CN1190793A - Method and device for checking IC device shell pin - Google Patents
Method and device for checking IC device shell pin Download PDFInfo
- Publication number
- CN1190793A CN1190793A CN97104651A CN97104651A CN1190793A CN 1190793 A CN1190793 A CN 1190793A CN 97104651 A CN97104651 A CN 97104651A CN 97104651 A CN97104651 A CN 97104651A CN 1190793 A CN1190793 A CN 1190793A
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- CN
- China
- Prior art keywords
- pin
- device shell
- detector
- photophore
- optical axis
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides a device used to check the pins of a flat pack-type integrated circuit package shell, which comprises more than three pairs of illuminators and detectors, which are opposite to each other. The pins of the integrated circuit package shell are arranged between the illuminators and the detectors. A function is constructed by the angle of an optical axes formed by the illuminators and the detectors and the quantity of light measured by the detectors as variables. The maximum acceptance angle and the maximum light absorption can be got from the minimal value of the obtained function. The layout of the pins can be appraised by comparing the maximum light income with the reference value.
Description
The present invention relates to a kind of method and apparatus of checking and estimating IC device shell pin, particularly a kind of method and device of checking and estimating the layout state of platypelloid type IC device shell pin.
In general, platypelloid type IC device shell 10, such as quad flat shell (QFP) comprise that a main body 11 and several are arranged in the pin 12 of these main body 11 sidepieces, see Fig. 1.As shown in the figure, pin 12 comprises: the extension 121 that stretches out from shell main body 11 levels; The downward rake 122 that extends with a predetermined angular; And from rake 122 horizontally extending ends 123.
When IC device shell 10 was installed on the printed circuit board (PCB) (not shown), the attitude of all pins 12, direction, inclination angle and height all should be identical, so that all pins 12 all contact with circuit board.That is to say that when IC device shell is installed on the circuit board, if the inhomogeneous unanimity of layout of pin 12, some pin 12 can not contact with plate 1, as shown in Figure 2.Like this, just can not correctly implement welding, thereby produce the substandard products element.For avoiding this phenomenon to take place, before IC device shell is installed on the circuit board, tackles it and check, the layout of pin is estimated.Evaluation can be undertaken by the measurement to the isoplanar degree of pin.
See also Fig. 3 and 4, the traditional pin testing fixture that is used to measure pin isoplanar degree comprises: a suction nozzle 111 is used to fix IC device shell 10; One photophore 120; One detector 130, it and photophore 120 are faced and are separated by being arranged pin 12 by one of the IC device shell 10 of suction nozzle 111 fixings; One controller 140 is used to measure pin 12 backs of passing through of being sent by photophore 120 and arrives the light quantity of detector 130, thereby the layout of pin 12 is estimated.
To place between photophore 120 and the detector 130 by the IC device shell 10 that suction nozzle 111 fixes.Under this state, light self-luminous device 120 directed toward detector of sending 130.At this moment, the difference in height that pin is 12 is big more, and the light that pin 12 stops is many more, and the light quantity that arrives detector 130 is few more.Thereby, by detecting the light quantity that arrives detector 130, can determine the isoplanar degree of the pin 12 of IC device shell 10.
But when utilizing above-mentioned traditional device that the pin of IC device shell is checked, for obtaining check result accurately, the arrangement of the sidepiece of IC device shell main body and pin end must be parallel to each other.Because above-mentioned inspection condition is difficult to satisfy, the accuracy of inspection descends.
In addition, as shown in Figure 5, if IC device shell 10 that fixes by suction nozzle 111 and optical axis θ at angle, even the layout of pin 12 is very desirable, also there is a zone " B " to be covered, thereby reduced the light quantity that arrives detector 130 by sloping portion 122 (see figure 1)s of pin 12.When utilizing traditional method that pin is checked, be to compare the pin layout state of measuring by an absolute value and a reference value that detector is received light quantity.Thereby, even IC device shell is fixed exactly, no matter the layout of pin how, is still judged this device defectiveness, i.e. reliability decrease of Jian Chaing.
The purpose of this invention is to provide a kind of method and apparatus of checking the pin layout in the platypelloid type IC device shell, to address the above problem.Compare with traditional method, its accuracy is higher.
For realizing above-mentioned purpose of the present invention, a kind of device of checking the pin of IC device shell is provided, it comprises: a bracing or strutting arrangement, it is installed versatilely and rotatably to pick up IC device shell; At least three pairs of photophore and detectors that face with each other and be provided with, row's pin of IC device shell is between photophore and detector; One controller is used to measure that each photophore sends walks around pin and by between the pin and arrive the light quantity of each detector, thereby the layout of pin is checked.
For realizing above-mentioned purpose of the present invention, provide a kind of device of checking pin that utilizes to come the method that the pin of IC device shell is checked, described testing fixture comprises at least three pairs of photophore and the detectors that face with each other and be provided with, and row's pin of IC device shell is between photophore and detector.Described method comprises step: IC device shell is placed between photophore and the detector; Detect that photophore sends walk around pin and by between the pin and arrive the light quantity of detector; Utilize the optical axis angle of every pair of photophore and detector formation and the shading amount of pin to construct a function as variable; Try to achieve minimum of a function value and minimum optical axis angle; And and the maximum light income of minimum optical axis angle correspondence compare with a ginseng value, thereby the layout of pin is estimated.
By reference accompanying drawing description of preferred embodiments, above-mentioned purpose of the present invention and advantage will become apparent.
Fig. 1 is a stereogram, shows a typical platypelloid type IC device shell;
Fig. 2 is a sectional view, the state when showing the platypelloid type IC device shell and being installed in the substrate;
Fig. 3 is a stereogram, shows the device that the pin of IC device shell is checked in a kind of traditional being used to;
Fig. 4 checks the end view of the conventional apparatus of IC device shell pin for shown in Figure 3 being used to;
Fig. 5 is a plane graph, shows the operation principle of conventional apparatus that the pin of IC device shell is checked in shown in Figure 3 being used to;
Fig. 6 is a stereogram, shows the device that is used to check the pin of IC device shell according to of the present invention;
Fig. 7 is the plane graph according to the device of the pin that is used to check IC device shell of the present invention;
Fig. 8 is a plane graph, shows the operation principle according to the device of the pin that is used to check IC device shell of the present invention;
Fig. 9 is the function curve according to the method acquisition of the pin of inspection IC device shell of the present invention.
Please refer to Fig. 6 and Fig. 7, be used to check that according to of the present invention the device of pin comprises: suction nozzle 211, it is installed versatilely, to pick up and fixing one IC device shell 10; The setting that faces with each other of at least three pairs of photophores 221,222,223 and detector 231,232,233, photophore and detector is arranged between them by row's pin 12 of the IC device shell 10 of suction nozzle 211 fixings; Controller 240 is used to measure that each photophore 221,222 and 223 sends walks around pin 12 and by arriving the light quantity of corresponding detectors 231,232 and 233 between the pin 12 then, thereby the layout state of pin 12 is estimated.
The optical axis that is formed by photophore 222 and detector 232 has a θ angle with respect to the optical axis that photophore 221 and detector 231 form, and the latter itself also has a θ angle with respect to the optical axis that photophore 223 and detector 233 form.These three optical axis intersections are in " F " point.A head of suction nozzle 211 is supported in reference number 210 expressions among Fig. 6, and it can make suction nozzle 211 move and rotate.For example, after the pin 12 that is positioned at IC device shell 10 1 sides inspection finished, head 210 removable or rotating nozzles 211 were checked with the pin to the opposite side that is positioned at IC device shell 10.
When the device of the operation pin that is used to check IC device shell of the present invention, in the time of on the IC device shell 10 of examine places such as the workbench (not shown) of the common components feedway of drum-type feeder (bowl feeder) or orthoscopic feeder and so on, by the transducer (not shown) that is contained on the workbench head 210 is moved on on the workbench, head descends and IC device shell 10 is fixed then.
By moving-head 210, the IC device shell 10 that will be fixed is positioned the test zone between photophore 221,222,223 and the detector 231,232,233.
According to feature of the present invention, even suction nozzle 211 not with IC device shell 10 fixing exactly, but utilizes one group of detector, 231,232 and 233 detected light quantities as a variable, residing position in the time of still can finding light income to be maximum.Describe the device of inspection pin in detail with three pairs of photophores and detector below with reference to Fig. 8.
Figure 8 shows that suction nozzle 211 is not with IC device shell 10 situation of fixing exactly.In the case, the light quantity that arrives each detector 231,232 and 233 has nothing in common with each other.Like this, the angle of each optical axis be respectively θ °, 0 ° ,-θ °, when the shading amount is respectively F (θ °), F (0 °), F (θ °), can get following quadratic equation:
F(θ)＝aθ
2+bθ+c
Here, coefficient " a ", " b ", " c " are determined by the angle and the shading amount of optical axis.When minimum cut-off angle θ be-during b/2a, minimum shading amount " L " is c-b
2/ 4a sees Fig. 9.If minimum cut-off angle θ, promptly-b/2a, between-θ ° and θ °, then minimum shading amount is F (θ °) or F (θ °), and in these two selected amounts, one of them is less than another.
Minimum cut-off angle is exactly maximum acceptance angle, and this value has been represented the isoplanar degree of the pin of being checked.Here, the isoplanar degree is determined by this value and reference value are compared.That is to say that according to the present invention, no matter how IC device shell is installed fixing by this, the detection limit that obtains with one group of photophore and detector is as variable, can draw a function, can obtain maximum acceptance angle and maximum light income by this function, thereby the layout of pin is estimated.Therefore, because maximum light income is a constant, so can do to check more reliably to pin.In this embodiment, quadratic equation is based on three pairs of photophores and detector establishment.But, must adopt the more function of high-order to using the photophore more than three pairs and the situation of detector.
Utilize the method and apparatus of the pin of above-mentioned inspection IC device shell, can improve the efficient that pin is checked accuracy and inspection, and with IC device shell by the location independent of suction nozzle fixing.
Claims (6)
1. device that is used to check the pin of IC device shell comprises:
One bracing or strutting arrangement, it is installed versatilely and rotatably to pick up described IC device shell;
At least three pairs of photophores and detector, they face with each other and are provided with and row's pin of described IC device shell is placed between the two; And
One controller, be used to measure that each described photophore sends, walk around described pin and by arriving the light quantity of each described detector between the pin then, to check the layout of described pin.
2. the device that is used to check the pin of IC device shell as claimed in claim 1 is characterized in that, by several optical axis intersections that described photophore and detector are formed.
3. the device that is used to check the pin of IC device shell as claimed in claim 2 is characterized in that described each optical axis intersection is in a point.
4. one kind is utilized the device of checking pin to come the method that the pin of IC device shell is checked, described testing fixture comprises at least three pairs of photophore and the detectors that face with each other and be provided with, and row's pin of IC device shell is between photophore and detector.Described method comprises step:
IC device shell is placed between photophore and the detector;
Detect that photophore sends walk around pin and by between the pin and arrive the light quantity of detector;
Utilize the optical axis angle of every pair of photophore and detector formation and construct a function as variable by the shading amount that described pin produces;
Try to achieve described minimum of a function value and minimum optical axis angle;
And will compare with a reference value, thereby the layout of pin is estimated with the maximum light income of minimum optical axis angle correspondence.
5. the device of the pin of inspection IC device shell as claimed in claim 4 is characterized in that, described each optical axis intersection is in a bit.
