CN118412307B

CN118412307B - Self-balancing antistatic wafer carrier

Info

Publication number: CN118412307B
Application number: CN202410876360.1A
Authority: CN
Inventors: 王黎明
Original assignee: Jiangsu Shengchi Microelectronics Co ltd
Current assignee: Jiangsu Shengchi Microelectronics Co ltd
Priority date: 2024-07-02
Filing date: 2024-07-02
Publication date: 2024-09-27
Anticipated expiration: 2044-07-02
Also published as: CN118412307A

Abstract

The invention discloses a self-balancing antistatic wafer carrier, which relates to the technical field of wafer carriers and comprises a supporting plate, a first movable rod, a supporting bottom, a placing box and a balancing module, wherein the first movable rod is arranged at the top of the supporting plate, the supporting bottom is arranged at the output end of the first movable rod through a swivel, the placing box is arranged at the top of the supporting bottom, the placing box is in a middle split movement type, the balancing module is arranged at the top of the supporting plate, and the first antistatic block is arranged on the inner wall of the placing box. According to the invention, the integrated circuit processing board controls the first movable rod to start when the left offset state is installed, and meanwhile, the level sensor continuously detects real-time offset state data and compares with the offset database until the level sensor returns to the normal state, and the integrated circuit processing board controls the second movable rod to start when the right offset state is installed, and meanwhile, the level sensor continuously detects real-time offset state data and compares with the offset database until the level sensor returns to the normal state.

Description

Self-balancing antistatic wafer carrier

Technical Field

The invention relates to the technical field of wafer carriers, in particular to a self-balancing antistatic wafer carrier.

Background

The antistatic wafer carrier is designed for storing and transporting wafers, is an important semiconductor plastic product for storing, conveying, transporting and protecting wafers in a processing process and between factories, and is a necessary component of a wafer factory carrying scheme, but the existing wafer carrier cannot automatically adjust the balance degree, so that the wafers are easy to incline and overturn.

The existing wafer carrier has the following defects:

1. Patent document CN109524337B discloses a wafer carrier, "it includes a lower side plate, a left side plate, a right side plate, an upper side plate, a rear side plate, a left slide rail set, a right slide rail set, a left stopper member, a right stopper member, and a control gate. The left side plate can be connected to the left end of the lower side plate. The right side plate can be connected to the right end of the lower side plate. The upper side plate can be connected to the upper ends of the left side plate and the right side plate. The rear side plate can be connected to the rear ends of the lower side plate, the left side plate and the upper side plate. The left sliding rail set can be arranged on the inner surface of the left side plate. The right slide rail set may be disposed on an inner surface of the right side plate. The left stop member may be disposed on the left slide rail set. The right stop member may be disposed on the right slide rail set. The control gate can comprise a front side plate and a locking component, the locking component can fix the front side plate at the front ends of the left side plate, the right side plate, the upper side plate and the lower side plate, but the existing wafer carrier cannot automatically adjust the balance degree and easily enable the wafer to incline and overturn;

2. Patent document CN110641841a discloses a wafer frame carrier, "comprising a case. The box body is composed of an opening, a top plate, a bottom plate, a back plate and two side plates. Wherein each side panel includes a cassette structure. The rear of each cassette structure is provided with a metal anti-collision part so as to prevent the box body from being damaged due to collision when tiny particles are generated or placed in the wafer frame, but the existing wafer carrier cannot stabilize the wafer, and the wafer is easy to be damaged accidentally in the transportation and movement process, so that the safety is not high;

3. Patent document CN107452660a discloses a wafer carrier and a method for manufacturing the same, "equipment suitable for processing a single large diameter wafer can process wafers of various diameters. The carrier comprises a wafer bin, two side ear widening parts and a leg pad heightening part. The two side ear widening and leg pad height make the carrier equivalent to a wafer bin carrying larger diameter wafers matched in width, height with the corresponding robot. Therefore, the carrier loaded with the wafers can be picked and placed without modifying the motion program of the manipulator, and meanwhile, the tops of the wafers with different diameters are positioned on the same horizontal plane by the leg pad height parts, so that the processing effects generated when the wafer processing fluid flows through the wafers with different diameters are consistent, the production efficiency and the equipment utilization rate are improved, the adaptability of the equipment is improved, the repeated purchase of similar equipment is avoided, and the cost is saved. The manufacturing method of the wafer carrier is simple, but the existing wafer carrier cannot adapt to the manufacturing requirement under the condition of various wafer sizes;

4. Patent document CN115142048a discloses a wafer carrier and a method for preparing a silicon nitride dielectric film, wherein the wafer carrier comprises: the wafer carrier comprises a base, wherein a plurality of accommodating grooves are arranged in the base at intervals, and the accommodating grooves are used for carrying wafers; and the cover body is covered on the base, a cavity for accommodating the wafer is formed after the cover body and the base are covered, a plurality of air inlet grooves respectively corresponding to the plurality of accommodating grooves are formed in the cover body, mixed gas of silane and ammonia is introduced into the cavity through the air inlet grooves, and the air inlet grooves extend along the circumferential direction of the corresponding wafer. According to the wafer carrier provided by the application, when the silicon nitride dielectric film grows on the wafer, the base and the cover body which can be covered are arranged, and the wafer is placed in the cavity between the base and the cover body, so that the wafer carrier is relatively airtight, the granularity is easy to control, and in addition, the air inlet grooves extend along the circumferential direction of the corresponding wafer, so that the uniformity is improved, but the existing wafer carrier cannot improve the safety of placing the wafer, and the wafer is easy to damage.

Disclosure of Invention

The invention aims to provide a self-balancing antistatic wafer carrier, which solves the technical problems that the wafer carrier provided in the background art cannot automatically adjust the balance degree and is easy to incline and overturn a wafer.

In order to achieve the above purpose, the present invention provides the following technical solutions: the self-balancing antistatic wafer carrier comprises a supporting plate, a first moving rod, a supporting bottom, a placing box and a balancing module, wherein the first moving rod is arranged at the top of the supporting plate, the supporting bottom is arranged at the output end of the first moving rod through a swivel, the placing box is arranged at the top of the supporting bottom and is in a middle split movement type, the balancing module is arranged at the top of the supporting plate, and the first antistatic block is arranged on the inner wall of the placing box;

the balance module comprises a second movable rod, a level sensor and a control box, wherein the second movable rod is located at the top of the supporting plate, the output end of the second movable rod is connected with the bottom of the supporting plate through a swivel, the level sensor is located at the bottom of the supporting plate, the control box is located at the top of the supporting plate, an integrated circuit processing plate is installed in the control box, the second movable rod is electrically connected with the integrated circuit processing plate, the first movable rod is electrically connected with the integrated circuit processing plate, the level sensor can detect real-time offset state data of the supporting plate, and the integrated circuit processing plate is internally provided with a level sensor offset database.

Preferably, the real-time offset state data is transmitted into the integrated circuit processing board to be compared with the offset database, the comparison result of the real-time offset state data and the offset database is a normal state, the comparison result of the real-time offset state data and the offset database is a left offset state, and the comparison result of the real-time offset state data and the offset database is a right offset state.

Preferably, the inner wall of the first antistatic block is provided with a stable wafer component, the stable wafer component is used for preventing wafers from being accidentally damaged in the transportation process, the inner wall of the support bottom is provided with an adjusting component, and the adjusting component is used for compatibility of various wafer sizes.

Preferably, the stable wafer subassembly includes moving way, the slider, no. five springs, the spliced pole, the arc pressure head, the moving way is located the inner wall of antistatic block, the slider is located the inner wall of moving way, no. five springs are located the inner wall of antistatic block, the spliced pole is located the one end of No. five springs, the outer wall of antistatic block is equipped with No. six mouths, and the one end of spliced pole extends to the outer wall of antistatic block through No. six mouths, the arc pressure head is located the one end of spliced pole, no. three support tubes are installed to the inner wall of antistatic block, no. four buffer blocks are installed to the inner wall of No. three support tubes, no. three support tubes's inner wall runs through and installs T shape pole, and the one end and the outer wall connection of No. four buffer blocks of T shape pole, the one end and the outer wall connection of slider of T shape pole.

Preferably, the T-shaped rod moves through a third support cylinder, the sliding block moves through a moving channel, the connecting column moves through a sixth opening, and the fourth buffer block is made of rubber.

Preferably, the adjusting part comprises a T-shaped frame, a seventh opening, a push head and a sixth spring, wherein the T-shaped frame is positioned on the inner wall of the bottom support, the outer wall of the T-shaped frame is provided with a sliding sleeve, the outer wall of the sliding sleeve is provided with a support column, the seventh opening is positioned on the top of the bottom support, the support column is connected with the bottom of the placement box through the seventh opening, the push head is positioned on the outer wall of the T-shaped frame, one end of the push head is connected with the outer wall of the support column, the sixth spring is positioned on the outer wall of the support column, and one end of the sixth spring is connected with the outer wall of the T-shaped frame.

Preferably, the support column moves through the seventh port, and the sliding sleeve moves through the support of the T-shaped frame.

Preferably, the inner wall of placing the box is provided with a slow moving component, the slow moving component is used for buffering when the wafer is placed, and the first antistatic block is uniformly paved on the inner wall of the placing box.

Preferably, the slow motion subassembly includes gag lever post, no. eight barrels, damping piece, no. nine springs, and the gag lever post is located the inner wall of placing the box, and No. eight barrels parcel is at the outer wall of gag lever post, and damping piece is located the inner wall of placing the box, and the plate body is installed to the outer wall of No. eight barrels, and the one end of damping piece is connected with the bottom of plate body, and No. nine springs are located the inner wall of placing the box, and No. nine springs's one end is connected with the bottom of plate body, and No. two antistatic pieces are installed at the top of plate body, and No. two antistatic pieces and No. one antistatic piece are polyether ether ketone material.

Preferably, the working steps of the electric wafer carrier are as follows:

S1, continuously detecting real-time offset state data by a horizontal sensor to compare with an offset database in a normal state, wherein a first movable rod and a second movable rod are not started, the integrated circuit processing board controls the first movable rod to start in a left offset state, and simultaneously the horizontal sensor continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor returns to the normal state, and the integrated circuit processing board controls the second movable rod to start in a right offset state, and simultaneously the horizontal sensor continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor returns to the normal state, so that the automatic balance adjustment of the electric wafer carrier is realized, and the wafer tilting and overturning functions are avoided;

s2, driving the arc-shaped pressure head to move when the wafer is placed at the arc-shaped pressure head, driving the connecting column to move by the arc-shaped pressure head, driving the five-spring to move by the connecting column, driving the T-shaped rod to move by the five-spring to move, driving the slide block to move by the T-shaped rod, driving the four-buffering block to move by the T-shaped rod, and pressing and fixing the wafer by the four-buffering block through the arc-shaped pressure head, so that the function of stabilizing the wafer, preventing the wafer from being damaged accidentally in the transportation and movement process and improving the safety is realized;

S3, a limiting head is arranged at one end of the T-shaped frame and used for limiting the movement of the sliding sleeve, the pushing head is moved to drive the supporting column to move, the supporting column is moved to drive the sliding sleeve to move, the sliding sleeve moves to drive the supporting column to drive the spring No. six to move, the spring No. six moves to drive the supporting column to drive the placing box to move, the placing box moves to adjust the width of the placing box, and the functions of compatibility of various wafer sizes to adapt to different manufacturing requirements are achieved;

s4, the limiting rod is used for providing movable support for the eight-cylinder, the top of the second antistatic block is used for driving the plate body to move, the plate body is used for driving the eight-cylinder to move, the eight-cylinder is used for driving the damping block to move, the damping block is used for driving the nine-spring to move by the second antistatic block, the impact force of the second antistatic block on the wafer is buffered by the nine-spring to move, and the function of improving the safety of the wafer placement and preventing the wafer from being damaged is achieved.

Compared with the prior art, the invention has the beneficial effects that:

1. according to the invention, when the horizontal sensor is installed in a normal state, the real-time offset state data is continuously detected by the horizontal sensor to be compared with the offset database, the first movable rod and the second movable rod are not started, the integrated circuit processing board controls the first movable rod to be started when the horizontal sensor is in a left offset state, meanwhile, the horizontal sensor continuously detects the real-time offset state data to be compared with the offset database until the horizontal sensor returns to the normal state, the integrated circuit processing board controls the second movable rod to be started when the horizontal sensor is in a right offset state, and meanwhile, the horizontal sensor continuously detects the real-time offset state data to be compared with the offset database until the horizontal sensor returns to the normal state, so that the function of automatically adjusting the balance degree of the electric wafer carrier is realized;

2. According to the invention, when a wafer is placed at the arc-shaped pressure head, the arc-shaped pressure head is driven to move, the connecting column is driven to move, the fifth spring is driven to move, the connecting column is driven to move by the fifth spring, the T-shaped rod is driven to move, the slide block is driven to move by the T-shaped rod, the fourth buffer block is driven to move by the slide block, the wafer is pressed and fixed by the fourth buffer block through the arc-shaped pressure head, and the function of stabilizing the wafer, preventing the wafer from being damaged accidentally in the transportation and moving process and improving the safety is realized;

3. According to the invention, the limit head is arranged at one end of the T-shaped frame and used for limiting the movement of the sliding sleeve, the push head is moved to drive the support column to move, the support column is moved to drive the sliding sleeve to move, the sliding sleeve moves to drive the support column to move the spring No. six, the spring No. six moves to drive the support column to drive the placement box to move, the placement box moves to adjust the width of the placement box, and the functions of compatibility of various wafer sizes to adapt to different manufacturing requirements are realized;

4. According to the invention, the limiting rod is arranged to provide a movable support for the eighth cylinder, the wafer is placed on the top of the second antistatic block to drive the plate body to move, the plate body moves to drive the eighth cylinder to move, the eighth cylinder moves to drive the damping block to move, the second antistatic block drives the ninth spring to move, and the ninth spring moves to buffer the impact force generated by placing the wafer by the second antistatic block, so that the wafer placement safety is improved, and the wafer damage is prevented.

Drawings

FIG. 1 is a schematic elevational view of the present invention;

FIG. 2 is a schematic diagram of the front structure of the present invention;

FIG. 3 is a schematic view of a first movable rod structure according to the present invention;

FIG. 4 is a schematic diagram of a self-balancing control flow scheme according to the present invention;

FIG. 5 is a schematic diagram of an antistatic block structure according to the present invention;

FIG. 6 is a schematic view of an arcuate indenter of the present invention;

FIG. 7 is a schematic diagram of a pusher structure according to the present invention;

FIG. 8 is a schematic diagram of a second antistatic block according to the present invention.

In the figure: 1. a supporting plate; 2. a first movable rod; 3. supporting the bottom; 4. placing a box; 6. a level sensor; 8. a control box; 9. an antistatic block number one; 10. a fifth spring; 11. a sixth port; 12. a connecting column; 13. an arc-shaped pressure head; 14. a moving track; 15. a slide block; 16. a third support cylinder; 17. a fourth buffer block; 18. a T-bar; 19. a T-shaped frame; 21. a sliding sleeve; 22. pushing heads; 23. a support column; 24. a seventh port; 25. a spring number six; 26. a limit rod; 27. a damping block; 28. a eighth cylinder; 29. a spring nine; 30. a plate body; 31. an antistatic block II; 35. and a second movable rod.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

Example 1: referring to fig. 1,2, 3 and 4, an embodiment of the present invention is provided: the self-balancing antistatic wafer carrier comprises a supporting plate 1, a first movable rod 2, a supporting bottom 3, a placing box 4 and a balancing module, wherein the first movable rod 2 is arranged at the top of the supporting plate 1, the supporting bottom 3 is arranged at the output end of the first movable rod 2 through a rotating ring, the placing box 4 is arranged at the top of the supporting bottom 3, the placing box 4 is in middle split movement, the balancing module is arranged at the top of the supporting plate 1, the first antistatic block 9 is arranged on the inner wall of the placing box 4, a stable wafer component is arranged on the inner wall of the first antistatic block 9 and is used for preventing accidental damage of a wafer in the transportation process, an adjusting component is arranged on the inner wall of the supporting bottom 3 and is used for compatibility of various wafer sizes, the balancing module comprises a second movable rod 35, a horizontal sensor 6 and a control box 8, the second movable rod 35 is positioned at the top of the supporting plate 1, the output end of the second movable rod 35 is connected with the bottom of the supporting bottom 3 through the rotating ring, the level sensor 6 is positioned at the bottom of the supporting base 3, the control box 8 is positioned at the top of the supporting plate 1, an integrated circuit processing board is arranged in the control box 8, a second movable rod 35 is electrically connected with the integrated circuit processing board, a first movable rod 2 is electrically connected with the integrated circuit processing board, the level sensor 6 can detect real-time offset state data of the supporting base 3, the integrated circuit processing board is internally provided with an offset database of the level sensor 6, the real-time offset state data is transmitted into the integrated circuit processing board and is compared with the offset database, the comparison result of the real-time offset state data and the offset database is a normal state, the comparison result of the real-time offset state data and the offset database is a left offset state, the comparison result of the real-time offset state data and the offset database is a right offset state, the horizontal sensor 6 continuously detects real-time offset state data to compare with the offset database in the normal state, the first movable rod 2 and the second movable rod 35 are not started, the integrated circuit processing board controls the first movable rod 2 to start in the left offset state, the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, the integrated circuit processing board controls the second movable rod 35 to start in the right offset state, and the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, and the functions of automatically adjusting the balance degree and avoiding wafer tilting and overturning of the electric wafer carrier are realized.

Example 2: referring to fig. 1,2,5 and 6, an embodiment of the present invention is provided: the stable wafer subassembly includes moving way 14, slider 15, no. five springs 10, spliced pole 12, arc pressure head 13, moving way 14 is located the inner wall of antistatic block 9 No. one, slider 15 is located the inner wall of moving way 14, no. five springs 10 are located the inner wall of antistatic block 9 No. five springs 10, spliced pole 12 is located the one end of No. five springs 10, the outer wall of No. one antistatic block 9 is equipped with No. six mouths 11, and the one end of spliced pole 12 extends to the outer wall of No. one antistatic block 9 through No. six mouths 11, arc pressure head 13 is located the one end of spliced pole 12, no. three support cylinders 16 are installed to the inner wall of No. one antistatic block 9, no. four buffer blocks 17 are installed to the inner wall of No. three support cylinders 16, no. three support cylinders 16's inner wall runs through and installs T shape pole 18, and the one end of T shape pole 18 is connected with the outer wall of No. four buffer blocks 17, one end of T shape pole 18 is connected with the outer wall of slider 15, no. three support cylinders 16 move, slider 15 moves through moving way 14, spliced pole 12 is through No. six mouths 11, no. 11 extend to the outer wall of antistatic block 9, no. 13 drive the wafer 13, no. 17 drive the fixed die head 13 and move the wafer 13, the arc pressure head 13 is driven by the fixed die head 13, the arc pressure head 13 moves the fixed die 16, and the arc pressure head is carried out the stable wafer, and the stable wafer is realized, and the arc pressure head is carried out in the motion is carried by the motion, and the wafer is carried by the stable wafer, and the stable wafer is carried by the stable wafer.

Example 3: referring to fig. 2 and 7, an embodiment of the present invention is provided: the adjusting component comprises a T-shaped frame 19, a seventh opening 24, a push head 22 and a sixth spring 25, wherein the T-shaped frame 19 is positioned on the inner wall of the supporting bottom 3, a sliding sleeve 21 is arranged on the outer wall of the T-shaped frame 19, a supporting column 23 is arranged on the outer wall of the sliding sleeve 21, the seventh opening 24 is positioned on the top of the supporting bottom 3, the supporting column 23 is connected with the bottom of the placement box 4 through the seventh opening 24, the push head 22 is positioned on the outer wall of the T-shaped frame 19, one end of the push head 22 is connected with the outer wall of the supporting column 23, the sixth spring 25 is positioned on the outer wall of the supporting column 23, one end of the sixth spring 25 is connected with the outer wall of the T-shaped frame 19, the supporting column 23 moves through the seventh opening 24, the sliding sleeve 21 moves through the support of the T-shaped frame 19, one end of the T-shaped frame 19 is provided with a limiting head, the limiting head is used for limiting the movement of the sliding sleeve 21, the push head 22 moves to drive the supporting column 23 to move, the sliding sleeve 21 moves, the sliding column 23 moves the sliding sleeve 21 to move the sliding spring 25 to drive the sixth spring 25 to move, the sixth spring 25 to move the supporting column 23, the placement box 4 to move, the supporting column 4, the placing box 4, and the width is adjusted by the width of the supporting box 4, and the wafer is manufactured in different sizes.

Example 4: referring to fig. 2 and 8, an embodiment of the present invention is provided: the slow motion subassembly includes gag lever post 26, no. eight section of thick bamboo 28, damping piece 27, no. nine spring 29, the gag lever post 26 is located the inner wall of placing box 4, no. eight section of thick bamboo 28 parcel is at the outer wall of gag lever post 26, damping piece 27 is located the inner wall of placing box 4, plate 30 is installed to the outer wall of No. eight section of thick bamboo 28, and the one end of damping piece 27 is connected with the bottom of plate 30, no. nine spring 29 is located the inner wall of placing box 4, and No. nine spring 29's one end is connected with the bottom of plate 30, no. two antistatic piece 31 is installed at the top of plate 30, no. two antistatic piece 31 and No. one antistatic piece 9 are polyether-ether ketone material, the effect of gag lever post 26 is for No. eight section of thick bamboo 28 provides the removal support, the wafer is placed at No. two antistatic piece 31 top and is driven plate 30 and is removed, plate 30 removes and drives No. eight section of thick bamboo 28 and removes, no. 28 removes and makes plate 30 drive damping piece 27 remove, no. two antistatic piece 31 drive No. nine spring 29 and remove, no. nine spring 29 removes and makes No. two antistatic piece 31 and is the wafer 31 and is placed the wafer that the impact of the safety of wafer that is damaged.

The working steps of the electric wafer carrier are as follows:

S1, continuously detecting real-time offset state data by a horizontal sensor 6 to compare with an offset database in a normal state, wherein a first movable rod 2 and a second movable rod 35 are not started, and the integrated circuit processing board controls the first movable rod 2 to start in a left offset state, and simultaneously the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, and the integrated circuit processing board controls the second movable rod 35 to start in a right offset state, and simultaneously the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, so that the automatic balance adjustment of the electric wafer carrier is realized, and the wafer tilting and overturning prevention function is realized;

s2, when a wafer is placed at the arc-shaped pressure head 13, the arc-shaped pressure head 13 is driven to move, the connecting column 12 is driven to move, the spring 10 is driven to move by the connecting column 12, the connecting column 12 is driven to move by the spring 10, the T-shaped rod 18 is driven to move by the movement of the T-shaped rod 15, the T-shaped rod 18 is driven to move by the movement of the slide block 15, the buffer block 17 is driven to move by the T-shaped rod 18, the wafer is pressed and fixed by the arc-shaped pressure head 13, and the functions of stabilizing the wafer, preventing the wafer from being damaged accidentally in the transportation and moving process and improving the safety are realized;

S3, a limiting head is arranged at one end of the T-shaped frame 19 and used for limiting the movement of the sliding sleeve 21, the push head 22 moves to drive the supporting column 23 to move, the supporting column 23 moves to drive the sliding sleeve 21 to move, the sliding sleeve 21 moves to drive the supporting column 23 to drive the No. six spring 25 to move, the No. six spring 25 moves to drive the supporting column 23 to drive the placement box 4 to move, the placement box 4 moves to adjust the width of the placement box, and the functions of compatibility of various wafer sizes to adapt to different manufacturing requirements are achieved;

S4, the limiting rod 26 is used for providing movable support for the No. eight cylinder 28, the top of the second antistatic block 31 drives the plate body 30 to move, the plate body 30 moves to drive the No. eight cylinder 28 to move, the No. eight cylinder 28 moves to enable the plate body 30 to drive the damping block 27 to move, the second antistatic block 31 drives the No. nine spring 29 to move, and the No. nine spring 29 moves to enable the No. two antistatic block 31 to buffer the impact force generated by placing the wafer, so that the function of improving the safety of placing the wafer and preventing the wafer from being damaged is achieved.

The working principle is that the horizontal sensor 6 continuously detects real-time offset state data to compare with the offset database in the normal state, the first movable rod 2 and the second movable rod 35 are not started, the integrated circuit processing board controls the first movable rod 2 to start in the left offset state, the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, the integrated circuit processing board controls the second movable rod 35 to start in the right offset state, the horizontal sensor 6 continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor 6 returns to the normal state, the function of automatically adjusting the balance degree of the electric wafer carrier is realized, the wafer is placed at the arc pressure head 13 to drive the arc pressure head 13 to move, the arc pressure head 13 moves to drive the connecting column 12 to move, the connecting column 12 moves to drive the five springs 10 to move, the movement of the fifth spring 10 causes the connecting column 12 to drive the T-shaped rod 18 to move, the movement of the T-shaped rod 18 drives the sliding block 15 to move, the movement of the sliding block 15 causes the T-shaped rod 18 to drive the fourth buffer block 17 to move, the movement of the fourth buffer block 17 presses and fixes the wafer through the arc-shaped pressing head 13, the function of stabilizing the wafer to prevent the wafer from being damaged accidentally and improving the safety in the transportation and movement process is realized, one end of the T-shaped frame 19 is provided with a limiting head, the limiting head is used for limiting the movement of the sliding sleeve 21, the movement of the pushing head 22 drives the supporting column 23 to move, the movement of the supporting column 23 drives the sliding sleeve 21 to move, the movement of the sliding sleeve 21 causes the supporting column 23 to drive the movement of the sixth spring 25, the movement of the sixth spring 25 causes the supporting column 23 to drive the placing box 4 to move, the placing box 4 to adjust the width thereof, the function of various wafer sizes to be compatible to adapt to different manufacturing requirements is realized, the limiting rod 26 is used for providing a movable support for the eighth cylinder 28, the wafer is placed at antistatic piece 31 top drive plate body 30 removal No. two, and plate body 30 removes and drives No. eight barrels 28 removal, and No. eight barrels 28 removal makes plate body 30 drive damping piece 27 removal, and damping piece 27 removes and makes No. two antistatic pieces 31 drive No. nine springs 29 removal, and No. nine springs 29 remove and make No. two antistatic pieces 31 place the impact buffering that is the wafer, has realized improving the security that the wafer placed and has prevented the function that the wafer damaged.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an antistatic wafer carrier of self-balancing formula, includes fagging (1), a movable rod (2), props end (3), places box (4) and balanced module, its characterized in that: a first movable rod (2) is arranged at the top of the supporting plate (1), a supporting bottom (3) is arranged at the output end of the first movable rod (2) through a swivel, a placing box (4) is arranged at the top of the supporting bottom (3), the placing box (4) is in a middle split movable type, a balancing module is arranged at the top of the supporting plate (1), and a first antistatic block (9) is arranged on the inner wall of the placing box (4);

The balance module comprises a second movable rod (35), a horizontal sensor (6) and a control box (8), wherein the second movable rod (35) is located at the top of the supporting plate (1), the output end of the second movable rod (35) is connected with the bottom of the supporting bottom (3) through a swivel, the horizontal sensor (6) is located at the bottom of the supporting bottom (3), the control box (8) is located at the top of the supporting plate (1), an integrated circuit processing board is arranged in the control box (8), the second movable rod (35) is electrically connected with the integrated circuit processing board, the first movable rod (2) is electrically connected with the integrated circuit processing board, the horizontal sensor (6) can detect real-time offset state data of the supporting bottom (3), and the integrated circuit processing board is internally provided with a horizontal sensor (6) offset database.

2. The self-balancing antistatic wafer carrier of claim 1, wherein: and the real-time offset state data is transmitted into the integrated circuit processing board to be compared with the offset database, the comparison result of the real-time offset state data and the offset database is a normal state, the comparison result of the real-time offset state data and the offset database is a left offset state, and the comparison result of the real-time offset state data and the offset database is a right offset state.

3. The self-balancing antistatic wafer carrier of claim 2, wherein: the inner wall of the first antistatic block (9) is provided with a stable wafer assembly, the stable wafer assembly is used for preventing wafers from being accidentally damaged in the transportation process, the inner wall of the supporting base (3) is provided with an adjusting assembly, and the adjusting assembly is used for compatibility of various wafer sizes.

4. A self-balancing antistatic wafer carrier as claimed in claim 3, wherein: the stable wafer subassembly includes removal way (14), slider (15), no. five spring (10), spliced pole (12), arc pressure head (13), the inner wall that removes way (14) and be located antistatic block (9), slider (15) are located the inner wall that removes way (14), no. five spring (10) are located the inner wall of antistatic block (9), spliced pole (12) are located the one end of No. five spring (10), the outer wall of antistatic block (9) is equipped with No. six mouths (11), and the one end of spliced pole (12) extends to the outer wall of antistatic block (9) through No. six mouths (11), arc pressure head (13) are located the one end of spliced pole (12), no. three prop up a section of thick bamboo (16) are installed to the inner wall of antistatic block (9), no. four buffer blocks (17) are installed to the inner wall of No. three prop up a section of thick bamboo (16), and the one end of T shape pole (18) is connected with the outer wall of No. four buffer blocks (17), one end of T shape pole (18) is connected with the one end of slider (15).

5. The self-balancing antistatic wafer carrier of claim 4, wherein: t-shaped rod (18) is moved through No. three support tube (16), and slider (15) is moved through moving way (14), and spliced pole (12) are moved through No. six mouths (11), and No. four buffer blocks (17) are rubber material.

6. The self-balancing antistatic wafer carrier of claim 5, wherein: the adjusting component comprises a T-shaped frame (19), a seventh opening (24), a push head (22) and a sixth spring (25), wherein the T-shaped frame (19) is located on the inner wall of the supporting bottom (3), a sliding sleeve (21) is arranged on the outer wall of the T-shaped frame (19), a supporting column (23) is arranged on the outer wall of the sliding sleeve (21), the seventh opening (24) is located on the top of the supporting bottom (3), the supporting column (23) is connected with the bottom of the placing box (4) through the seventh opening (24), the push head (22) is located on the outer wall of the T-shaped frame (19), one end of the push head (22) is connected with the outer wall of the supporting column (23), the sixth spring (25) is located on the outer wall of the supporting column (23), and one end of the sixth spring (25) is connected with the outer wall of the T-shaped frame (19).

7. The self-balancing antistatic wafer carrier of claim 6, wherein: the support column (23) moves through a seventh opening (24), and the sliding sleeve (21) moves through the support of the T-shaped frame (19).

8. The self-balancing antistatic wafer carrier of claim 7, wherein: the inner wall of placing box (4) is installed and is slowly moved the subassembly, slowly moves the buffering when subassembly is used for the wafer to place, and antistatic block No. 9 is even lays the inner wall of placing box (4).

9. The self-balancing antistatic wafer carrier of claim 8, wherein: the slow motion subassembly includes gag lever post (26), no. eight barrels (28), damping piece (27), no. nine spring (29), gag lever post (26) are located the inner wall of placing box (4), no. eight barrels (28) parcel is at the outer wall of gag lever post (26), damping piece (27) are located the inner wall of placing box (4), plate body (30) are installed to the outer wall of No. eight barrels (28), and the one end and the bottom of plate body (30) of damping piece (27) are connected, no. nine spring (29) are located the inner wall of placing box (4), and the one end and the bottom of plate body (30) of No. nine spring (29) are connected, no. two antistatic piece (31) are installed at the top of plate body (30), no. two antistatic piece (31) and No. one antistatic piece (9) are polyether ether ketone material.

10. A self-balancing device according to claim 9a method for using an antistatic wafer carrier, the method is characterized by comprising the following working steps of:

S1, continuously detecting real-time offset state data by a horizontal sensor (6) to compare with an offset database in a normal state, wherein a first movable rod (2) and a second movable rod (35) are not started, and an integrated circuit processing board controls the first movable rod (2) to start in a left offset state, and simultaneously the horizontal sensor (6) continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor (6) returns to the normal state, and the integrated circuit processing board controls the second movable rod (35) to start in a right offset state, and simultaneously the horizontal sensor (6) continuously detects the real-time offset state data to compare with the offset database until the horizontal sensor (6) returns to the normal state, so that the function of automatically adjusting the balance degree of the electric wafer carrier is realized;

S2, when a wafer is placed at the arc-shaped pressure head (13), the arc-shaped pressure head (13) is driven to move to drive the connecting column (12) to move, the connecting column (12) is driven to move to drive the five-number spring (10), the five-number spring (10) is moved to drive the connecting column (12) to drive the T-shaped rod (18) to move, the T-shaped rod (18) is driven to move to drive the sliding block (15) to move, the sliding block (15) is driven to drive the T-shaped rod (18) to move, and the four-number buffer block (17) is driven to press and fix the wafer through the arc-shaped pressure head (13), so that the function of stabilizing the wafer to prevent the wafer from being damaged accidentally in the transportation and movement process and improving the safety is realized;

S3, one end of the T-shaped frame (19) is provided with a limiting head, the limiting head is used for limiting the movement of the sliding sleeve (21), the pushing head (22) moves to drive the supporting column (23) to move, the supporting column (23) moves to drive the sliding sleeve (21) to move, the sliding sleeve (21) moves to drive the supporting column (23) to drive the No. six spring (25) to move, the No. six spring (25) moves to drive the supporting column (23) to drive the placing box (4) to move, and the placing box (4) moves to adjust the width of the placing box, so that the functions of compatibility of various wafer sizes to adapt to different manufacturing requirements are realized;

S4, the effect of gag lever post (26) is for eight barrels (28) provides the removal support, the wafer is placed at antistatic piece (31) top and is driven plate body (30) and remove, plate body (30) remove and drive eight barrels (28) and remove, eight barrels (28) remove and make plate body (30) drive damping piece (27) remove, damping piece (27) remove and make antistatic piece (31) drive nine numbers spring (29) remove, nine numbers spring (29) remove and make antistatic piece (31) place the impact buffering that is with the wafer, the security that has realized improving the wafer and has placed prevents the function that the wafer is damaged.