CN118444538A - Mask table of photoetching machine - Google Patents
Mask table of photoetching machine Download PDFInfo
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- CN118444538A CN118444538A CN202410904094.9A CN202410904094A CN118444538A CN 118444538 A CN118444538 A CN 118444538A CN 202410904094 A CN202410904094 A CN 202410904094A CN 118444538 A CN118444538 A CN 118444538A
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- 238000001259 photo etching Methods 0.000 title claims abstract description 48
- 239000007787 solid Substances 0.000 claims abstract description 32
- 238000001459 lithography Methods 0.000 claims abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 81
- 229910052710 silicon Inorganic materials 0.000 abstract description 81
- 239000010703 silicon Substances 0.000 abstract description 81
- 230000000694 effects Effects 0.000 abstract description 13
- 235000012431 wafers Nutrition 0.000 description 76
- 239000000428 dust Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of lithography machines, in particular to a mask table of a lithography machine. The invention comprises a photoetching machine fixedly arranged at the top of a machine fixing plate, a bottom plate is arranged below the bottom of the machine fixing plate, a mask box is arranged between the machine fixing plate and the bottom plate, and the mask box comprises: the three pushing boxes are arranged in the fixed sheet box in a triangular shape, and the internal structures of the three pushing boxes are the same; the three-direction contact of the soft rubber clamping arms and the placement plate are used for fixing one side of the silicon wafer, the soft rubber clamping arms and the placement plate form a complete solid state, the edges of the silicon wafer are pushed and fixed through the three soft rubber clamping arms, the silicon wafer with different ruler diameters can be adapted to, the operation end of the photoetching machine is covered through the rectangular lantern ring, on one hand, operation light emitted by the operation end of the photoetching machine can be gathered, pattern transfer operation is facilitated, on the other hand, the situation that the operation end of the photoetching machine is exposed outside is avoided, and during operation, the operation quality and effect are influenced due to external factors.
Description
Technical Field
The invention relates to the technical field of lithography machines, in particular to a mask table of a lithography machine.
Background
The photoetching machine is a common device in the semiconductor industry, is used for transferring a chip circuit diagram on a mask plate onto a silicon chip, and is a core link of IC manufacture. The working principle of the photoetching machine is to project a pattern onto a silicon wafer by utilizing an optical principle, and then manufacture a circuit pattern by using a photosensitive material. The main components of the photoetching machine comprise a light source, an optical projection system, a control system and a photoresist coating and developing system.
The patent of publication number CN116256950B discloses a photoetching machine workbench, through motor spindle, cylindricality inclined hole, air pump and draught fan that set up, can produce the negative pressure when making the inside gas flow of motor spindle through the draught fan cooperation air pump, and then can be with incessantly introducing the inside back of motor spindle and discharge of air between workstation and the motor, thereby utilize between workstation and the motor air to introduce the motor spindle and form the air current and make the air isolation between workstation and the motor, and then can prevent that the motor from causing the problem emergence of influence to the temperature near the workstation after long-time work, can effectually improve photoetching machine processing's quality.
In the prior art, a silicon wafer is generally placed horizontally, then a photoetching machine transfers a pattern on a mask plate to the silicon wafer, if the silicon wafer is placed improperly or sways during transfer, the pattern on the mask plate cannot be transferred to the silicon wafer perfectly, and then the silicon wafer is scrapped, so that resources are consumed.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems that when the pattern on the mask plate is transferred onto the silicon wafer, the silicon wafer cannot be placed or is swayed during transfer, so that the transfer is imperfect and the silicon wafer is scrapped.
In order to solve the technical problems, the invention provides a mask table of a lithography machine, which comprises a lithography machine fixedly arranged at the top of a solid machine plate, wherein a bottom plate is arranged below the bottom of the solid machine plate, a mask box is arranged between the solid machine plate and the bottom plate, and the mask box comprises: the three pushing boxes are arranged in the fixed sheet box in a triangular shape, the three pushing boxes have the same internal structure, the placing plates are arranged in the fixed sheet box, the edges of the placing plates are in sliding connection with the outer walls of the three pushing boxes, the sliding limiting groove plates are fixedly arranged in the pushing boxes, the pressing block is in sliding connection with the inner wall of the sliding limiting groove plates, the hinge plates are hinged with the outer wall of one side of the pressing block and in sliding connection with the through grooves formed in the pushing boxes, the pushing blocks are arranged on the outer walls of the pushing blocks, one side of the push block is fixedly arranged at the other end of the hinge plate, the bottom of the push block is in sliding connection with the top of the placing plate, two groups of slide shafts are symmetrically arranged in number, one ends of the two groups of slide shafts are fixedly connected with one side of the push block, the other ends of the two groups of slide shafts are arranged at the outer side of the push box and are in sliding connection with the inner wall of the push box, springs are arranged at the outer side of the slide shafts, two ends of each spring are respectively fixedly connected with one side of the push block and the inner wall of the push box, and soft rubber clamping arms are fixedly arranged at the other side of the push block;
The pushing blocks in the three pushing boxes are used for pushing the silicon wafer from three different directions in a triangular mode, when the three soft rubber clamping arms are completely contacted with the edge of the silicon wafer, at the moment, one side of the silicon wafer is fixed through the three-direction contact of the soft rubber clamping arms and the placement plate, and the soft rubber clamping arms and the placement plate form a complete solid state.
In one embodiment of the invention, a button is arranged between the push block and the soft rubber clamping arm, and the button is positioned in the middle of the push block;
when the soft rubber clamping arms on one side of the three pushing blocks are simultaneously contacted with the silicon wafer, the edge of the silicon wafer presses the button in the soft rubber clamping arms, so that the pressing block is controlled to stop pressing and moving, and a control effect is achieved.
In one embodiment of the invention, the placement plate comprises: the device comprises two groups of rollers, wherein the two groups of rollers are symmetrically arranged at the bottom of a placement plate, the number of guide rails is two, the two guide rails are symmetrically arranged inside a piece fixing box, the two groups of rollers are respectively and slidably connected with the inner walls of the two guide rails, a screw rod is in threaded connection with the inner wall of the placement plate, one end of the screw rod is arranged at the outer side of a rectangular lantern ring, a rotary cylinder is fixedly arranged at the outer side of the rectangular lantern ring, one end of the screw rod is fixedly connected with the output end of the rotary cylinder, a screw rod is slidably connected with the inner wall of the placement plate and the outer wall of the screw rod, and one end of the screw rod is fixedly connected with the inner wall of the piece fixing box;
When the silicon chip is placed on the placement plate, the rotary air cylinder drives the screw rod to rotate, the placement plate is driven to move while the screw rod rotates, the roller at the bottom of the placement plate rolls in the guide rail when the placement plate moves, the placement plate drives the silicon chip to enter the inside of the solid piece box from the outside of the solid piece box while rolling, when the inner side edge of the placement plate contacts the innermost pushing box, the rotary air cylinder stops rotating, the placement plate stops moving, at the moment, the silicon chip on the placement plate is positioned under the working end of the photoetching machine, and the screw rod provides a certain stability for the movement of the placement plate.
In one embodiment of the invention, the top of the placement plate is fixedly provided with a limit stop, and the limit stop is arranged on one side of the top of the placement plate;
When the silicon wafer is placed on the placement plate, one side edge of the silicon wafer is attached to the limit stop on one side of the placement plate, one side of the silicon wafer is limited by placing the one side of the silicon wafer in the limit stop, and then the silicon wafer and the limit stop are contacted in three directions through the soft rubber clamping arm, so that a complete solid wafer state can be formed.
In one embodiment of the invention, the inner wall of the mask box is connected with a rectangular lantern ring in a sliding manner, the working end of the photoetching machine is arranged in the rectangular lantern ring, the tops of the three pressing blocks are fixedly connected with the bottom of the rectangular lantern ring, a nano machine box is arranged between the machine fixing plate and the bottom plate, and the nano machine box is arranged in the mask box and is fixedly connected with one side of the solid piece box;
The nano machine box drives the rectangular lantern ring to slide on the working end of the photoetching machine, and drives the pressing block to move downwards while sliding, so that the soft rubber clamping arm continuously moves to the edge of the silicon wafer to be close, when the soft rubber clamping arm contacts the edge of the silicon wafer, the rectangular lantern ring stops sliding, at the moment, the rectangular lantern ring covers the working end of the photoetching machine, on one hand, working light emitted by the working end of the photoetching machine can be gathered, pattern transfer operation is facilitated, on the other hand, the working end of the photoetching machine can be prevented from being exposed outside, and during operation, the working quality and effect are influenced by external factors.
In one embodiment of the invention, one end of the rectangular lantern ring is fixedly connected with a slat, a telescopic cylinder is arranged in the nano-chassis, one end bottom of the slat is fixedly connected with the output end of the telescopic cylinder, and the outer wall of the slat is in sliding connection with the inner wall of the nano-chassis;
When the rectangular lantern ring moves, the telescopic cylinder in the nano machine box drives the rectangular lantern ring to move through the slat, and when the soft rubber clamping arm contacts the edge of the silicon wafer, the edge of the silicon wafer extrudes the button to control the telescopic cylinder to stop moving.
In one embodiment of the present invention, the sheet-fixing case includes: the device comprises two groups of air suction heads, two groups of air suction heads are respectively arranged at one corner in a fixed sheet box and are provided with two air passing pipes, one ends of the two air passing pipes are respectively and fixedly connected with the bottoms of the two groups of air suction heads, two air passing pipes are respectively and fixedly connected with the two air passing pipes, one ends of the two air passing pipes are fixedly connected with the inner wall of a nano machine box, the two air exhaust pipes are respectively, and one ends of the two air exhaust pipes are fixedly connected with the inner wall of the bottom side of the nano machine box;
four air suction heads positioned at four corners in the solid piece box are used for exhausting air in the solid piece box, air drawn out from the air suction heads flows through the air pipe to enter the nano machine box along with the transition air pipe, then the air is discharged through the exhaust pipes, the air in the solid piece box is sucked through the four air suction heads, dust in the air in the solid piece box can be prevented from falling on a silicon wafer on one hand, the transfer effect is affected, on the other hand, the influence of dust in the air can be prevented when the working end of the photoetching machine is scattered, the transfer effect is not facilitated, the air flow drawn out from the nano machine box can be subjected to a heat reducing treatment through the air flow, and the operation of the photoetching machine is prevented from being affected by overhigh temperature.
In one embodiment of the invention, one end of each exhaust pipe is fixedly provided with an exhaust fan;
the exhaust fan extracts wind power through the exhaust pipe, so that air flow in the fixed sheet box is pumped through the four exhaust heads.
In one embodiment of the invention, screw fixing holes are formed on the inner wall of the machine fixing plate and the inner wall of the photoetching machine, and the two screw fixing holes correspond to each other;
When the photoetching machine is fixed, the screw fixing holes on the photoetching machine and the screw fixing holes on the fixing plate are relatively aligned, and then the screw fixing holes and the screw fixing holes are fixed through screw nuts, so that the operation efficiency is prevented from being affected by shaking during operation of the photoetching machine.
In one embodiment of the invention, the top of the machine fixing plate is symmetrically and fixedly provided with a mould setting frame, and a stable Heng Zhu is symmetrically arranged between the machine fixing plate and the bottom plate;
the die carrier at the top of the fixing plate can be used for placing different templates and silicon wafers after the operation is finished, so that the die carrier is convenient to place, and the stability Heng Zhu provides a stable state for the table body during the operation.
Compared with the prior art, the technical scheme of the invention has the following advantages:
According to the mask table of the photoetching machine, the pushing blocks in the three pushing boxes push the silicon wafer from three different directions in a triangular mode, when the three soft rubber clamping arms completely contact the edge of the silicon wafer, the three soft rubber clamping arms contact and the placing plate per se fix one side of the silicon wafer to form a complete solid state, when the silicon wafer is fixed, the photoetching machine works, the pattern on the mask plate is accurately and perfectly transferred to the silicon wafer, the phenomenon that the silicon wafer is swayed during the operation can be prevented through fixing the silicon wafer, the pattern transfer is inappropriately scrapped is caused, the edge of the silicon wafer is pushed and fixed through the three soft rubber clamping arms, the silicon wafer with different diameters can be adapted to the operation end of the photoetching machine is covered through the rectangular lantern ring, on one hand, the operation light emitted by the operation end of the photoetching machine can be gathered, the pattern transfer operation is facilitated, on the other hand, the operation end of the photoetching machine can be prevented from being exposed outside, and on the other hand, during the operation, the operation quality and the effect are influenced by external factors.
According to the mask table of the lithography machine, the four air suction heads positioned at four corners in the fixed sheet box are used for exhausting air in the fixed sheet box, air pumped out from the air suction heads flows through the transition air pipe and enters the nano machine box, then the air is discharged through the air suction pipes, the four air suction heads are used for exhausting air in the fixed sheet box, dust in the air in the fixed sheet box can be pumped out, on one hand, the silicon wafer can be prevented from falling onto the dust to influence the transfer effect, on the other hand, the influence of dust in the air when the working end of the lithography machine is scattered can be prevented, the transfer effect is not facilitated, and the rotary air cylinder and the telescopic air cylinder can be subjected to heat reducing treatment through the fact that the pumped air flow is scattered out from the nano machine box, so that the operation of the lithography machine is prevented from being influenced by overhigh temperature.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
FIG. 1 is a main body diagram of the present invention;
FIG. 2 is an overall view of the present invention;
FIG. 3 is a schematic view of the structure of the screw fixing hole in the invention;
FIG. 4 is a schematic diagram of the structure of the exhaust fan in the present invention;
FIG. 5 is a schematic view of the structure of the air duct of the present invention;
FIG. 6 is a schematic view of the structure of the placement plate according to the present invention;
FIG. 7 is a schematic view of the structure of the screw in the present invention;
FIG. 8 is a schematic view of the structure of the roller in the present invention;
FIG. 9 is a schematic view of the structure of the press block in the invention;
FIG. 10 is a schematic view of the structure of the hinge plate in the present invention;
fig. 11 is a schematic view of the structure of the push button in the present invention.
Description of the specification reference numerals: 1. a photoetching machine; 2. setting a die carrier; 3. a fixing plate; 4. a mask box; 5. stability Heng Zhu; 6. fixing holes by screws; 7. a rectangular collar; 8. a fixing plate box; 9. a bottom plate; 10. a nano-chassis; 11. an exhaust fan; 12. an exhaust tube; 13. a slat; 14. a telescopic cylinder; 15. briquetting; 16. a transition air pipe; 17. an air suction head; 18. placing a plate; 19. a limit stop; 20. pushing the box; 21. a wind pipe; 22. a guide rail; 23. a screw; 24. a screw rod; 25. a roller; 26. a slide shaft; 27. a spring; 28. a pushing block; 29. a soft rubber clamping arm; 30. a button; 31. a hinge plate; 32. a limited slip slot plate; 33. a through groove; 34. and (5) rotating the cylinder.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Example 1
As shown in fig. 6 to 11, a mask table of a lithography machine of the present invention comprises a lithography machine 1 fixedly installed on the top of a solid machine plate 3, a bottom plate 9 is provided below the bottom of the solid machine plate 3, a mask box 4 is provided between the solid machine plate 3 and the bottom plate 9, the mask box 4 comprises a solid piece box 8, pushing boxes 20, three pushing boxes 20 are provided, the three pushing boxes 20 are arranged in the solid piece box 8 in a triangle shape, the internal structures of the three pushing boxes 20 are the same, a placement plate 18, the placement plate 18 is arranged in the solid piece box 8, the edge of the placement plate 18 is in sliding connection with the outer walls of the three pushing boxes 20, a limited slip groove plate 32, the limited slip groove plate 32 is fixedly installed in the pushing boxes 20, a pressing block 15 is in sliding connection with the inner walls of the limited slip groove plate 32, a hinge plate 31, one end of a hinge plate 31 is hinged with the outer wall of one side of the pressing block 15 and is in sliding connection with a through groove 33 formed in the pushing box 20, one side of the pushing block 28 is fixedly arranged at the other end of the hinge plate 31, the bottom of the pushing block 28 is in sliding connection with the top of the placing plate 18, two groups of sliding shafts 26 are symmetrically arranged, one ends of the two groups of sliding shafts 26 are fixedly connected with one side of the pushing block 28, the other ends of the two groups of sliding shafts 26 are arranged at the outer side of the pushing box 20 and are in sliding connection with the inner wall of the pushing box 20, a spring 27 is arranged at the outer side of the sliding shaft 26, two ends of the spring 27 are respectively fixedly connected with one side of the pushing block 28 and the inner wall of the pushing box 20, a soft rubber clamping arm 29 is fixedly arranged at the other side of the pushing block 28;
Specifically, firstly, a silicon wafer is placed on the placing plate 18, then the placing plate 18 is pushed into the wafer holding box 8, when the edge of the placing plate 18 contacts the innermost pushing box 20, the placing plate 18 stops moving, at the moment, the pressing block 15 is pressed down in the limited sliding groove plate 32 to slide, at the same time, the pressing block 15 pushes the hinged plate 31 to rotate and slide in the through groove 33, when the hinged plate 31 rotates, one end of the hinged plate 31 pushes the pushing block 28 to slide on the placing plate 18, the pushing block 28 slides and drives the sliding shaft 26 to squeeze the spring 27 to slide in the pushing box 20, when the pushing block 28 slides on the placing plate 18, and when the soft rubber clamping arms 29 on one side of the three pushing blocks 28 simultaneously contact the silicon wafer, the pressing block 15 stops pressing down movement, because when the silicon wafer is placed on the placing plate 18, the placing plate 18 holds one side of the silicon wafer, and when the pressing block 15 stops moving, when the three soft rubber clamping arms 29 are completely contacted with the edge of the silicon wafer, the three soft rubber clamping arms 29 are contacted with the plate 18 to fix one side of the silicon wafer, the soft rubber clamping arms are contacted with the plate 18 to form a complete solid state, after the silicon wafer is fixed, the photoetching machine 1 works to precisely and perfectly transfer the pattern on the mask plate to the silicon wafer, the three soft rubber clamping arms 29 are used for pushing and fixing the edge of the silicon wafer to be suitable for the silicon wafers with different sizes, the two groups of sliding shafts 26 and springs 27 provide limit for the movement of the pushing blocks 28 on one hand, and provide stability for the movement of the pushing blocks 28 on the other hand, and the pushing length of the pushing blocks 28 needs to be calculated and designed practically,
Further, a button 30 is arranged between the push block 28 and the soft rubber clamping arm 29, and the button 30 is positioned in the middle of the push block 28;
Specifically, when the soft rubber clamping arms 29 on one side of the three pushing blocks 28 simultaneously contact with the silicon wafer, the edges of the silicon wafer press the buttons 30 in the soft rubber clamping arms 29, so that the pressing block 15 is controlled to stop pressing and moving, and a control effect is achieved.
As shown in fig. 4 to 8, the placement plate 18 includes two sets of rollers 25, the number of the rollers 25 is two, the two sets of rollers 25 are symmetrically arranged at the bottom of the placement plate 18, the number of the guide rails 22 is two, the two guide rails 22 are symmetrically arranged inside the sheet fixing box 8, the two sets of rollers 25 are respectively and slidably connected with the inner walls of the two guide rails 22, the screw 23 and the inner wall of the placement plate 18 are in threaded connection, one end of the screw 23 is arranged at the outer side of the rectangular lantern ring 7, the rotary cylinder 34 is fixedly arranged at the outer side of the sheet fixing box 8, one end of the screw 23 is fixedly connected with the output end of the rotary cylinder 34, the screw 24 is slidably connected with the inner wall of the placement plate 18, and one end of the screw 24 is fixedly connected with the inner wall of the sheet fixing box 8;
Specifically, when a silicon wafer is placed on the placement plate 18, the rotating cylinder 34 drives the screw 23 to rotate, the placement plate 18 is driven to move while the screw 23 rotates, the roller 25 at the bottom of the placement plate 18 rolls in the guide rail 22 when the placement plate 18 moves, the placement plate 18 drives the silicon wafer to enter the inside of the solid piece box 8 from the outside of the solid piece box 8 while rolling, when the inner side edge of the placement plate 18 contacts the innermost push box 20, the rotating cylinder 34 stops rotating, the placement plate 18 stops moving, at this time, the silicon wafer on the placement plate 18 is positioned under the working end of the photoetching machine 1, the screw 24 provides a certain stability for the movement of the placement plate 18, and the length of the screw 24 and the screw 23 needs to be calculated practically.
Further, a limit stop 19 is fixedly arranged on the top of the placement plate 18, and the limit stop 19 is arranged on one side of the top of the placement plate 18;
Specifically, when the silicon wafer is placed on the placement plate 18, one side edge of the silicon wafer is attached to the inside of the limit stop 19 on one side of the placement plate 18, one side of the silicon wafer is placed in the limit stop 19 to limit the silicon wafer, and then the silicon wafer and the limit stop are contacted in three directions through the soft rubber clamping arm 29 to form a complete solid state, and the setting position of the limit stop 19 needs to be calculated in practice.
Further, the inner wall of the mask box 4 is slidably connected with a rectangular lantern ring 7, the working end of the photoetching machine 1 is arranged in the rectangular lantern ring 7, the tops of the three pressing blocks 15 are fixedly connected with the bottom of the rectangular lantern ring 7, a nano machine box 10 is arranged between the machine fixing plate 3 and the bottom plate 9, and the nano machine box 10 is arranged in the mask box 4 and is fixedly connected with one side of the piece fixing box 8;
Specifically, the nano-machine box 10 drives the rectangular lantern ring 7 to slide on the working end of the photoetching machine 1, and drives the pressing block 15 to move downwards while sliding, so that the soft rubber clamping arms 29 continuously move close to the edge of the silicon wafer, when the soft rubber clamping arms 29 contact the edge of the silicon wafer, the rectangular lantern ring 7 stops sliding, at the moment, the rectangular lantern ring 7 covers the working end of the photoetching machine 1, and the rectangular lantern ring 7 covers the working end of the photoetching machine 1, so that on one hand, working light emitted by the working end of the photoetching machine 1 can be gathered, pattern transfer operation is facilitated, on the other hand, the working end of the photoetching machine 1 can be prevented from being exposed outside, and during operation, the working quality and effect are influenced by external factors.
Further, one end of the rectangular lantern ring 7 is fixedly connected with a slat 13, a telescopic cylinder 14 is arranged in the nano-machine case 10, one end bottom of the slat 13 is fixedly connected with the output end of the telescopic cylinder 14, and the outer wall of the slat 13 is in sliding connection with the inner wall of the nano-machine case 10;
Specifically, when the rectangular lantern ring 7 moves, the telescopic cylinder 14 in the nano-machine box 10 drives the rectangular lantern ring 7 to move through the slat 13, and when the soft rubber clamping arm 29 contacts the edge of the silicon wafer, the edge of the silicon wafer presses the button 30 so as to control the telescopic cylinder 14 to stop moving.
Example two
As shown in fig. 1 to 5, a comparative example one, in which another embodiment of the present invention is: the fixed sheet box 8 comprises two groups of air suction heads 17, wherein the two groups of air suction heads 17 are respectively arranged at one corner in the fixed sheet box 8, two air passing pipes 21 are arranged, one ends of the two air passing pipes 21 are respectively fixedly connected with the bottoms of the two groups of air suction heads 17, two air passing pipes 16 are respectively arranged, two air passing pipes 16 are respectively fixedly connected with the two air passing pipes 21, one ends of the two air passing pipes 16 are fixedly connected with the inner wall of the nano machine box 10, two air exhaust pipes 12 are arranged, and one ends of the two air exhaust pipes 12 are fixedly connected with the inner wall of the bottom side of the nano machine box 10;
Specifically, when the lithography machine 1 works, four air suction heads 17 positioned at four corners in the fixed sheet box 8 perform air suction operation on the fixed sheet box 8, air drawn from the air suction heads 17 flows through the air pipe 21 and enters the nano machine box 10 through the air transfer pipe 16, then is discharged through the air suction pipe 12, air suction is performed on the fixed sheet box 8 through the four air suction heads 17, dust in the fixed sheet box 8 can be drawn, on one hand, silicon wafers can be prevented from falling onto the dust to affect the transfer effect, on the other hand, the influence of dust in the air when the working end of the lithography machine 1 is scattered can be prevented, the transfer effect is not facilitated, air flow air drawn out through the nano machine box 10 can perform a heat reduction treatment on the rotating cylinder 34 and the telescopic cylinder 14, and the work of the lithography machine 1 is prevented from being influenced by overhigh temperature.
Further, one end of the two exhaust pipes 12 is fixedly provided with an exhaust fan 11;
Specifically, the exhaust fan 11 draws wind through the exhaust pipe 12, so that the air flow in the sheet fixing box 8 is drawn through the four exhaust heads 17.
Further, screw fixing holes 6 are formed in the inner wall of the fixing plate 3 and the inner wall of the photoetching machine 1, and the two screw fixing holes 6 correspond to each other;
Specifically, when the photoetching machine 1 is fixed, the screw fixing holes 6 on the photoetching machine 1 and the screw fixing holes 6 on the fixing plate 3 are relatively aligned, and then the screw fixing holes and the screw fixing holes are fixed through the screw nuts, so that the operation efficiency is prevented from being affected by shaking when the photoetching machine 1 works.
Furthermore, the top of the machine fixing plate 3 is symmetrically and fixedly provided with a mould setting frame 2, and a stable Heng Zhu is symmetrically arranged between the machine fixing plate 3 and the bottom plate 9;
Specifically, the die carrier 2 at the top of the fixing plate 3 can be used for placing different templates and silicon wafers after the operation is finished, so that the die carrier is convenient to place, and the stabilizing column 5 provides a stable state for the table body during the operation.
Working principle: by aligning the screw fixing holes 6 on the photoetching machine 1 and the screw fixing holes 6 on the machine fixing plate 3 relatively, fixing the two holes by screw nuts, when a silicon wafer is placed on the placing plate 18, the rotating cylinder 34 drives the screw rod 23 to rotate, the placing plate 18 is driven to move while the screw rod 23 rotates, the roller 25 at the bottom of the placing plate 18 rolls in the guide rail 22 when the placing plate 18 moves, the placing plate 18 drives the silicon wafer to enter the interior of the solid piece box 8 from the outside of the solid piece box 8 while rolling, when the inner side edge of the placing plate 18 contacts the innermost pushing box 20, the rotating cylinder 34 stops rotating, the placing plate 18 stops moving, at the moment, the silicon wafer on the placing plate 18 is positioned under the working end of the photoetching machine 1, then the nano machine box 10 drives the rectangular lantern ring 7 to slide on the working end of the photoetching machine 1, the pressing block 15 is driven to move downwards while sliding, the pressing block 15 is pressed downwards to slide in the limiting sliding groove plate 32, the pressing block 15 pushes the hinge plate 31 to slide in the penetrating groove 33 in a rotating mode while sliding, one end of the hinge plate 31 pushes the pushing block 28 to slide on the placing plate 18 while the pushing block 28 slides, the sliding shaft 26 is driven to press the spring 27 to slide in the pushing box 20 while sliding, when the pushing block 28 slides on the placing plate 18, the pressing block 15 stops to move downwards when the soft rubber clamping arms 29 on one side of the three pushing blocks 28 simultaneously contact with a silicon wafer, because the placing plate 18 holds one side of the silicon wafer when the silicon wafer is placed on the placing plate 18, when the pressing block 15 stops moving, the pushing block 28 in the three pushing boxes 20 pushes the silicon wafer from three different directions in a triangular mode, when the three soft rubber clamping arms 29 completely contact with the edge of the silicon wafer, the three directions of the soft rubber clamping arms 29 are used for contacting and placing the plate 18 to fix one side of the silicon wafer, the soft rubber clamping arms 29 and the plate form a complete solid piece state, when the silicon wafer is fixed, the lithography machine 1 operates, patterns on the mask plate are accurately and perfectly transferred to the silicon wafer, the edges of the silicon wafer are pushed and fixed by the three soft rubber clamping arms 29 to be suitable for the silicon wafers with different ruler diameters, the operation end of the lithography machine 1 is covered by the rectangular lantern ring 7, on one hand, the operation light emitted by the operation end of the lithography machine 1 can be gathered, pattern transfer operation is facilitated, on the other hand, the operation end of the lithography machine 1 can be prevented from being exposed outside, during operation, the operation quality and the effect are influenced by external factors, during operation of the lithography machine 1, four suction heads 17 positioned at four corners of the solid piece box 8 perform suction operation on the inside the lithography machine 8, the suction box 8 are sequentially moved into the nano machine box 10 by the air duct 21 through the air duct 16, then the four suction heads 17 perform suction on the inside the solid piece box 8, the air in the lithography machine 8 can be prevented from being blown out, on the other hand, the suction machine can be prevented from being influenced by the suction machine 1, the temperature can be prevented from being influenced by the suction machine, and the suction machine can be prevented from being influenced by the air cylinder, and the dust can be prevented from being blown out from the suction machine, on the other hand, the suction machine can be prevented from being influenced by the suction machine 1, and the air cylinder can be prevented from the high temperature, and the suction machine can be influenced by the dust can be prevented from the air by the suction machine can be greatly and the air by the air 1.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (10)
1. The utility model provides a photoetching machine mask platform, includes photoetching machine (1) of fixed mounting in solid quick-witted board (3) top, its characterized in that: a bottom plate (9) is arranged below the bottom of the machine fixing plate (3), and a mask box (4) is arranged between the machine fixing plate (3) and the bottom plate (9);
The mask box (4) comprises:
A fixing piece box (8);
the pushing boxes (20) are three in number, the three pushing boxes (20) are arranged in the fixed sheet box (8) in a triangular shape, and the internal structures of the three pushing boxes (20) are the same;
the placing plate (18) is arranged in the fixed sheet box (8), and the edge of the placing plate (18) is in sliding connection with the outer walls of the three pushing boxes (20);
A limited slip groove plate (32), wherein the limited slip groove plate (32) is fixedly arranged in the push box (20);
the pressing block (15) is connected with the inner wall of the limited slip groove plate (32) in a sliding manner;
The hinge plate (31), one end of the hinge plate (31) is hinged with the outer wall of one side of the pressing block (15) and is in sliding connection with a through groove (33) formed in the pushing box (20);
The pushing block (28), one side of the pushing block (28) is fixedly arranged at the other end of the hinge plate (31), and the bottom of the pushing block (28) is in sliding connection with the top of the placing plate (18);
The sliding shafts (26) are symmetrically arranged in number, one ends of the two groups of sliding shafts (26) are fixedly connected with one side of the pushing block (28), and the other ends of the two groups of sliding shafts (26) are arranged on the outer side of the pushing box (20) and are in sliding connection with the inner wall of the pushing box (20);
The spring (27) is arranged at the outer side of the sliding shaft (26), and two ends of the spring (27) are fixedly connected with one side of the push block (28) and the inner wall of the push box (20) respectively;
and the soft rubber clamping arm (29), and the soft rubber clamping arm (29) is fixedly arranged on the other side of the pushing block (28).
2. A lithographic machine mask table according to claim 1, wherein: a button (30) is arranged between the push block (28) and the soft rubber clamping arm (29), and the button (30) is positioned in the middle of the push block (28).
3. A lithographic machine mask table according to claim 1, wherein: the placement plate (18) comprises:
the number of the rollers (25) is two, and the two groups of rollers (25) are symmetrically arranged at the bottom of the placing plate (18);
The guide rails (22) are two in number, the two guide rails (22) are symmetrically arranged in the fixed sheet box (8), and the two groups of rollers (25) are respectively connected with the inner walls of the two guide rails (22) in a sliding manner;
The screw rod (23) is in threaded connection with the inner wall of the placement plate (18), and one end of the screw rod (23) is arranged at the outer side of the rectangular lantern ring (7);
The rotary air cylinder (34), the rotary air cylinder (34) is fixedly arranged on the outer side of the rectangular lantern ring (7), and one end of the screw rod (23) is fixedly connected with the output end of the rotary air cylinder (34);
The inner wall of the placement plate (18) is in sliding connection with the outer wall of the screw (24), and one end of the screw (24) is fixedly connected with the inner wall of the fixing piece box (8).
4. A mask stage of a lithography machine according to claim 3, wherein: the top of the placement plate (18) is fixedly provided with a limit stop (19), and the limit stop (19) is arranged on one side of the top of the placement plate (18).