6. the device of the pin of inspection IC device shell as claimed in claim 4 is characterized in that, described photophore and detector are three pairs, and described function is a quadratic function.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR42242/96 | 1996-09-24 | ||
| KR42242/1996 | 1996-09-24 | ||
| KR1019960042242A KR100238269B1 (en) | 1996-09-24 | 1996-09-24 | Coplanarity measurment apparatus for IC package lead fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1190793A true CN1190793A (en) | 1998-08-19 |
| CN1108636C CN1108636C (en) | 2003-05-14 |
Family
ID=19475238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97104651A Expired - Fee Related CN1108636C (en) | 1996-09-24 | 1997-07-28 | Method and device for checking IC device shell pin |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2916447B2 (en) |
| KR (1) | KR100238269B1 (en) |
| CN (1) | CN1108636C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903999A (en) * | 2012-12-27 | 2014-07-02 | 三星电机株式会社 | Semiconductor package inspection equipment |
| CN106604628A (en) * | 2015-10-20 | 2017-04-26 | 泰科电子(上海)有限公司 | System for determining installation state of pin of electrical connector |
| CN112378350A (en) * | 2020-11-16 | 2021-02-19 | 四川显石电子科技有限公司 | Flatness detection method for PIN PIN of network transformer |
| CN112739977A (en) * | 2018-10-05 | 2021-04-30 | 株式会社富士 | Measuring device and component mounting machine |
| CN117038494A (en) * | 2023-10-10 | 2023-11-10 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4079471B2 (en) * | 1996-09-17 | 2008-04-23 | 松下電器産業株式会社 | Electronic component mounting machine and electronic component mounting method |
| KR100287786B1 (en) * | 1998-07-21 | 2001-04-16 | 이중구 | Apparatus for determining the position of a component and method using such |
| KR100552328B1 (en) * | 2003-07-28 | 2006-02-20 | (주)알티에스 | Examination method for of semiconductor chip and method for measuring the total height and stand-off of semiconductor chip |
| KR102062656B1 (en) | 2019-09-09 | 2020-01-06 | (주)에이앤에이 | Cylindrical Battery Aligner |
| CN117781959B (en) * | 2023-12-26 | 2024-07-30 | 成都宏明双新科技股份有限公司 | Method for detecting and aligning Pin flatness of shielding case |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62143448A (en) * | 1985-12-18 | 1987-06-26 | Hitachi Tokyo Electron Co Ltd | Lead flatness inspecting device |
| JPH01260349A (en) * | 1988-04-12 | 1989-10-17 | Maidasu Kogyo:Kk | Detection for bending of ic lead pin |
| JPH07111330B2 (en) * | 1991-06-11 | 1995-11-29 | 北城 徹也 | IC package appearance automatic inspection method |
| JP3012038B2 (en) * | 1991-06-28 | 2000-02-21 | ソニー株式会社 | Lead inspection device |
| JPH05235131A (en) * | 1992-02-26 | 1993-09-10 | Hitachi Ltd | Bend inspection apparatus of lead of semiconductor device |
-
1996
- 1996-09-24 KR KR1019960042242A patent/KR100238269B1/en not_active IP Right Cessation
-
1997
- 1997-07-28 CN CN97104651A patent/CN1108636C/en not_active Expired - Fee Related
- 1997-09-12 JP JP9249037A patent/JP2916447B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903999A (en) * | 2012-12-27 | 2014-07-02 | 三星电机株式会社 | Semiconductor package inspection equipment |
| CN106604628A (en) * | 2015-10-20 | 2017-04-26 | 泰科电子(上海)有限公司 | System for determining installation state of pin of electrical connector |
| CN106604628B (en) * | 2015-10-20 | 2019-07-12 | 泰科电子(上海)有限公司 | System for determining the installation condition of the pin of electric connector |
| CN112739977A (en) * | 2018-10-05 | 2021-04-30 | 株式会社富士 | Measuring device and component mounting machine |
| CN112378350A (en) * | 2020-11-16 | 2021-02-19 | 四川显石电子科技有限公司 | Flatness detection method for PIN PIN of network transformer |
| CN112378350B (en) * | 2020-11-16 | 2021-08-17 | 四川显石电子科技有限公司 | Flatness detection method for PIN PIN of network transformer |
| CN117038494A (en) * | 2023-10-10 | 2023-11-10 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
| CN117038494B (en) * | 2023-10-10 | 2023-12-15 | 天津芯成半导体有限公司 | Auxiliary intelligent detection system for chip processing industry |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10107169A (en) | 1998-04-24 |
| JP2916447B2 (en) | 1999-07-05 |
| KR100238269B1 (en) | 2000-01-15 |
| KR19980022945A (en) | 1998-07-06 |
| CN1108636C (en) | 2003-05-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030514 |