25 | 卡用连接器装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20020102882A1 (enExample) |
| EP (1) | EP1227549A3 (enExample) |
| JP (1) | JP3784646B2 (enExample) |
| KR (1) | KR100432205B1 (enExample) |
| CN (1) | CN1198367C (enExample) |
| TW (1) | TW519784B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003308490A (ja) * | 2002-04-18 | 2003-10-31 | Japan Aviation Electronics Industry Ltd | 電子部品用金属製カバー及びその製造方法 |
| USD482692S1 (en) | 2002-04-22 | 2003-11-25 | Mitsumi Electric Co., Ltd. | Electrical connector for memory card |
| USD482364S1 (en) | 2002-04-22 | 2003-11-18 | Mitsumi Electric Co., Ltd. | Attaching device for memory card |
| USD482693S1 (en) | 2002-05-31 | 2003-11-25 | Mitsumi Electric Co., Ltd. | Attaching device for memory card |
| JP2004335172A (ja) * | 2003-05-01 | 2004-11-25 | Hosiden Corp | カードコネクタ |
| JP4141362B2 (ja) * | 2003-09-29 | 2008-08-27 | アルプス電気株式会社 | カードアダプタ |
| USD499731S1 (en) | 2003-11-14 | 2004-12-14 | Hon Hai Precision Ind. Co., Ltd. | Card connector |
| TWM280565U (en) * | 2005-03-11 | 2005-11-11 | Hon Hai Prec Ind Co Ltd | Electrical card connector |
| TWM282379U (en) * | 2005-04-29 | 2005-12-01 | Hon Hai Prec Ind Co Ltd | Electrical card connector |
| JP4307419B2 (ja) * | 2005-07-04 | 2009-08-05 | ヒロセ電機株式会社 | カード用コネクタ |
| JP4664170B2 (ja) * | 2005-09-27 | 2011-04-06 | 富士通株式会社 | カードコネクタ装置 |
| TWM308538U (en) * | 2006-09-29 | 2007-03-21 | Tai Sol Electronics Co Ltd | Card connector with small-card guiding function |
| US20100248501A1 (en) * | 2009-03-24 | 2010-09-30 | Chih-Ling Yang | Card Connector |
| CN102709753B (zh) * | 2012-06-08 | 2016-06-08 | 北京盛博协同科技有限责任公司 | 一种cf卡锁紧器 |
| CN105098415B (zh) | 2014-05-07 | 2017-12-05 | 莫仕连接器(成都)有限公司 | 端子座与电子卡连接器 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2791854B2 (ja) * | 1994-04-20 | 1998-08-27 | 日本航空電子工業株式会社 | イジェクト機構付きカード用コネクタ |
| JP3020020B2 (ja) * | 1995-05-18 | 2000-03-15 | モレックス インコーポレーテッド | カ−ド用コネクタ |
| JP3021369B2 (ja) * | 1996-11-08 | 2000-03-15 | 日本航空電子工業株式会社 | カード用コネクタ |
| US6095868A (en) * | 1997-03-21 | 2000-08-01 | The Whitaker Corporation | Card reader connector having a separable cover |
| JP2000012167A (ja) * | 1998-06-18 | 2000-01-14 | Alps Electric Co Ltd | Icカード用コネクタ |
| JP2001006777A (ja) * | 1999-06-08 | 2001-01-12 | Molex Inc | メモリカード用コネクタ |
| JP3765708B2 (ja) * | 2000-05-30 | 2006-04-12 | アルプス電気株式会社 | カード用コネクタ装置 |
| JP3783591B2 (ja) * | 2001-09-07 | 2006-06-07 | オムロン株式会社 | メモリカード用コネクタ |
-
2001
- 2001-01-26 JP JP2001017857A patent/JP3784646B2/ja not_active Expired - Fee Related
- 2001-12-07 TW TW090130433A patent/TW519784B/zh active
-
2002
- 2002-01-02 US US10/038,123 patent/US20020102882A1/en not_active Abandoned
- 2002-01-09 KR KR10-2002-0001236A patent/KR100432205B1/ko not_active Expired - Fee Related
- 2002-01-23 EP EP02001589A patent/EP1227549A3/en not_active Withdrawn
- 2002-01-25 CN CNB021025827A patent/CN1198367C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1227549A3 (en) | 2003-12-10 |
| US20020102882A1 (en) | 2002-08-01 |
| CN1367553A (zh) | 2002-09-04 |
| JP3784646B2 (ja) | 2006-06-14 |
| JP2002222392A (ja) | 2002-08-09 |
| TW519784B (en) | 2003-02-01 |
| EP1227549A2 (en) | 2002-07-31 |
| KR20020063110A (ko) | 2002-08-01 |
| KR100432205B1 (ko) | 2004-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |