CN118891299A - 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 - Google Patents

树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 Download PDF

Info

Publication number
CN118891299A
CN118891299A CN202380025733.8A CN202380025733A CN118891299A CN 118891299 A CN118891299 A CN 118891299A CN 202380025733 A CN202380025733 A CN 202380025733A CN 118891299 A CN118891299 A CN 118891299A
Authority
CN
China
Prior art keywords
formula
compound
mass
group
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380025733.8A
Other languages
English (en)
Chinese (zh)
Inventor
桥口和弘
长谷部惠一
平野俊介
小林宇志
中岛祐司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of CN118891299A publication Critical patent/CN118891299A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380025733.8A 2022-03-11 2023-03-03 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置 Pending CN118891299A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022038646 2022-03-11
JP2022-038646 2022-03-11
PCT/JP2023/007986 WO2023171554A1 (ja) 2022-03-11 2023-03-03 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

Publications (1)

Publication Number Publication Date
CN118891299A true CN118891299A (zh) 2024-11-01

Family

ID=87935374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380025733.8A Pending CN118891299A (zh) 2022-03-11 2023-03-03 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置

Country Status (5)

Country Link
JP (1) JPWO2023171554A1 (https=)
KR (1) KR20240157734A (https=)
CN (1) CN118891299A (https=)
TW (1) TW202348646A (https=)
WO (1) WO2023171554A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024090408A1 (ja) * 2022-10-26 2024-05-02 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
KR20250107837A (ko) * 2022-10-26 2025-07-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
WO2025187617A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2026083785A1 (ja) * 2024-10-15 2026-04-23 三菱瓦斯化学株式会社 樹脂組成物、硬化物、樹脂複合シート、プリプレグ、金属箔張積層板、プリント配線板、および、半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020054601A1 (ja) 2018-09-12 2020-03-19 日本化薬株式会社 マレイミド樹脂、硬化性樹脂組成物およびその硬化物
CN120289924A (zh) * 2019-02-28 2025-07-11 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷电路板
CN113490596A (zh) * 2019-02-28 2021-10-08 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷电路板
CN113121999B (zh) * 2019-12-31 2023-04-07 广东生益科技股份有限公司 一种树脂组合物及使用它的预浸料、层压板和印制电路板
KR102727867B1 (ko) 2020-03-11 2024-11-07 닛뽄 가야쿠 가부시키가이샤 말레이미드 수지 및 그의 제조 방법, 말레이미드 용액, 그리고, 경화성 수지 조성물 및 그의 경화물
WO2022054867A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN116997576A (zh) * 2021-03-24 2023-11-03 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板

Also Published As

Publication number Publication date
WO2023171554A1 (ja) 2023-09-14
TW202348646A (zh) 2023-12-16
JPWO2023171554A1 (https=) 2023-09-14
KR20240157734A (ko) 2024-11-01

Similar Documents

Publication Publication Date Title
KR102728882B1 (ko) 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판
TW202346398A (zh) 樹脂、樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
KR102849732B1 (ko) 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및 반도체 장치
CN118891299A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
JP7380943B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN118891298A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置
CN118019802A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
CN118019803A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
WO2023171553A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2024101238A1 (ja) 樹脂、樹脂組成物、および、その応用
CN119630734A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
WO2024101237A1 (ja) 樹脂、樹脂組成物、および、その応用
CN118019800A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
JP7616497B1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板および半導体装置
CN121794327A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
CN121794315A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
WO2025058026A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN121794312A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
WO2025187613A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN118019807A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
WO2025187616A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2025187614A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
CN121794314A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置
WO2025225477A1 (ja) 樹脂組成物、硬化物、プリプレグ、樹脂複合シート、プリント配線板、および、半導体装置
CN121794326A (zh) 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板和半导体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination