CN118541809A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN118541809A
CN118541809A CN202280087437.6A CN202280087437A CN118541809A CN 118541809 A CN118541809 A CN 118541809A CN 202280087437 A CN202280087437 A CN 202280087437A CN 118541809 A CN118541809 A CN 118541809A
Authority
CN
China
Prior art keywords
region
field plate
plate electrode
width
gate trench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280087437.6A
Other languages
English (en)
Chinese (zh)
Inventor
福西淳也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118541809A publication Critical patent/CN118541809A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • H10D64/117Recessed field plates, e.g. trench field plates or buried field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/252Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/252Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H10D64/2527Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/518Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes

Landscapes

  • Electrodes Of Semiconductors (AREA)
CN202280087437.6A 2022-01-11 2022-10-27 半导体装置 Pending CN118541809A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-002323 2022-01-11
JP2022002323 2022-01-11
PCT/JP2022/040078 WO2023135896A1 (ja) 2022-01-11 2022-10-27 半導体装置

Publications (1)

Publication Number Publication Date
CN118541809A true CN118541809A (zh) 2024-08-23

Family

ID=87278767

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280087437.6A Pending CN118541809A (zh) 2022-01-11 2022-10-27 半导体装置

Country Status (5)

Country Link
US (1) US20240355889A1 (https=)
JP (1) JPWO2023135896A1 (https=)
CN (1) CN118541809A (https=)
DE (1) DE112022005871T5 (https=)
WO (1) WO2023135896A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6967352B2 (ja) 2017-02-07 2021-11-17 ローム株式会社 半導体装置および半導体装置の製造方法、ならびに、半導体ウエハ構造物
US10950699B2 (en) * 2019-08-05 2021-03-16 Vishay-Siliconix, LLC Termination for vertical trench shielded devices
JP7461218B2 (ja) * 2020-05-22 2024-04-03 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
US20240355889A1 (en) 2024-10-24
DE112022005871T5 (de) 2024-10-02
JPWO2023135896A1 (https=) 2023-07-20
WO2023135896A1 (ja) 2023-07-20

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