CN118786323A - 用于测量晶片的装置和方法 - Google Patents
用于测量晶片的装置和方法 Download PDFInfo
- Publication number
- CN118786323A CN118786323A CN202380023524.XA CN202380023524A CN118786323A CN 118786323 A CN118786323 A CN 118786323A CN 202380023524 A CN202380023524 A CN 202380023524A CN 118786323 A CN118786323 A CN 118786323A
- Authority
- CN
- China
- Prior art keywords
- wafer
- measuring
- scanning
- measuring beam
- designed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
- G01B9/02091—Tomographic interferometers, e.g. based on optical coherence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
- G01B21/045—Correction of measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/0207—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer
- G01B9/02072—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer by calibration or testing of interferometer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022104416.5A DE102022104416A1 (de) | 2022-02-24 | 2022-02-24 | Vorrichtung und Verfahren zum Vermessen von Wafern |
| DE102022104416.5 | 2022-02-24 | ||
| PCT/EP2023/051736 WO2023160928A1 (de) | 2022-02-24 | 2023-01-25 | Vorrichtung und verfahren zum vermessen von wafern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118786323A true CN118786323A (zh) | 2024-10-15 |
Family
ID=85122276
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380023524.XA Pending CN118786323A (zh) | 2022-02-24 | 2023-01-25 | 用于测量晶片的装置和方法 |
| CN202380023554.0A Pending CN118749058A (zh) | 2022-02-24 | 2023-01-25 | 用于测量晶片的装置和方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380023554.0A Pending CN118749058A (zh) | 2022-02-24 | 2023-01-25 | 用于测量晶片的装置和方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US20250189299A1 (enExample) |
| EP (3) | EP4722639A3 (enExample) |
| JP (2) | JP2025506804A (enExample) |
| KR (2) | KR20240162506A (enExample) |
| CN (2) | CN118786323A (enExample) |
| DE (1) | DE102022104416A1 (enExample) |
| ES (1) | ES3063702T3 (enExample) |
| PL (1) | PL4483131T3 (enExample) |
| WO (2) | WO2023160928A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022120069A1 (de) | 2022-08-09 | 2024-02-15 | Precitec Optronik Gmbh | Vorrichtung zum Messen von Abständen an mehreren Messpunkten auf einem Werkstück |
| DE102024113613A1 (de) * | 2023-05-25 | 2024-11-28 | Precitec Optronik Gmbh | Vorrichtung und Verfahren zum Vermessen von Wafern |
| DE102023135850A1 (de) * | 2023-12-19 | 2025-06-26 | Precitec Optronik Gmbh | Vorrichtung und Verfahren zum Messen von Oberflächen- und Dickenprofilen eingetauchter Werkstücke |
| DE102024111194B4 (de) | 2024-04-22 | 2026-04-30 | Precitec Optronik Gmbh | Vorrichtung zur optischen Messung der Dicke eines intransparenten Objekts sowie Verfahren zum Kalibrieren einer solchen Vorrichtung |
| DE102024115438A1 (de) * | 2024-06-04 | 2025-12-04 | Precitec Optronik Gmbh | Verfahren und Vorrichtung zur Detektion von Hohlräumen in gebondeten Wafern |
| DE102024118277A1 (de) | 2024-06-27 | 2025-12-31 | Precitec Optronik Gmbh | Verfahren und Vorrichtung zur Abstands- und Dickenmessung |
| DE102024120424A1 (de) | 2024-07-18 | 2026-01-22 | Precitec Optronik Gmbh | Vorrichtung und Verfahren zum Vermessen von Wafern |
| DE102024120426A1 (de) | 2024-07-18 | 2026-01-22 | Precitec Optronik Gmbh | Verfahren und Vorrichtung zur Abstands- und Dickenmessung |
| DE102024132847A1 (de) | 2024-11-11 | 2026-05-13 | Precitec Optronik Gmbh | Verfahren und Vorrichtung zur Vermessung transparenter mehrschichtiger Objekte mit einem Kohärenztomographen |
| DE102024132825B3 (de) | 2024-11-11 | 2026-01-15 | Precitec Optronik Gmbh | Verfahren und Vorrichtung zum berührungslosen Vermessen eines Objekts |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5321501A (en) | 1991-04-29 | 1994-06-14 | Massachusetts Institute Of Technology | Method and apparatus for optical imaging with means for controlling the longitudinal range of the sample |
| US5648865A (en) * | 1993-12-27 | 1997-07-15 | Asahi Kogaku Kogyo Kabushiki Kaisha | Scanning optical system |
| FR2836215B1 (fr) * | 2002-02-21 | 2004-11-05 | Yodea | Systeme et procede de modelisation et de restitution tridimensionnelle d'un objet |
| US6927860B2 (en) | 2003-05-19 | 2005-08-09 | Oti Ophthalmic Technologies Inc. | Optical mapping apparatus with optimized OCT configuration |
| JP4522253B2 (ja) * | 2004-12-24 | 2010-08-11 | キヤノン株式会社 | 光走査装置及びそれを用いた画像表示装置 |
| GB2429522A (en) | 2005-08-26 | 2007-02-28 | Univ Kent Canterbury | Optical mapping apparatus |
| WO2010017954A2 (de) * | 2008-08-12 | 2010-02-18 | Carl Zeiss Meditec Ag | Tiefenauflösende optische kohärenzreflektrometrie |
| KR20120081419A (ko) * | 2011-01-11 | 2012-07-19 | 삼성전기주식회사 | 다층 박막 특성 측정 장치 및 방법 |
| US8489225B2 (en) * | 2011-03-08 | 2013-07-16 | International Business Machines Corporation | Wafer alignment system with optical coherence tomography |
| US9714825B2 (en) | 2011-04-08 | 2017-07-25 | Rudolph Technologies, Inc. | Wafer shape thickness and trench measurement |
| ES2391510B1 (es) | 2011-04-29 | 2013-11-11 | Consejo Superior De Investigaciones Científicas (Csic) | Procedimiento de calibracion y correccion de la distorsion de barrido de un sistema de tomografia de coherencia optica |
| DE102011051146B3 (de) * | 2011-06-17 | 2012-10-04 | Precitec Optronik Gmbh | Prüfverfahren zum Prüfen einer Verbindungsschicht zwischen waferförmigen Proben |
| US9757817B2 (en) | 2013-03-13 | 2017-09-12 | Queen's University At Kingston | Methods and systems for characterizing laser machining properties by measuring keyhole dynamics using interferometry |
| DE102016120523B4 (de) * | 2016-10-27 | 2026-06-11 | Raylase Gmbh | Ablenkeinheit |
| US10234265B2 (en) | 2016-12-12 | 2019-03-19 | Precitec Optronik Gmbh | Distance measuring device and method for measuring distances |
| WO2018221034A1 (ja) * | 2017-06-02 | 2018-12-06 | ソニー株式会社 | フォーカス制御装置、フォーカス制御方法、プログラムおよび撮像装置 |
| DE102017118776B4 (de) * | 2017-08-17 | 2020-11-12 | Blickfeld GmbH | Scaneinheit mit mindestens zwei Stützelementen und einem freistehenden Umlenkelement und Verfahren zum Scannen von Licht |
| KR102145381B1 (ko) | 2018-05-21 | 2020-08-19 | 주식회사 고영테크놀러지 | Oct 시스템, oct 영상 생성 방법 및 저장 매체 |
| US11061223B2 (en) * | 2019-02-28 | 2021-07-13 | Facebook Technologies, Llc | Distortion controlled projector for scanning systems |
| CN113740998B (zh) * | 2020-05-30 | 2022-11-22 | 华为技术有限公司 | 光学镜头、摄像模组及电子设备 |
| US12403548B2 (en) | 2020-08-19 | 2025-09-02 | Panasonic Intellectual Property Management Co., Ltd. | Laser processing apparatus and laser processing method |
| US11644419B2 (en) * | 2021-01-28 | 2023-05-09 | Kla Corporation | Measurement of properties of patterned photoresist |
-
2022
- 2022-02-24 DE DE102022104416.5A patent/DE102022104416A1/de active Pending
-
2023
- 2023-01-25 JP JP2024550134A patent/JP2025506804A/ja active Pending
- 2023-01-25 EP EP26151440.0A patent/EP4722639A3/de active Pending
- 2023-01-25 KR KR1020247031575A patent/KR20240162506A/ko active Pending
- 2023-01-25 ES ES23702257T patent/ES3063702T3/es active Active
- 2023-01-25 EP EP23702257.9A patent/EP4483131B1/de active Active
- 2023-01-25 KR KR1020247031573A patent/KR20240161654A/ko active Pending
- 2023-01-25 JP JP2024549448A patent/JP2025506745A/ja active Pending
- 2023-01-25 CN CN202380023524.XA patent/CN118786323A/zh active Pending
- 2023-01-25 WO PCT/EP2023/051736 patent/WO2023160928A1/de not_active Ceased
- 2023-01-25 WO PCT/EP2023/051737 patent/WO2023160929A1/de not_active Ceased
- 2023-01-25 CN CN202380023554.0A patent/CN118749058A/zh active Pending
- 2023-01-25 EP EP23702256.1A patent/EP4483130A1/de active Pending
- 2023-01-25 US US18/840,843 patent/US20250189299A1/en active Pending
- 2023-01-25 PL PL23702257.9T patent/PL4483131T3/pl unknown
-
2024
- 2024-05-23 US US18/673,052 patent/US12264914B2/en active Active
-
2025
- 2025-02-28 US US19/067,381 patent/US20250198743A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250189299A1 (en) | 2025-06-12 |
| US20240310159A1 (en) | 2024-09-19 |
| EP4483131B1 (de) | 2026-01-14 |
| WO2023160928A1 (de) | 2023-08-31 |
| US20250198743A1 (en) | 2025-06-19 |
| EP4483131A1 (de) | 2025-01-01 |
| PL4483131T3 (pl) | 2026-05-25 |
| US12264914B2 (en) | 2025-04-01 |
| WO2023160929A1 (de) | 2023-08-31 |
| KR20240162506A (ko) | 2024-11-15 |
| EP4722639A3 (de) | 2026-05-13 |
| EP4483130A1 (de) | 2025-01-01 |
| KR20240161654A (ko) | 2024-11-12 |
| ES3063702T3 (en) | 2026-04-20 |
| EP4722639A2 (de) | 2026-04-08 |
| JP2025506804A (ja) | 2025-03-13 |
| CN118749058A (zh) | 2024-10-08 |
| JP2025506745A (ja) | 2025-03-13 |
| DE102022104416A1 (de) | 2023-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |