CN118516074A - Composition for forming anisotropic conductive film - Google Patents
Composition for forming anisotropic conductive film Download PDFInfo
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- CN118516074A CN118516074A CN202410584558.2A CN202410584558A CN118516074A CN 118516074 A CN118516074 A CN 118516074A CN 202410584558 A CN202410584558 A CN 202410584558A CN 118516074 A CN118516074 A CN 118516074A
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- anisotropic conductive
- conductive film
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- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 16
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 7
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 229920000728 polyester Polymers 0.000 claims abstract description 7
- 229920006317 cationic polymer Polymers 0.000 claims abstract description 5
- 125000002091 cationic group Chemical group 0.000 claims abstract description 3
- 239000003999 initiator Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 8
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 7
- 239000003505 polymerization initiator Substances 0.000 claims description 7
- 238000009472 formulation Methods 0.000 claims description 6
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 150000003242 quaternary ammonium salts Chemical group 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- -1 acryl Chemical group 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229960000834 vinyl ether Drugs 0.000 description 3
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- MLRCQIICAYVJHD-UHFFFAOYSA-N 1-but-1-enoxybut-1-ene Chemical class CCC=COC=CCC MLRCQIICAYVJHD-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- 125000004806 1-methylethylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- VZVKWLCVKPJHRK-UHFFFAOYSA-N 1-pent-1-enoxypent-1-ene Chemical class CCCC=COC=CCCC VZVKWLCVKPJHRK-UHFFFAOYSA-N 0.000 description 1
- ZKJNETINGMOHJG-UHFFFAOYSA-N 1-prop-1-enoxyprop-1-ene Chemical class CC=COC=CC ZKJNETINGMOHJG-UHFFFAOYSA-N 0.000 description 1
- WVXLLHWEQSZBLW-UHFFFAOYSA-N 2-(4-acetyl-2-methoxyphenoxy)acetic acid Chemical compound COC1=CC(C(C)=O)=CC=C1OCC(O)=O WVXLLHWEQSZBLW-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- BHOJJZTVUGWMQA-UHFFFAOYSA-N 2-ethenyl-2-methyloxetane Chemical compound C=CC1(C)CCO1 BHOJJZTVUGWMQA-UHFFFAOYSA-N 0.000 description 1
- FZIIBDOXPQOKBP-UHFFFAOYSA-N 2-methyloxetane Polymers CC1CCO1 FZIIBDOXPQOKBP-UHFFFAOYSA-N 0.000 description 1
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- ADBKJHCCJUZFAM-UHFFFAOYSA-N 3-ethyl-2-methyloxetane Chemical compound CCC1COC1C ADBKJHCCJUZFAM-UHFFFAOYSA-N 0.000 description 1
- PWGAXPBJOGFFMY-UHFFFAOYSA-N 3-ethyl-3-(2-methylpropoxymethoxymethyl)oxetane Chemical compound CC(C)COCOCC1(CC)COC1 PWGAXPBJOGFFMY-UHFFFAOYSA-N 0.000 description 1
- SLNCKLVYLZHRKK-UHFFFAOYSA-N 3-ethyl-3-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCC1(CC)COC1 SLNCKLVYLZHRKK-UHFFFAOYSA-N 0.000 description 1
- UWFHYGTWXNRUDH-UHFFFAOYSA-N 3-ethyl-3-[4-[(3-ethyloxetan-3-yl)methoxy]butoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCOCC1(CC)COC1 UWFHYGTWXNRUDH-UHFFFAOYSA-N 0.000 description 1
- GBDPVIKGIRHANI-UHFFFAOYSA-N 3-ethyl-3-[6-[(3-ethyloxetan-3-yl)methoxy]hexoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCCOCC1(CC)COC1 GBDPVIKGIRHANI-UHFFFAOYSA-N 0.000 description 1
- HPINXYMPRYQBGF-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxy]-2,2-bis[(3-ethyloxetan-3-yl)methoxymethyl]propoxy]methyl]oxetane Chemical compound C1OCC1(CC)COCC(COCC1(CC)COC1)(COCC1(CC)COC1)COCC1(CC)COC1 HPINXYMPRYQBGF-UHFFFAOYSA-N 0.000 description 1
- QGXMKEGFTNLFQQ-UHFFFAOYSA-N 3-ethyloxetan-3-ol Chemical compound CCC1(O)COC1 QGXMKEGFTNLFQQ-UHFFFAOYSA-N 0.000 description 1
- UYCGHYYLNBVUGK-UHFFFAOYSA-N 4-(ethenoxymethyl)-1,3-dioxolan-2-one Chemical compound C=COCC1COC(=O)O1 UYCGHYYLNBVUGK-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- LHQZPSHKKVHDTB-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) oxalate Chemical compound C1CC2OC2CC1COC(=O)C(=O)OCC1CC2OC2CC1 LHQZPSHKKVHDTB-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ASQQEOXYFGEFKQ-UHFFFAOYSA-N dioxirane Chemical compound C1OO1 ASQQEOXYFGEFKQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
Abstract
The present invention relates to a composition for forming an anisotropic conductive film, and more particularly, to a cationically polymerizable anisotropic conductive film using an alicyclic epoxy compound, which has a shelf life superior to that of the conventional one while securing the same curing temperature and connection reliability. The anisotropic conductive film includes: the film forming resin, the cationic polymer, the cationic initiator and the conductive particles are characterized in that the film forming resin is polyester acrylic resin.
Description
Technical Field
The present invention relates to a cured composition, and in particular to the use of the cured composition in anisotropic conductive films.
Background
Anisotropic conductive films refer to films formed of uniformly dispersed fine conductive particles in an adhesive member, and are widely used in electrical connection of small electric components (such as IC chips or driving circuit devices) to substrates or substrates used in the manufacture of electronic products (such as liquid crystal displays, personal computers, portable communication devices, etc.).
The composition for forming an anisotropic conductive film is generally composed of conductive particles and an insulating resin. As the insulating resin, a thermosetting resin is generally used, which includes, for example, an epoxy resin and an acryl resin. The epoxy type thermosetting resin has excellent adhesive strength to various surfaces and has high heat resistance and moisture resistance. But epoxy resins require high curing temperatures and long curing times. On the other hand, the acryl-based thermosetting resin has a low curing temperature and a short curing time. However, the acryl resin does not have good adhesive strength, heat resistance or moisture resistance.
Disclosure of Invention
In view of the shortcomings in the application of the existing anisotropic conductive films, the invention aims to provide a curing composition which has excellent connectivity and heat-resistant stability.
In order to achieve the technical effects, the technical scheme adopted by the invention is as follows:
An anisotropic conductive film for anisotropically electrically connecting a terminal of a first circuit member and a terminal of a second circuit member, comprising: the film forming resin, a cationic polymer, a cationic initiator and conductive particles, and is characterized in that the film forming resin is polyester acrylic resin;
further, the viscosity of the polyester acrylic resin is 10000-50000 (25 ℃/mPa. S);
further, the polyester acrylic resin is preferably CN2200, CN2251, EB830, LR8793, LR8799, changxing 6331;
further, the proportion of the film-forming resin in the entire formulation is preferably 10 to 70% by mass, more preferably 30 to 60% by mass.
Further, the cationic polymer can be one or more of aliphatic epoxy compounds and vinyl ether compounds.
Further, other aliphatic epoxy compounds are preferably hexahydrobisphenol A diglycidyl ether, 3, 4-epoxycyclohexenylmethyl-3 ',4' -epoxycyclohexene formate, dicyclohexyl diepoxide, or oxetane compounds.
The other aliphatic epoxy compound may be a homopolymer of glycerol triglycidyl ether, ethylene glycol glycidyl ether, 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate, bis (3, 4-epoxycyclohexylmethyl) oxalate, trimethylol propane glycidyl ether, 1, 2-epoxy-4-vinylcyclohexane, 2' - [ (1-methylethylene) bis (4, 1-phenylenediamaldehyde) ] dioxirane (bisphenol A type epoxy resin), 3-oxiranyl 7-oxabicyclo [4,1,0] heptane, ethylene glycol diglycidyl ether, C12-C14 alkyl glycidyl ether, 3-methyl-3-vinylmethyloxetane, 3-methyl-3-vinylmethyloxy polyethoxylated methyloxetane, 1, 4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1, 6-bis (3-ethyl-3-oxetanylmethoxy) hexane, pentaerythritol, tris (3-ethyl-3-oxethyl) oxetanylmethyl ether, 3-hydroxy [ (3-methyl) oxetane, 3-hydroxy ] 3-ethyloxy) methyl-3-ethyloxetane, 3-hydroxy-3-ethyloxetane One or more of polyethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tricyclodecanediyl dimethylene (3-ethyl-3-oxetanylmethyl) ether, trimethylol propane tris (3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, 2-methyl-2-vinyloxetane, 2-ethyl-2-vinyloxetane, and the like;
Further, the vinyl ether compound may be selected from vinyl ethers, 1-propenyl ethers, 1-butenyl ethers, 1-pentenyl ethers, preferably vinyl ethers. More preferably, the vinyl ether compound may be one or a combination of two or more selected from triethylene glycol divinyl ether, 1, 4-cyclohexanedimethanol divinyl ether, 4-hydroxybutyl vinyl ether, glycerol carbonate vinyl ether, dodecyl vinyl ether, and the like.
Further, the ratio of the alicyclic epoxy compound to the vinyl ether compound in the entire formulation is preferably 20 to 80% by mass, more preferably 30 to 60% by mass.
Further, the cationic polymerization initiator preferably contains a quaternary ammonium salt-based thermal acid generator, and as a specific example of the quaternary ammonium salt-based thermal acid generator, TR-TAG-50101、TR-TAG-50102、TR-TAG-50108、TR-TAG-50301、TR-TAG-50302、TR-TAG-50308、TR-TAG-50201、TR-TAG-50202 manufactured by Severe electronic materials Co., ltd;
further, the proportion of the cationic polymerization initiator in the entire formulation is preferably 0.1 to 10% by mass, more preferably 1 to 5% by mass.
Further, the conductive particles may be suitably selected from conductive particles used for conventionally known anisotropic conductive films. Examples include: metal particles such as nickel, cobalt, silver, copper, gold, and palladium, alloy particles such as solder, and metal-coated resin particles. More than 2 kinds may be used in combination.
Further, the proportion of the conductive particles in the entire formulation is preferably 2 to 15% by mass, more preferably 5 to 10% by mass.
Further, the thickness of the anisotropic conductive film of the present invention is preferably 3 to 50. Mu.m, more preferably 5 to 20. Mu.m.
Further, the invention also comprises a manufacturing method of the anisotropic conductive film: the conductive particles, the cationic polymerization initiator, and the adhesive composition are dissolved in an organic solvent to prepare a composition, and the coating material is formed into a film by a known film forming method.
The anisotropic conductive film of the present invention may be a single layer, but an insulating resin layer may be laminated so as not to reduce particle trapping property during anisotropic conductive connection and to reduce the amount of conductive particles used, thereby reducing manufacturing cost and saving underfill operation.
The anisotropic conductive film of the present invention is preferably used for anisotropic conductive connection of 1 st electronic components such as IC chips, IC modules, FPCs, and the like, and 2 nd electronic components such as plastic substrates, glass substrates, rigid substrates, ceramic substrates, FPCs, and the like. The connection structure for anisotropically conductive connection of the 1 st electronic component and the 2 nd electronic component by using the anisotropic conductive film of the present invention is also part of the present invention. As a method for connecting electronic components using an anisotropic conductive film, a known method can be used.
Detailed Description
The invention will be further illustrated with reference to specific examples, which should not be construed as limiting the scope of the invention.
< Fabrication of Anisotropic conductive film >)
The following compounds in parts by mass shown in Table 1 were weighed and uniformly mixed, and the mixed mixture was applied to silicone-treated PET (polyethylene terephthalate) with a bar coater so that the average thickness thereof after drying was 12. Mu.m, and dried at 70℃for 5 minutes to prepare an insulating resin layer.
TABLE 1
< Manufacturing of bonded body >
An insulating resin layer was laminated on the conductive particle-containing layer at 60℃and 5MPa, whereby an anisotropic conductive film sandwiched between a pair of PET release films having a thickness of 50. Mu.m was obtained.
< Evaluation >
The anisotropic conductive films sandwiched between a pair of PET release films were put into a constant temperature and humidity chamber set at 40% humidity, 25 ℃ or 30 ℃ and sampled every 24 hours after the putting, and the following release property and press-fit property evaluations were performed, and the shelf life characteristics were comprehensively evaluated based on the evaluation results. The results obtained are shown in table 2.
< Peelability >
The PET release film on the conductive particle-containing layer side of the anisotropic conductive film was peeled off, and the anisotropic conductive film was attached to the plain glass from the conductive particle-containing layer side, to prepare a laminate of the plain glass and the anisotropic conductive film. The laminate was placed with the green glass side in contact with a hot plate set at 45 ℃, and pressure was applied by hand from the anisotropic conductive film side, followed by cooling to room temperature. After cooling, the PET release film on the insulating resin layer side was peeled from the laminate, and it was confirmed whether only the PET release film was peeled from the plain glass, but the anisotropic conductive film was not peeled.
Press fit >
An anisotropic conductive film was sandwiched between a test IC chip and a test substrate so that an insulating resin layer was placed on the side of the IC chip, and heated and pressurized (120 ℃ C., 60MPa, 5 seconds) to prepare a connection for evaluation. The indentation state of the produced joint was checked, and whether the indentation was not thinned or disappeared was checked.
< Heat stability >)
The time point at which the anisotropic conductive film was peeled from the green glass in the peeling property evaluation was taken as the heat-resistant period. In addition, in the case where the anisotropic conductive film was not peeled from the green glass in the peeling property evaluation, the point of time at which the indentation was thinned (disappeared) in the press-fit evaluation was taken as the heat-resistant period.
Table 2 evaluation of application Properties
As is clear from the above table, the adhesive composition of the present invention has excellent heat resistance after application, and can maintain the adhesiveness of the product for a long period of time.
The foregoing description is only of the preferred embodiments of the invention and is not intended to limit the invention.
Claims (10)
1. An anisotropic conductive film for anisotropically electrically connecting a terminal of a first circuit member and a terminal of a second circuit member, comprising: cationic polymer, cationic initiator and conductive particles, characterized in that the film forming resin is polyester acrylic resin.
2. The polyester acrylic resin according to claim 1, characterized in that its viscosity is 10000-50000 (25 ℃/mPa x s).
3. The polyester acrylic resin according to claim 1 or 2 is CN2200, CN2251, EB830, LR8793, LR8799, changxing 6331.
4. The anisotropic conductive film according to claim 1, wherein the proportion of the film forming resin in the entire formulation is 10 to 70 mass%.
5. The anisotropic conductive film of claim 1, wherein: the cationic polymer is one or more of aliphatic epoxy compounds and vinyl ether compounds.
6. The anisotropic conductive film according to claim 1 or 5, wherein the cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator.
7. The cationic polymerization initiator according to claim 6, wherein the quaternary ammonium salt-based thermal acid generator is TR-TAG-50101、TR-TAG-50102、TR-TAG-50108、TR-TAG-50301、TR-TAG-50302、TR-TAG-50308、TR-TAG-50201、TR-TAG-50202.
8. The cationic polymerization initiator according to claim 1 or 6, wherein the proportion of the cationic polymerization initiator in the whole formulation is preferably 0.1 to 10% by mass, more preferably 1 to 5% by mass.
9. A connection structure obtained by anisotropically electrically connecting the 1 st electronic component and the 2 nd electronic component by using the anisotropic conductive film according to any one of claims 1 to 8.
10. The anisotropic conductive film according to claim 1 to 6, which is used for an IC chip, an IC module, a1 st electronic component such as FPC, a plastic substrate, a glass substrate, a rigid substrate, a ceramic substrate, and an FPC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410584558.2A CN118516074A (en) | 2024-05-12 | 2024-05-12 | Composition for forming anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410584558.2A CN118516074A (en) | 2024-05-12 | 2024-05-12 | Composition for forming anisotropic conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118516074A true CN118516074A (en) | 2024-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410584558.2A Pending CN118516074A (en) | 2024-05-12 | 2024-05-12 | Composition for forming anisotropic conductive film |
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| Country | Link |
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| CN (1) | CN118516074A (en) |
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- 2024-05-12 CN CN202410584558.2A patent/CN118516074A/en active Pending
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