CN118475103A

CN118475103A - Insulation shielding structure and electronic equipment

Info

Publication number: CN118475103A
Application number: CN202310149531.6A
Authority: CN
Inventors: 方乐安; 李志涛; 刘绪磊; 左鹏; 史少飞
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-02-09
Filing date: 2023-02-09
Publication date: 2024-08-09

Abstract

An insulating shielding structure is applied to shielding electromagnetic interference of an interfered source and electric insulation between the interfered source and the interfering source; the interfered source and the interference source are arranged on the substrate; the insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source so as to separate the interference source and the interfered source; the insulating shield structure includes: an insulating layer for electrically insulating the source of interference from the source of interfered interference; and the metal layer is tightly attached to the insulating layer and is used for shielding electromagnetic interference generated by the interference source to the interfered source. Therefore, whether the interference source and the interfered source are arranged on the upper surface or the lower surface of the substrate, the insulation shielding structure can realize electrical insulation and electromagnetic interference shielding between the interference source and the interfered source, further, the distance between the interference source or the interfered source is reduced, and the layout density of the interference source or the interfered source is improved.

Description

Insulation shielding structure and electronic equipment

Technical Field

The present application relates to the field of electronic technologies, and in particular, to an insulating shielding structure and an electronic device.

Background

With the development trend of high safety, high power density and high operating frequency of computer technology, the density of electronic components in electronic equipment is higher, and electromagnetic interference and electrical insulation problems are more and more challenged. Taking a switching power supply as an example, under the development trend of higher power density and higher working frequency of a server, a network power supply and the like, a larger voltage peak and a worse electromagnetic coupling environment are caused. Therefore, electromagnetic interference and electrical insulation caused by high-density electronic components are increasingly challenged.

Disclosure of Invention

In order to solve the above-mentioned problems, an embodiment of the present application provides an insulation shielding structure, including: an insulating layer; and the metal layer is closely attached to the insulating layer. The electromagnetic interference problem of the interfered source can be solved, and the electric insulation problem between the interfered source and the interference source can be solved.

In a first aspect, the present application provides an insulating shielding structure for shielding electromagnetic interference of a interfered source and electrical insulation between the interfered source and the interfering source; the interfered source and the interference source are arranged on the substrate; the insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source so as to separate the interference source and the interfered source; the insulating shield structure includes: an insulating layer for electrically insulating the source of interference from the source of interfered interference; and the metal layer is tightly attached to the insulating layer and is used for shielding electromagnetic interference generated by the interference source to the interfered source.

In this embodiment, an insulating shielding structure is provided between the interference source and the interfered source, the insulating shielding structure including: insulating layer, metal layer. Wherein, the insulating layer can realize the electrical insulation of the interference source and the interfered source. The metal layer is tightly attached to the insulating layer, so that electromagnetic interference shielding of an interference source and an interfered source can be realized. The insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source, so that the insulating shielding structure can realize electric insulation and electromagnetic interference shielding between the interference source and the interfered source no matter the interference source and the interfered source are arranged on the upper surface or the lower surface of the substrate. The insulating shielding structure penetrates through the substrate, so that the interference source or the interfered source can be arranged on the upper surface or the lower surface of the substrate, and the position of the interference source or the interfered source which can be laid out is increased. Further, the distance between the interference sources or the interfered sources is reduced, and the layout density of the interference sources or the interfered sources is improved. The requirements of more interference sources or the layout of the interfered sources are met under the requirement of a limited space or a smaller space, so that more functions are realized.

In one embodiment, the insulating layer is a ceramic dielectric layer.

In the embodiment, the ceramic material has good high-frequency performance and electrical performance, high thermal conductivity, excellent chemical stability and thermal stability and other performances, and is an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. In terms of transmission loss, the transmission loss of the ceramic board is low. The ceramic plate has low dielectric constant, low dielectric loss and strong electric conductivity. The ceramic plate has high heat conductivity, small heat resistance and low transmission loss.

In another embodiment, the metal layer is a copper dielectric layer or an aluminum dielectric layer.

In this embodiment, the copper dielectric layer or the aluminum dielectric layer is made of a metal conductive material, has an electromagnetic shielding effect, and can shield electromagnetic signals. The copper dielectric layer or the aluminum dielectric layer can shield electromagnetic interference generated by the interference source, so that the interfered source is protected from electromagnetic interference. The copper dielectric layer or the aluminum dielectric layer also has good plasticity, and is convenient to be tightly attached to the insulating layer.

In another embodiment, the metal layer forms a plating layer that is in close contact with the insulating layer.

In the embodiment, the metal layer forms a plating layer, and the method has the advantages of low cost, simple process and good shielding effect. The plating layer formed by the metal layer has good electric conduction and magnetic conduction properties. The plating layer formed by electroplating is uniform and firm, has wide application base materials, and has the characteristics of high binding force, high hardness, excellent wear resistance and corrosion resistance, good weldability, special electromagnetic performance and the like. The heat conduction resistance between the plating layer formed by the metal layer and the surface of the plated insulating layer is small, so that the heat dissipation performance of the insulating shielding structure is improved.

In another embodiment, the dimensions of the metal layer are adapted to the interference source or the interfered source.

In this embodiment, the laying area of the metal layer is determined based on the external dimensions of the interference source, the electromagnetic interference intensity, the electromagnetic interference shielding requirement, and the like. When the interference source emits electromagnetic interference, the metal layer can effectively shield the electromagnetic interference emitted by the interference source. The area of the metal layer is determined based on the external dimensions of the interfered source, the electromagnetic interference intensity, the electromagnetic interference shielding requirement and the like. Before the interfered source is subjected to electromagnetic interference, the metal layer can effectively shield the electromagnetic interference and protect the interfered source from being influenced by the electromagnetic interference. Meanwhile, the existence area of an unnecessary metal layer is reduced, the related cost of the metal layer is reduced, and the production efficiency of the insulating shielding structure is improved.

In another embodiment, the substrate includes: a heat conducting layer; the metal layer is fixedly connected with the heat conducting layer.

In this embodiment, the higher density of the electronic components makes the electronic device generate more heat during operation, and the heat dissipation problem becomes more serious. The metal layer is fixedly connected with the heat conduction layer of the substrate. The insulating layer and the metal layer can realize heat dissipation to the substrate. The heat dissipated by the substrate can be heat generated in the working process of the electronic components, or heat transferred to the substrate by other heat sources through conduction, convection, radiation and the like.

In another embodiment, the metal layer and the heat conducting layer are fixedly connected in a welding or bonding mode.

In this embodiment, the welding material for welding has a heat conductive property, or the bonding material for bonding has a heat conductive property. After the metal layer is welded or bonded with the heat conducting layer, the strength of the joint is high, and the joint is not easy to separate. In the process of radiating the substrate by the insulating layer and the metal layer, the welding part or the bonding part of the metal layer and the heat conducting layer has heat conducting property and good heat radiating property. At the same time, the welded or bonded portion does not fail due to overheating, such as breakage, peeling, or the like.

In another embodiment, the metal layer is provided in a plurality of layers, provided on different sides of the insulating layer.

In the embodiment, the metal layers are arranged in multiple layers, so that the problem that the electromagnetic interference shielding effect of partial areas of the metal layers is poor is solved, and the electromagnetic interference shielding effect of the insulating shielding structure is better. The metal layer sets up to the multilayer, and the heat conduction layer of base plate carries out heat transfer and heat dissipation through multilayer metal layer, has increased insulating shielding structure's heat radiating area, has improved insulating shielding structure's radiating effect.

In another embodiment, the insulating layers are provided in a plurality of layers, and the metal layer is provided between each two insulating layers of the plurality of insulating layers.

In this embodiment, the insulating layer is provided in a plurality of layers, which solves the problem that the electrical insulation effect of a partial region of the insulating layer is poor, and makes the electrical insulation effect of the insulating shield structure better. The insulating layer is arranged in a plurality of layers, and the heat conduction layer of the substrate sequentially transfers heat to the metal layer and the plurality of insulating layers. The structure of the multi-layer insulating layer increases the heat dissipation area and improves the heat dissipation effect of the insulating shielding structure.

In another embodiment, the insulating shielding structure penetrates the substrate in an orthogonal or non-orthogonal manner.

In this embodiment, the insulating shielding structure is disposed at a predetermined angle to the substrate. When the preset angle is 90 degrees, the insulating shielding structure penetrates through the substrate in an orthogonal mode; when the preset angle is an angle other than 90 degrees, the insulating shielding structure penetrates through the substrate in a non-orthogonal mode. The insulating shielding structure penetrates through the substrate in an orthogonal or non-orthogonal mode, so that the insulating shielding structure and electronic components on the substrate are free from interference, or electromagnetic interference shielding effect, electric insulation effect, heat dissipation effect or electromagnetic interference shielding effect, electric insulation effect or heat dissipation effect with optimal effect can be achieved.

In another embodiment, the interference source includes a first interference source and a second interference source, the first interference source is disposed on the upper surface of the substrate, and the second interference source is disposed on the lower surface of the substrate; the first interference source and the second interference source are positioned on one side of the insulating shielding structure, and the interfered source is positioned on the other side of the insulating shielding structure.

In this embodiment, since the insulating shielding structure penetrates through the substrate, when the interference sources exist on the upper surface and the lower surface of the substrate at the same time, the insulating shielding structure can realize electromagnetic interference shielding and electrical insulation of the interference sources on different surfaces of the substrate. The interference source is protected from interference of interference sources on different surfaces of the substrate, and the electromagnetic shielding effect and the electric insulation effect of the electronic equipment are improved.

In another embodiment, the interfered sources include a first interfered source and a second interfered source, the first interfered source is disposed on an upper surface of the substrate, and the second interfered source is disposed on a lower surface of the substrate; the first interfered source and the second interfered source are positioned on one side of the insulating shielding structure, and the interference source is positioned on the other side of the insulating shielding structure.

In this embodiment, since the insulating shielding structure penetrates through the substrate, when the interfered sources exist on the upper surface and the lower surface of the substrate at the same time, the insulating shielding structure can realize the protection of electromagnetic interference shielding and electrical insulation on the interfered sources on different surfaces. The insulating shielding structure can protect the interfered sources on different surfaces of the substrate from interference from the interfered sources. The insulating shielding structure can protect a plurality of interfered sources, and improves the electromagnetic shielding effect and the electric insulating effect of the electronic equipment.

In another embodiment, the substrate is a printed circuit board; the interference source and the interfered source are electronic components.

In this embodiment, the printed circuit board is a scene where electromagnetic interference occurs, and is also an object requiring electrical insulation. The main sources of interference and interfered sources of printed circuit boards requiring electromagnetic interference shielding and electrical insulation are various electronic components. Because the insulating shielding structure penetrates through the printed circuit board, when the interference source exists on the same side or different surfaces of the printed circuit board or the interference source exists on different surfaces of the printed circuit board, the insulating shielding structure can realize electromagnetic interference shielding and electric insulation on the interference source. Meanwhile, the interfered source on the printed circuit board can be protected from being interfered by the interference source. The insulating shielding structure increases the protection range of the interfered source and improves the electromagnetic shielding effect, the electrical insulating effect or the heat dissipation effect of the electronic equipment comprising the printed circuit board. Illustratively, by measuring the intensity of electromagnetic interference present, the electromagnetic interference conditions of the printed circuit board with and without the insulating shielding structure are compared; test results show that the insulating shielding structure provided by the embodiment of the application can reduce electromagnetic interference noise by more than 10 dB. Illustratively, when an insulating shielding structure is used, the distance of electrical insulation can be reduced from 8mm to about 2mm by 75%; the distance between the interference source and the interfered source is reduced, the layout area is reduced from 15mm 10mm to 9mm 10mm, and the layout density is increased by 40%. Illustratively, the heat-generating conductors of the working assembly are connected to the heat-generating layer for heat transfer and then dissipated through the insulating shielding structure; and compared with the temperature simulation test result, the insulating shielding structure reduces the temperature of the heating conductor by more than 5 ℃.

In a second aspect, the present application provides an electronic device comprising: a substrate, an interference source, an interfered source, any one of the above insulating shielding structures; the interfered source and the interference source are arranged on the substrate; the insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source so as to separate the interference source and the interfered source.

Drawings

The drawings that accompany the description can be briefly described as follows in the embodiments or in the prior art,

Fig. 1 is a schematic diagram of a front view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a top view of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a front view of another electronic device according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a front view of an insulation shielding structure according to an embodiment of the present application;

fig. 5 is a schematic structural view of a right side view of an insulation shielding structure according to an embodiment of the present application;

Fig. 6 is a schematic diagram illustrating a heat dissipation process of an insulation shielding structure according to an embodiment of the present application;

Fig. 7 is a schematic diagram of a heat dissipation process of an insulation shielding structure through a connection structure according to an embodiment of the present application;

FIG. 8 is a schematic view of an insulating shielding structure according to an embodiment of the present application;

FIG. 9 is a schematic diagram of an adapting relationship between an area of an insulation shielding structure and an interference source or an interfered source according to an embodiment of the present application;

FIG. 10 is a schematic view of a multi-layered metal layer of an insulation shield structure according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a multi-layered metal layer of an insulation shielding structure according to an embodiment of the present application;

Fig. 12 is a schematic view of a multi-layer metal layer of an insulation shielding structure provided in an embodiment of the present application disposed on different sides of an insulation layer;

FIG. 13 is a schematic view of a multi-layer insulating layer of an insulating shielding structure according to an embodiment of the present application;

FIG. 14 is a schematic view of an insulation shielding structure with multiple interference sources according to an embodiment of the present application;

FIG. 15 is a schematic view of an insulation shielding structure with multiple interfered sources according to an embodiment of the present application;

FIG. 16 is a schematic view of an insulation shielding structure with multiple interference sources and multiple interfered sources according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of a PCB board assembly of a switching power supply, which is a working assembly of an insulation shielding structure provided in an embodiment of the present application;

fig. 18 is a schematic structural view of an insulation shielding structure applied to a PCB assembly according to an embodiment of the present application;

fig. 19 is a schematic flow chart of a manufacturing process of an insulation shielding structure applied to a PCB assembly according to an embodiment of the present application;

Fig. 20 is a schematic structural view of another insulation shielding structure applied to a PCB assembly according to an embodiment of the present application;

fig. 21 is a schematic flow chart of a manufacturing process of another insulation shielding structure applied to a PCB assembly according to an embodiment of the present application;

fig. 22 is a schematic diagram of electromagnetic interference test results of a PCB board assembly without using an insulating shielding structure provided in an embodiment of the present application;

Fig. 23 is a schematic diagram of an electromagnetic interference test result of a PCB board assembly using an insulation shielding structure according to an embodiment of the present application;

FIG. 24 is a schematic view showing the composition of an operational assembly without the use of an insulating shielding structure provided in an embodiment of the present application;

FIG. 25 is a schematic view showing the composition of an operational assembly using an insulating shielding structure provided in an embodiment of the present application;

FIG. 26 is a schematic diagram of temperature simulation test results of an operational assembly without the use of an insulating shielding structure provided in an embodiment of the present application;

Fig. 27 is a schematic diagram of temperature simulation test results of an operational assembly using an insulating shielding structure according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In the description of the present application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or by an abutting or integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances. In embodiments of the application, "contacting" or "coupling" may refer to direct contact between components, or may refer to contact between components by an adhesive or a thermally conductive gel.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

With the development trend of high safety, high power density and high working frequency of computer technology, the density of electronic components in electronic equipment is higher and the voltage peak is larger. Electromagnetic interference (Electromagnetic Interference, EMI), electrical insulation problems of electronic devices are increasingly challenged.

There is a solution in which a multilayer printed circuit board (Printed Circuit Board, PCB) with copper laid on the inner layer is assembled on the upper surface (Top surface) of the device structure where electromagnetic interference shielding and electrical insulation are required. The copper dielectric layer is used for shielding electromagnetic interference between interference sources and interfered sources on two sides of the multilayer PCB; the surface layer of the PCB is used for realizing electric insulation between interference sources and interfered sources on two sides of the multilayer PCB. This solution does not allow to realize the problems of electromagnetic interference, electrical insulation between the source of interference and the source of interfered on the lower surface (Bottom surface) of the device structure.

Therefore, the embodiment of the application provides a solution, an insulating shielding structure, which is arranged on the substrate of the electronic equipment in a penetrating way. In the embodiment of the application, the insulating shielding structure penetrates through the upper surface (Top surface) and the lower surface (Bottom surface) of the device substrate. The insulation shielding structure realizes the electromagnetic interference problem and the electric insulation problem between the Top-plane interference source and the interfered source, and realizes the electromagnetic interference problem and the electric insulation problem between the Bottom-plane interference source and the interfered source.

In one embodiment, the insulating shielding structure also implements electromagnetic interference problems and electrical insulation problems between the Top-plane interference source or the interfered source and the Bottom-plane interference source or the interfered source.

As shown in fig. 1 and 2, an embodiment of the present application provides an electronic device 100, including: an insulating shielding structure 110, a working assembly 120 requiring electromagnetic interference shielding and electrical insulation. The insulating shield structure 110 includes: an insulating layer 111, a metal layer 112. The working assembly 120 includes a substrate 121, at least one interference source, at least one interfered source. The working module 120 is a module that needs electromagnetic interference shielding and electrical insulation in the electronic device when in the working state. At least one interfered source and at least one interfering source are disposed on the substrate 121. The insulating shielding structure 110 is disposed through the substrate 121 and located between the interference source and the interfered source to separate the interference source and the interfered source.

In one embodiment, at least one interferer is proximate to insulating layer 111 and at least one interfered source is proximate to metal layer 112, e.g., interferer 122, interfered source 123 shown in fig. 1. In one embodiment, at least one interfered source is proximate to insulating layer 111 and at least one interfered source is proximate to metal layer 112, e.g., interfered source 122, interference source 123 shown in FIG. 1. It is further understood that the electronic component facing the insulating layer 111 may be either an interference source or an interfered source; the electronic component on the side facing the metal layer 112 may be either an interference source or an interfered source.

In one embodiment, the electronic device 100 may be a mobile phone, a notebook computer, a tablet computer, a switching power supply, or the like. The electronic components may be filters, resistors, capacitors, transistors, or integrated circuits, etc., and are optional in the embodiment of the present invention.

In one embodiment, as shown in fig. 1, at least one interfering source and at least one interfered source may be distributed on the same side of the substrate 121. As shown in fig. 3, at least one source of interference and at least one source of interfered may also be distributed on different sides of the substrate 121.

In one embodiment, when at least one interference source and at least one interfered source are distributed on the same side of the substrate 121, the insulating shielding structure 110 penetrates through the upper surface (Top surface) and the lower surface (Bottom surface) of the substrate 121, thereby realizing at least one interference source of the Top surface, electromagnetic interference problem between at least one interfered source, and electrical insulation problem, and simultaneously realizing at least one interference source of the Bottom surface, electromagnetic interference problem between at least one interfered source, and electrical insulation problem.

In one embodiment, when at least one interference source, at least one interfered source are distributed on different sides of the substrate 121, the insulating shielding structure 110 implements an electromagnetic interference problem, an electrical insulation problem, or the insulating shielding structure 110 implements an electromagnetic interference problem, an electrical insulation problem, between at least one interference source of the Top plane and at least one interfered source of the Bottom plane. It will be further appreciated that when the substrate 121 has electromagnetic interference shielding and electrical insulation functions, at least one interference source, at least one interfered source, are distributed on different sides of the substrate 121, and electromagnetic interference and electrical insulation interference generated by at least one interference source may be shielded by both the substrate 121 and the insulation shielding structure 110. When the substrate 121 does not have electromagnetic interference shielding and electrical insulation functions, at least one interference source and at least one interfered source are distributed on different sides of the substrate 121, and electromagnetic interference and electrical insulation interference generated by the at least one interference source penetrate through the substrate 121 and are shielded by the insulation shielding structure 110.

In one embodiment, as shown in fig. 2, a through hole or a groove is formed on the substrate 121 for the insulating shielding structure 110 to penetrate through the substrate 121.

In one embodiment, the substrate 121 includes a thermally conductive layer or line with which the metal layer 112 of the insulating shield structure 110 is in communication. The insulating shield structure 110 may realize a heat dissipation function of the substrate 121. The heat source of the substrate 121 is mainly heat generated by electronic components mounted on the substrate 121, or heat generated by conduction, convection, and radiation of heat sources such as other devices to the substrate 121.

In one embodiment, the manner in which the metal layer 112 of the insulating shielding structure 110 communicates with the heat conducting layer or the heat conducting line of the substrate 121 includes: welding, bonding, abutment, etc.

In one embodiment, when the communication mode is welding, welding spots may be disposed at the positions of the grooves corresponding to the heat conducting layers or the heat conducting lines, or welding spots may be disposed at the connecting positions of the metal layers 112 of the insulating shielding structure 110, or the metal layers 112 and the heat conducting layers or the heat conducting lines may be directly welded without disposing welding spots.

In one embodiment, when the communication means is bonding, the bonding agent may be in a solid state or in a liquid state. The adhesive may be an adhesive having heat conductive property or a general adhesive.

In one embodiment, when the communication manner is abutting, the metal layer 112 may be closely attached to the heat conductive layer or the heat conductive line of the substrate 121 by providing a groove as shown in fig. 2, or by mechanical means. For example, when the close fitting is achieved by the grooves, protruding points, protruding blocks, or protruding bars may be provided at the groove positions, so that the heat conductive layers or the heat conductive lines of the substrate 121 are closely fitted. Illustratively, when the close fitting is achieved mechanically, the heat conductive layer or the heat conductive line of the substrate 121 may be closely fitted by providing a jackscrew or other clamping means.

In one embodiment, the electronic device 100 is a switching power supply. The large EMI of the switching power supply is due to the fact that a plurality of electronic components, such as a MOS (Metal-Oxide-Semiconductor Field-Effect Transistor, a MOSFET, abbreviated as MOS) and a freewheeling diode, are always in a switching state. Taking a switching power supply comprising an MOS tube as an example, when the switching power supply works normally, voltages at two ends of a source electrode and a drain electrode of the MOS tube are similar to a periodic pulse signal, rising edges and falling edges are approximately about 10ns, and a duty ratio is related to the working state of a module and has relatively large voltage variation dv/dt and current variation di/dt. According to the fourier transform, the periodic pulses are rich in spectral components, and the spectral components corresponding to the rising edge of 10ns can reach 300MHz or so, so that the test frequency of electromagnetic compatibility EMC (Electromagnetic Magnetic Compatibility, EMC) is completely covered.

In one embodiment, the electrical insulation is designed to meet the requirements of safety regulations. The definition of safety regulations is to realize the safety of products in application in the form of regulations, and is short for safety regulations (laws and administrative regulations) and safety standards. The purpose is to reduce various injuries of products to human bodies and property, including electric shock, fire, overheat, mechanochemical and radiation, etc., and reduce the running risk of enterprises. The role of electrical insulation is very important. The insulating layer 111 of the insulating shielding structure 110 penetrates through the upper surface and the lower surface of the substrate 121, and electrically insulates the interference source and the interfered source on both sides of the insulating layer 111.

In one embodiment, the heat dissipation problem is one of the bottlenecks that limit the high density development of electronic components of electronic devices. Typically, the transfer of heat involves three ways: conduction, convection, and radiation. The heat dissipation of a general system is evaluated and optimized from the three points so as to meet the optimal design of the heat of the system. For natural cooling equipment, heat is dissipated through a heat conducting medium, and generally, heat dissipation is conducted by adopting modes of copper bars, buried copper, cold pipes, cold plates, ceramic substrates and the like. Under the condition that the power of the power supply is continuously increased and the volume is not shortened and reduced, the metal layer 112 of the insulating shielding structure 110 is communicated with a heat conducting layer or a heat conducting circuit inside the substrate of the electronic equipment. The heat of the substrate 121 is dissipated through the insulating layer 111 and the metal layer 112 of the insulating shield structure 110. The insulating shielding structure 110 and the substrate 121 are disposed at a predetermined angle, and are disposed, for example, perpendicularly and orthogonally, so that the heat dissipation effect is good.

As shown in fig. 4 and 5, an embodiment of the present application provides an insulating shielding structure 110 for shielding electromagnetic interference of a interfered source and electrical insulation between the interfered source and the interfering source. The interfered source and the interfering source are disposed on the substrate 121. The insulating shielding structure 110 is disposed through the substrate 121 and located between the interference source and the interfered source to separate the interference source and the interfered source. The insulating shield structure 110 includes: an insulating layer 111, a metal layer 112. An insulating layer 111 for electrically insulating between the interference source and the interfered source; the metal layer 112 is closely attached to the insulating layer, and is used for shielding electromagnetic interference generated by the interference source to the interfered source.

An insulating shielding structure 110 is disposed between the source of interference and the source of interfered, the insulating shielding structure 110 comprising: an insulating layer 111, a metal layer 112. The insulating layer 111 can electrically insulate the interference source from the interfered source. The metal layer 112 is closely attached to the insulating layer 111, so that electromagnetic interference shielding between the interference source and the interfered source can be realized. The insulating shielding structure 110 is disposed between the interference source and the interfered source through the substrate 121, so that the edge shielding structure 110 can electrically insulate and electromagnetic interference between the interference source and the interfered source no matter the interference source and the interfered source are disposed on the Top surface or the Bottom surface of the substrate 121. The insulating shielding structure 110 is arranged on the substrate 121 in a penetrating manner, so that an interference source or an interfered source can be arranged on the Top surface or the Bottom surface, the position of the electronic components, which can be laid out, is increased, the mounting distance between the electronic components is reduced, the density of the electronic components can be increased, and the requirement of realizing more electric control functions under the requirement of a limited space or a smaller space is met.

In one embodiment, the substrate 121 includes: and a heat conducting layer. The metal layer 112 is fixedly connected with the heat conductive layer. The heat conducting layer of the substrate 121 may be a heat conducting line, a heat conducting pipeline, or other structures for conducting heat in the substrate 121. The heat conductive layer may be located at an external position or an internal position of the substrate 121, or may be the substrate 121 itself.

The high density of the electronic components makes the heat generated by the electronic equipment more and the heat dissipation problem more severe in the working process of the electronic components. The metal layer 112 is fixedly connected with the heat conductive layer of the substrate 121. The insulating layer 111 and the metal layer 112 can dissipate heat from the substrate 121. The heat dissipated by the substrate 121 may be heat generated during the operation of the electronic component, or may be heat transferred to the substrate 121 by other heat sources through conduction, convection, radiation, or the like.

As shown in fig. 6, in one embodiment, the heat dissipation process is described using the heat generated by the electronic components on the substrate 121 as an example. The heat generated by the electronic components is transferred to the heat conductive layer of the substrate 121. The thermally conductive layer of the substrate 121 transfers heat. The heat conductive layer of the substrate 121 transfers heat to the metal layer 112 through the fixed connection of the metal layer 112 and the heat conductive layer. The insulating layer 111 may be a structure having a heat conductive function, such as a ceramic plate, an aluminum substrate, or the like; but also structures without heat conducting function such as plastic plates, polymer plates etc. When the insulating layer 111 is a structure having a heat conduction function, the metal layer 112 transfers heat to the insulating layer 111, and the heat is transferred to the outside through the insulating layer 111 and the metal layer 112. When the insulating layer 111 is a structure having no heat conduction function, heat is transferred to the outside through the metal layer 112.

As shown in fig. 7, in one embodiment, the working assembly 120 is further provided with a connection structure 124. The connection structure 124 may be a solder joint for making a soldered connection of the metal layer 112 and the heat conductive layer. The connection structure 124 may be a contact structure, which is used to implement a connection manner such as adhesion, abutting, etc. between the metal layer 112 and the heat conductive layer. In an embodiment of the present application, heat is transferred from the thermally conductive layer to the metal layer 112 through the connection structure 124. Other heat transfer processes are not described in detail.

In other embodiments, the metal layer 112 of the insulating and shielding structure 110 may be provided with the connection structure 124, or the connection structure 124 may be provided on both the insulating and shielding structure 110 and the working assembly 120.

In one embodiment, the metal layer 112 is fixedly connected to the heat conductive layer by soldering.

After the metal layer 112 and the heat conducting layer are welded, the strength of the joint is high, and the joint is not easy to separate. In the process of radiating the heat from the substrate 121 by the insulating layer 111 and the metal layer 112, the welding part of the metal layer 112 and the heat conducting layer is made of metal, so that the heat conducting performance is good, and the heat conducting performance cannot be disabled due to overheating, such as breakage, falling off and the like.

In one embodiment, a solder joint is provided at a connection location of the heat conductive layer or at a connection location of the metal layer 112, and the solder joint between the metal layer 112 and the heat conductive layer is achieved by the solder joint.

In one embodiment, the metal layer 112 is fixedly connected to the heat conductive layer by adhesion. The adhesive may be in a solid state or in a liquid state. The adhesive may be an adhesive having heat conductive property or a general adhesive.

In one embodiment, the metal layer 112 is fixedly connected to the heat conductive layer in an abutting manner. The metal layer 112 may be closely attached to the heat conductive layer or the heat conductive line of the substrate 121 by providing a groove structure or by mechanical means.

In one embodiment, the insulating shielding structure 110 is disposed at a predetermined angle with respect to the substrate 121. The preset angle may be, for example, an angle θ as shown in fig. 8. As shown in fig. 8, the side line of the predetermined angle is the center line of the insulating shielding structure 110 and the substrate 121. In other embodiments, when the surface of the insulating shielding structure 110 or the substrate 121 is a flat surface, the edge of the predetermined angle may be the surface of the insulating shielding structure 110 and the substrate 121.

In one embodiment, the insulating shield structure 110 extends through the substrate 121 in an orthogonal or non-orthogonal manner. It is further understood that the insulating shielding structure 110 is disposed at a predetermined angle with respect to the substrate 121. When the predetermined angle is 90 degrees, the insulating shielding structure 110 penetrates the substrate 121 in an orthogonal manner. When the predetermined angle is an angle other than 90 degrees, the insulating shielding structure 110 penetrates the substrate 121 in a non-orthogonal manner.

In one embodiment, the predetermined angle value is determined based on the layout and interference conditions of the electronic components on the substrate 121. In one embodiment, the preset angle value is determined based on an electromagnetic interference shielding effect, or an electrical insulation effect, or a heat dissipation effect that satisfies the use requirement. In one embodiment, when the optimal effect is achieved based on the electromagnetic interference shielding effect, the electrical insulation effect, or the heat dissipation effect, the corresponding angle value is determined to be the preset angle. Illustratively, if the heat radiation effect is optimal when the insulating shield structure 110 is disposed at 90 ° with the substrate 121, i.e., when the insulating shield structure 110 is disposed perpendicularly orthogonal to the substrate 121, the preset angle is set at 90 °. The insulating shielding structure 110 and the substrate 121 are set to a preset angle, so that the insulating shielding structure 110 and electronic components on the substrate 121 do not interfere with each other, or an electromagnetic interference shielding effect, an electrical insulation effect, a heat dissipation effect or an electromagnetic interference shielding effect, an electrical insulation effect or a heat dissipation effect which meet the use requirements are achieved, or an optimal effect is achieved.

In one embodiment, the insulating layer is a ceramic dielectric layer.

The ceramic material has good high-frequency performance and electrical performance, high heat conductivity, excellent chemical stability and thermal stability, and the like, and is an ideal packaging material for a new generation of large-scale integrated circuits and power electronic modules. In terms of transmission loss, the transmission loss of the ceramic board is low. The ceramic plate has low dielectric constant, low dielectric loss and strong electric conductivity. The ceramic plate has high heat conductivity, small heat resistance and low transmission loss.

In other embodiments, the insulating layer may be other sheet materials having insulating properties. For example, a metal plate material such as an aluminum substrate, a copper substrate, or an iron substrate has electrical insulation and high thermal conductivity, and may be an alloy plate material, a polymer plate material, or the like.

In one embodiment, the metal layer 112 is a copper dielectric layer, or an aluminum dielectric layer.

The copper dielectric layer or the aluminum dielectric layer is made of metal conductive materials, has electromagnetic shielding effect and can shield electromagnetic signals. The copper dielectric layer or the aluminum dielectric layer can shield electromagnetic interference generated by the interference source, so that the interfered source is protected from electromagnetic interference. The copper dielectric layer or aluminum dielectric layer also has good plasticity, and is convenient to be tightly attached to the insulating layer 111.

In other embodiments, the material of the metal layer 112 may be a soft magnetic alloy material, a ferromagnetic material, or the like with electromagnetic interference shielding function.

In one embodiment, the metal layer 112 forms a plating layer that is in close contact with the insulating layer 111.

Electromagnetic shielding is a method of controlling induction or propagation of electromagnetic waves from one region to another region by the principle of metal isolation. The current electromagnetic shielding method generally adopts a metal housing, a shielding coating, vacuum deposition metal and other modes, wherein the shielding coating mode has the advantages of lower cost, simple process and good shielding effect. The shielding coating has good electric conduction and magnetic conduction properties. The plating layer formed by electroplating is uniform and firm, and has the characteristics of wide applicable base materials, high binding force, high hardness, excellent wear resistance and corrosion resistance, good weldability, special electromagnetic performance and the like.

In other embodiments, the metal layer 112 may be a material with high magnetic conductivity, such as a thin metal sheet, a conductive foil, a conductive fabric, a spray coating, a plating layer, and the like, and has good electromagnetic interference shielding capability.

In one embodiment, the metal layer 112 is plated by electroplating. In other embodiments, the metal layer 112 and the insulating layer 111 are tightly adhered by pressing, sintering, or the like. After the metal layer 112 and the insulating layer 111 are pressed or sintered, the metal layer 112 is formed.

In one embodiment, the dimensions of the metal layer 112 are adapted to the source of interference or the source of interfered.

In one embodiment, the area of the metal layer 112 is determined based on the physical dimensions of the interfering source, or the interfered source. Illustratively, as shown in FIG. 9, the area of the metal layer 112 is determined based on the physical dimensions of the interfering source, or the interfered source. The area of the metal layer 112 is larger than the outline size of the interference source or the interfered source, and electromagnetic interference of the Top surface and the Bottom surface is shielded.

In other embodiments, the area of the metal layer 112 is also related to the strength of electromagnetic interference. And determining the laying area of the metal layer based on the electromagnetic interference intensity, electromagnetic interference shielding requirement and the like of the interference source. When the interference source emits electromagnetic interference, the metal layer can effectively shield the electromagnetic interference emitted by the interference source. The area of the metal layer is determined based on the electromagnetic interference intensity, electromagnetic interference shielding requirements, and the like. Before the interfered source is subjected to electromagnetic interference, the metal layer can effectively shield the electromagnetic interference and protect the interfered source from being influenced by the electromagnetic interference. Meanwhile, the existence area of an unnecessary metal layer is reduced, the related cost of the metal layer is reduced, and the production efficiency of the insulating shielding structure is improved.

In one embodiment, the region of the metal layer 112 that is present in the insulating layer 111 may be a localized region in the insulating layer 111. In other embodiments, the metal layer 112 may be present in the insulating layer 111, or may be a surface area on one side of the insulating layer 111, or may be a surface area on both sides of the insulating layer 111.

The area of the metal layer 112 is determined based on the external dimensions of the interference source. The metal layer 112 may effectively shield electromagnetic interference emitted by the interference source when the interference source emits electromagnetic interference. The area of the metal layer 112 is determined based on the physical dimensions of the interfered source. The metal layer 112 can effectively shield electromagnetic interference before the interfered source is subjected to electromagnetic interference, and protect the interfered source from electromagnetic interference. Meanwhile, the existence area of the unnecessary metal layer 112 can be reduced, the cost related to the metal layer 112 is reduced, and the production efficiency is improved.

In other embodiments, the metal layer 112 may be present in the insulating layer 111 on one or both sides of the surface area, shielding electromagnetic interference from both interfering and interfered sources. The dimensions of the insulating layer 111 may be determined based on the requirements of electrical insulation or based on the space requirements of the application.

In one embodiment, as shown in FIG. 10, the metal layer 112 is provided in multiple layers. The problem of poor electromagnetic interference shielding effect of the partial region can be solved, so that the electromagnetic interference shielding effect of the insulating shielding structure 110 is better. By increasing the heat dissipation area, the heat dissipation effect of the insulating shield structure 110 can also be made better.

In one embodiment, the metal layers 112 may be different metals or the same metal. The metals of different materials complement each other, so that the electromagnetic interference shielding effect of the insulating shielding structure 110 is better. As shown in fig. 5, the plurality of metal layers 112 may be disposed at different positions of the insulating layer 111, so that the electromagnetic interference shielding effect of the insulating shielding structure 110 is better.

In one embodiment, as shown in fig. 11, the metal layers 112 may be provided in different sizes to solve the problem of poor electromagnetic interference shielding effect in a partial area. In other embodiments, multiple metal layers 112 may be provided to the same size.

In one embodiment, as shown in fig. 12, multiple metal layers 112 may be disposed on different sides of the insulating layer 111. For example, when two electronic components generate electromagnetic interference with each other, when the metal layers 112 are disposed on both sides of the insulating layer 111, the electromagnetic interference shielding effect is better. In other embodiments, multiple metal layers 112 may be disposed on the same side of the insulating layer 111, as illustrated in fig. 10, for example.

In one embodiment, the insulating layer 111 is provided in multiple layers. The problem of poor electrical insulation effect of the partial region can be solved, so that the electrical insulation effect of the insulation shielding structure 110 is better. By increasing the heat dissipation area, the heat dissipation effect of the insulating shield structure 110 can also be made better.

In one embodiment, the insulating layer 111 is provided in multiple layers. A metal layer 112 is provided between each two insulating layers 111 of the plurality of insulating layers 111. In one embodiment, the outer surface of the insulating layer 111 at the outermost side of the multi-layer insulating layer 111 is further provided with a metal layer 112, and the metal layer 112 is connected to the heat conducting layer of the substrate 121 to dissipate heat of the substrate 121 and the electronic device or electronic component thereon. The arrangement of the multi-layer insulating layer 111 and the multi-layer metal layer 112 makes the heat dissipation effect of the insulating shielding structure 110 better.

In one embodiment, the insulating layers 111 may be insulating layers of different materials or insulating materials of the same material. The insulation layers 111 made of different materials are complementary to each other, so that the insulation effect of the insulation shielding structure 110 is better.

In one embodiment, the multiple insulating layers 111 may be provided in different sizes to solve the problem of poor electrical insulation in the partial region. In other embodiments, multiple layers of insulating layers 111 may be provided to be the same size.

In one embodiment, as shown in fig. 13, multiple insulating layers 111 may be provided on different sides of the metal layer 112. For example, when two electronic components are electrically insulated from each other, the insulating layer 111 is provided on both sides of the metal layer 112, and the electrical insulation effect is better. In other embodiments, multiple insulating layers 111 may be disposed on the same side of the metal layer 112.

As shown in fig. 14 to 16, a plurality of electronic components are provided on one side or both sides of the substrate 121. The multiple electronic components may be all interference sources, or may be all referred to as interfered sources, and embodiments of the present application are not limited herein. For the sake of further explanation, the following assumptions are made for the embodiments of the present application: the electronic component on the side close to the insulating plate 111 is set as an interference source, and the electronic component on the side close to the metal layer 111 is set as an interfered source.

In one embodiment, as shown in fig. 3, when the interference source and the interfered source are located on different sides of the substrate, the insulating shielding structure 110 of the embodiment of the present application penetrates through the substrate 121, so as to electrically insulate and electromagnetic interference shield the interference source and the interfered source on different sides of the substrate.

In one embodiment, as shown in FIG. 14, the work assembly 120 includes: a plurality of sources of interference 122. The plurality of interference sources 122 are disposed on the substrate 121, and the first interference source 122 and the second interference source 122 are disposed on different sides of the substrate 121. The insulating shielding structure 110 is located between the plurality of interference sources 122 and the interfered source 123.

In one embodiment, the interference source includes a first interference source disposed on the upper surface of the substrate 121 and a second interference source disposed on the lower surface of the substrate 121. The first interference source and the second interference source are located on one side of the insulating shielding structure 110, and the interfered source is located on the other side of the insulating shielding structure.

Since the insulating shielding structure 110 penetrates through the substrate 121, when interference sources exist on different surfaces of the substrate 121, the insulating shielding structure 110 can perform electromagnetic interference shielding and electrical insulation on the interference sources on different surfaces. The interfered source 123 may be protected from interference from sources from different surfaces of the substrate 121. The electronic device 100 is enabled to achieve a better electromagnetic shielding effect and an electrical insulation effect.

In one embodiment, as shown in FIG. 15, the work assembly 120 includes: a plurality of interfered sources 123. The multiple interfered sources 123 are disposed on the substrate 121, and the first interfered source 123 and the second interfered source 123 are disposed on different sides of the substrate 121. The insulating shielding structure 110 is located between the interference source 122 and the plurality of interfered sources 123.

In one embodiment, the interfered sources include a first interfered source and a second interfered source. The first interfered source is disposed on the upper surface of the substrate 121, and the second interfered source is disposed on the lower surface of the substrate 121. The first interfered source and the second interfered source are located on one side of the insulating shielding structure 110, and the interference source is located on the other side of the insulating shielding structure 110.

Since the insulating shielding structure 110 penetrates through the substrate 121, when the interfered sources exist on different surfaces of the substrate 121, the insulating shielding structure 110 can perform electromagnetic interference shielding and electrical insulation on the interfered sources on different surfaces. The interfered sources 123 on different surfaces of the substrate 121 may be protected from interference from the interfering sources. The insulating and shielding structure 110 increases the protection range of the interfered source, so that the electronic device 100 can achieve better electromagnetic shielding effect and electrical insulation effect.

In other embodiments, as shown in fig. 16, the working assembly 120 includes: a plurality of interferers 122 and a plurality of interfered sources 123. The plurality of interference sources 122 are disposed on the substrate 121, and the first interference source 122 and the second interference source 122 are disposed on different sides of the substrate 121. The multiple interfered sources 123 are disposed on the substrate 121, and the first interfered source 123 and the second interfered source 123 are disposed on different sides of the substrate 121. The insulating shielding structure 110 is located between the plurality of interference sources 122 and the plurality of interfered sources 123.

Because the insulating shielding structure 110 penetrates through the substrate 121, when there are interference sources and interfered sources on different surfaces of the substrate 121, the insulating shielding structure 110 can realize electromagnetic interference shielding and electrical insulation for the interference sources on different surfaces. While the interfered sources 123 on the different surfaces of the substrate 121 may be protected from interference from the interfering sources on the different surfaces. The insulating and shielding structure 110 increases the protection range of the interfered source, so that the electronic device 100 can achieve better electromagnetic shielding effect and electrical insulation effect.

In one embodiment, the substrate 121 is a printed circuit board; the interference source and the interfered source are electronic components.

The printed circuit board (Printed circuit boards, PCB) is a major scenario where electromagnetic interference occurs, and is also the subject of electrical insulation. The main sources of interference and interfered sources of printed circuit boards requiring electromagnetic interference shielding and electrical insulation are various electronic components. Since the insulating shielding structure 110 penetrates the printed circuit board, when the interference source exists on the same side of the printed circuit board or on different surfaces or is interfered by the interference source, the insulating shielding structure 110 can realize electromagnetic interference shielding and electrical insulation of the interference source. Meanwhile, the interfered source on the printed circuit board can be protected from being interfered by the interference source. The insulating and shielding structure 110 increases the protection range of the interfered source, so that the electronic device 100 including the printed circuit board can achieve better electromagnetic shielding effect and electrical insulation effect.

In other embodiments, in the case where electromagnetic interference occurs or electrical insulation is required, the substrate 121 may be a metal plate such as an aluminum substrate or a copper substrate, or a plastic plate made of a polymer material. The interference source and the interfered source may also be electronic devices, such as devices including a transformer, a power switch, etc., and the insulating shielding structure 110 of the embodiment of the present application is illustratively disposed between the devices including the transformer and other devices to implement electrical insulation or electromagnetic interference shielding between the devices including the transformer and other devices.

In one embodiment, a metallic shielding bezel, assembled to the surface of the PCB, is a solution for EMI electromagnetic interference shielding. The metal shielding baffle is grounded and shields the EMI electromagnetic interference of the circuits at two sides. Because the baffle is a metal conductor, the baffle and circuits on two sides have the safety problem of space electric insulation. The insulating shielding structure 110 of the embodiment of the present application can solve the problems of electromagnetic interference shielding and electrical insulation at the same time.

In one embodiment, an inner copper-clad multi-layer PCB board is assembled on the surface of the PCB, and is also a common EMI electromagnetic interference solution in the industry. The inner layer of the PCB is connected to the grounding point of the PCB of the bottom plate in a welding mode after being coated with copper sheets, and EMI electromagnetic interference of circuits on two sides is shielded. The PCB surface layer has no circuit copper sheet design, and can electrically insulate circuits at two sides. The solution can only solve the Top-side EMI electromagnetic interference problem and the electrical insulation problem, and the Bottom-side EMI electromagnetic interference problem and the electrical insulation problem still exist. The insulating and shielding structure 110 of the embodiment of the present application penetrates through the substrate 121, so as to solve the electromagnetic interference shielding and electrical insulation problems of the Top surface and the Bottom surface.

In one embodiment, an insulating material such as an insulating film is currently the mainstream electrical insulation design in the industry, and the insulating material is used to electrically insulate the veneer from the structural member. Assembling the conductor to be insulated by using an insulating material; an insulating material is between the structural member and the single plate conductor. The insulating material has single action and can not effectively shield the EMI electromagnetic interference. The insulating shielding structure 110 of the embodiment of the present application can solve the electromagnetic interference shielding and electrical insulation problems at the same time.

In one embodiment, the PCB embedded copper block technology is an effective heat dissipation technology which is mature in the current industry, and heat of the power device is vertically downwards and then dissipated to two sides through the embedded copper block. The PCB is locally embedded into the copper block; the buried copper block is tightly attached to the PCB surface power device; the copper block is connected with a soldering copper block on the surface layer of the PCB. The embedded copper block has high PCB processing difficulty and low yield, and the cost of the PCB is increased by more than 40% compared with that of a PCB without embedded copper. The insulating shielding structure 110 of the embodiment of the application is independently designed and processed, and the insulating shielding structure 110 does not influence the yield of the PCB and has low cost.

In one embodiment, the insulating shielding structure 110 is an insulating shielding orthogonal module heat dissipation structure, which effectively solves the problems of electrical insulation, EMI electromagnetic interference and heat dissipation in a part of high-density power application scenarios. The heat dissipation structure is a ceramic module and comprises a ceramic substrate and a copper layer. The ceramic module and the PCB adopt orthogonal design architecture, and the ceramic module isolates the interfered source and the interference source, so that the PCB meets the requirement of electric insulation. The interference source and the interfered source are shielded by the ceramic module to shield electromagnetic interference (EMI), and the heating copper sheet of the inner layer of the PCB is subjected to heat dissipation by the ceramic module.

In one embodiment, in the insulating shielding structure 110, a surface copper-clad ceramic board is soldered or bonded vertically between different circuit modules of the PCB to achieve EMI electromagnetic interference shielding, electrical insulation distance extension and vertical heat dissipation between the modules.

In one embodiment, the insulating shielding structure 110 is a ceramic module, which includes a ceramic substrate and a surface layer covered with copper, and is vertically mounted with the PCB, so that EMI electromagnetic interference shielding between the Top-plane interference source and the interfered source can be achieved due to the electromagnetic shielding effect of the covered copper, and EMI electromagnetic interference shielding between the Bottom-plane interference source and the interfered source can be achieved.

In one embodiment, the insulating shielding structure 110 is a ceramic module, and the ceramic module penetrates through the upper surface and the lower surface of the PCB to be vertically assembled, so that due to the insulating property of the ceramic board, electrical insulation between the Top-plane interference source and the interfered source can be achieved, and electrical insulation between the Bottom-plane interference source and the interfered source can be achieved.

In one embodiment, the insulating shielding structure 110 is a ceramic module, and the surface layer of the ceramic plate is coated with copper by partial plating or whole plate plating. The electroplating area is welded or bonded with the bonding pad in the PCB hole, so that the vertical heat conduction of the heating circuit in the PCB is realized. The bonding pad is connected with the heating circuit in the PCB in a through way.

As shown in fig. 17-21, the embodiment of the application provides a PCB board assembly of a switching power supply. As shown in fig. 18 and 19, the embodiment of the present application provides a composition and manufacturing process of the insulation shielding structure 110 applied to the PCB assembly. As shown in fig. 20 and 21, another embodiment of the present application provides another composition and manufacturing process of the insulation shield structure 110 applied to the PCB assembly.

In the embodiment of the present application, the insulating shielding structure 110 penetrates through the notch 27 of the PCB board. The application scene of the embodiment of the application is a switching power supply, and the problems to be solved are as follows: under the condition of high-density layout of electronic components, how to solve the problems of EMI electromagnetic interference and electrical insulation between a primary side circuit and a secondary side circuit and the heat dissipation of a secondary side plane magnetic PCB winding.

In the embodiment of the application, the primary side circuit refers to a circuit on the voltage input side of the switching power supply, and the secondary side circuit refers to a circuit on the voltage output side.

In one embodiment, as shown in fig. 17, the primary circuit is an interferer 122 and the secondary circuit is an interfered source 123. The problem of electromagnetic interference shielding of the interfered source 123 by the interfering source 122 needs to be solved. In other embodiments, the primary side circuit may be a disturbed source and the secondary side circuit a disturbed source; the primary side circuit and the secondary side circuit can be mutually an interference source and an interfered source.

In one embodiment, as shown in fig. 17, the secondary planar magnetic PCB windings are high density and require heat dissipation to prevent failure of the electronic components due to overheating.

In one embodiment, there is a need to address the electrical insulation problem of PCB circuits. Illustratively, a reinforced insulating electrical gap of 6.5mm and a creepage distance of 8mm need to be satisfied.

As shown in fig. 18 and 19, the embodiment of the present application provides a composition and design process of the insulation shielding structure 110 applied to the PCB assembly. As shown in fig. 18, the insulation shield structure 110 and the PCB assembly are integrally designed.

In the embodiment of the application, for the sake of simplicity of view, components such as a primary side circuit, a secondary side planar magnetic PCB winding and the like are omitted in fig. 18, and intermediate parts are cut off, so that intermediate repeated parts are omitted, and the representation of fig. 18 is not affected. In the embodiment of the present application, the working assembly 120 is specifically a PCB assembly, and the substrate 121 is specifically a PCB.

In one embodiment, the insulating shield structure 110 and PCB board assembly are of unitary design and manufacture. The specific dimensions of the insulating shield structure 110 and the PCB board are determined based on the dimensions of the PCB board and the electronic components on the PCB board. In use, the insulating shield structure 110 is removed and installed in a fit with the PCB assembly. In other embodiments, the insulating shield structure 110 and the PCB assembly may be manufactured separately and assembled and installed.

As shown in fig. 19, the specific manufacturing and using steps of the insulation shielding structure 110 and the PCB assembly include:

in step S201, the insulating shield structure 110 is provided with: an insulating plate 111, a metal layer 112, a single full surface mount pad 113-1, and a tin finger tab 114. Illustratively, the insulating plate 111 is, for example, a ceramic plate; metal layer 112, such as a copper dielectric layer;

step S202, a PCB board assembly is provided with: a substrate 121, a tin finger female 125, a single integral sidewall pad 126-1. The PCB board assembly is provided with a notch 127 for the insulating shielding structure 110 to pass through the notch 127.

In step S203, the male tin finger 114 and the female tin finger 125 are wave soldered. The single integral surface mount pad 113-1 is spot welded, or laser welded, or wave soldered with the single integral sidewall pad 126-1. The edge shielding structure 110 is assembled with the PCB assembly.

In an embodiment of the present application, the edge shielding structure 110 provides EMI electromagnetic interference shielding and electrical insulation on both the upper and lower sides of the PCB assembly. The edge shielding structure 110 achieves the heat dissipation problem of the PCB board assembly, and the inner layer heat conductors of the PCB board conduct heat to the edge shielding structure 110 through the single integral side wall bonding pads 126-1 for heat dissipation. The single integral sidewall pad 126-1 is connected to a thermally conductive layer or line inside the PCB board.

In the embodiment of the application, the male tin finger and the female tin finger can be exchanged, and the number of the single complete surface-mounted bonding pads 113-1 and the number of the single complete side-wall bonding pads 126-1 can also be set to be a plurality. The tin finger male head and the tin finger female head can also be replaced by other connecting pieces. Other means of attachment, such as bonding, may be used instead.

As shown in fig. 20 and 21, another composition and design process of the insulation shielding structure 110 applied to the PCB assembly are provided in the embodiments of the present application. As shown in fig. 20, the insulation shield structure 110 and the PCB assembly are integrally designed.

In the embodiment of the application, for the sake of simple view, components such as a primary side circuit, a secondary side plane magnetic PCB winding and the like are omitted in fig. 20, and intermediate parts are cut off, so that intermediate repeated parts are omitted, and the representation of fig. 20 is not affected. In the embodiment of the present application, the working assembly 120 is specifically a PCB assembly, and the substrate 121 is specifically a PCB.

As shown in fig. 21, the specific design and use steps of the insulation shielding structure 110 and the PCB assembly include:

step S301, the insulating shielding structure 110 is provided with: an insulating plate 111, a metal layer 112, and a plurality of independent surface mount pads 113-2. Illustratively, the insulating plate 111 is, for example, a ceramic plate; metal layer 112, such as a copper dielectric layer;

step S302, a PCB board assembly is provided with: a substrate 121, a plurality of individual sidewall pads 126-2. The PCB board assembly is provided with a notch 127 for the insulating shielding structure 110 to pass through the notch 127. The PCB assembly is provided with an inner layer heat dissipation conductor 128 for dissipating heat from the PCB assembly.

In step S303, the plurality of individual surface mount pads 113-2 are spot welded, or laser welded, or wave soldered with the plurality of individual sidewall pads 126-2. The edge shielding structure 110 is assembled with the PCB assembly.

In an embodiment of the present application, the edge shielding structure 110 provides EMI electromagnetic interference shielding and electrical insulation on both the upper and lower sides of the PCB assembly. The edge shielding structure 110 achieves the heat dissipation problem of the PCB board assembly, and the inner heat dissipation conductor 128 of the PCB board conducts heat to the edge shielding structure 110 through the plurality of independent side wall pads 126-2 for heat dissipation. The plurality of individual sidewall pads 126-2 are connected to an inner heat sink conductor 128 inside the PCB.

In the embodiment of the present application, the number of the plurality of independent surface-mounted pads 113-2 and the plurality of independent sidewall pads 126-2 may be set to be plural. Other means of attachment, such as bonding, may be used instead.

As shown in fig. 22 and 23, based on the PCB assembly shown in fig. 17 and the insulation shield structure 110 shown in fig. 18, a comparative test was performed on electromagnetic interference conditions of the PCB assembly with and without the insulation shield structure 110.

Fig. 22 shows electromagnetic interference test results of a PCB assembly without the insulating shielding structure 110. As shown in fig. 22, a curve 401 is a limit value corresponding to quasi-peak detection; curve 402 is the limit value corresponding to the average detection; curve 403 is quasi-peak detection; curve 404 is the mean detection. When the insulating shielding structure 110 is not used in the PCB assembly, the minimum difference of the limit values corresponding to the quasi-peak detection is 2dB at the left box position in fig. 22, i.e., the margin of the quasi-peak detection is 2dB.

Fig. 23 is an electromagnetic interference test result of a PCB assembly using the insulation shielding structure 110. As shown in fig. 23, a curve 501 is a limit value corresponding to quasi-peak detection; curve 502 is the limit value corresponding to the mean detection; curve 503 is quasi-peak detection; curve 504 is the mean detection. After the PCB assembly uses the insulating shield structure 110, at the left box position in fig. 23, the minimum difference between the limit values of the quasi-peak detection and the quasi-peak detection is 12dB, i.e., the margin of the quasi-peak detection is 12dB. Compared with the margin of quasi peak detection when the PCB assembly does not use the insulating shielding structure 110, the margin of quasi peak detection is 2dB, the strength of electromagnetic interference noise of the insulating shielding structure 110 is reduced, the margin of quasi peak detection is improved, and the safety of electronic components of the PCB assembly is improved.

In one embodiment, the EMI electromagnetic interference problem is very serious for high density layout power supplies. As shown in fig. 22 and 23, the electromagnetic interference condition of the PCB assembly with and without the insulating shielding structure 110 is compared by measuring the intensity of the electromagnetic interference in the presence of EMI. Test results show that the insulating shielding structure 110 of the embodiment of the application can reduce electromagnetic interference noise by more than 10 dB.

As shown in fig. 24 and 25, the beneficial effect of the insulating shield structure 110 on solving high density electronic components is illustrated based on one embodiment of the working assembly 120.

Fig. 24 is a schematic diagram of the composition of the working assembly 120 without the insulating shielding structure 110. As shown in fig. 24, the working assembly 120 of the embodiment of the present application includes: a substrate 121, an interference source 122, and an interfered source 123. The length of the substrate 121 is 15mm, the width thereof is 10mm, and the thickness thereof is not limited. The spacing between the interfering source 122 and the interfered source 123 is 8mm.

Fig. 25 is a schematic diagram of the composition of the working assembly 120 when the insulating shielding structure 110 is used. As shown in fig. 25, the working assembly 120 of the embodiment of the present application includes: a substrate 121, an interference source 122, and an interfered source 123. The length of the substrate 121 is 9mm, the width is 10mm, and the thickness is not limited. The spacing between the interfering source 122 and the interfered source 123 is 2mm.

In one embodiment, a layout 8mm distance is required between the aggressor 122 and the victim 123 to achieve the 8mm safety distance requirement for electrical insulation based on the electrical insulation requirements. When the insulating shield structure 110 is used, the interference source 122 and the interfered source 123 are electrically insulated from each other by the insulating shield structure 110. The distance of electrical insulation can be reduced from 8mm to about 2mm by 75%. The layout area is reduced from 15mm 10mm to 9mm 10mm, and the layout density is increased by 40%.

