CN119137686A - 导电糊、rfid嵌体、rfid嵌体的制造方法、用于粘接芯片的导电糊的用途和用于得到rfid嵌体的导电糊的用途 - Google Patents

导电糊、rfid嵌体、rfid嵌体的制造方法、用于粘接芯片的导电糊的用途和用于得到rfid嵌体的导电糊的用途 Download PDF

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Publication number
CN119137686A
CN119137686A CN202380037434.6A CN202380037434A CN119137686A CN 119137686 A CN119137686 A CN 119137686A CN 202380037434 A CN202380037434 A CN 202380037434A CN 119137686 A CN119137686 A CN 119137686A
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CN
China
Prior art keywords
meth
acrylate
less
conductive
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202380037434.6A
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English (en)
Chinese (zh)
Inventor
土桥悠人
小林洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN119137686A publication Critical patent/CN119137686A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202380037434.6A 2022-07-08 2023-07-06 导电糊、rfid嵌体、rfid嵌体的制造方法、用于粘接芯片的导电糊的用途和用于得到rfid嵌体的导电糊的用途 Pending CN119137686A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-110459 2022-07-08
JP2022110459 2022-07-08
PCT/JP2023/025104 WO2024010060A1 (ja) 2022-07-08 2023-07-06 導電ペースト、ｒｆｉｄインレイ、ｒｆｉｄインレイの製造方法、チップを接着するための導電ペーストの使用、及びｒｆｉｄインレイを得るための導電ペーストの使用

Publications (1)

Publication Number Publication Date
CN119137686A true CN119137686A (zh) 2024-12-13

Family

ID=89453565

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380037434.6A Pending CN119137686A (zh) 2022-07-08 2023-07-06 导电糊、rfid嵌体、rfid嵌体的制造方法、用于粘接芯片的导电糊的用途和用于得到rfid嵌体的导电糊的用途

Country Status (4)

Country Link
JP (1) JP7762209B2 (https=)
CN (1) CN119137686A (https=)
TW (1) TW202412018A (https=)
WO (1) WO2024010060A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236040A (ja) * 2004-02-19 2005-09-02 Sekisui Chem Co Ltd 導電性微粒子の配置方法
JP2010047716A (ja) 2008-08-22 2010-03-04 Toyo Ink Mfg Co Ltd スクリーン印刷用導電性インキ組成物及び導電性塗膜
KR20170090353A (ko) * 2014-11-20 2017-08-07 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체
WO2018047598A1 (ja) 2016-09-06 2018-03-15 株式会社スリーボンド 熱硬化型導電性接着剤
JP6796448B2 (ja) 2016-10-20 2020-12-09 Ｄｏｗａエレクトロニクス株式会社 導電性ペーストおよびその製造方法、ならびに太陽電池セル
US11503720B2 (en) * 2018-09-17 2022-11-15 3M Innovative Properties Company Flexible device including conductive traces with enhanced stretchability
JP7413024B2 (ja) * 2020-01-07 2024-01-15 日本化学工業株式会社 導電性接着剤、それを用いた接着構造体及び電子部品
JP7627092B2 (ja) * 2020-06-05 2025-02-05 出光興産株式会社 射出成形用金型及び熱硬化性組成物の射出成形方法

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Publication number Publication date
TW202412018A (zh) 2024-03-16
JPWO2024010060A1 (https=) 2024-01-11
JP7762209B2 (ja) 2025-10-29
WO2024010060A1 (ja) 2024-01-11

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