CN118633047A - 光波导的制造方法 - Google Patents

光波导的制造方法 Download PDF

Info

Publication number
CN118633047A
CN118633047A CN202280085131.7A CN202280085131A CN118633047A CN 118633047 A CN118633047 A CN 118633047A CN 202280085131 A CN202280085131 A CN 202280085131A CN 118633047 A CN118633047 A CN 118633047A
Authority
CN
China
Prior art keywords
core
layer
optical waveguide
laminate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202280085131.7A
Other languages
English (en)
Chinese (zh)
Inventor
今井洋武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN118633047A publication Critical patent/CN118633047A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
CN202280085131.7A 2021-12-27 2022-10-25 光波导的制造方法 Withdrawn CN118633047A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-212865 2021-12-27
JP2021212865 2021-12-27
PCT/JP2022/039791 WO2023127257A1 (ja) 2021-12-27 2022-10-25 光導波路の製造方法

Publications (1)

Publication Number Publication Date
CN118633047A true CN118633047A (zh) 2024-09-10

Family

ID=86998640

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280085131.7A Withdrawn CN118633047A (zh) 2021-12-27 2022-10-25 光波导的制造方法

Country Status (4)

Country Link
JP (1) JP7311066B1 (https=)
CN (1) CN118633047A (https=)
TW (1) TW202328719A (https=)
WO (1) WO2023127257A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120936678A (zh) * 2023-03-31 2025-11-11 住友电木株式会社 树脂组合物、膜、膜组、光波导、光电复合基板和电子部件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4539031B2 (ja) * 2002-05-28 2010-09-08 パナソニック電工株式会社 光電気混載基板の製造方法
JP2006039231A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Works Ltd 光電気配線混載基板の製造方法
JP4138824B2 (ja) * 2006-07-06 2008-08-27 河村産業株式会社 プラスチックフィルム−導体金属箔積層体の製造方法
JP2009276724A (ja) * 2008-05-19 2009-11-26 Nitto Denko Corp 光導波路装置の製造方法
US8716403B2 (en) * 2008-12-10 2014-05-06 Electronics And Telecommunications Research Institute Prepolymer prepared by a condensation reaction and a polymer sheet obtained therefrom
JP2014199369A (ja) * 2013-03-29 2014-10-23 住友ベークライト株式会社 光導波路および電子機器
JP2015087658A (ja) * 2013-10-31 2015-05-07 住友ベークライト株式会社 光導波路、光電気混載基板および電子機器
JP6331336B2 (ja) * 2013-10-31 2018-05-30 住友ベークライト株式会社 光導波路、光電気混載基板および電子機器

Also Published As

Publication number Publication date
TW202328719A (zh) 2023-07-16
JP7311066B1 (ja) 2023-07-19
WO2023127257A1 (ja) 2023-07-06
JPWO2023127257A1 (https=) 2023-07-06

Similar Documents

Publication Publication Date Title
US9535216B2 (en) Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film
CN107111002B (zh) 光学体、光学膜粘合体及光学体的制造方法
CN104583815A (zh) 带有透镜的基板及其制造方法,以及带有透镜的光波导
US12405682B2 (en) Laminated optical component and touch sensor device
KR20210068051A (ko) 광학 적층체, 편광판 복합체 및 화상 표시 장치
CN118633047A (zh) 光波导的制造方法
JP2024083560A (ja) 光導波路
US12600101B2 (en) Manufacturing method of optical waveguide
JP7414185B2 (ja) 光導波路の製造方法
JP7735786B2 (ja) 光導波路の製造方法
JP6070214B2 (ja) レンズ部材、レンズ部材付き光導波路、およびこれらの製造方法
JP2003344684A (ja) 光電気混載基板用材料
JP6274340B1 (ja) 光導波路フィルムおよび光学部品
JP2016126240A (ja) 印刷用樹脂原版の製造方法およびフレキソ印刷版
JP2023096847A (ja) 光導波路の製造方法
JP6183532B1 (ja) 光導波路フィルムおよび光学部品
JP6048033B2 (ja) 光導波路及びその製造方法
JP6888373B2 (ja) 光導波路フィルムおよび光学部品
JP2004302007A (ja) 光導波路部材及び光メモリ素子
JP2018084693A (ja) 光導波路フィルムおよび光学部品
CN118176454A (zh) 光学层叠体、光学装置、光学层叠体的制造方法
JP2006184802A (ja) 光導波路およびその製造方法
JP6048032B2 (ja) 光導波路及びその製造方法
TWI434087B (zh) 光電混載基板及電子機器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20240910