As shown in fig. 26 and 27, the beneficial effect of the insulating shield structure 110 on solving the heat dissipation problem is illustrated based on one embodiment of the working assembly 120. A comparative test was performed on the heat dissipation of the PCB assembly with and without the use of the insulating shield structure 110. As shown in fig. 26 and 27, the plurality of test points of the working module 120 are subjected to temperature test, and the temperatures of the multi-test points are recorded.

Fig. 26 is a schematic diagram of the results of temperature simulation testing of the working assembly 120 without the insulating shielding structure 110. As shown in fig. 26, when the insulating shielding structure 110 is not used, the highest temperature among the plurality of test points of the working assembly 120 is 139.9 ℃, corresponding to the temperature of the test point marked with Maximum above in fig. 26.

Fig. 27 is a schematic diagram of the results of temperature simulation testing of the working assembly 120 when the insulating shielding structure 110 is used. As shown in fig. 27, when the insulating shield structure 110 is used, the highest temperature among the plurality of test points of the working assembly 120 is 134.4 ℃, corresponding to the temperature of the test point marked with Maximum above in fig. 26.

In one embodiment, the heat generation of the inner conductor is severe for PCBs with winding wire designs in the inner layer. The working assembly 120 of the embodiment of the present application is connected to the insulating shielding structure 110 through the inner heating conductor to perform heat transfer, and then performs effective heat dissipation through the insulating shielding structure 110. As a result of the temperature simulation test such as shown in fig. 26 and 27, when the insulating shielding structure 110 according to the embodiment of the present application is used, the temperature of the heat-generating conductor in the inner layer of the PCB is reduced by more than 5 ℃.

In one embodiment, the insulating shielding structure 110 is a ceramic module having EMI electromagnetic interference shielding properties, electrical insulating properties, and high thermal conductivity properties. The insulating shield structure 110 penetrates the upper and lower surfaces of the substrate 121 of the working assembly 120, and is vertically assembled by welding or bonding. The insulating shielding structure 110 provides electrically insulating isolation of the interference source and the interfered source assembly of the working assembly 120, EMI electromagnetic interference shielding, between the interference source and the interfered source of the working assembly 120. After the insulating shielding structure 110 is communicated with the heating circuit of the working assembly 120, vertical heat conduction is performed, and the heat conduction efficiency is high. In the embodiment of the application. Ceramic module refers to an assembly comprising ceramic plates.

In one embodiment, the insulating shielding structure 110 may provide electrical insulation and EMI electromagnetic interference shielding between conductors of the TOP side of the substrate 121 of the work assembly 120. The insulating shielding structure 110 may also provide electrical insulation and EMI electromagnetic interference shielding between conductors of the botom side of the substrate 121 of the work assembly 120.

In one embodiment, the insulating shielding structure 110 has an EMI electromagnetic interference shielding function. The insulating shielding structure 110 is a copper-clad ceramic module, and is vertically assembled between the interference source and the interfered source, so as to realize EMI electromagnetic interference shielding between the TOP surface and the BOTTOM surface of the substrate 121 of the working assembly 120 and the interference source and the interfered source. Illustratively, the EMI electromagnetic interference may be reduced by more than 10 dB.

In one embodiment, the insulating shield structure 110 has an electrical insulating function. The insulating and insulating shielding structure 110 is vertically penetrating and assembled between two conductors of the substrate 121 of the working assembly 120, so as to realize electrical insulation between conductors of the TOP surface and the BOTTOM surface of the substrate 121. Illustratively, the electrical insulation distance is reduced by 75% and the layout density is increased by 40%.

In one embodiment, the insulating shielding structure 110 has a heat dissipation function. The insulating shielding structure 110 with high heat conductivity is connected with the heating conductor on the substrate 121 in a contact manner through the heat conducting layer in the substrate 121. Illustratively, the heat-generating conductor temperature is reduced by 5 ℃.

In one embodiment, the insulating shield structure 110 is of orthogonal assembly design to the substrate 121. In other embodiments, the insulating shielding structure 110 and the substrate 121 are assembled in a non-orthogonal manner, and the assembly angle may be from 0 ° to 180 °.

In one embodiment, the insulating layer 111 of the insulating shielding structure 110 is made of ceramic, and the insulating layer 111 may be coated with copper on one side or may be coated with copper on both sides. The insulating shield structure 110 may also be a multi-layer ceramic board assembly with copper cladding on the inner layers of the multi-layer ceramic board assembly. The insulating layer 111 and the metal layer 112 may be stacked and combined in multiple layers to obtain the insulating shielding structure 110.

In one embodiment, the insulating shield structure 110 may also be other structures. The other structure has insulating properties, or high thermal conductivity properties, or EMI electromagnetic interference shielding properties.

In one embodiment, the working assembly 120 may be a PCB board based assembly, or may be other board based assemblies such as sheet metal, aluminum substrate, etc., polymer board such as plastic, etc.

The types, the number, the shapes, the installation modes, the structures and the like of the components of the insulating shielding structure 110 provided by the embodiment of the application are not limited to the above embodiments, and all the technical schemes realized under the principle of the application are within the protection scope of the scheme. Any one or more embodiments or illustrations in the specification, combined in a suitable manner, are within the scope of the present disclosure.

Finally, the above embodiments are only used to illustrate the technical solution of the present application. It will be appreciated by those skilled in the art that, although the application has been described in detail with reference to the foregoing embodiments, various modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof. Such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions in the various embodiments of the application.

Claims

1. An insulating shielding structure, characterized by being applied to shield electromagnetic interference of a interfered source and electrical insulation between the interfered source and the interfering source; the interfered source and the interference source are arranged on the substrate;

The insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source so as to separate the interference source and the interfered source;

The insulating shield structure includes:

An insulating layer for electrically insulating the source of interference from the source of interfered interference;

and the metal layer is tightly attached to the insulating layer and is used for shielding electromagnetic interference generated by the interference source to the interfered source.

2. The insulating shield structure of claim 1, wherein said insulating layer is a ceramic dielectric layer.

3. The insulating and shielding structure of any one of claims 1 and 2, wherein the metal layer is a copper dielectric layer or an aluminum dielectric layer.

4. An insulating and shielding structure according to any one of claims 1 to 3, wherein said metal layer forms a plating layer in close contact with said insulating layer.

5. The insulating and shielding structure of any one of claims 1-4, wherein the dimensions of said metal layer are adapted to the interference source or the interfered source.

6. The insulating and shielding structure of any one of claims 1-5, wherein said substrate comprises: a heat conducting layer; the metal layer is fixedly connected with the heat conducting layer.

7. The insulating and shielding structure of claim 6, wherein said metal layer is fixedly connected to said thermally conductive layer by welding or bonding.

8. The insulating and shielding structure of any one of claims 1-7, wherein said metal layers are provided in multiple layers, disposed on different sides of said insulating layer.

9. The insulating and shielding structure according to any one of claims 1 to 8, wherein the insulating layers are provided in a plurality of layers, and the metal layer is provided between each two insulating layers of the plurality of insulating layers.

10. The insulating and shielding structure of any one of claims 1-9, wherein the insulating and shielding structure extends through the substrate in an orthogonal or non-orthogonal manner.

11. The insulating and shielding structure of any one of claims 1-10, wherein the interference source comprises a first interference source and a second interference source, the first interference source being disposed on an upper surface of the substrate, the second interference source being disposed on a lower surface of the substrate;

the first interference source and the second interference source are positioned on one side of the insulating shielding structure, and the interfered source is positioned on the other side of the insulating shielding structure.

12. The insulating and shielding structure of any one of claims 1-11, wherein the interfered sources include a first interfered source and a second interfered source, the first interfered source being disposed on an upper surface of the substrate, the second interfered source being disposed on a lower surface of the substrate;

The first interfered source and the second interfered source are positioned on one side of the insulating shielding structure, and the interference source is positioned on the other side of the insulating shielding structure.

13. The insulating and shielding structure of any one of claims 1-12, wherein the substrate is a printed circuit board; the interference source and the interfered source are electronic components.

14. An electronic device, comprising: a substrate, an interference source, an interfered source, an insulating shielding structure according to any of claims 1-13;

the interfered source and the interference source are arranged on the substrate; the insulating shielding structure penetrates through the substrate and is positioned between the interference source and the interfered source so as to separate the interference source and the interfered source.