5. A lithographic machine mask table according to claim 1, wherein: the inner wall sliding connection of mask case (4) has rectangle lantern ring (7), the inside of rectangle lantern ring (7) is arranged in to the operation end of lithograph (1), three the top of briquetting (15) and the bottom fixed connection of rectangle lantern ring (7), be provided with between solid quick-witted board (3) and bottom plate (9) and receive quick-witted case (10), receive quick-witted case (10) to arrange in the inside of mask case (4) and with one side fixed connection of solid piece case (8).
6. The mask stage of claim 5, wherein: one end fixedly connected with slat (13) of rectangle lantern ring (7), the inside of receiving machine case (10) is provided with flexible cylinder (14), the one end bottom of slat (13) is fixed connection with the output of flexible cylinder (14), the outer wall of slat (13) and the inner wall sliding connection of receiving machine case (10).
7. The mask stage of claim 5, wherein: the sheet fixing box (8) comprises:
the two groups of the air suction heads (17) are arranged, and the two groups of the air suction heads (17) are respectively arranged at one corner in the fixed sheet box (8);
The air passing pipes (21) are two in number, and one ends of the two air passing pipes (21) are fixedly connected with the bottoms of the two groups of air suction heads (17) respectively;
The air-conditioner comprises two air-transferring pipes (16), wherein the two air-transferring pipes (16) are fixedly connected with two air-transferring pipes (21) respectively, and one ends of the two air-transferring pipes (16) are fixedly connected with the inner wall of the nano-cabinet (10);
The air suction pipes (12), the number of the air suction pipes (12) is two, and one end of each air suction pipe (12) is fixedly connected with the inner wall of the bottom side of the nano-cabinet (10).
8. A lithographic machine mask table according to claim 7, wherein: one end of each exhaust pipe (12) is fixedly provided with an exhaust fan (11).
9. A lithographic machine mask table according to claim 1, wherein: screw fixing holes (6) are formed in the inner wall of the fixing plate (3) and the inner wall of the photoetching machine (1), and the two screw fixing holes (6) correspond to each other.
10. A lithographic machine mask table according to claim 1, wherein: the top of the machine fixing plate (3) is symmetrically and fixedly provided with a mould setting frame (2), and a stability Heng Zhu (5) is symmetrically arranged between the machine fixing plate (3) and the bottom plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410904094.9A CN118444538A (en) | 2024-07-08 | 2024-07-08 | Mask table of photoetching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410904094.9A CN118444538A (en) | 2024-07-08 | 2024-07-08 | Mask table of photoetching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118444538A true CN118444538A (en) | 2024-08-06 |
Family
ID=92333592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410904094.9A Pending CN118444538A (en) | 2024-07-08 | 2024-07-08 | Mask table of photoetching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118444538A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150286154A1 (en) * | 2012-11-12 | 2015-10-08 | Shanghai Micro Electronics Equipment Co., Ltd. | Balance Mass System Shared by Workpiece Table and Mask Table, and Lithography Machine |
| CN111624858A (en) * | 2020-06-29 | 2020-09-04 | 广东万合新材料科技有限公司 | Immersion lithography machine for semiconductor chip production |
| CN111781805A (en) * | 2020-07-16 | 2020-10-16 | 赣州市业润自动化设备有限公司 | Vacuum chuck with adjustable adsorption area for photoetching machine |
| CN116256950A (en) * | 2023-05-16 | 2023-06-13 | 张家港奇点光电科技有限公司 | Workbench of photoetching machine |
| CN116931385A (en) * | 2023-07-11 | 2023-10-24 | 安徽国芯智能装备有限公司 | Mask table of photoetching machine |
-
2024
- 2024-07-08 CN CN202410904094.9A patent/CN118444538A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150286154A1 (en) * | 2012-11-12 | 2015-10-08 | Shanghai Micro Electronics Equipment Co., Ltd. | Balance Mass System Shared by Workpiece Table and Mask Table, and Lithography Machine |
| CN111624858A (en) * | 2020-06-29 | 2020-09-04 | 广东万合新材料科技有限公司 | Immersion lithography machine for semiconductor chip production |
| CN111781805A (en) * | 2020-07-16 | 2020-10-16 | 赣州市业润自动化设备有限公司 | Vacuum chuck with adjustable adsorption area for photoetching machine |
| CN116256950A (en) * | 2023-05-16 | 2023-06-13 | 张家港奇点光电科技有限公司 | Workbench of photoetching machine |
| CN116931385A (en) * | 2023-07-11 | 2023-10-24 | 安徽国芯智能装备有限公司 | Mask table of photoetching machine |
Non-Patent Citations (1)
| Title |
|---|
| 刘丹 等: "步进扫描投影光刻机工件台和掩模台的进展", 《激光与光电子学进展》, 31 May 2003 (2003-05-31), pages 14 - 20 * |
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