CN119317938A - 不适合检测装置以及不适合检测方法 - Google Patents

不适合检测装置以及不适合检测方法 Download PDF

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Publication number
CN119317938A
CN119317938A CN202280096731.3A CN202280096731A CN119317938A CN 119317938 A CN119317938 A CN 119317938A CN 202280096731 A CN202280096731 A CN 202280096731A CN 119317938 A CN119317938 A CN 119317938A
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CN
China
Prior art keywords
image
unsuitable
model
learning
unit
Prior art date
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Pending
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CN202280096731.3A
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English (en)
Chinese (zh)
Inventor
鹈沼宗利
丰田康隆
筱田伸一
奥田知之
元吉隆广
小松壮太
石川昌义
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN119317938A publication Critical patent/CN119317938A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/20—Processor architectures; Processor configuration, e.g. pipelining
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/10—Selection of transformation methods according to the characteristics of the input images
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30168—Image quality inspection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
CN202280096731.3A 2022-06-21 2022-06-21 不适合检测装置以及不适合检测方法 Pending CN119317938A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024750 WO2023248355A1 (ja) 2022-06-21 2022-06-21 不適合検出装置、および、不適合検出方法

Publications (1)

Publication Number Publication Date
CN119317938A true CN119317938A (zh) 2025-01-14

Family

ID=89379603

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280096731.3A Pending CN119317938A (zh) 2022-06-21 2022-06-21 不适合检测装置以及不适合检测方法

Country Status (6)

Country Link
US (1) US20250356476A1 (https=)
JP (1) JPWO2023248355A1 (https=)
KR (1) KR20240163122A (https=)
CN (1) CN119317938A (https=)
TW (2) TW202507649A (https=)
WO (1) WO2023248355A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025177678A (ja) * 2024-05-24 2025-12-05 浜松ホトニクス株式会社 学習方法、推論モデル、ノイズ低減方法、ノイズ低減システム及びノイズ低減プログラム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190842B2 (ja) * 2017-11-02 2022-12-16 キヤノン株式会社 情報処理装置、情報処理装置の制御方法及びプログラム
JP7122625B2 (ja) * 2018-07-02 2022-08-22 パナソニックＩｐマネジメント株式会社 学習データ収集装置、学習データ収集システム、及び学習データ収集方法
EP3618077A1 (en) * 2018-08-27 2020-03-04 Koninklijke Philips N.V. Generating metadata for trained model
KR102654003B1 (ko) * 2018-12-21 2024-04-04 주식회사 히타치하이테크 화상 인식 장치 및 방법
CN114245933B (zh) * 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
JPWO2021095256A1 (https=) * 2019-11-15 2021-05-20
US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
US12051183B2 (en) * 2020-04-30 2024-07-30 KLA Corp. Training a machine learning model to generate higher resolution images from inspection images
US11769242B2 (en) * 2020-05-21 2023-09-26 Kla Corporation Mode selection and defect detection training
US11776108B2 (en) * 2020-08-05 2023-10-03 KLA Corp. Deep learning based defect detection
CN114095662B (zh) * 2022-01-20 2022-07-05 荣耀终端有限公司 拍摄指引方法及电子设备

Also Published As

Publication number Publication date
JPWO2023248355A1 (https=) 2023-12-28
TW202507649A (zh) 2025-02-16
US20250356476A1 (en) 2025-11-20
TWI856660B (zh) 2024-09-21
KR20240163122A (ko) 2024-11-18
WO2023248355A1 (ja) 2023-12-28
TW202401358A (zh) 2024-01-01

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